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Tesis sobre el tema "Fan out"

Autor: Grafiati

Publicado: 4 de junio de 2021

Última modificación: 13 de febrero de 2022

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1

Cawte, Paul Stephen. "The theory of volume holographic fan-out elements." Thesis, Imperial College London, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.283137.

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Roberts, M. W. "Logic circuit testability for reconvergent fan-out nodes." Thesis, University of York, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.374197.

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3

Abuelyaman, Eltayeb Salih. "Sequential circuits fault simulation using fan out stem based techniques." Diss., The University of Arizona, 1988. http://hdl.handle.net/10150/184466.

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This dissertation describes a new simulation technique for an automatic test generation system, SCIRTSS version 4.0 (Sequential Circuit Test Sequence System). This test generation system is driven by the hardware compiler AHPL, a Hardware Programming Language, and an intelligent heuristic-based search for test vector generation. Using a fault-injection gate-level simulator and the generated test vector, all the faulty states of the circuit are simulated in parallel and the simulator is thus able to find all detected faults by a particular input sequence. The major objective of this research wa

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4

Klink, Madeline LeNore. "Laugh out loud in real life : women's humor and fan identity." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/59730.

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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Comparative Media Studies, 2010.<br>Cataloged from PDF version of thesis.<br>Includes bibliographical references (p. 83-91).<br>The emerging field of fan studies has, until recently, been defined only by the research that has taken place within it. Almost universally, this research focuses on self-identified fans. However, scholars are beginning to examine and debate what the limits of the field should be. This study argues that self-identified fans are not the only group that ought to be examined under the heading of fan studies.

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5

Strömberg, Malin. "Paper dimensional stability in sheet-fed offset printing : Papperets dimensionsstabilitet i en arkoffsetpress." Thesis, Högskolan Dalarna, Grafisk teknik, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:du-1400.

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In offset printing, dampening solution is used to create a good balance in the process. If too much water is transferred to the paper, the sheet can change its size between the printing units, due to water absorption, and cause a problem with the colour register. This phenomenon is usually referred to as fanout. In this degree project, an investigation was made to see if the paper dimensions changed through its way in the sheet-fed printing process. The instrument Luchs Register Measuring Systems (Lynx) was used, and a method for measuring if the paper changed its dimensions with this instrume

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Berglund, Martin. "Optical measuring system using a camera and laser fan-out for narrow mounting on a miniaturized submarine." Thesis, Uppsala University, Ångström Space Technology Centre, ÅSTC, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-112681.

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<p>The aim was to develop, manufacture and evaluate diffractive lenses, or diffractive optical elements (DOE), for use in correlation with a camera to add perspective in pictures. The application is a miniaturized submarine developed in order to perform distant exploration and analysis in harsh and narrow environments. The idea is to project a laser pattern upon the observed structure and thereby add geometrical information to pictures acquired with an onboard CMOS camera. The design of the DOE-structures was simulated using the optimal rotational angle method (ORA). A set of prototype DOEs we

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7

Whetten, Jonathan M. "Using Operator Teams for Supervisory Control." BYU ScholarsArchive, 2009. https://scholarsarchive.byu.edu/etd/2033.

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Robots and other automated systems have potential use in many different fields. As the scope of robot applications that robots are used for increases, there is a growing desire to have human operators manage multiple robots. Typical methods of enabling operators to multi-task in this way involve some combination of user interfaces that support human cognition and advanced robot autonomy. Our research explores a complementary method of managing multiple robots by utilizing operator teams. The evidence suggests that for appropriate task scenarios, two cooperating operators can be more than twice

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8

Pelini, Nicholas Michael. "Netlist Security Algorithm Acceleration Using OpenCL on FPGAs." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1501861339318045.

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9

Barnard, Timothy L. ""Far out past": Hemingway, manhood, and modernism." W&M ScholarWorks, 2005. https://scholarworks.wm.edu/etd/1539623462.

