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Journal articles on the topic 'Rugged electronics'

Author: Grafiati

Published: 4 June 2021

Last updated: 3 February 2022

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1

Marcus, IraR. "4513064 Package for rugged electronics." Microelectronics Reliability 26, no. 2 (1986): 398–99. http://dx.doi.org/10.1016/0026-2714(86)90746-8.

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2

Beach, L. A., and G. W. Phillips. "Electronics Package for Rugged HPGE Detectors." IEEE Transactions on Nuclear Science 33, no. 1 (1986): 664–67. http://dx.doi.org/10.1109/tns.1986.4337189.

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3

Qian, You, Bo Woon Soon, Pushpapraj Singh, Humberto Campanella, and Chengkuo Lee. "All metal nanoelectromechanical switch working at 300 °C for rugged electronics applications." Nanoscale 6, no. 11 (2014): 5606. http://dx.doi.org/10.1039/c3nr05255a.

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4

Shenai, Krishna, Philip G. Neudeck, M. Dudley, and Robert F. Davis. "Material Defects and Rugged Electrical Power Switching in Semiconductors." Materials Science Forum 717-720 (May 2012): 1077–80. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1077.

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A paradigm shift in the development and utilization of power semiconductor switch technology is proposed. This new "top down" approach begins with the field-reliability of a power semiconductor switch in a power converter circuit is subjected to long-term repetitive-switching under stressful field-operating conditions. This approach is derived from extensive field-reliability data collected on state-of-the-art silicon power MOSFETs in compact computer/telecom power supplies that clearly suggests that power MOSFET field-failures were primarily caused by bulk material defects. A careful survey of power switch technologies reported to-date in Silicon Carbide (SiC) and Gallium Nitride (GaN) further suggests that excessive bulk material defects have predominantly hindered the development and commercialization of cost-effective, high-performance, and reliable high-power devices. A reliability-driven approach is likely to "unlock" the vast potential of SiC (and GaN for moderate power levels) power device technology for high-voltage and high-power switching electronics in order to impact transformative changes.

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5

Egan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (1999): 98–106. http://dx.doi.org/10.1115/1.483140.

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Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of wearable computers in a polymer composite substrate. As both a protective outer case and a conductive heat dissipating medium, the substrate satisfies two basic constraints of wearable computer design: ruggedness and cooling efficiency. One such application of embedded electronics is the VuMan3R, a wearable computer designed and manufactured at Carnegie Mellon University for aircraft maintenance. This paper combines finite element numerical simulations, physical experimentation, and analytical models to understand the thermal phenomena of embedded electronic design and to explore the thermal design space. Numerical models ascertain the effect of heat spreaders and polymer composite substrates on the thermal performance, while physical experimentation of an embedded electronic artifact ensures the accuracy of the numerical simulations and the practicality of the thermal design. Analytical models using thermal resistance networks predict the heat flow paths within the embedded electronic artifact as well as the role of conductive fillers used in polymer composites. [S1043-7398(00)00102-X]

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6

Shashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.

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Abstract Alumina and aluminum nitride substrates are routinely used in micro-electronic packaging where large quantity of heat needs to be dissipated, such as in LED packaging, high power electronics and laser packaging. Heat management in high power electronics or LED's is crucial for their lifespan and reliability. The ever-increasing need for higher power keeps challenging the packaging engineers to become more sophisticated in their packaging. With the availability of a 40 μm thick, high thermal conductivity ribbon alumina from Corning, the options available for packaging engineers has widened. This product has very high dielectric breakdown (~10kV at 40 μm thick), high thermal conductivity (&gt;36 W/mK) and is rugged enough to be handled (with components attached) during packaging. These characteristics make ribbon alumina a cost-effective alternative to incumbent materials such as thick aluminum nitride, for use in high power microelectronics packaging. In this paper, high power LED and IGBT modules are modeled using commercially available code from ANSYS®. A geometry representative of typical LED packaging and IGBT packaging is constructed with Ansys Design Modeler platform and the allied meshing is done employing in-built Meshing tool in ANSYS Workbench®. We show that packaging with ~40 μm ribbon alumina delivers performance on par with or better than packaging with thicker aluminum nitride substrates.

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7

STOPA, PETER J., JOLANTA I. SOOS, RONALD G. ROSEMEIER, SUDHIR B. TRIVEDI, and SUSAN W. KUTCHER. "DEVELOPMENT OF MINIATURE ACOUSTO OPTIC TUNABLE FILTER (AOTF) SPECTROMETER FOR DETECTION OF TOXIC INDUSTRIAL CHEMICALS (TICS)." International Journal of High Speed Electronics and Systems 17, no. 04 (2007): 867–76. http://dx.doi.org/10.1142/s0129156407005041.

