Relevant bibliographies by topics / Encapsulation systems

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Encapsulation systems'

Author: Grafiati
Published: 4 June 2021
Last updated: 11 February 2022

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Journal articles on the topic "Encapsulation systems"

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Winkler, Sebastian, Jan Edelmann, Christine Welsch, and Roman Ruff. "Different encapsulation strategies for implanted electronics." Current Directions in Biomedical Engineering 3, no. 2 (2017): 725–28. http://dx.doi.org/10.1515/cdbme-2017-0153.

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AbstractRecent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined and include the implementation of electrical feedthroughs, wireless communication and wireless energy transfer as well as biomedical specifications such as hermetic sealing, mechanical stability and biocompatibility. The encapsulations are manufactured and qualified experimentally.
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Giraldo, Kevin A., Juan Sebastian Bermudez, Carlos E. Torres, Luis H. Reyes, Johann F. Osma, and Juan C. Cruz. "Microfluidics for Multiphase Mixing and Liposomal Encapsulation of Nanobioconjugates: Passive vs. Acoustic Systems." Fluids 6, no. 9 (2021): 309. http://dx.doi.org/10.3390/fluids6090309.

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One of the main routes to ensure that biomolecules or bioactive agents remain active as they are incorporated into products with applications in different industries is by their encapsulation. Liposomes are attractive platforms for encapsulation due to their ease of synthesis and manipulation and the potential to fuse with cell membranes when they are intended for drug delivery applications. We propose encapsulating our recently developed cell-penetrating nanobioconjugates based on magnetite interfaced with translocating proteins and peptides with the purpose of potentiating their cell internalization capabilities even further. To prepare the encapsulates (also known as magnetoliposomes (MLPs)), we introduced a low-cost microfluidic device equipped with a serpentine microchannel to favor the interaction between the liposomes and the nanobioconjugates. The encapsulation performance of the device, operated either passively or in the presence of ultrasound, was evaluated both in silico and experimentally. The in silico analysis was implemented through multiphysics simulations with the software COMSOL Multiphysics 5.5® (COMSOL Inc., Stockholm, Sweden) via both a Eulerian model and a transport of diluted species model. The encapsulation efficiency was determined experimentally, aided by spectrofluorimetry. Encapsulation efficiencies obtained experimentally and in silico approached 80% for the highest flow rate ratios (FRRs). Compared with the passive mixer, the in silico results of the device under acoustic waves led to higher discrepancies with respect to those obtained experimentally. This was attributed to the complexity of the process in such a situation. The obtained MLPs demonstrated successful encapsulation of the nanobioconjugates by both methods with a 36% reduction in size for the ones obtained in the presence of ultrasound. These findings suggest that the proposed serpentine micromixers are well suited to produce MLPs very efficiently and with homogeneous key physichochemical properties.
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Curi-Borda, Cecilia, Javier Linares-Pastén, Tuba Tat, et al. "Multilayer Bixin Microcapsules: The Impact of Native Carbohydrates on the Microencapsulation Efficiency and Dispersion Stability." Foods 8, no. 3 (2019): 108. http://dx.doi.org/10.3390/foods8030108.