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This dissertation investigates Ernest Hemingway's authorship as an instance of international modernisms forming as sustained engagements with gender and sexuality. By focusing on four of Hemingway's most experimental texts it shows how a figure of both "high" and "popular" modernism sought to occupy a heterogeneous space of cultural queerness vitalized by masculinity, national and ethnic identities, and writing.;The introduction discusses how post-war gender, sexual, and literary discourses reflected period obsessions with authenticity in the face of a rising commodity culture. It also introdu

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10

Murray, Delaney. "DAUGHTERS OF THE DIGITAL: A PORTRAIT OF FANDOM WOMEN IN THE CONTEMPORARY INTERNET AGE." Ohio University Honors Tutorial College / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=ouhonors1587738612384951.

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11

Lee, Wen-Hui. "A comparative analysis of Midwestern attitudes when dining out." Online version, 1998. http://www.uwstout.edu/lib/thesis/1998/1998leew.pdf.

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12

Griesbaum, Sven. "Untersuchung der Rolle des Fas-FasL-Systems bei der Auslösung der Apoptose durch Tumorzellen in Fas-knock-out-Maus-Makrophagen." [S.l.] : [s.n.], 2004. http://deposit.ddb.de/cgi-bin/dokserv?idn=972879552.

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13

Kegler, Melissa Jean. "NES and NNES reactions to in- and out-group usages of dyke and fag /." Abstract, 2009. http://eprints.ccsu.edu/secure/00000564/01/2004ABSTR.htm.

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Thesis (M.S.) -- Central Connecticut State University, 2009.<br>Thesis advisor: Matthew Ciscel. "... in partial fulfillment of the requirements for the degree of Master of Science in Teaching English to Speakers of Other Languages." Includes bibliographical references (leaves 62-63). Abstract available via the World Wide Web.

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14

HIGH, Peter B. "A Drama of Superimposed Maps: Ozu's So Far From The Land of Our Parents." 名古屋大学大学院国際言語文化研究科, 2008. http://hdl.handle.net/2237/10093.

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15

Laursone, Gunita, and Emelie Domeij. "Exploring the Trend of Near-Sourcing to Eastern-Europe: the Case of Swedish Manufacturers." Thesis, Internationella Handelshögskolan, Högskolan i Jönköping, IHH, Centre of Logistics and Supply Chain Management, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-19173.

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Outsourcing has been a way for firms to reduce their cost of production and enabling them to focus on their core competencies for decades. As the total costs for manufacturing in China – the most prominent outsourcing location, are increasing due to unfavourable mar-ket changes, which in turn leads to loss of the competitive advantage, European companies are more and more often realizing and pursuing the benefits of ‘near-sourcing’ their manu-facturing operations to Eastern European countries. This paper is a study of outsourcing decisions related to specific products in the Swedish manufactur

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16

Hauschild, Johannes Michael [Verfasser], Frank [Akademischer Betreuer] Pollmann, Frank [Gutachter] Pollmann, and Michael [Gutachter] Knap. "Quantum Many-Body Systems Far Out of Equilibrium — Simulations with Tensor Networks / Johannes Michael Hauschild ; Gutachter: Frank Pollmann, Michael Knap ; Betreuer: Frank Pollmann." München : Universitätsbibliothek der TU München, 2019. http://d-nb.info/1199537772/34.

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17

Ellis, Kimberly. "Mothers for the Environment| Spreading the Word Far and Wide on How to Take Better Care of our Environment." Thesis, Prescott College, 2016. http://pqdtopen.proquest.com/#viewpdf?dispub=1605749.

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<p> This paper argues the importance of communicating messages to a general public about the important issues of the environmental state of the Earth, and it proposes that solutions need to be offered to help each individual act ecologically responsibly when using Earth’s natural resources. Further, this paper suggests that choosing an effective medium to engage in communication with a general public is crucial.</p><p> To this end, I asked two questions that formed the basis of my research: 1. What research or personal experiences suggest that there is an urgent need to communicate mes

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18

Jacobson, Rebecca. "Investigation into the Loess-Palaeosol and Red Clay Record from the Pliocene- Quaternary Chinese Loess Plateau Using In-Phase and Out-OfPhase Magnetic Susceptibility." Thesis, Uppsala universitet, Institutionen för geovetenskaper, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-352266.

