Artículos de revistas sobre el tema "Compact thermal modeling"
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Wei Huang, M. R. Stan y K. Skadron. "Parameterized physical compact thermal modeling". IEEE Transactions on Components and Packaging Technologies 28, n.º 4 (diciembre de 2005): 615–22. http://dx.doi.org/10.1109/tcapt.2005.859737.
Lasance, C. "Special section on compact thermal modeling". IEEE Transactions on Components and Packaging Technologies 26, n.º 1 (marzo de 2003): 134–35. http://dx.doi.org/10.1109/tcapt.2003.814000.
Codecasa, L., D. D'Amore y P. Maffezzoni. "Compact Thermal Networks for Modeling Packages". IEEE Transactions on Components and Packaging Technologies 27, n.º 1 (marzo de 2004): 96–103. http://dx.doi.org/10.1109/tcapt.2004.825796.
Narasimhan, S., A. Bar-Cohen y R. Nair. "Thermal compact modeling of parallel plate heat sinks". IEEE Transactions on Components and Packaging Technologies 26, n.º 1 (marzo de 2003): 136–46. http://dx.doi.org/10.1109/tcapt.2003.811860.
Janicki, Marcin, Przemysław Ptak, Tomasz Torzewicz y Krzysztof Górecki. "Compact Thermal Modeling of Modules Containing Multiple Power LEDs". Energies 13, n.º 12 (17 de junio de 2020): 3130. http://dx.doi.org/10.3390/en13123130.
Chen, Ming, Yan Ting Yu, Bo Wang y Yong Tang. "Test of IGBT Transient Thermal Impedance and Modeling Research on Thermal Model". Advanced Materials Research 148-149 (octubre de 2010): 429–33. http://dx.doi.org/10.4028/www.scientific.net/amr.148-149.429.
Codecasa, Lorenzo, Vincenzo d’Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff y John Parry. "Partition-based approach to parametric dynamic compact thermal modeling". Microelectronics Reliability 79 (diciembre de 2017): 361–70. http://dx.doi.org/10.1016/j.microrel.2017.06.059.
KOYAMADA, Koji, Yasuharu YAMADA, Toshihiko NISHIO y Hidetoshi KOTERA. "Compact Modeling Approach using GA for Accurate Thermal Simulation." Transactions of the Japan Society of Mechanical Engineers Series B 65, n.º 632 (1999): 1370–76. http://dx.doi.org/10.1299/kikaib.65.1370.
Janicki, Marcin, Przemyslaw Ptak, Tomasz Torzewicz y Krzysztof Gorecki. "Compact Thermal Modeling of Color LEDs—A Comparative Study". IEEE Transactions on Electron Devices 67, n.º 8 (agosto de 2020): 3186–90. http://dx.doi.org/10.1109/ted.2020.2998459.
Bartholomeusz, Brian J. "Thermal modeling studies of organic compact disk-writable media". Applied Optics 31, n.º 7 (1 de marzo de 1992): 909. http://dx.doi.org/10.1364/ao.31.000909.
KOYAMADA, Koji, Masanori KUZUNO y Toshihiko NISHIO. "Compact Modeling for Thermal Simulation Using Response Surface Methodology". Proceedings of OPTIS 2000.4 (2000): 187–92. http://dx.doi.org/10.1299/jsmeoptis.2000.4.187.
Roy, A. S. y C. C. Enz. "Compact Modeling of Thermal Noise in the MOS Transistor". IEEE Transactions on Electron Devices 52, n.º 4 (abril de 2005): 611–14. http://dx.doi.org/10.1109/ted.2005.844735.
Kaija, Kimmo, Pekka Heino y Eero O. Ristolainen. "Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model". Journal of Microelectronics and Electronic Packaging 2, n.º 1 (1 de enero de 2005): 64–71. http://dx.doi.org/10.4071/1551-4897-2.1.64.
