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Artículos de revistas sobre el tema "Embedded Technology"

Autor: Grafiati

Publicado: 4 de junio de 2021

Última modificación: 26 de julio de 2025

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1

Garcia, Paulo, Tiago Gomes, Filipe Salgado, Joao Monteiro, and Adriano Tavares. "Towards hardware embedded virtualization technology." ACM SIGBED Review 11, no. 2 (2014): 45–47. http://dx.doi.org/10.1145/2668138.2668145.

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2

Zhu, Yuhan, and Junsheng Zhang. "Technology Life Cycle Embedded Technology Development Path Analysis Method." Procedia Computer Science 202 (2022): 289–94. http://dx.doi.org/10.1016/j.procs.2022.04.038.

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3

MIYAZAKI, Masashi, Kazuaki IDA, Masakazu MIYAZAKI, et al. "Development of Embedded Organic Module Technology." Journal of Japan Institute of Electronics Packaging 10, no. 4 (2007): 298–304. http://dx.doi.org/10.5104/jiep.10.298.

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4

Jones, Gareth D., and John Lauffer. "Embedded passive technology for networking systems." Circuit World 28, no. 4 (2002): 26–32. http://dx.doi.org/10.1108/03056120210431516.

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5

Davignon, John J. "Trimming embedded resistors: an enabling technology." Circuit World 30, no. 1 (2004): 12–15. http://dx.doi.org/10.1108/03056120410496324.

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6

Wijeyesekera, D. C., L. M. S. Alvin John, and Z. Adnan. "Embedded Empiricisms in Soft Soil Technology." IOP Conference Series: Materials Science and Engineering 136 (July 2016): 012001. http://dx.doi.org/10.1088/1757-899x/136/1/012001.

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7

Imanaka, Yoshihiko, and Jun Akedo. "Embedded Capacitor Technology Using Aerosol Deposition." International Journal of Applied Ceramic Technology 7 (March 9, 2009): E23—E32. http://dx.doi.org/10.1111/j.1744-7402.2009.02359.x.

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8

Iyer, S. S., and H. L. Kalter. "Embedded DRAM technology: opportunities and challenges." IEEE Spectrum 36, no. 4 (1999): 56–64. http://dx.doi.org/10.1109/6.755442.

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9

Sobol, Marion G., and David Lei. "Environment, manufacturing technology, and embedded knowledge." International Journal of Human Factors in Manufacturing 4, no. 2 (1994): 167–89. http://dx.doi.org/10.1002/hfm.4530040205.

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10

Kim, Han Gyu, Il Ho Son, Joon Yub Song, and Tae Ho Ha. "Embedded Controller Technology of Injection Molding Machine for Control and Monitoring." Journal of the Korean Society for Precision Engineering 31, no. 7 (2014): 577–83. http://dx.doi.org/10.7736/kspe.2014.31.7.577.

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11

Pang, Yu Jun, Jun Wang, and Li Feng Wei. "Research of Embedded Internet Technology for Internet of Things." Applied Mechanics and Materials 55-57 (May 2011): 2153–56. http://dx.doi.org/10.4028/www.scientific.net/amm.55-57.2153.

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Development of Internet of things, the application of embedded Internet technology will be wide. This paper introduces characteristic of embedded Internet technology, concludes and compares resolutions of how to connect embedded equipment to Internet. At the same time, this paper analyses characteristic of embedded TCP/IP protocol and present method for developing embedded TCP/IP protocol.

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12

Song, Rong, Wen Chang Lang, and Shu Wei Pan. "Development of Embedded System GUI Based on Qt/Embedded." Applied Mechanics and Materials 109 (October 2011): 586–90. http://dx.doi.org/10.4028/www.scientific.net/amm.109.586.

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Against some problems which exist in the current embedded graphical user interface development such as low efficiency in the operating, poor portability and so on. This paper brings up an embedded GUI development method based on Qt/Embedded. Firstly, the construction technology of X11 virtual compiler platform and the implementation technology of cross-compile environment are described in details which are necessary in GUI development. Secondly, the Qt library file is cut, and the picture is displayed with Chinese-characters in accordance with the specific embedded goal. In the end, prove the

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13

Azémar, Jérôme. "Embedded solutions: Fan-out and Embedded Die Packages market and technology trends." International Symposium on Microelectronics 2015, no. 1 (2015): 000235–38. http://dx.doi.org/10.4071/isom-2015-wa31.