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Loess is a well sorted, fine grained, windblown (aeolian) sediment and deposits as a blanket over large areas, reaching from a few centimetres to several hundreds of meters in height and can drape large landscapes in form of mountains. During a more humid and warmer climate, redox conditions are changed in the loess deposits, with greater seasonal moisture creating greater soil formation (pedogenesis), i.e. palaeosol. The Chinese Loess Plateau is dominated by the East Asian monsoon climate, and consists of an alternating Loess-palaeosol Formation, spanning back to at least the whole Quaternar

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19

Alemany, Adair Aparecida Santos. "Influência da dieta hipercolesterolêmica em camundongos knock-out LDLr -/- expostos as partículas ambientais concentradas sobre o sistema pulmonar." Universidade de São Paulo, 2013. http://www.teses.usp.br/teses/disponiveis/5/5160/tde-25092013-151131/.

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Introdução: Os dados epidemiológicos e experimentais têm mostrado efeitos adversos da exposição pré e pós natal ao material particulado (MP2,5) sobre a saúde fetal e adulto. Entretanto, poucos estudos abordaram a toxicidade fetal da exposição gestacional à poluição do ar ambiental, bem como efeitos a longo prazo de adversos da exposição pré-natal sobre o desenvolvimento pós-natal e maturação de vários sistemas de órgãos. Objetivos: O objetivo deste estudo foi determinar se a exposição pré-natal e / ou pós-natal ao material particulado, influencia o desenvolvimento pulmonar e resposta vascular

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20

Myers, Andrew S. "Exploring the Synergistic Effect of Corn and Oat Fiber on Egg Albumin-Induced Reduction in Oil Absorption During Frying." Ohio University / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1314722156.

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21

Mekina, Emilienne-Nadège. "Description du fang-nzaman, langue bantoue du Gabon : phonologie et classes nominales." Thesis, Université de Lorraine, 2012. http://www.theses.fr/2012LORR0328.

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Cette thèse consiste en une description du Fang-Nzaman, langue bantoue parlée au Gabon en Afrique Centrale. Le travail présente la phonologie en commençant par l'identification des phonèmes, avec la mise en relief des paires minimales qui permettent d'opposer les phonèmes : /mb/ vs /b/ et de les classer comme unités distinctives. Le choix des oppositions qui sont présentées a été fait en fonction des éléments nécessaires à l'identification dans certaines positions. Pour les phonèmes, le lexème permet les oppositions dans les structures les plus usitées. Les phonèmes sont ainsi définis dans leu

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22

Nataša, Milićević. "Zamenjivači masti na bazi pšeničnih i ovsenih mekinja i njihova primena u formulaciji keksa." Phd thesis, Univerzitet u Novom Sadu, Tehnološki fakultet Novi Sad, 2018. https://www.cris.uns.ac.rs/record.jsf?recordId=107706&source=NDLTD&language=en.

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Sporedni proizvodi dobijeni u procesu mlevenja žitarica, p&scaron;enične i ovsene mekinje, hidrotermički su tretirane u cilju dobijanja gelova, koji se, kao zamenjivači masti, mogu koristiti u formulacijama prehrambenih proizvoda. Optimizacija procesnih parametara (koncentracija mekinja, vreme homogenizacije i temperatura homogenizacije) proizvodnje gelova vr&scaron;ena je primenom postupka odzivne funkcije (RSM). Gelovi od p&scaron;eničnih i ovsenih mekinja, koji su pripremljeni po prethodno utvrđenim optimalnim parametrima (za p&scaron;enične mekinje: 22,0% koncentracija mekinja, vreme homog

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23

Cattelam, Jonatas. "Caraterísticas pós-abate de bovinos terminados com substitutos ao milho em dietas de alto grão." Universidade Federal de Santa Maria, 2015. http://repositorio.ufsm.br/handle/1/4375.