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Bixin is a hydrophobic carotenoid present in the integument of the seeds of Bixa orellana. Microencapsulation was applied to obtain water dispersible formulations and protect the colorant against degradation. Microencapsulated systems were obtained by spray-drying a mild alkaline bixin dispersion with different encapsulating materials. The encapsulation trials were performed with and without native carbohydrates of the integument in addition to the main encapsulant. It was possible to dry dispersions with up to 10% bixin counted on total solids. All the studied systems were characterized by colorimetry, UV-vis spectroscopy, Scanning Electron Microscopy, light microscopy, turbidometric sedimentation analyses and laser light diffraction analyses. All the systems showed aqueous dispersibility but displayed differences in their transparency, UV-vis spectra and physical stability at pH 3. The results show that the native carbohydrates enhance the encapsulation efficiency of other encapsulating materials. The chemical composition of this native carbohydrate fraction shows the presence of polysaccharides containing arabinose, galactose and glucose as monomers. Starch was identified enzymatically. The native carbohydrates allowed the encapsulation of bixin in its native microcrystalline form, resulting in a multilayer structure after spray-drying. In addition, the colorant particles displayed dispersibility under acidic aqueous conditions suggesting that they are stabilized by the native carbohydrates after the microcapsules are dissolved.
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Kulkarni, Romit, Peter Wappler, Mahdi Soltani, et al. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages." Journal of Manufacturing and Materials Processing 3, no. 1 (2019): 18. http://dx.doi.org/10.3390/jmmp3010018.

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation serves as an added advantage by reducing the thermo-mechanical stresses occurring due to thermal-cyclic loading, compared to block-sized or thicker encapsulations. This paper assesses the encapsulation process of a board-level package by means of thermoset injection molding. Various aspects reviewed in this paper include the conception of a demonstrator, investigation of the flow simulation of the injection molding process, execution of molding trials with different encapsulation thicknesses, and characterization of the packages. The process shows a high dependence on the substrate properties, injection molding process parameters, device mounting tolerances, and device geometry tolerances. Nevertheless, the thermoset injection molding process is suitable for the encapsulation of board-level packages limiting itself only with respect to the thickness of the encapsulation material, which depends on other external aforementioned factors.
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Steiner, Benjamin M., David Julian McClements, and Gabriel Davidov-Pardo. "Encapsulation systems for lutein: A review." Trends in Food Science & Technology 82 (December 2018): 71–81. http://dx.doi.org/10.1016/j.tifs.2018.10.003.

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Persano, Anna, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano, and Jacopo Iannacci. "Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems." Sensors 20, no. 7 (2020): 2133. http://dx.doi.org/10.3390/s20072133.

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In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.
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Wubshet, Nadab H., Yashar Bashirzadeh, and Allen P. Liu. "Fascin-induced actin protrusions are suppressed by dendritic networks in giant unilamellar vesicles." Molecular Biology of the Cell 32, no. 18 (2021): 1634–40. http://dx.doi.org/10.1091/mbc.e21-02-0080.

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By reconstituting minimal actin cytoskeletal systems inside giant vesicles, we show that dendritic and bundled actin networks compete to assemble actin networks. Encapsulation of fascin and Arp2/3 complex results in increased dendritic network aggregation and inhibited bundled actin-induced protrusions compared to encapsulating actin and fascin alone.
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Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (2019): 508. http://dx.doi.org/10.3390/mi10080508.

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.
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Mujica-Álvarez, Javiera, O. Gil-Castell, Pabla A. Barra, et al. "Encapsulation of Vitamins A and E as Spray-Dried Additives for the Feed Industry." Molecules 25, no. 6 (2020): 1357. http://dx.doi.org/10.3390/molecules25061357.

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Encapsulated fat-soluble powders containing vitamin A (VA) and E (VE) were prepared as a feasible additive for extruded feed products. The effect of the encapsulating agents (Capsul-CAP®, sodium caseinate-SC) in combination with Tween 80 (TW) as an emulsifier and maltodextrin (MD) as a wall material on the physicochemical properties of emulsions and powders was evaluated. First, nanoemulsions containing MD:CAP:TW:VA/VE and MD:SC:TW:VA/VE were prepared and characterized. Then, powders were obtained by means of spray-drying and analyzed in terms of the product yield, encapsulation efficiency, moisture content, porosity, surface morphology, chemical structure, and thermal properties and thermo-oxidative/thermal stability. Results showed that although nanoemulsions were obtained for all the compositions, homogeneous microcapsules were found after the drying process. High product yield and encapsulation efficiency were obtained, and the presence of the vitamins was corroborated. The characteristics of the powders were mainly influenced by the encapsulating agent used and also by the type of vitamin. In general, the microcapsules remained thermally stable up to 170 °C and, therefore, the proposed encapsulation systems for vitamins A and E were suitable for the preparation of additives for the feed manufacturing through the extrusion process.
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Ionescu (Filip), Oana, Maria Viorica Ciocilteu, Costel Valentin Manda, et al. "Bone - Graft Delivery Systems of Type PLGA- gentamicin and Collagen - hydroxyapatite - gentamicine." Materiale Plastice 56, no. 3 (2019): 534–27. http://dx.doi.org/10.37358/mp.19.3.5224.