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This paper describes a remotely operable miniature spectrometer for the detection of Toxic Industrial Chemicals (TIC) using Near Infra-Red (NIR) spectroscopy. The spectrometer discussed here is compact, rugged and capable of operating on either as a handheld unit or on robotic platforms. The packaged unit consists of two modules: an optical head unit and an electronics unit. The optical head contains an infra-red light source, an Acousto-Optical Tunable Filter (AOTF) spectrometer, and associated electronics. The other module is contains the associated electronics assembly and cables connecting it with the optical head. This unit has fiber optic and free space detection capabilities and can be operated using 24 V battery power packs. We have developed a method to detect unknown chemical threat using measured signatures of known chemicals and chemometric techniques. At this time the system can detect chemicals in solid and liquid forms. We are currently optimizing the system for detection of chemicals in gaseous/vapor forms.

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8

MacGugan, D. "DM300 - A 300°C Geothermal Directional Module Development." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (2012): 000293–300. http://dx.doi.org/10.4071/hitec-2012-tha11.

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Enhanced high-temperature geothermal drilling operations require accurate directional drilling measurements to efficiently configure the borehole. A rugged, 300°C capable directional drilling module, Honeywell's DM300, provides the geothermal drilling operator with accurate indications of tool-face angle, inclination, and heading of the down-hole assembly. The DM300 system incorporates two orthogonal arrays of accelerometers and magnetometers with their associated electronic circuitry as well as system level circuitry. The sensors and electronics are packaged in a sealed 1 ¼″ diameter titanium housing. The DM300 high-temperature electronics approach utilizes custom Honeywell developed ASICs that leverage our proven HTSOI4™ silicon-on-insulator technology to successfully operate at 300°C. Vibrating beam MEMS accelerometers provide an inherently digital acceleration signal, through measurement of beam vibration phase using counting methods. Flux-gate magnetometers incorporate a custom voltage-to-frequency converter digitizing ASIC. The magnetometer ASIC integrates several system level functions to reduce chip count in the overall system design. Active cooling is not required for these DM300 features to operate, perform, and survive in a 300°C down-hole environment. This paper presents system concept design and implementation through a two phase development. The current development phase focuses on the development and characterization of the sensors, their associated electronics, and packaging into a 300°C capable housing. A future development phase will incorporate a 300°C capable Gate Array ASIC and EEPROM. The Gate Array functions capture the digital sensor signals and provides SPI bus interface as required for a deployable directional drilling module.

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9

Smith, Tom, Phil Husbands, and Michael O'Shea. "Fitness Landscapes and Evolvability." Evolutionary Computation 10, no. 1 (2002): 1–34. http://dx.doi.org/10.1162/106365602317301754.

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In this paper, we develop techniques based on evolvability statistics of the fitness land-scape surrounding sampled solutions. Averaging the measures over a sample of equal fitness solutions allows us to build up fitness evolvability portraits of the fitness land-scape, which we show can be used to compare both the ruggedness and neutrality in a set of tunably rugged and tunably neutral landscapes. We further show that the tech-niques can be used with solution samples collected through both random sampling of the landscapes and online sampling during optimization. Finally, we apply the techniques to two real evolutionary electronics search spaces and highlight differences between the two search spaces, comparing with the time taken to find good solutions through search.

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MacGugan, Douglas C., Eric C. Abbott, and J. Chris Milne. "230°C Accelerometer with Digitized Output for Directional Drilling." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000298–304. http://dx.doi.org/10.4071/hitec-tha14.

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Measurement-While-Drilling (MWD) technology for oil and gas, and geothermal directional drilling exploration is pushing into ever higher temperature environments - beyond 200°C. Orientation sensors supporting these high temperature environments need to provide highly accurate elevation and tool face measurements on the order of 0.1°. Honeywell has developed a new digital high temperature down-hole accelerometer, DHTA230, capable of providing the required accuracy at the elevated temperatures of 230°C, in the rugged MWD shock and vibration environment, with expected excellent reliability and life. The DHTA230 is designed for use in the downhole environment, but is based upon a mature Honeywell accelerometer using dual vibrating beam sensing elements. These sensing elements are configured as double-ended-tuning-forks in a push-pull orientation attached onto a pendulous proof mass. This push-pull configuration provides an acceleration signal proportional to the frequency difference of the vibrating beams, an easily captured digital signal through measurement of the two vibrating beam phases. The digitized accelerometer eliminates the need for A/D electronics in the high temperature drilling environment. The DHTA230 is 0.79” in diameter with a depth of .393” at the mount flange. The ruggedized configuration of the DHTA230 is expected to provide reliable orientation measurement in high temperature direction drilling applications up to 1000h. The DHTA230 electronics incorporate ceramic hybrids with chip and wire construction. Active die are based upon proven 300°C chips developed previously for the Enhanced Geothermal Systems OM300, fabricated using Honeywell HTSOI4 process. The electronics include power conditioning providing reliable operation using a single power supply between 7V and 15V. Dual oscillator electronic circuits provide the necessary function to drive and sense the dual vibrating beams, while providing a CMOS logic level signal of the frequency pulse train. The accelerometer provides precision output up to 15g acceleration inputs, and allows sensing of higher-g vibration levels. This paper contains information on the target application, electrical and mechanical component requirements, design, fabrication approach, and initial prototype testing. The DHTA230 is expected to enter production transition in 2015.