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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior<br>The objective of this study was to evaluate the characteristics of non-integrant parts of steers and heifers, feedlot fed with high-grain diets. Were used forty-five cattle were used in two categories, with 21 heifers with initial age of 32 months and 24 steers with initial age of 20 months, from the crossing between Charolais and Nellore. The animals were assigned to treatments as according energy source in the diet, being these: rice; white oat or corn, being seven heifers and eight bulls for each diet. The animals were confined

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24

McPeake, Zoe. "Our Bodies Aren't Wonderlands : Disenchanting the MIS(sing)Representation of Women in Popular Music." Thesis, Université d'Ottawa / University of Ottawa, 2018. http://hdl.handle.net/10393/38093.

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Through an intersectional feminist lens using Critical Discourse Analysis, this thesis investigates the representations of four prominent women, their embodiments and their sexualities in the lyrics of their songs.

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25

Willemse, Yolandi. "Sportspesifieke inoefening en antropometriese, fisieke en motoriese vereistes van 15– tot 17–jaar oue vroulike netbalspelers / Y. Willemse." Thesis, North-West University, 2010. http://hdl.handle.net/10394/4946.

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In the light of the facts given in literature it is evident that players in the game of netball need to meet specific anthropometric (body length, body mass, percentage body fat and percentage muscle mass), physical (pliancy, abdominal power, aerobic endurance and anaerobic endurance) and motor (speed over 5 m and 10 m, agility and explosive power) requirements. This consequently necessitates specific attention to be given to the mentioned requirements. In spite of the fact that a few studies do exist that enter into the requirements of the profile of netball players in different positions, as

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26

Njingang, Mbadjoin Theodore. "Le changement par les technologies numériques en école d'ingénieurs : Étude d’impact." Thesis, Cergy-Pontoise, 2015. http://www.theses.fr/2015CERG0764/document.

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Résumé : Cette recherche analyse l'impact des technologies numériques sur l'efficacité de l'innovation des formations professionnelles d'ingénieur, des apprentissages et la flexibilité des dispositifs pédagogiques, ainsi que sur la professionnalisation des enseignants tuteurs universitaires. Ceci, au regard des modèles d'organisation managériale et d’usages pédagogiques des TIC. Les résultats de l’axe 1 indiquent que, les dispositifs de Master présentent un modèle d’organisation bi modale hybride qui impacte directement le déséquilibre de répartition des charges entre distance/présence. L’impa

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27

Yu, Yi-Cheng, and 游益政. "Fan-Out and Fan-In Log Mining :Comparison and Its Automatic Evaluation." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/47444686065149300138.

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碩士<br>國立臺灣大學<br>資訊工程學研究所<br>91<br>Server log records search requests of internet users, which has become the most important data of studying user search behaviors. In this thesis, logs were classified two classes-say, Fan-Out Log(e.g., proxy server log) and Fan-In Log(e.g., web server log). We will investigate the relationships of query terms and tell out the differences between the two types of logs. Besides, we propose two automatic evaluation approaches, and try to show these approaches are feasible to replace human assessors in large scale evaluation. The results show the Fan-Ou

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28

Han, Xuliang. "Fan-out equalized shared optical backplane bus." Thesis, 2003. http://hdl.handle.net/2152/626.

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Han, Xuliang Chen Ray T. "Fan-out equalized shared optical backplane bus." 2003. http://wwwlib.umi.com/cr/utexas/fullcit?p3119522.

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Araújo, Luís Gonçalo Morais. "Estudo das tensões residuais num package Fan-Out." Dissertação, 2015. https://repositorio-aberto.up.pt/handle/10216/89029.

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31

Chuang, Cheng-Hsien, and 莊政憲. "Cost-Optimal Parallel Circuits with Fan-Out 4." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/59380003040683546127.