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The purpose of this study was the synthesis of two types of biodegradable materials with synthetic polymers (PLGA) or natural polymers (collagen) and hydroxyapatite, followed by determination of the encapsulation percentage of the drug in the polymer. Regardless of the chosen method, the percentage of the encapsulated drug was found to be quite high: 15.92% in the Coll-HA-Genta material and 19.59% respectively in the PLGA-Genta biocomposite. The therapeutic value of gentamicin was improved by encapsulating it in delivery systems, contributing to sustained release for a long time (about 30 days).
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Dissertations / Theses on the topic "Encapsulation systems"

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Teh, Nee-Joo. "Direct polymeric encapsulation of electronic systems for automotive applications." Thesis, Loughborough University, 2004. https://dspace.lboro.ac.uk/2134/33881.

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Over the past forty years, compelling demands for safer, cleaner and more efficient vehicles have given rise to a drastic increase in the replacement of many traditional mechanical and electrical mechanisms by more advanced electronic systems. Due to their harsh operating environments, automotive electronic systems are subject to failures from thermomechanical stresses and corrosive breakdown, adversely affecting their reliability and lifespan. Furthermore, the development of bus communication protocols for improved control capabilities has prompted wider systems distribution within the restricted space of a vehicle and inadvertently led to higher assembly complexity, increased vehicle weight and manufacturing costs. Despite advancements in the industry, no commercially viable process exists that is capable of providing electronic systems with sufficient robustness for their operating environments while also offering assembly consolidation to enable cost reduction. The primary focus of this thesis is the engineering of a low-cost, single-cycle process for the direct encapsulation of electronic systems within thermoplastic structures, leading to the production of robust, geometrically flexible and ready-to-assemble plastic automotive components with integrated electronics and requisite power distribution.
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Wang, Juan. "Characterization of microsphere drug delivery systems during encapsulation and initial drug release /." The Ohio State University, 2000. http://rave.ohiolink.edu/etdc/view?acc_num=osu1488202678776876.

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Sun, Di. "CHARACTERIZATION OF MEDICAL GRADE POLY-DIMETHYLSILOXANE AS ENCAPSULATION MATERIALS FOR IMPLANTABLE MICROELECTROMECHANICAL SYSTEMS." Case Western Reserve University School of Graduate Studies / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=case1396631435.

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Bowman, Amy Catherine. "A selective encapsulation solution for packaging an optical micro electro mechanical system." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0108102-140953.

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Thesis (M.S.)--Worcester Polytechnic Institute.<br>Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).
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McCague, Colum. "Development of novel composite cement systems for the encapsulation of aluminium from nuclear wastes." Thesis, Queen's University Belfast, 2015. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.678940.