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11

Chiolino, N., A. M. Francis, J. Holmes, M. Barlow, and C. Perkowski. "470 Celsius Packaging System for Silicon Carbide Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (2021): 000083–88. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000083.

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Abstract High temperature Silicon Carbide (SiC) integrated circuit (IC) processes have enabled devices that operate at &gt;450°C for more than a year. These results have established the need for more advanced and practical packaging strategies. Off the shelf state of the art packages cannot withstand the same high temperatures as the semiconductor can for long periods of time. Packaging SiC die to survive temperatures &gt;450°C, while also maintaining a reasonable packaging strategy that is agile, rapid, and modular, presents new challenges. Presented is a technique for packaging SiC die with a focus on additive manufacturing, modular design scaling, and rugged survivability. This packaging strategy utilizes state of the art Additive Manufacturing (AM) methods, using an nScrypt 3Dn-Tabletop printer, together with stereolithography (SLA) digital light processing (DLP) 3D printing. Ultra-violet (UV) curable ceramic resins are used to create high temperature connectors. A design environment is also described, in which first time correct, interconnect layers are verified in software to reduce the risk of errors. A Ceramic Wiring Board Process Design Kit (CWBPDK) allows the design of single or multiple layers of metal, with fabricated SiC die. This interconnect is verified with standard design rule checking (DRC) and layout vs. schematic (LVS) software. Entire systems in packages can be verified using multiple SiC die. Input and output pins (I/O) are connected to these modules using metal connectors. After design, manufacturing can be performed in just a few days. A system in package for driving a stepper motor was designed and fabricated using this packaging method. The motor actuator design utilizes four separate SiC die. These die contain large JFETs designed for sourcing current in a unipolar stepper motor architecture. This module was placed in a furnace at 470°C and demonstrated functional operation for over 1000 hours. These devices were able to source an average of 30 mA in &gt;400°C temperatures to drive the room temperature stepper motor. A high I/O count, next generation package for discrete SiC chips was also designed using this packaging system. A single large JFET component was soaked for over 100 hours at both 500°C and 800°C. Utilizing Ozark IC’s automated test design environment, several DC and transient variables were captured for both tests and will be presented.

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12

Beaton, Stuart P., and Mike Spowart. "UV Absorption Hygrometer for Fast-Response Airborne Water Vapor Measurements." Journal of Atmospheric and Oceanic Technology 29, no. 9 (2012): 1295–303. http://dx.doi.org/10.1175/jtech-d-11-00141.1.

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Abstract A next-generation vacuum-ultraviolet (Lyman-alpha) absorption hygrometer for high-rate research aircraft humidity measurements designed by the National Center for Atmospheric Research is described. It retains the high data rate, optical and mechanical simplicity, and low maintenance of previous Lyman-alpha hygrometers, while incorporating modern electronics and rugged, long-lived commercially available lamps and detectors. The mass of the sensing head is 2.0 kg in a volume of 3700 cm3, while the power supply is 1.3 kg mass in a volume of 1100 cm3. Power draw is 0.2 A at 120 V alternating current (AC). In bench and aircraft flight testing the prototype shows a bandwidth of 35 Hz and mixing ratio noise of ±0.5% over a water vapor mixing ratio range of 2–15 g kg−1. This range can be scaled to lower mixing ratios by increasing the pathlength. This performance enables measurements of water vapor concentration with high spatial resolution from research aircraft. The prototype instrument has flown over 380 h with minimal maintenance or repairs.

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13

Stabach, Jennifer, Zach Cole, Chad B. O'Neal, Brice McPherson, Robert Shaw, and Brandon Passmore. "A High Performance Power Package for Wide Bandgap Semiconductors Using Novel Wire Bondless Power Interconnections." International Symposium on Microelectronics 2015, no. 1 (2015): 000353–58. http://dx.doi.org/10.4071/isom-2015-wp16.