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碩士<br>國立臺灣科技大學<br>資訊工程研究所<br>89<br>Given n values x1, x2,..., xn, and an associative binary operation ⊕, the prefix problem is to compute the n values x1 ⊕x2⊕...⊕xi, 1≤i≤n. Because the prefix operation has many applications, many combinational circuits for solving the prefix problem, called prefix circuits, have been designed. For any prefix circuit D with s operation nodes, if s ≤2n -2, then its layout area can be the smallest; thus, D is cost-optimal. In this thesis, we construct a cost-optimal prefix circuit QE4 with fan-out 4. Its depth is between 2┌log n┐-7and 2┌log n┐-3. The depth o

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Araújo, Luís Gonçalo Morais. "Estudo das tensões residuais num package Fan-Out." Master's thesis, 2015. https://repositorio-aberto.up.pt/handle/10216/89029.

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33

Chen, Yu-Chen, and 陳宥辰. "Optimization of Fan-Out Wafer Level Package molding parameters." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/5kefy3.

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碩士<br>國立中興大學<br>精密工程學系所<br>107<br>The recent fan-out wafer level packaging has become the current trend. From the point of view of low cost, the most significant advantage of FOWLP is that it can save the carrier board and the thickness of the package is also thinner, which helps to enhance the competitiveness of the chip manufacturer. But today there are many challenges, such as warpage caused by the mismatch between the thermal expansion coefficients of EMC materials and wafers in the packaging process, which are currently facing a major challenge. The main purpose of this paper is to focus

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34

Wang, Pin-Chieh, and 王品傑. "Reliability study on Fan-out Wafer Level flexible package." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/46870981945524256529.

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碩士<br>義守大學<br>機械與自動化工程學系<br>104<br>The purpose of this research is to design and fabricate the fan-out wafer level flexible package by micro-electro-mechanic system (MEMS) technology with biomaterial. Reliability of temperature cycling test has been conducted through the commercial finite element analysis software ANSYS. Thermal loading test are crucial for multiple materials constructed in packaging structure. Due to mismatch of thermal expansion coefficients, thermal induced stress/strain would result in a decrease in the life of electronic packages. Therefore, the predicted life can be dete

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35

Beazley, Malory. "Out of the Cupboards and Into the Streets!: Harry Potter Genderfuck Fan Fiction and Fan Activism." Thesis, 2014. http://spectrum.library.concordia.ca/978492/1/Beazley_MA_S2014.pdf.

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Henry Jenkins’ definition of fan activism emphasizes the tactics fans use to effect widespread political and social change at a grassroots level. Yet fan activism is also more of a loose or fluid concept that includes active and implicit manifestations of resistance. Surveying two different genres of Harry Potter genderfuck fan fiction - genderswap and transfic - helps illustrate the complex ways in which fans enact their political agency. The work that fans do in online communities, from writing contemporary academic theories into fan fiction to intervening in popular fan tropes that present

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36

Huang, Pei-Cheng, and 黃沛誠. "Warpage Improvement of Molded Wafer for Fan-out Wafer Packaging." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/rn4wre.

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碩士<br>國立中興大學<br>機械工程學系所<br>106<br>In recent years, the global economy has grown steadily. The semiconductor industry and electronic product technologies have leapt forward, making people''s lives more convenient and the means of obtaining information more diversified. Advanced packaging technology play a decisive role in the development of high performance, high density, low power consumption and small size of integrated circuits (ICs). Traditional wire bonding and flip chips packages have failed to meet the demand. Therefore, fan-out wafer level packages (FOWLPs) have been developed and gradu

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LO, WEI-CHEN, and 羅韋晨. "Warpage Simulation Analysis for Fan-out Panel Level Packaging Process." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/8g32d7.

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碩士<br>國防大學理工學院<br>機械工程碩士班<br>107<br>Fan-out panel-level packaging (FOPLP) technology is known as next-generation fan-out technology because of its high throughput and thin package. However, warpage may occur in the FOPLP process, which causes subsequent yield and reliability problems. Therefore, this thesis adopts finite element software to simulate the warpage generated by FOPLP in each stage process and discusses the influence of FOPLP packaging materials and structural parameters. The aim of this thesis is to determine the appropriate FOPLP geometry design and material parameters for improv

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38

Deng, Shang-Shiuan, and 鄧上軒. "Warpage Simulation of Fan-Out Wafer Level Chip Scale Package." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/37274369936517085920.