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Currently in the UK, composite blends of Portland cement (PC) and blastfurnace slag (up to 90%) are commonly used for the encapsulation of low and intermediate level wastes. The high volume replacement of PC is considered necessary in order to to reduce the high heat generation resulting from cement hydration in 500 litre waste packages. While suited to the majority of waste streams, the high pH environment in such systems (usually around 12.5 -13), will cause the corrosion of certain waste metals such as aluminium. Since aluminium is only passive between pH4 - 8.5, the use of an alternative low-pH cement system could serve to reduce/inhibit the corrosion. However, before such cements can be considered, two main research problems must be addressed, as follows: (1) quantitative evaluation of alternative cement systems based on their corrosion performance with aluminium; (2) high heat generation due to the rapid rate of hydration. The research in this thesis was thus divided into two strands, as follows: (1) The design and development of a novel, scientifically robust testing facility for the quantitative monitoring of aluminium corrosion in cement pastes; (2) the development of novel cement composites based on weakly alkaline calcium sulfoaluminate (CSA) cement for the encapsulation of aluminium from nuclear wastes. The output from this research is considered to be of interest to the UK nuclear industry.
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Ludurczak, Willy Pellet Claude. "Capteur d'humidité en Si poreux pour la fiabilité des systems in package." S. l. : S. n, 2008. http://ori-oai.u-bordeaux1.fr/pdf/2008/LUDURCZAK_WILLY_2008.pdf.

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Kang, Ji-Hwan. "Energy transfer enhancement of photon upconversion systems for solar energy harvesting." Thesis, Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/45846.

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Photon energy upconversion (UC), a process that can convert two or more photons with low energy to a single photon of higher energy, has the potential for overcoming the thermodynamic efficiency limits of sunlight-powered devices and processes. An attractive route to lowering the incident power density for UC lies in harnessing energy transfer through triplet-triplet annihilation (TTA). To maximize energy migration in multicomponent TTA-assisted UC systems, triplet exciton diffusivity of the chromophores within an inert medium is of paramount importance, especially in a solid-state matrix for practical device integration. In this thesis, low-threshold sensitized UC systems were fabricated and demonstrated by a photo-induced interfacial polymerization within a coaxial-flow microfluidic channel and in combination with nanostructured optical semiconductors. Dual-phase structured uniform UC capsules allow for the highly efficient bimolecular interactions required for TTA-based upconversion, as well as mechanical strength for integrity and stability. Through controlled interfacial photopolymerization, diffusive energy transfer-driven photoluminescence in a bi-molecular UC system was explored with concomitant tuning of the capsule properties. We believe that this core-shell structure has significance not only for enabling promising applications in photovoltaic devices and photochromic displays, but also for providing a useful platform for photocatalytic and photosensor units. Furthermore, for improving photon upconverted emission, a photonic crystal was integrated as an optical structure consisting of monodisperse inorganic colloidal nanoparticles and polymer resin. The constructively enhanced reflected light allows for the reuse of solar photons over a broad spectrum, resulting in an increase in the power conversion efficiency of a dye-sensitized solar cell as much as 15-20 %.
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Ludurczak, Willy. "Capteur d’humidité en Si poreux pour la fiabilité des systems in package." Thesis, Bordeaux 1, 2008. http://www.theses.fr/2008BOR12244/document.