Wang, Y., H. Cai, L. A. B. Naviner, Y. Zhang, J. O. Klein y W. S. Zhao. "Compact thermal modeling of spin transfer torque magnetic tunnel junction". Microelectronics Reliability 55, n.º 9-10 (agosto de 2015): 1649–53. http://dx.doi.org/10.1016/j.microrel.2015.06.029.
Koyamada, Koji, Yasuharu Yamada, Toshihiko Nishio y Hidetoshi Kotera. "Compact modeling approach using genetic algorithms for accurate thermal simulation". Heat Transfer?Asian Research 30, n.º 1 (2000): 28–39. http://dx.doi.org/10.1002/1523-1496(200101)30:1<28::aid-htj4>3.0.co;2-3.
Walter, Frederick M. y Jose A. Pons. "Modeling the Atmosphere of RX J1856.5−3754". Symposium - International Astronomical Union 218 (2004): 279–82. http://dx.doi.org/10.1017/s0074180900181173.
Alexeev, A., G. Martin y G. Onushkin. "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs". Microelectronics Reliability 87 (agosto de 2018): 89–96. http://dx.doi.org/10.1016/j.microrel.2018.05.014.
Liu, Zao, Sheldon X. D. Tan, Hai Wang, Yingbo Hua y Ashish Gupta. "Compact thermal modeling for packaged microprocessor design with practical power maps". Integration 47, n.º 1 (enero de 2014): 71–85. http://dx.doi.org/10.1016/j.vlsi.2013.07.003.
Wei Huang, S. Ghosh, S. Velusamy, K. Sankaranarayanan, K. Skadron y M. R. Stan. "HotSpot: a compact thermal modeling methodology for early-stage VLSI design". IEEE Transactions on Very Large Scale Integration (VLSI) Systems 14, n.º 5 (mayo de 2006): 501–13. http://dx.doi.org/10.1109/tvlsi.2006.876103.
Melczarsky, I., J. A. Lonac, F. Filicori y A. Santarelli. "Compact Empirical Modeling of Nonlinear Dynamic Thermal Effects in Electron Devices". IEEE Transactions on Microwave Theory and Techniques 56, n.º 9 (septiembre de 2008): 2017–24. http://dx.doi.org/10.1109/tmtt.2008.2001956.
Lasance, C. J. M. "Two benchmarks to facilitate the study of compact thermal modeling phenomena". IEEE Transactions on Components and Packaging Technologies 24, n.º 4 (2001): 559–65. http://dx.doi.org/10.1109/6144.974943.
Chen, Ming, An Hu, Yong Tang y Bo Wang. "SABER-Based Simulation for Compact Dynamic Electro-Thermal Modeling Analysis of Power Electronic Devices". Advanced Materials Research 291-294 (julio de 2011): 1704–8. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.1704.
Ding, Feilong, Baokang Peng, Xi Li, Lining Zhang, Runsheng Wang, Zhitang Song y Ru Huang. "A review of compact modeling for phase change memory". Journal of Semiconductors 43, n.º 2 (1 de febrero de 2022): 023101. http://dx.doi.org/10.1088/1674-4926/43/2/023101.
Merrikh, Ali Akbar. "Compact thermal modeling methodology for predicting skin temperature of passively cooled devices". Applied Thermal Engineering 85 (junio de 2015): 287–96. http://dx.doi.org/10.1016/j.applthermaleng.2015.04.007.
Górecki, Paweł. "Compact Thermal Modeling of Power Semiconductor Devices with the Influence of Atmospheric Pressure". Energies 15, n.º 10 (12 de mayo de 2022): 3565. http://dx.doi.org/10.3390/en15103565.
Domański, Krzysztof, Piotr Prokaryn, Daniel Tomaszewski, Michał Marchewka y Piotr Grabiec. "Development and Modeling of Thermal Energy Harvesting Setup". Journal of Nano Research 39 (febrero de 2016): 191–201. http://dx.doi.org/10.4028/www.scientific.net/jnanor.39.191.