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碩士<br>國立成功大學<br>機械工程學系碩博士班<br>97<br>Wafer level packaging is an important development trend for IC package design. The fan-out wafer level package discussed here has the flip chip form which uses thin-film redistribute then uses solder bump to connect the package to the printed wiring board directly. Liquid compound was used for the encapsulation process. Comparing with wire-bond BGA, the fan-out wafer level package has better electric properties, lower power consumption, and smaller package size. Warpage problem plays an important role in IC encapsulation processes. Previous researchers had

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39

Liu, Yan-Cheng, and 劉晏誠. "A Study of Out-of Plane Deformation of Fan-out Wafer-level Package during Fabrication Process." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/rnpy55.

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碩士<br>逢甲大學<br>航太與系統工程學系<br>106<br>Globally, consumer demand for electronic devices having small form factor, low cost, great functional diversification, high performance and even low power consumption is still growing. As such, developing advanced semiconductor manufacturing technologies is straightforward for achieving these desired goals. Though FOWLP technology is presently one of the rapidest-growing and even fastest-spreading advanced packaging technologies, several crucial issues remain not fully resolved and elucidated, such as large form factor manufacturing, yield, reliability, therma

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40

Cheng-YingYang and 楊承穎. "Warpage and Die-shift Analyses for Fan-out Wafer Level Packaging." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/a5rxn6.

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碩士<br>國立成功大學<br>機械工程學系<br>106<br>Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer

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鄭義宣. "Investigating Warpage and Stress Distribution of Fan-Out Panel Level Packaging." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/qqumak.

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碩士<br>國立交通大學<br>機械工程系所<br>106<br>This research aims to investigate the warpage of the fan out panel level packaging (FOPLP) induced by thermal process through finite element analysis. Firstly, based on the warpage experiment of epoxy molding compound (EMC) and glass, this research characterize the chemical shrinkage of EMC. Through the verification of experiment and simulation, the chemical shrinkage of EMC is 0.96% under the specific process. Then, the accuracy of the simulation method was verified by the warpage experiment and simulation of packaging specimen test, and the simulation method

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42

Tsai, Chia-Han, and 蔡佳翰. "Warpage analysis of Fan-out panel level packaging using equivalent CTE." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/g838ae.

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Liao, Tsung-Jen, and 廖宗仁. "Effects of Temperature Cycling Test on Fan-out Wafer Level Package Reliability." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/u47a6e.

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碩士<br>國立交通大學<br>工學院半導體材料與製程設備學程<br>103<br>Fan-out Wafer Level Package is the upcoming future packaging technology. FO-WLP has the potential to realize any number of interconnects with standard pitches at any shrink stage of the wafer node technology. The purpose of this thesis was investigated in reliability test of Pre-condition &; TCT 250/500 cycles with finished FO-WLP product. Interface observed differences and solder layer metallurgical reaction between the different coefficient of thermal expansion. And trying to figure out the relationship between the shear mode and shear strengt

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LI, YU-JUN, and 黎昱均. "Warpage Simulation and Optimization Analysis of Fan-out Wafer Level Package Process." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/a5bts3.

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碩士<br>國防大學理工學院<br>航空太空工程碩士班<br>107<br>Fan-out wafer level package (FOWLP) is one of most popular packaging technology in recent years. This is because FOWLP is considered as the key to break through the bottleneck of Moore’s Law, and it provides opportunities for the foundries to participate packaging business. However, FOWLP process is facing the challenges on packaging warpage during manufacturing process due to CTE mismatch between the structure materials. To this end, FOWLP warpage in each process stages were simulated, and a new silicon ring design was proposed to reduce process warpage i

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Ling, Fang-Yu, and 林枋萭. "Investigating Mechanical Behaviors of Fan-Out Panel Level Packaging Structures during De-bonding." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/k8528y.

