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1

Gonschorek, Karl-Heinz, and Ralf Vick. Electromagnetic Compatibility for Device Design and System Integration. Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03290-5.

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2

L, Engl W., ed. Process and device modelling. North-Holland, 1986.

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3

Workshop on Large Scale Computational Device Modeling (1985 Naperville, Ill.). Large scale computational device modeling. Coordinated Science Laboratory, University of Illinois, 1986.

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4

Kwyro, Lee, ed. Semiconductor device modeling for VLSI. Prentice Hall, 1993.

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5

Wolfgang, Karthe, Commission of the European Communities. Directorate-General for Science, Research, and Development., European Optical Society, and Society of Photo-optical Instrumentation Engineers., eds. Nanofabrication technologies and device integration: 13-14 April 1994, Lindau, FRG. SPIE, 1994.

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6

Huang, Weixin. Economic integration as a development device: The case of the EC and China. Verlag breitenbach Publishers, 1992.

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7

Man, Cham Kit, ed. Computer-aided design and VLSI device development. Kluwer Academic Publishers, 1986.

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8

Källbäck, Bengt. High-Speed Electronics: Basic Physical Phenomena and Device Principles. Springer Berlin Heidelberg, 1986.

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9

David, Burnett, Kimura Shiníchiro, Singh Bhanwar, et al., eds. Challenges in process integration and device technology: 18-19 September 2000, Santa Clara, USA. SPIE, 2000.

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10

J, Motta Ricardo, Berberian Hapet A, IS & T--the Society for Imaging Science and Technology., and Society of Photo-optical Instrumentation Engineers., eds. Device-independent color imaging and imaging systems integration: 1-3 February 1993, San Jose, California. SPIE, 1993.

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11

J, Motta Ricardo, Berberian Hapet A, IS & T--the Society for Imaging Science and Technology., and Society of Photo-optical Instrumentation Engineers., eds. Device-independent color imaging and imaging systems integration: 1-3 February 1993, San Jose, California. SPIE, 1993.

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12

Chatterjee, Pallab. Legacy Data: A Structured Methodology for Device Migration in DSM Technology. Springer US, 2003.

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13

Symposium on Crystalline Defects and Contamination (2nd : 1997 Paris, France). Proceedings of the Symposium on Crystalline Defects and Contamination, their Impact and Control in Device Manufacturing II. Edited by Kolbesen Bernd O, Electrochemical Society Electronics Division, Electrochemical Society Meeting, International Society of Electrochemistry. Meeting, and Symposium on Silicon Cleaning Technology (1997 : Paris, France). Electrochemical Society, 1997.

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14

Madrid, Philip E. Device design and process window analysis of a deep submicron CMOS VLSI technology. Addison-Wesley, 1992.

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15

Meeting, Materials Research Society, ed. Integrated miniaturized materials: From self-assembly to device integration : symposium held April 5-9, 2010, San Francisco, California, U.S.A. Materials Research Society, 2010.

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16

Symposium on Crystalline Defects and Contamination (2001 Nuremberg, Germany). Proceedings of the satellite symposium to ESSDERC 2001 Nuremberg/Germany: Crystalline defects and contamination : their impact and control in device manufacturing III ; DECON 2001. Edited by Kolbesen Bernd O, Electrochemical Society Electronics Division, European Solid State Device Research Conference (31st : 2001 : Nuremberg/Germany), and DECON 2001. Electrochemical Society, 2001.

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17

(Society), SPIE, ed. Nanoepitaxy: Homo- and heterogeneous synthesis, characterization, and device integration of nanomaterials : 3-4 August 2009, San Diego, California, United States. SPIE, 2009.

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18

Symposium on Crystalline Defects and Contamination: their Impact and Control in Device Manufacturing (3rd : 2001 Paris, France). Crystalline Defects and Contamination, their Impact and Control in Device Manufacturing III: DECON 2001 : Proceedings of the satellite symposium to ESSDERC 2001, Nuremberg, Germany. Edited by Kolbesen Bernd O, Electrochemical Society Electronics Division, and European Solid State Device Research Conference (31st : 2001 : Nuremberg, Germany). Electrochemical Society, 2001.

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19

Bishop, Lauri. The Integration of Principles of Motor Learning to Reduce Gait Asymmetry Using a Novel Robotic Device in Individuals Chronically Post-Stroke. [publisher not identified], 2018.

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20

Satellite Symposium to ESSDERC 2005 (2005 Grenoble, France). Crystalline defects and contamination: Their impact and control in device manufacturing IV, DECON 2005 : proceedings of the Satellite Symposium to ESSDERC 2005, Grenoble, France. Edited by Kolbesen Bernd O, Electrochemical Society. Electronics and Photonics Division., and European Solid State Device Research Conference (35th : 2005 : Grenoble, France). Electrochemical Society, 2005.