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Silicon carbide (SiC) wide bandgap semiconductor power device technologies offer improved electrical and thermal performance over silicon in high performance power electronic applications, such as hybrid or fully electric vehicles, aerospace, solar inverters, and advanced military systems. However, current packaging limitations make it difficult to operate these devices to their full potential. One such limitation includes die interconnections, which are traditionally made using large diameter aluminum wire bonds. This discussion introduces an innovative wire bondless interconnect technique for power packaging called PowerStep. This approach includes a precision etched metal tab with raised regions matching the size and location of device terminals and trenches to accommodate critical features on devices such as passivated surfaces. The tab offers a low profile, low inductance, low resistance, high electrical and thermal conductivity, and mechanically rugged interconnection solution. PowerStep has been implemented to facilitate a single-step interconnection method for a 600 to 1700 V SiC electronics package, replacing wire bonds which are connected one at a time. In addition, a key element of this package is the absence of a baseplate, resulting in lower weight, volume, and cost, as well as reduced manufacturing complexity. The electrical, thermal, and mechanical characteristics of PowerStep interconnections are analyzed and compared to conventional aluminum wire bonds to demonstrate the advantages of wire bondless interconnections coupled with wide bandgap devices. The low parasitics and junction-to-case thermal resistance of the package combined with PowerStep interconnects capture the high performance of SiC for power applications.

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14

Paula, Greg. "The Rise of VSR Motors." Mechanical Engineering 120, no. 02 (1998): 86–87. http://dx.doi.org/10.1115/1.1998-feb-6.

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This article reviews variable-switched reluctance (VSR) motors that are now entering mainstream use from jet fighters to washing machines. A VSR motor is generally used as a stepper motor and, if properly controlled, can be made to behave like a servomotor. Basically, the motor is a rotor and stator with a coil winding in the stator. VSR motors also provide other benefits. They can be programmed to precisely match the loads they serve, and their simple, rugged construction has no expensive magnets or squirrel cages like the ac induction motor. It can be difficult to give VSR motors a smooth torque profile, so they are used more often in place of variable speed motors than as servomotors. There are ways to control torque ripple, such as adding encoders and electronics to compensate, but these added controls could cost at least as much as what the motor itself would save. VSR motors work with relatively small air gaps. If the shaft is off-center, unbalanced tangential forces come into play, so shafts and bearing systems generally need to be of a higher quality than with other motors.

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Pant, Bharat B., Lucky Withanawasam, Mike Bohlinger, Mark Larson, and Bruce W. Ohme. "High Temperature Anisotropic Magnetoresistive (AMR) Sensors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (2015): 000236–43. http://dx.doi.org/10.4071/hiten-session7-paper7_1.

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Magnetic field sensors are employed in down-hole oil, gas, and geothermal well-drilling applications for azimuth sensing, orientation/rotation sensing, and magnetic anomaly detection. Key requirements of these applications include high measurement accuracy in the near-DC frequency regime, high-operating temperatures, high mechanical shock and vibration, and severe size constraints. Silicon manufacturing processes enable the development of rugged components with small size compatible with assembly processes used for adjacent electronics in hermetically sealed hybrid and/or ceramic packages. Silicon-based magnetic sensors include Anistotropic Magnetoresistive (AMR), Giant Magnetoresistive (GMR) and Tunnelling Magnetoresistive (TMR) sensors. Commercially available GMR and TMR sensors generally cannot be operated much above 150°C. While GMR and TMR have enabled great areal density growth for magnetic recording industry over the past two decades, AMR sensors provide high accuracy measurements in the near-DC regime above 150°C. This is in part due to simplicity of their construction, but also due to their low noise characteristics at low frequencies compared to GMR and TMR. This paper will describe the extension of Honeywell's low noise AMR sensors into high temperature regime up to 225°C. Sensors being reported have room temperature bridge resistance of ~700 Ω, open loop sensitivity of ~2.5 mV/V-Gauss, with a temperature coefficient of sensitivity of −2500 ppm/°C. The low-frequency minimum detectable field monotonically increases with increasing temperature. At room temperature it is ~2.2 μG/√Hz@1 Hz and reaches a value of ~26μG/√Hz@1 Hz at 225°C. Signal and noise density both increase with increasing sensor bias voltage such that low-frequency signal-to-noise ratio does not vary in the bias voltage range of 2.5 V to 10V. These sensors have also been configured in a closed loop format using low noise electronics. Measurements of closed loop transfer function in the range of ±0.8 Gauss were made. The sensor was placed in a thermal chamber while the feedback electronics were placed outside at room temperature. The linearity of the transfer function is quite excellent; deviation from linearity increases monotonically with increasing temperature reaching &lt; 0.002% of full scale or 29 μGauss at 225°C. Closed loop operation of a typical sensor shows 1-σ measurement variability of 21 μGauss at 220°C. By a combination of averaging and closed loop operation an input step from 0 to 75 μGauss is replicated at the output to within 0.1 μG at 225°C.