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Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key pla

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14

AZEMAR, Jerome, Rozalia BEICA, Thibault BUISSON, Andrej IVANCOVIC, and Amandine PIZZAGALLI. "Embedded solutions: Fan-out and Embedded Dies Packages market and technology trends." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000182–216. http://dx.doi.org/10.4071/2015dpc-ta21.

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Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key pla

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15

WATANABE, Noboru. "Outline of Embedded Technology Skill Standards (ETSS)." Journal of JSEE 54, no. 5 (2006): 97–102. http://dx.doi.org/10.4307/jsee.54.5_97.

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16

Sanz, Ricardo, Carlos Martínez, Manuel Rodríguez, and Adolfo Hernando. "Embedded Component Technology for Complex Control Systems." IFAC Proceedings Volumes 41, no. 2 (2008): 6897–902. http://dx.doi.org/10.3182/20080706-5-kr-1001.01169.

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17

Yampolsky, Michael, Evgeny Pikhay, and Yakov Roizin. "Embedded UV Sensors in CMOS SOI Technology." Sensors 22, no. 3 (2022): 712. http://dx.doi.org/10.3390/s22030712.

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We report on ultraviolet (UV) sensors employing high voltage PIN lateral photodiode strings integrated into the production RF SOI (silicon on isolator) CMOS platform. The sensors were optimized for applications that require measurements of short wavelength ultraviolet (UVC) radiation under strong visible and near-infrared lights, such as UV used for sterilization purposes, e.g., COVID-19 disinfection. Responsivity above 0.1 A/W in the UVC range was achieved, and improved blindness to visible and infrared (IR) light demonstrated by implementing back-end dielectric layers transparent to the UV,

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18

Zhang, Wei, Cai Xia Ma, and Shuang Xia Niu. "Discussig of Electricity Embedded Software Testing Technology." Applied Mechanics and Materials 401-403 (September 2013): 1674–79. http://dx.doi.org/10.4028/www.scientific.net/amm.401-403.1674.

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Focusing on the feature of embedded software in power industry and to ensure its high reliability, the authors of this article introduced a comprehensive and effective testing technique based on the theory and practice of embedded test, with two phases: static test and dynamic unit test. It focus on the coding rule checking, quality metrics, analysis, flow control and data flow analysis and coverage analysis techniques.

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19

Page, Thomas. "Embedded Electronics in Textiles and Wearable Technology." i-manager's Journal on Embedded Systems 3, no. 4 (2015): 1–18. http://dx.doi.org/10.26634/jes.3.4.3511.

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20

Yao, T., B. Luo, F. Gunawan, K. Ding, Q. Peng, and L. Kong. "The Technical Problems of Discrete Embedded Technology." ECS Transactions 60, no. 1 (2014): 823–29. http://dx.doi.org/10.1149/06001.0823ecst.

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21

Konana, Prabhudev, and Gautam Ray. "Physical product reengineering with embedded information technology." Communications of the ACM 50, no. 10 (2007): 72–78. http://dx.doi.org/10.1145/1290958.1290965.

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22

Wang, Weizhen, Yukari Nagai, Yuan Fang, and Masami Maekawa. "Interactive technology embedded in fashion emotional design." International Journal of Clothing Science and Technology 30, no. 3 (2018): 302–19. http://dx.doi.org/10.1108/ijcst-09-2017-0152.

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PurposeThe purpose of this paper is to bridge the gap between human emotions and wearable technologies for interactive fashion innovation. To consider the reasons why smart clothing should satisfy the internet of things (IoT) technical functions and human emotional expression simultaneously, to investigate the manner in which artistic design perspectives and engineering methods combined effectively, to explore the R&D elements of future smart clothing based on the IoT technology.Design/methodology/approachThis study combines artistic design perspectives with information-sensing engineering

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23

Groden, Claire, and Laurie Pattison-Gordon. "Technology Tips: Making Connections Using Embedded Software." Mathematics Teacher 88, no. 6 (1995): 500–502. http://dx.doi.org/10.5951/mt.88.6.0500.

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The NCTM's Curriculum and Evaluation Standards or School Mathematics (1989) calls for increased ttention to “connecting mathematics to other subjects and to the world outside the classroom.” Often, these connections are made with interdisciplinary projects and through the study of mathematics embedded in a real-world situation. We can also make connections by using software created for practical, real-world applications in the mathematics classroom

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24

Butterfield, William S. "Continuous Nip Profiling with Embedded Sensor Technology." JAPAN TAPPI JOURNAL 64, no. 10 (2010): 1154–57. http://dx.doi.org/10.2524/jtappij.64.1154.