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La problématique de cette thèse est l’amélioration de la fiabilité des systèmes électroniques encapsulés, concernant l’herméticité et les perturbations causées par les infiltrations d’humidité. Le travail consiste en l’étude d’un capteur pour mesurer in situ le taux d’humidité dans les cavités des systèmes encapsulés. Comparativement aux actuelles techniques d’évaluation de l’herméticité, l’intérêt du dispositif réside dans la généralisation du test à chaque cavité, le contrôle de l’atmosphère de la cavité sur une longue période d’utilisation, et la correction automatique de la dérive occasionnée (packaging intelligent). Deux structures en Si poreux (SP) ont été étudiées pour réaliser des capteurs, et ont d’abord été caractérisées d’un point de vue morphologique. Les deux couches ont la même porosité de 45 %. Les mesures de sorption d’azote appliquées aux théories BET et BJH ont montré que SP1 et SP2 présentaient respectivement des surfaces spécifiques de 330 et 223 m²/g, et des diamètres poreux moyens de 4,3 et 5.5 nm. Une nouvelle méthode de caractérisation basée sur le traitement d’image de surface de Si poreux est présentée. La méthode permet d’estimer les distributions de taille de pore (DTP), porosité, surface spécifique et fraction volumique d’oxyde. Elle est validée par la cohérence des résultats obtenus, comparés à ceux donnés par les théories de sorption. Outre le caractère complet de l’analyse, les avantages de cette méthode sont sa simplicité de mise en œuvre, sa non restriction à une gamme de taille de pores, et l’absence d’hypothèse mathématique sur l’estimation de la DTP. Les tests électriques ont montré que SP1 présentait une résistance supérieure à SP2 et que le capteur basé sur SP1 présentait une plus grande sensibilité vis-à-vis de la prise d’humidité : -90 % entre 0 et 80 % d’humidité relative. La spécificité du transport électrique dans les structures étudiées a été mise en évidence expérimentalement, conduisant à l’hypothèse d’une barrière de potentiels à l’interface Si - Si poreux. La plus grande résistance présentée par SP1 a été explicitée par sa plus grande fraction volumique d’oxyde, ainsi que les effets plus prononcés de confinement quantique et de déplétion de surface. L’utilité d’un capteur d’humidité in situ en Si poreux pour l’herméticité des systems in package a été démontrée par les résultats expérimentaux d’un prototype<br>This work deals with the improvement of reliability of packaged electronic devices, concerning the hermeticity and the disturbances caused by moisture infiltration. As an analysis method of sealing quality of Systems in Package (SiP), a study of humidity sensors for in situ moisture level evaluation of SiP microcavities is presented. Compared to others analysis methods, the interest of the present one is its global utility for all manufactured chips, the capability to monitor the cavities atmosphere over a long period, and the possibility of automatic drifts correction. Two porous silicon (PS) based structures have been studied to make sensors. First we performed morphological analyses of PS layers. Both have a porosity of 45 %. Nitrogen sorption measurements applied to BET and BJH theories showed that PS1 and PS2 respectively present specific areas of 330 and 223 m²/g and mean pore diameters of 4.3 and 5.5 nm. A new analysis method based on processing of PS surface images is presented. It allows the estimation of pore size distribution (PSD), porosity, specific area, and volumic oxide ratio. The method has been validated by the closeness between its results and sorption theories results. In addition to the method’s completeness, it presents several advantages such as easy-to-use application, no restriction on PSD range, and no computing hypothesis on PSD evaluation. Electrical measurements showed that PS1 resistance is higher than PS2 resistance, and that sensitivity of PS1 based sensors exposed to moisture variation is superior: -90 % from 0 to 80 % relative humidity. Specificity of carriers transport in PS structures has been experimentally underlined; leading to the hypothesis of a potential barrier between PS and non porous Si. Higher resistance has been explained by the higher volumic oxide ratio of PS1, and the more developed quantum confinement and depletion surface effects. Utility of such in situ PS moisture sensor for SiP hermeticity has been demonstrated by preliminary experimental results
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Liang, Ya Palmese Giuseppe R. Lowman Anthony M. "Functional polymer-polymer composites by nano/meso-fiber encapsulation : applications in drug delivery systems and polymer toughening /." Philadelphia, Pa. : Drexel University, 2010. http://hdl.handle.net/1860/3316.

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Wai, Yuen Mun. "Ethernet encapsulation and emulation for DVB/MPEG multimedia wireless systems : base station and subscriber interface VHDL designs." Thesis, Nottingham Trent University, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.431894.

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Books on the topic "Encapsulation systems"

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Lakkis, Jamileh M., ed. Encapsulation and Controlled Release Technologies in Food Systems. John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781118946893.

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Lakkis, Jamileh M., ed. Encapsulation and Controlled Release Technologies in Food Systems. Blackwell Publishing, 2007. http://dx.doi.org/10.1002/9780470277881.