Alexeev, Anton, Grigory Onushkin, Jean-Paul Linnartz y Genevieve Martin. "Multiple Heat Source Thermal Modeling and Transient Analysis of LEDs". Energies 12, n.º 10 (15 de mayo de 2019): 1860. http://dx.doi.org/10.3390/en12101860.
Patil, Chandrashekhar. "A Novel Thermal Modeling of Through Silicon Vias in 3-D IC structures". International Journal of Materials 7 (15 de enero de 2021): 104–10. http://dx.doi.org/10.46300/91018.2020.7.19.
Ender, Ferenc, Márton Németh, Péter Pálovics, Andras Drozdy y András Poppe. "Thermal compact modeling approach of droplet microreactor based Lab-on-a-Chip devices". Microelectronics Journal 45, n.º 12 (diciembre de 2014): 1786–94. http://dx.doi.org/10.1016/j.mejo.2014.07.005.
Zhang, Liuyang, Yuanqing Cheng, Wang Kang, Lionel Torres, Youguang Zhang, Aida Todri-Sanial y Weisheng Zhao. "Addressing the Thermal Issues of STT-MRAM From Compact Modeling to Design Techniques". IEEE Transactions on Nanotechnology 17, n.º 2 (marzo de 2018): 345–52. http://dx.doi.org/10.1109/tnano.2018.2803340.
Pacelli, A., P. Palestri y M. Mastrapasqua. "Compact modeling of thermal resistance in bipolar transistors on bulk and SOI substrates". IEEE Transactions on Electron Devices 49, n.º 6 (junio de 2002): 1027–33. http://dx.doi.org/10.1109/ted.2002.1003724.
Shengjie, Ying, Y. C. Lam, S. C. M. Yu y K. C. Tam. "Thermal debinding modeling of mass transport and deformation in powder-injection molding compact". Metallurgical and Materials Transactions B 33, n.º 3 (junio de 2002): 477–88. http://dx.doi.org/10.1007/s11663-002-0058-6.
Pohl, László, Gusztáv Hantos, János Hegedüs, Márton Németh, Zsolt Kohári y András Poppe. "Mixed Detailed and Compact Multi-Domain Modeling to Describe CoB LEDs". Energies 13, n.º 16 (5 de agosto de 2020): 4051. http://dx.doi.org/10.3390/en13164051.
Bahrami, M., J. R. Culham y M. M. Yovanovich. "Modeling Thermal Contact Resistance: A Scale Analysis Approach". Journal of Heat Transfer 126, n.º 6 (1 de diciembre de 2004): 896–905. http://dx.doi.org/10.1115/1.1795238.
Glowka, D. A. y C. M. Stone. "Thermal Response of Polycrystalline Diamond Compact Cutters Under Simulated Downhole Conditions". Society of Petroleum Engineers Journal 25, n.º 02 (1 de abril de 1985): 143–56. http://dx.doi.org/10.2118/11947-pa.
Ceccarelli, L., A. S. Bahman y F. Iannuzzo. "Impact of device aging in the compact electro-thermal modeling of SiC power MOSFETs". Microelectronics Reliability 100-101 (septiembre de 2019): 113336. http://dx.doi.org/10.1016/j.microrel.2019.06.028.
Sahu, Yogendra, Pragya Kushwaha, Avirup Dasgupta, Chenming Hu y Yogesh Singh Chauhan. "Compact Modeling of Drain Current Thermal Noise in FDSOI MOSFETs Including Back-Bias Effect". IEEE Transactions on Microwave Theory and Techniques 65, n.º 7 (julio de 2017): 2261–70. http://dx.doi.org/10.1109/tmtt.2017.2666811.
Lasance, Clemens J. M. "Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review". Heat Transfer Engineering 29, n.º 2 (febrero de 2008): 149–68. http://dx.doi.org/10.1080/01457630701673188.
Cheng, Hsien-Chie, Siang-Yu Lin y Yan-Cheng Liu. "Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles". Materials 14, n.º 18 (19 de septiembre de 2021): 5427. http://dx.doi.org/10.3390/ma14185427.