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25

Yoon, Yong-Kyu, and Mark G. Allen. "Embedded conductor technology for micromachined RF elements." Journal of Micromechanics and Microengineering 15, no. 6 (2005): 1317–26. http://dx.doi.org/10.1088/0960-1317/15/6/025.

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26

Itoh, Kiyoo. "Trends in low-voltage embedded-RAM technology." Facta universitatis - series: Electronics and Energetics 15, no. 1 (2002): 1–12. http://dx.doi.org/10.2298/fuee0201001i.

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First, trends in the gate-oxide thickness of MOSFET for DRAM and MPU are discussed to clarify the strong need for low-voltage operation of embedded RAMs. Then, modern peripheral logic circuits for reducing leakage currents and DRAM/SRAM cells to cope with the ever-decreasing signal charges are described. Finally, needs for developments of subthreshold-current reduction circuits for use in active mode, memory-rich SoC architectures, and gain cells and non-volatile cells are emphasized.

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27

Nojiri, Tohru, Yuki Kondo, Naohiko Irie, Masayuki Ito, Hajime Sasaki, and Hideo Maejima. "Domain Partitioning Technology for Embedded Multicore Processors." IEEE Micro 29, no. 6 (2009): 7–17. http://dx.doi.org/10.1109/mm.2009.96.

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28

Bas, Joan, Taposhree Dutta, Ignacio Llamas Garro, Jesús Salvador Velázquez-González, Rakesh Dubey, and Satyendra K. Mishra. "Embedded Sensors with 3D Printing Technology: Review." Sensors 24, no. 6 (2024): 1955. http://dx.doi.org/10.3390/s24061955.

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Embedded sensors (ESs) are used in smart materials to enable continuous and permanent measurements of their structural integrity, while sensing technology involves developing sensors, sensory systems, or smart materials that monitor a wide range of properties of materials. Incorporating 3D-printed sensors into hosting structures has grown in popularity because of improved assembly processes, reduced system complexity, and lower fabrication costs. 3D-printed sensors can be embedded into structures and attached to surfaces through two methods: attaching to surfaces or embedding in 3D-printed sen

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29

Barrett, Michael. "Embedded… But Exposed." New Electronics 54, no. 15 (2021): 38–39. http://dx.doi.org/10.12968/s0047-9624(22)60534-0.

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30

Aday, Jon G., Ted Tessier, Kazuhisa Itoi, and Satoshi Okude. "ChipsetT: Embedded Die Substrate Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 000377–97. http://dx.doi.org/10.4071/2013dpc-ta13.

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Embedded die substrate technologies are being developed in an assortment of configurations and for different market segments. The technology being discussed in this paper will be focused on both a fan out technology – ChipsetT Fan-Out and a system in package approach (ChipsetT SiP) in which a multiple component bill of materials (BOM) is used. The Chipset process is based on the WABE (Wafer and Board Level Embedding) technology. WABE technology is based on co-lamination of multilayer polyimide flex wiring and conductive z-axis sintered metal interconnections. This ChipsetT Fan Out technology a

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31

Li, Wen Hui. "Study on the Technology of Digital Image Processing." Applied Mechanics and Materials 687-691 (November 2014): 3555–58. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.3555.

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The paper aims to study a design and technique of the image processing based on the architecture of embedded system. Aimed at the own characteristic of embedded system, designing a platform been endowed with more operating functions of embedded image processing with versatility. The author adopts the method of the embedded system design based on the basic functions and characteristic of image processing system, summarizing and comparing of the characteristic and new developments of the EOS for the ARM processor, and finally chooses the embedded Linux for the operating system of our platform, a

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32

Chen, Hong Li. "Research on Security Level Assessment Technology in Embedded Real-Time System." Applied Mechanics and Materials 696 (November 2014): 266–70. http://dx.doi.org/10.4028/www.scientific.net/amm.696.266.

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This paper briefly describes the main ideas and implementation of technology strategy of Embedded real-time system security level assessment which is important part of mechanism to system flexibility based on embedded real-time system, designs the embedded real-time system security level assessment system based on pattern matching for the characteristics of embedded real-time systems. By building security level assessment system and simulation testing environment based on RT-Linux real-time operating system, the impact of Embedded real-time system security level assessment strategy on performa

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33

Hanna, Steve. "Secure Embedded Software Development." New Electronics 53, no. 16 (2020): 26–27. http://dx.doi.org/10.12968/s0047-9624(22)61399-3.