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International Conference on Red Blood Cell Carriers (1st 1984 Rockefeller Foundation Bellagio Study and Conference Center). Red blood cells as carriers for drugs: A method for disseminating chemotherapeutics, hormones, enzymes, and other therapeutic agents via the circulatory system. Edited by DeLoach J. R, Sprandel U, and Rockefeller Foundation. Karger, 1985.

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Jones, William H. Project integration architecture: Architectural overview. National Aeronautics and Space Administration, Glenn Research Center, 2001.

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Nakov, Svetlin. Fundamentals of Computer Programming with C#: The Bulgarian C# Book. Svetlin Nakov, 2013.

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Karsa, D. R., and R. A. Stephenson. Encapsulation and Controlled Release. Woodhead Publishing Ltd, 1993.

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Brinker, Udo H., and Jean-Luc Mieusset. Molecular Encapsulation: Organic Reactions in Constrained Systems. Wiley & Sons, Incorporated, John, 2011.

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Brinker, Udo H., Jean-Luc Mieusset, and Jean-Luc Mieusset. Molecular Encapsulation: Organic Reactions in Constrained Systems. Wiley & Sons, Incorporated, John, 2010.

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Brinker, Udo H., and Jean-Luc Mieusset. Molecular Encapsulation: Organic Reactions in Constrained Systems. Wiley & Sons, Incorporated, John, 2011.

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Udo, Brinker, and Mieusset Jean-Luc, eds. Molecular encapsulation: Organic reactions in constrained systems. Wiley, 2010.

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Book chapters on the topic "Encapsulation systems"

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Zakharova, Lucia, Alla Mirgorodskaya, Elena Zhiltsova, Ludmila Kudryavtseva, and Alexander Konovalov. "Reactions in Supramolecular Systems." In Molecular Encapsulation. John Wiley & Sons, Ltd, 2010. http://dx.doi.org/10.1002/9780470664872.ch15.

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Abraham, Werner, and Lutz Grubert. "Organic Cations in Constrained Systems." In Molecular Encapsulation. John Wiley & Sons, Ltd, 2010. http://dx.doi.org/10.1002/9780470664872.ch12.

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Goosen, Mattheus F. A. "Mass Transfer in Immobilized Cell Systems." In Cell Encapsulation Technology and Therapeutics. Birkhäuser Boston, 1999. http://dx.doi.org/10.1007/978-1-4612-1586-8_2.

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Thies, Curt. "Encapsulation by complex coacervation." In Encapsulation and Controlled Release Technologies in Food Systems. John Wiley & Sons, Ltd, 2016. http://dx.doi.org/10.1002/9781118946893.ch3.

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Fang, Zhongxiang, and Bhesh Bhandari. "Encapsulation Techniques for Food Ingredient Systems." In Food Materials Science and Engineering. Wiley-Blackwell, 2012. http://dx.doi.org/10.1002/9781118373903.ch12.

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Nedović, Viktor, Ana Kalušević, Verica Manojlović, Tanja Petrović, and Branko Bugarski. "Encapsulation Systems in the Food Industry." In Food Engineering Series. Springer US, 2013. http://dx.doi.org/10.1007/978-1-4614-7906-2_13.

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Jana, Sougata, Arijit Gandhi, and Kalyan Kumar Sen. "Delivery Systems for Proteins and Peptides." In Applications of Encapsulation and Controlled Release. CRC Press, 2019. http://dx.doi.org/10.1201/9780429299520-9.

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Kaifer, Angel E. "Molecular Encapsulation of Redox-Active Guests." In Electrochemistry of Functional Supramolecular Systems. John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470583463.ch3.

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Gorman, Christopher B. "Dendritic Encapsulation of Redox-Active Units." In Electrochemistry of Functional Supramolecular Systems. John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470583463.ch4.

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Singh, Sauraj, Ruchir Priyadarshi, Bijender Kumar, et al. "Polymer–Drug Conjugates as Drug Delivery Systems." In Applications of Encapsulation and Controlled Release. CRC Press, 2019. http://dx.doi.org/10.1201/9780429299520-4.