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16

JPT staff, _. "Electronic Gauges Fine-Tuned For Rugged, Permanent Downhole Monitoring." Journal of Petroleum Technology 55, no. 08 (2003): 26. http://dx.doi.org/10.2118/0803-0026-jpt.

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17

Thorn EMI Electronics Ltd. "Rugged plasma displays." Displays 7, no. 1 (1986): 48. http://dx.doi.org/10.1016/0141-9382(86)90053-3.

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18

Guan, Yong, Sheng Zhen Jin, Li Feng Wu, Wei Pan, Yong Mei Liu, and Jie Zhang. "Power Supply Prognostics and Health Management of High Reliability Electronic Systems in Rugged Environment." Key Engineering Materials 474-476 (April 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/kem.474-476.1195.

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The high reliable embedded system in rugged environment has huge potential application value. There are 34% faults in electronic system by the cause of the fault of power system. So the prognostics mechanism and the algorithm of power health has been a core support technology in applications. the fault and the deterioration and healing model of the power system in rugged environment is constructed by analysis of FFP, DFP and healing(alleviation)for improving the reliability, the usability and the maintainability. And many questions such as fixed-time maintenance and back-down maintenance depending on conventional statistical method are solved fundamentally. Finally, the prognostics and health management methods of power health in domestic and foreign presently are contrasted and analyzed.

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19

Walker, G. R., and N. G. Walker. "Rugged all-fibre endless polarisation controller." Electronics Letters 24, no. 22 (1988): 1353. http://dx.doi.org/10.1049/el:19880925.

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20

Ma, Ruiqing, Mike Hack, and Julie J. Brown. "Flexible AMOLEDs for Low-Power, Rugged Applications." Information Display 26, no. 2 (2010): 8–14. http://dx.doi.org/10.1002/j.2637-496x.2010.tb00213.x.

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21

Yuan, Xin’an, Wei Li, Xiaokang Yin, et al. "Identification of Tiny Surface Cracks in a Rugged Weld by Signal Gradient Algorithm Using the ACFM Technique." Sensors 20, no. 2 (2020): 380. http://dx.doi.org/10.3390/s20020380.

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It is still a big challenge to identify tiny surface cracks in a rugged weld due to the lift-off variations using the nondestructive testing (NDT) method. In this paper, the signal gradient algorithm is presented to identify the tiny surface crack in the rugged weld using the alternating current field measurement (ACFM) technique. The ACFM simulation model and testing system was set up to obtain the insensitive signal to the lift-off variations. The signal gradient algorithm was presented to process the insensitive signal for the identification of the tiny surface crack in the rugged weld. The results show that the Bz signal is the insensitive signal to lift-off variations caused by the rugged weld. The signal to noise ratio (SNR) of the crack identification signal was greatly improved by the signal gradient algorithm, and a tiny surface crack can be identified effectively in the weld and the heat affected zone (HAZ).

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22

Shenai, Krishna, Michael Dudley, and Robert F. Davis. "Rugged Electrical Power Switching in Semiconductors: A Systems Approach." Proceedings of the IEEE 102, no. 1 (2014): 35–52. http://dx.doi.org/10.1109/jproc.2013.2278616.

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23

Rudolph, M., N. Chaturvedi, K. Hirche, J. Wurfl, W. Heinrich, and G. Trankle. "Highly Rugged 30 GHz GaN Low-Noise Amplifiers." IEEE Microwave and Wireless Components Letters 19, no. 4 (2009): 251–53. http://dx.doi.org/10.1109/lmwc.2009.2015514.

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24

Badger, M., A. Julien, A. D. LeBlanc, S. H. Moustapha, A. Prabhu, and A. A. Smailys. "The PT6 Engine: 30 Years of Gas Turbine Technology Evolution." Journal of Engineering for Gas Turbines and Power 116, no. 2 (1994): 322–30. http://dx.doi.org/10.1115/1.2906823.