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34

González-Blanco, Jennifer, Mercedes Vila-Alonso, and Manuel Guisado-González. "EXPLORING THE COMPLEMENTARITY BETWEEN FOREIGN TECHNOLOGY, EMBEDDED TECHNOLOGY AND INCREASE OF PRODUCTIVE CAPACITY." Technological and Economic Development of Economy 25, no. 1 (2019): 39–58. http://dx.doi.org/10.3846/tede.2019.7600.

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This study analyzes the complementarity of foreign technology acquired under license agreements, technology embedded in machinery and equipment and increase in a company’s productive capacity. We use panel data on Brazilian manufacturing companies from the World Bank Surveys. We used the random effects models, estimated by maximum likelihood. The results indicate that foreign technology, embedded technology and increase of productive capacity have a positive and significant impact on labor productivity. The complementarity test reveals that the relationship between the two technologies analyze

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35

Lv, Li. "Research on Aerobics Movement Choreography Based on Embedded Network Technology." Applied Mechanics and Materials 556-562 (May 2014): 5685–89. http://dx.doi.org/10.4028/www.scientific.net/amm.556-562.5685.

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Embedded Internet has preset functions and strong adaptability, which can be used in household appliances, medical equipment, and industrial machinery and so on. Through the method of embedded network, it completely changed the way of people live. In this paper we use clustering algorithm to improve the embedded network system, and use JSP technology to enhance the real-time and interactive of system, develop the aerobics visualization movement system, which realizes the interactive action between teachers and students. In order to test the performance of the system, we use AMBE-2000 as commun

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36

Yu, Wan Tao. "Design Practical System Based on Packet Tracer Technology." Applied Mechanics and Materials 687-691 (November 2014): 2897–900. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.2897.

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This paper combines with the actual background of the university experiment teaching of computer network, analyzes the construction situation and the existing problems of networking practical training system. Then it designs and implements the network practical training system based on embedded platform. The system mainly consists of three parts: the experiment control system, embedded experiment box and training courses. PC Terminal as the client of experimental control system is developed based on .NET/C#, which supports user login via online or offline mode, updating training courses intell

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37

Zhang, Qi Sheng, Ming Deng, Qi Wang, Yong Qiang Feng, and Rui Yang. "Application of Embedded Technology for Induced Polarization Instrument." Advanced Materials Research 383-390 (November 2011): 224–29. http://dx.doi.org/10.4028/www.scientific.net/amr.383-390.224.

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Induced polarization method is one of common methods for electrical prospecting of geophysical. The paper is to analyses and research application of embedded technology for induced polarization instrument and design multifunctional transceiver instrument. The paper is to realize hardware part of induced polarization instrument by regarding ARM processor as hardware core by combination of current intelligent power module (IPM), induced polarization analog signal processing and 24-digit △-∑ high-precision A/D conversion chip (CS5532), etc. It can transplant embedded operation system (uClinux) on

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38

Xiong, Jing, Han Yun Wen, and Kai Bai. "Research of Cross Platform Embedded Database Based on the SOC Technology." Applied Mechanics and Materials 40-41 (November 2010): 985–89. http://dx.doi.org/10.4028/www.scientific.net/amm.40-41.985.

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At present, the existing embedded database products have high degree of specialization and dependencies of platform, not fully reflect the characteristics of embedded system. This paper provides a requirement analysis and gives a completely different from the traditional design of the database, the paper has done a lot of research in some key technologies on the design and implementation of SOC technology, this design is always used in cross platform embedded database. The SOC technology embedded in a database system in the special chip to solve problems of platform portability.

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39

Che, Sheng Bing, Dong Mei Guo, Ye Mao Wang, and Li Li Pan. "A Software Watermarking Algorithm Based on Binder Technology." Applied Mechanics and Materials 687-691 (November 2014): 2971–74. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.2971.