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21

Satellite, Symposium to ESSDERC 2005 (2005 Grenoble France). Crystalline defects and contamination: Their impact and control in device manufacturing IV, DECON 2005 : proceedings of the Satellite Symposium to ESSDERC 2005, Grenoble, France. Electrochemical Society, 2005.

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22

International Workshop on VLSI Process and Device Modeling (1993 Nara-ken, Japan). 1993 International Workshop on VLSI Process and Device Modeling: (1993 VPAD), May 14 (Fri.) - May 15 (Sat.), 1993, Nara Ken-New Public Hall, Nara, Japan. Business Center for Academic Societies Japan, 1993.

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23

Islam, M. Saiful. Nanoepitaxy: Homo- and heterogeneous synthesis, characterization, and device integration of nanomaterials II : 1-2 and 4 August 2010, San Diego, California, United States. Edited by SPIE (Society). SPIE, 2010.

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24

1937-, Chang C. Y., and Sze S. M. 1936-, eds. ULSI devices. Wiley, 2000.

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25

H, Miller John J., and NASECODE Conference. (5th : 1987 : Dublin, Ireland), eds. The interfaces and integration of process device and circuit models, an introduction: An international short course held in association with the NASECODE V Conference, 15th - 16th June 1987, Trinity College, Dublin, Ireland. Boole Press, 1987.

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26

Alfred, Driessen, Society of Photo-optical Instrumentation Engineers., and European Optical Society, eds. Laser diodes, optoelectronic devices, and heterogenous integration. SPIE, 2003.

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27

Iacopi, Francesca, and Francis Balestra, eds. More-than-Moore Devices and Integration for Semiconductors. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-21610-7.

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28

Michael, Shur, and Maki Paul A. 1956-, eds. Advanced high speed devices. World Scientific Publishing Co., 2010.

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29

Elias, Towe, ed. Heterogeneous optoelectronics integration. SPIE Press, 2000.

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30

Beerel, Peter A. A Designer's Guide to VLSI Devices. Cambridge University Press, 2010.

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31

Kunze, Ulrich. Quanteninterferenz-Feldeffekttransistoren, Bauelemente für die Nanometer-Integration? Akademie der Wissenschaften und der Literatur, 1987.

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32

Hai, Ming, Zhang Xuping, Chen Maggie Yihong, et al., eds. Optoelectronic devices and integration: 8-11 November, 2004, Beijing, China. SPIE, 2005.

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33

Gonschorek, Karl-Heinz, and Ralf Vick. Electromagnetic Compatibility for Device Design and System Integration. Springer, 2014.

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34

Gonschorek, Karl-Heinz, and Ralf Vick. Electromagnetic Compatibility for Device Design and System Integration. Springer London, Limited, 2009.

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35

Electromagnetic Compatibility For Device Design And System Integration. Springer, 2009.

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36

El-Kareh, Badih. CMOS and BiCMOS Process Integration and Device Characterization. Springer, 2007.

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37

Gonschorek, Karl-Heinz, and Ralf Vick. Electromagnetic Compatibility for Device Design and System Integration. Springer, 2010.

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38

Lee, Kwyro, Trond Ytterdal, Tor A. Fjeldly, and Michael Shur. Semiconductor Device Modeling For VLSI. Prentice Hall, 1997.

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39

Lee, Kwyro, Trond Ytterdal, Tor A. Fjeldly, and Michael Shur. Semiconductor Device Modeling For VLSI. Prentice Hall, 1997.

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40

Kit Man Kit Man Cham, Soo-Young Soo-Young Oh, and John L. Moll. Computer-Aided Design and VLSI Device Development. Springer London, Limited, 2013.

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41

Semiconductor Device Modeling for VLSI. Pearson Education, Limited, 1993.

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42

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2020.

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43

Hopf, Jens Michael. Framework for the Integration of Mobile Device Features in PLM. Saint Philip Street Press, 2020.

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44

Hopf, Jens Michael. Framework for the Integration of Mobile Device Features in PLM. Saint Philip Street Press, 2020.

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45

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.

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46

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.

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47

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer New York, 2016.

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48

Miller, J. J. H. The Interfaces and Integration of Process, Device and Circuit Models. Boole Press Ltd, 1987.

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49

El-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2019.

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50

Goyal, Amit, Carlos J. Martinez, Rajesh R. Naik, Alberto Saiani, and David Gracias. Integrated Miniaturized Materials : Volume 1272: From Self-Assembly to Device Integration. University of Cambridge ESOL Examinations, 2014.

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