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The PT6 engine entered service in the mid-1960s. Since then, application of new technology has enabled low-cost development of engines approaching 1500 kW, the introduction of electronic controls, improved power-to-weight ratio, higher cycle temperature, and reduced specific fuel consumption. At the same time, PT6 field experience in business, commuter, helicopter, and trainer applications has resulted in engines with low Direct Operating Cost and a reputation for rugged design and a high standard of engine reliability. This paper will highlight some interesting examples of this technical evolution, including the development of electronic controls and the application of the latest three-dimensional aerodynamic and stress analysis to both compressor and turbine components.

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Xu, H. P. E., O. P. Trescases, I. S. M. Sun, et al. "Design of a rugged 60 V VDMOS transistor." IET Circuits, Devices & Systems 1, no. 5 (2007): 327. http://dx.doi.org/10.1049/iet-cds:20070008.

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Muhammad, Noor, Zhigeng Fang, and Muhammad Shoaib. "Remaining useful life (RUL) estimation of electronic solder joints in rugged environment under random vibration." Microelectronics Reliability 107 (April 2020): 113614. http://dx.doi.org/10.1016/j.microrel.2020.113614.

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Loret, Niccolò, Antonio Affinito, and Giuliano Bonanomi. "Introducing Evja - "Rugged" Intelligent Support System for precision farming." ACTA IMEKO 9, no. 2 (2020): 83. http://dx.doi.org/10.21014/acta_imeko.v9i2.795.

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<p>Precision agriculture is a farming system based on the combination of detailed observations, measuring and rapid-response to optimize energetic input to maximize crops production. Precision agriculture use decision support system (DSS) for optimize farm management. In this context, <em>EVJA Observe Prevent Improve</em> (or just EVJA) is an Intelligent Support System for precision agriculture. A vast set of data (i.e. temperature, relative humidity, deficit of vapour pressure, leaf wetness, solar radiation, carbon dioxide concentration, soil moisture etc.) is continuously collected, submitted to a local control unit, and processed through algorithms specifically developed for different crops. On the other hands, farmers can access EVJA from their pc and mobile devices, and monitor complex agronomic data analysis presented in a user-friendly interface.</p>In this article, we will show how EVJA works, and how its output can be used to assess the health state of plants through a specific set of functions. Moreover, we will show the methodology to develop useful predictive models based on this information.<p>Specifically, we will describe a predictive algorithms capable to predict the infection risks of downy mildew for baby leaves plantations and for Fusarium ear blight of wheat.</p>

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28

Reggiani, Susanna, Giorgio Baccarani, Elena Gnani, et al. "Explanation of the Rugged LDMOS Behavior by Means of Numerical Analysis." IEEE Transactions on Electron Devices 56, no. 11 (2009): 2811–18. http://dx.doi.org/10.1109/ted.2009.2030836.

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29

Battaglia, Brian, Dave Rice, Phuong Le, et al. "A rugged 100 W high-voltage vertical MOSFET L-band radar device." International Journal of Microwave and Wireless Technologies 1, no. 4 (2009): 277–84. http://dx.doi.org/10.1017/s1759078709990298.

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The silicon vertical MOSFET RF power amplifier described in this paper is the industry’s first to utilize high-voltage vertical technology. Operating under pulse conditions of 200 µs pulse width and 10% duty cycle, it delivers more than 100 W of peak power. Operating in Class AB with only 50 mA of bias current the device achieves more than 20 dB of gain and 47% power added efficiency at P1dB compression across 200 MHz of bandwidth at L-band from 1.2 to 1.4 GHz. The DC characteristics include a BVdss of 95 V enabling high-voltage operation with a 48 V power supply. The device is inherently rugged and withstands mismatch tolerances of 20:1 voltage standing wave ratio over all phase angles at full rated power and with 3 dB of input power over-drive and 10% greater than nominal voltage.

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Shiu, Jyh-Wen, Kuo-Chang Lee, Chao-Chiun Liang, Yuan-Chang Liao, Chen-Chu Tsai, and Janglin Chen. "A rugged display: Recent results of flexible cholesteric liquid-crystal displays." Journal of the Society for Information Display 17, no. 10 (2009): 811. http://dx.doi.org/10.1889/jsid17.10.811.

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31

Flynn, P. L., B. D. Hsu, and G. L. Leonard. "Coal-Fueled Diesel Engine Progress at GE Transportation Systems." Journal of Engineering for Gas Turbines and Power 112, no. 3 (1990): 369–75. http://dx.doi.org/10.1115/1.2906504.