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Conference papers on the topic "Encapsulation systems"

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Fleissner, Sebastian. "Towards transitory encapsulation." In SPLASH '15: Conference on Systems, Programming, Languages, and Applications: Software for Humanity. ACM, 2015. http://dx.doi.org/10.1145/2814189.2817274.

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Franck, Laurent, and Rosalba Suffritti. "Multiple Alert Message Encapsulation over Satellite." In Electronic Systems Technology (Wireless VITAE). IEEE, 2009. http://dx.doi.org/10.1109/wirelessvitae.2009.5172503.

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Marshall, Scott M., John M. Bellardo, Daniel Nelson, and Bryan Clevenger. "Reactive Encapsulation Mappings in HIDRA." In Internet and Multimedia Systems and Applications / 747: Human-Computer Interaction. ACTAPRESS, 2011. http://dx.doi.org/10.2316/p.2011.746-019.

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Cruickshank, H., L. Liang, P. Pillai, M. Noisternig, B. Collini-Nocker, and G. Fairhurst. "Unified link layer security design for IP encapsulation using unidirectional lightweight encapsulation over satellites." In 27th IET and AIAA International Communications Satellite Systems Conference (ICSSC 2009). IET, 2009. http://dx.doi.org/10.1049/cp.2009.1153.

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Yusen Lin and Bhattcharya. "System engineering encapsulation of reliability techniques." In Fourth International Workshop on Object-Oriented Real-Time Dependable Systems. IEEE, 1999. http://dx.doi.org/10.1109/words.1999.806572.

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Abbes, Fatma, Emmanuel Casseau, and Mohamed Abid. "IP encapsulation: Approach and Case Study." In 2006 International Conference on Computer Engineering and Systems. IEEE, 2006. http://dx.doi.org/10.1109/icces.2006.320424.

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Forehand, David I., and Charles L. Goldsmith. "Wafer Level Micropackaging for RF MEMS Switches." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73398.

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Abstract:
Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package added insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.
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Eberhard, Denis, and Frank Grosshauser. "Encapsulation of Software-Modules of Safety-Critical Systems." In SAE World Congress & Exhibition. SAE International, 2007. http://dx.doi.org/10.4271/2007-01-1485.

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Penrose, Howard W., and Donald Wittmuss. "Evaluation of vacuum encapsulation systems for integral motors." In 2011 Electrical Insulation Conference (EIC) (Formerly EIC/EME). IEEE, 2011. http://dx.doi.org/10.1109/eic.2011.5996142.

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Young, S. J., D. Janssen, E. A. Wenzel, B. M. Shadakofsky, and F. A. Kulacki. "Electronics cooling with onboard conformal encapsulation." In 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2016. http://dx.doi.org/10.1109/itherm.2016.7517557.

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Reports on the topic "Encapsulation systems"

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COVEY, L. I. WESF Capsule and Encapsulation Database System (EDS) Configuration Document. Office of Scientific and Technical Information (OSTI), 2000. http://dx.doi.org/10.2172/804816.

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Buelt, J. L. Mobile encapsulation and volume reduction system for wet low-level wastes. Office of Scientific and Technical Information (OSTI), 1985. http://dx.doi.org/10.2172/5401671.

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Elliston, B. Encapsulating IP with the Small Computer System Interface. RFC Editor, 1997. http://dx.doi.org/10.17487/rfc2143.

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HOFFERBER, G. A. Interface Control Document Between the Double Shell Tank (DST) system and the Waste Encapsulation and Storage Facility (WESF). Office of Scientific and Technical Information (OSTI), 2000. http://dx.doi.org/10.2172/802981.

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Burgess, J. S. Analysis of K-1 fan system for replacement of valve actuator, B Plant/Waste Encapsulation and Storage Facility. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/10114574.

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