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Information hiding in a resources section’s redundancies has large amount of watermark embedding, and the software watermarking based on PE file resources section format has high concealment. This paper combined this two algorithms’ advantages, and embedded the watermark information in these two ways. It also introduced the information hiding technology based on ICON file and binder technology to realize the tamper-proof function of the watermark. Experiments shows that this scheme not only improves the embedded information capacity, but also overcomes the problem that the embedded watermark a

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40

XU, Zhanya, and Zhong XIE. "Research on Key Technology of General Embedded GIS." Journal of Geographic Information System 02, no. 01 (2010): 15–18. http://dx.doi.org/10.4236/jgis.2010.21004.

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41

Xie, Rui, Tie Hua Ma, Hong Jin, and Dong Xing Pei. "Embedded Capacitive Grid Sensing Technology for Torque Measurement." Advanced Materials Research 468-471 (February 2012): 1551–54. http://dx.doi.org/10.4028/www.scientific.net/amr.468-471.1551.

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Torque measurement of transmission shaft has problems such as signal transmission, limited installation space and signal disturbance. In this paper proposes an embedded capacitive grid torque sensor. Through a special installation the output of capacitive grid sensor is proportional to twist angle, then torque can be calculated. The two electrodes of capacitive grid sensor can be embedded into the bearing and shaft respectively that reduces installation space, to improve the testability of transmission shaft. Experiments show that capacitive grid sensor performs high reliability and is able to

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42

Liu, Wei. "Application of Embedded Technology in Transient Electromagnetic Receiver." Applied Mechanics and Materials 668-669 (October 2014): 791–94. http://dx.doi.org/10.4028/www.scientific.net/amm.668-669.791.

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The transient electromagnetic method (TEM), which is also called time domain electromagnetic method, is one of the common methods of geophysical disciplines of electrical prospecting. This paper, based on theory of the TEM, analysed the application of the embedded technology in TEM, and completed the design of the transient electromagnetic receiver system. The ARM processor is the core part of the system, combined with high precision A/D conversion chip, CPLD module, PC104 and other hardware parts.Through repeated field actual tests, the system works stably and reliably and data acquisition re

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43

Diao, Li Feng, Ming Dai, and Guang Dong Zha. "Design of Calcium Tester Based on Embedded Technology." Applied Mechanics and Materials 336-338 (July 2013): 1496–99. http://dx.doi.org/10.4028/www.scientific.net/amm.336-338.1496.

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A design idea of calcium tester based on embedded platform is described. The composition of calcium test system is firstly analyzed. Secondly, in the acquisition of the potential signal of solution concentration the model of a sensor system is introduced. Finally the realization technique of tester is chiefly discussed in hardware and software.

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44

Xu, Min, and XingHua Lu. "Software fault location technology under terminal embedded component." Journal of Physics: Conference Series 1885, no. 2 (2021): 022046. http://dx.doi.org/10.1088/1742-6596/1885/2/022046.

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45

Hasegawa, Ryo, Naofumi Yawata, Noriaki Ando, Nobuhiko Nishio, and Takuya Azumi. "Embedded Component-based Framework for Robot Technology Middleware." Journal of Information Processing 25 (2017): 811–19. http://dx.doi.org/10.2197/ipsjjip.25.811.

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46

KESER, Beth, Craig AMRINE, George LEAL, William LYTLE, Doug MITCHELL, and Robert WENZEL. "Embedded Die Technology Breakthrough: The Redistributed Chip Package." Journal of Japan Institute of Electronics Packaging 11, no. 4 (2008): 280–84. http://dx.doi.org/10.5104/jiep.11.280.

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47

Sakai, Tadahiko. "JISSO Technology for ^|^ldquo;Device Embedded Substrate^|^rdquo;." Journal of The Japan Institute of Electronics Packaging 17, no. 5 (2014): 418–21. http://dx.doi.org/10.5104/jiep.17.418.

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48

Kikuchi, Katsuya, and Masahiro Aoyagi. "Advancement of Power Integrity Utilizing Device Embedded Technology." Journal of The Japan Institute of Electronics Packaging 22, no. 5 (2019): 444–49. http://dx.doi.org/10.5104/jiep.22.444.

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49

K. V, Rajani. "Embedded based Food Quality Detection with Sensor Technology." International Journal for Research in Applied Science and Engineering Technology 6, no. 5 (2018): 466–70. http://dx.doi.org/10.22214/ijraset.2018.5078.

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50

IRIE, Naohiko, and Toshihiro HATTORI. "Multi-Core/Multi-IP Technology for Embedded Applications." IEICE Transactions on Electronics E92.C, no. 10 (2009): 1232–39. http://dx.doi.org/10.1587/transele.e92.c.1232.

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