Kim, Duckjong, Sung Jin Kim y Alfonso Ortega. "Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks". Journal of Electronic Packaging 126, n.º 3 (1 de septiembre de 2004): 342–50. http://dx.doi.org/10.1115/1.1772415.
Angelotti, Alberto Maria, Gian Piero Gibiino, Corrado Florian y Alberto Santarelli. "Trapping Dynamics in GaN HEMTs for Millimeter-Wave Applications: Measurement-Based Characterization and Technology Comparison". Electronics 10, n.º 2 (10 de enero de 2021): 137. http://dx.doi.org/10.3390/electronics10020137.
Angelotti, Alberto Maria, Gian Piero Gibiino, Corrado Florian y Alberto Santarelli. "Trapping Dynamics in GaN HEMTs for Millimeter-Wave Applications: Measurement-Based Characterization and Technology Comparison". Electronics 10, n.º 2 (10 de enero de 2021): 137. http://dx.doi.org/10.3390/electronics10020137.
Son, Minji, Yesol Woo, Geunjae Kwak, Yun-Jo Lee y Myung-June Park. "CFD modeling of a compact reactor for methanol synthesis: Maximizing productivity with increased thermal controllability". International Journal of Heat and Mass Transfer 145 (diciembre de 2019): 118776. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.118776.
Gao, Xin, Min Chen, G. Jeffrey Snyder, Søren Juhl Andreasen y Søren Knudsen Kær. "Thermal Management Optimization of a Thermoelectric-Integrated Methanol Evaporator Using a Compact CFD Modeling Approach". Journal of Electronic Materials 42, n.º 7 (7 de marzo de 2013): 2035–42. http://dx.doi.org/10.1007/s11664-013-2514-2.
Chirtoc, M. y N. Horny. "Toolbox for modeling frequency-domain photothermal experiments on multilayers". Journal of Applied Physics 131, n.º 21 (7 de junio de 2022): 214502. http://dx.doi.org/10.1063/5.0091688.
Saleh, Alaa, Abdel Kader El Rafei, Mountakha Dieng, Tibault Reveyrand, Raphael Sommet, Jean-Michel Nebus y Raymond Quere. "Compact RF non-linear electro thermal model of SiGe HBT for the design of broadband ADC's". International Journal of Microwave and Wireless Technologies 4, n.º 6 (29 de agosto de 2012): 569–78. http://dx.doi.org/10.1017/s1759078712000566.
Colangelo, Alessandro, Elisa Guelpa, Andrea Lanzini, Giulia Mancò y Vittorio Verda. "Compact Model of Latent Heat Thermal Storage for Its Integration in Multi-Energy Systems". Applied Sciences 10, n.º 24 (16 de diciembre de 2020): 8970. http://dx.doi.org/10.3390/app10248970.
Scognamillo, Ciro, Antonio Pio Catalano, Michele Riccio, Vincenzo d’Alessandro, Lorenzo Codecasa, Alessandro Borghese, Ravi Nath Tripathi, Alberto Castellazzi, Giovanni Breglio y Andrea Irace. "Compact Modeling of a 3.3 kV SiC MOSFET Power Module for Detailed Circuit-Level Electrothermal Simulations Including Parasitics". Energies 14, n.º 15 (2 de agosto de 2021): 4683. http://dx.doi.org/10.3390/en14154683.
Codecasa, Lorenzo, Vincenzo d'Alessandro, Alessandro Magnani y Niccolo Rinaldi. "Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology". IEEE Transactions on Components, Packaging and Manufacturing Technology 7, n.º 1 (enero de 2017): 58–69. http://dx.doi.org/10.1109/tcpmt.2016.2623420.
Khoong, L. E., Y. C. Lam, J. C. Chai, J. Ma y L. Jiang. "Modeling of mass transfers in a porous green compact with two-component binder during thermal debinding". Chemical Engineering Science 64, n.º 12 (junio de 2009): 2837–50. http://dx.doi.org/10.1016/j.ces.2009.03.006.