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碩士<br>國立交通大學<br>機械工程系所<br>107<br>This research aims to investigate the mechanical behaviors of a Fan-Out Panel Level Packaging (FOPLP) display during the fabrication process using finite element analysis. The fabrication process includes the thermal cycling process and the de-bonding process of FOPLP display. By understanding the stress and strain distribution with FOPLP display, the degree of damage or failure for the FOPLP display during fabrication process can be reduced. In order to understand the mechanical de-bonding process, a simplified FOPLP two-dimensional finite element model was es

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Jhong, Jia-Heng, and 鍾佳衡. "Die Shift Assessment During Compression Molding in Fan-out Wafer-Level Packaging Process." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/67phv7.

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碩士<br>國立清華大學<br>動力機械工程學系<br>106<br>Due to the urgent need for miniaturization, multi-function, high performance and portability of electronic products, and the bottlenecks of lithography process technology, the advanced packaging technology is booming. The fan-out wafer level assembly has become one of the fastest growing semiconductor assembly technologies, which has the advantages of low cost, small size, high I/O count, excellent electrothermal performance and excellent multi-functional integration capability. However, there are still many problems to be solved, such as die shift, which wil

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Lin, Hsueh Ju, and 林雪如. "A Methodology for Alleviating Die Shift of Fan-Out Wafer-Level Packaging (FOWLP)." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/72905735841760367651.

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碩士<br>國立清華大學<br>資訊工程學系<br>103<br>Fan-out Wafer Level Packaging (FOWLP), which performs the packaging of dies while still being part of the wafer, has attracted a lot of attention for advanced electronic products in recent years. However, in FOWLP, there is a mechanical problem, the die shift problem which can cause a die to be shifted away from its original position on the carrier for FOWLP. The die shift problem can lead to the misalignment of contacts and therefore cause failure of dies. It has been shown by several researches that the majority of dies are shifted away from the center. Takin

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Hong, Yu-Ting, and 洪鈺婷. "Thermo-Hygro-Mechanical Stress and Warpage Analyses of Fan-Out Wafer Level Package." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/zedhbr.

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碩士<br>國立中山大學<br>機械與機電工程學系研究所<br>106<br>Since the polymer materials in electronic package are humidity sensitive, then their material properties may cause warpage of the package. When the polymer materials absorb moisture in the external environment and are affected by the temperature changes, the thermal stress and moisture stress are generated in polymers. Both the thermal expansion coefficient mismatch and moisture expansion coefficient mismatch can also result in the thermal stress and moisture stress. Based on the above statements, the package warpage occurs. This work adopted the finite e

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Wang, Kai Li, and 王凱立. "Test Cost Reduction Methodology for Integrated Fan-Out Wafer Level Chip Scale Package." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/26437843300124712064.

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碩士<br>國立清華大學<br>電機工程學系<br>104<br>The integrated fan-out wafer level chip scale packaging (InFO WLCSP) is one of the emerging packaging technologies to achieving small chip form factor with low manufacturing cost. In InFO WLCSP, copper (Cu) pillars are used as the contact interfaces, which can be probed directly without solder caps, thus decreasing test cost. Without solder caps, however, Cu pillars that are exposed in the air will be oxidized gradually, which increases the contact resistance, and leads to test quality loss. To alleviate this problem, the touch-down is a scheme to remove oxidat

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HSU, HUI-LING, and 許惠玲. "The Study of Wafer Sort Control in Fan Out Wafer Level Package (FOWLP)." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/19779089796225125965.

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碩士<br>國立高雄大學<br>電機工程學系--先進電子構裝技術產業研發碩士專班<br>104<br>This thesis aims the study of wafer sort control in fan out wafer level package (FOWLP). In this study a design of wafer prober and wafer probing operation to reduce the risk of wafer broken and wafer damage which caused by conditional wafer warpage in wafer sorting process. By using the design of experiment method and validate wafer handling acceptable working criteria of wafer prober, it is proved to improve mapping of wafer probing profile. The error modes due to wafer warpage in fan-out wafer level packaging can be resolved by the devel

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