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A coal-fueled diesel engine holds the promise of a rugged, modular heat engine that uses cheap, abundant fuel. Economic studies have indicated attractive returns at moderate diesel fuel prices. The compositions of coal-water fuels are being expanded to cover the major coal sources. Combustion has been developed at 1000 rpm with mechanical and electronic fuel injection. Dual fuel operation can run the engine over the load range. Erosion of fuel nozzles has been controlled with diamond compacts. Wear of piston rings and cylinder liners can be controlled with tungsten carbide coatings. Emission measurements show higher particulates and SO2 and lower NOx, CO, and HC. Particulate and SO2 control measures are being investigated.

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Schenato, Luca, Juan Pablo Aguilar-Lopez, Andrea Galtarossa, Alessandro Pasuto, Thom Bogaard, and Luca Palmieri. "A Rugged FBG-Based Pressure Sensor for Water Level Monitoring in Dikes." IEEE Sensors Journal 21, no. 12 (2021): 13263–71. http://dx.doi.org/10.1109/jsen.2021.3067516.

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Stedler, C., S. Werker, and R. Kronberger. "Rugged High-Linearity, Low-Noise Amplifier for 1.57-GHz GPS Band." IEEE Microwave Magazine 14, no. 1 (2013): 102–7. http://dx.doi.org/10.1109/mmm.2012.2226622.

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34

Podgaynaya, Alevtina, Ralf Rudolf, Dionyz Pogany, Erich Gornik, and Matthias Stecher. "Experimental and Theoretical Analyses of the Electrical SOA of Rugged p-Channel LDMOS." IEEE Electron Device Letters 31, no. 12 (2010): 1440–42. http://dx.doi.org/10.1109/led.2010.2081337.

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Toutin, T. "Three-dimensional topographic mapping with ASTER stereo data in rugged topography." IEEE Transactions on Geoscience and Remote Sensing 40, no. 10 (2002): 2241–47. http://dx.doi.org/10.1109/tgrs.2002.802878.

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Xiaoyi Wang, Huabing Huang, Peng Gong, Caixia Liu, Congcong Li, and Wenyu Li. "Forest Canopy Height Extraction in Rugged Areas With ICESat/GLAS Data." IEEE Transactions on Geoscience and Remote Sensing 52, no. 8 (2014): 4650–57. http://dx.doi.org/10.1109/tgrs.2013.2283272.

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Ma, Ruiqing, Kamala Rajan, Jeff Silvernail, et al. "Wearable 4-in. QVGA full-color-video flexible AMOLEDs for rugged applications." Journal of the Society for Information Display 18, no. 1 (2010): 50. http://dx.doi.org/10.1889/jsid18.1.50.

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Tan, Matthew Wei Ming, Gurunathan Thangavel, and Pooi See Lee. "Rugged Soft Robots using Tough, Stretchable, and Self‐Healable Adhesive Elastomers." Advanced Functional Materials 31, no. 34 (2021): 2103097. http://dx.doi.org/10.1002/adfm.202103097.

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Choi, Dongkyu, Youngsoo Kim, Seungmin Jung, Jongwon Kim, and Hwa Soo Kim. "A New Mobile Platform (RHyMo) for Smooth Movement on Rugged Terrain." IEEE/ASME Transactions on Mechatronics 21, no. 3 (2016): 1303–14. http://dx.doi.org/10.1109/tmech.2016.2520085.

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40

Eineder, M. "Efficient simulation of sar interferograms of large areas and of rugged terrain." IEEE Transactions on Geoscience and Remote Sensing 41, no. 6 (2003): 1415–27. http://dx.doi.org/10.1109/tgrs.2003.811692.

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Jeong, Heeyeon, Kyungjun Choi, Seong Jun Park, Cheol Hoon Park, Hyouk Ryeol Choi, and Uikyum Kim. "Rugged and Compact Three-Axis Force/Torque Sensor for Wearable Robots." Sensors 21, no. 8 (2021): 2770. http://dx.doi.org/10.3390/s21082770.

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In the field of robotics, sensors are crucial in enabling the interaction between robots and their users. To ensure this interaction, sensors mainly measure the user’s strength, and based on this, wearable robots are controlled. In this paper, we propose a novel three-axis force/torque sensor for wearable robots that is compact and has a high load capacity. The bolt and nut combination of the proposed sensor is designed to measure high-load weights, and the simple structure of this combination allows the sensor to be compact and light. Additionally, to measure the three-axis force/torque, we design three capacitance-sensing cells. These cells are arranged in parallel to measure the difference in capacitance between the positive and negative electrodes. From the capacitance change measured by these sensing cells, force/torque information is converted through deep neural network calibration. The sensing point can also be confirmed using the geometric and kinematic relation of the sensor. The proposed sensor is manufactured through a simple and inexpensive process using cheap and simply structured components. The performance of the sensor, such as its repeatability and capacity, is evaluated using several experimental setups. In addition, the sensor is applied to a wearable robot to measure the force of an artificial muscle.

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Peters, Klaus-Ruediger. "Detector strategies for environmental scanning electron microscopy." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 2 (1992): 1296–97. http://dx.doi.org/10.1017/s0424820100131115.

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Environmental SEM operate at specimen chamber pressures of ∼20 torr (2.7 kPa) allowing stabilization of liquid water at room temperature, working on rugged insulators, and generation of an environmental secondary electron (ESE) signal. All signals available in conventional high vacuum instruments are also utilized in the environmental SEM, including BSE, SE, absorbed current, CL, and X-ray. In addition, the ESEM allows utilization of the flux of charge carriers as information, providing exciting new signal modes not available to BSE imaging or to conventional high vacuum SEM.In the ESEM, at low vacuum, SE electrons are collected with a “gaseous detector”. This detector collects low energy electrons (and ions) with biased wires or plates similar to those used in early high vacuum SEM for SE detection. The detector electrode can be integrated into the first PLA or positioned at any other place resulting in a versatile system that provides a variety of surface information.

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Laviano, F., R. Gerbaldo, G. Ghigo, et al. "Rugged superconducting detector for monitoring infrared energy sources in harsh environments." Superconductor Science and Technology 23, no. 12 (2010): 125008. http://dx.doi.org/10.1088/0953-2048/23/12/125008.

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Sarkar, B. K., P. Mandal, R. Saha, S. Mookherjee, and D. Sanyal. "GA-optimized feedforward-PID tracking control for a rugged electrohydraulic system design." ISA Transactions 52, no. 6 (2013): 853–61. http://dx.doi.org/10.1016/j.isatra.2013.07.008.

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Rosato, J. J., P. C. Fazan, V. K. Mathews, et al. "Ultra‐High Capacitance Nitride Films Utilizing Surface Passivation on Rugged Polysilicon." Journal of The Electrochemical Society 139, no. 12 (1992): 3678–82. http://dx.doi.org/10.1149/1.2069143.

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Peters, Klaus-Ruediger, and Martin D. Fox. "Ultra-high resolution cinematic digital 3-D imaging of the cell surface by field-emission scanning electron microscopy." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 3 (1990): 12–13. http://dx.doi.org/10.1017/s0424820100157590.

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Field emission scanning electron microscopes (FSEM) establish high resolution on rugged bulk surfaces. However, often visualization and recognition of image details are hindered by low contrasts. Retrieval of such obscured image information is possible with three-dimensional (3-D) imaging.3-D information can be accessed in several ways. At low magnifications direct TV-rate imaging is possible allowing continuous relocation of the specimen and deduction of 3-D information from dynamic changes of perspectives and parallax. Additionally, two images from different stereo perspectives can be simultaniously produced and 3-D information can directly be displayed through optical or electronic devices (stereo imaging). The combination of dynamic perspective changes and stereo-presentation matches the 3-D information input of the human visual system and provides an optimal tool for visual 3-D pattern recognition.At higher magnifications (>~10,000-20,000x) real time stereo imaging is not possible. 3-D information display becomes limited to stationary perspective displays generated with long frame times.

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Chowdhury, A. K. M. S., S. A. Akbar, S. Kapileshwar, and J. R. Schorr. "A Rugged Oxygen Gas Sensor with Solid Reference for High Temperature Applications." Journal of The Electrochemical Society 148, no. 2 (2001): G91. http://dx.doi.org/10.1149/1.1343105.

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Whitney, Jean M., Kuya Takami, Scott T. Sanders, and Yasuhiro Okura. "Design of System for Rugged, Low-Noise Fiber-Optic Access to High-Temperature, High-Pressure Environments." IEEE Sensors Journal 11, no. 12 (2011): 3295–302. http://dx.doi.org/10.1109/jsen.2011.2156780.

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Guo-Min, He, Li Shu-Ping, and Huang Mei-Chun. "Structural and Electronic Properties of RuSi, RuGe and OsSi." Chinese Physics Letters 18, no. 10 (2001): 1389–91. http://dx.doi.org/10.1088/0256-307x/18/10/329.

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Dasmahapatra, Sibsankar, Bikash Kumar Sarkar, Rana Saha, Amitava Chatterjee, Saikat Mookherjee, and Dipankar Sanyal. "Design of an Adaptive Fuzzy-Bias SMC and Validation for a Rugged Electrohydraulic System." IEEE/ASME Transactions on Mechatronics 20, no. 6 (2015): 2708–15. http://dx.doi.org/10.1109/tmech.2015.2393437.

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