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1
Dadgostari, Soheila. "Bone-bonding to alkali/heat treated titanium". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2000. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape4/PQDD_0028/MQ50336.pdf.
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Kato, Hirofumi. "Bonding of alkali-and heat-treated tantalum implants to bone". Kyoto University, 2001. http://hdl.handle.net/2433/150541.
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Kawai, Toshiyuki. "Bone-bonding properties of Ti metal subjected to acid and heat treatments". Kyoto University, 2013. http://hdl.handle.net/2433/174787.
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Nishiguchi, Shigeru. "Bone-bonding Abilities of Alkali- and Heat-treated Titanium and Titaniumu Alloys". Kyoto University, 2000. http://hdl.handle.net/2433/180814.
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Cristescu, Carmen. "Bonding veneers using only heat and pressure : focus on bending and shear strength /". Luleå, 2008. http://epubl.luth.se/1402-1757/2008/43.
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Peksen, Murat. "Numerical modelling of nonwoven thermal bonding process & machinery". Thesis, Loughborough University, 2008. https://dspace.lboro.ac.uk/2134/14703.
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Nonwoven-fabrics have been in use since 1930s. Their advantages over other web fonnation methods like knitting and weaving have attracted many industries such as aerospace, automotive, sports, geotextiles, composites, battery separators etc. to explore and increase their usage. During nonwoven manufacturing, most of the laid loose webs have an insufficient strength as fonned, and require an additional bonding procedure in order to provide the produced nonwoven with its intended properties. To achieve the desired properties of the nonwoven web, the bonding process is therefore, the most important part during production. The thennal bonding through air is one of the modem techniques which is incrementally improved to increase the yield of manufactured nonwoven properties. The system has a disadvantage which is, that the production capacity and energy efficiency is very low. The entitled research aims an industrial optimisation of the thermal bonding through air by entailing a strategic approach and encompassing the whole process chain of the thennal bonding process. The comprehensive and flexible optimisation opportunities provided by the CFD has been used to aid in the control and optimisation of the thermal bonding process and machinery. To optimise the process and product quality, the complex system composing of several components and various physical phenomena occurring during processing is simulated using a hierarchical methodology. More specifically a hierarchical decomposition procedure to recast the original multi scale problem as a sequence of three scale decoupled macro-, meso-, and micro scale subproblems is exploited. The methodology is applied in conjunction with the validation of experiments on through-air bonding product lines. 2D and 3D computational fluid dynamics (CFD) models based on the continuum modelling approach and the theory of porous media coupled with the theory of mixtures are developed to treat the flow behavior, heat transfer, phase change and air moisture transport within the whole through-air bonding system. The model is concluded to be an economic computational tool hence providing rapid process optimisation and valuable infonnation early in the process, which can replace costly experiments and ensure product consistency under variable process and climate conditions. 2D and 3D hybrid modelling considering parametric discrete and continuum parts is also perfonned using conjugate heat transfer analyses. The approach precisely permits the optimisation of the machine component design and the associated optimisation of consistent process and product properties.
7
Alobaid, Baleegh. "SYNTHESIS AND CHARACTERIZATION OF MAGNESIUM - TITANIUM COMPOSITES BY SEVERE PLASTIC DEFORMATION". UKnowledge, 2018. https://uknowledge.uky.edu/cme_etds/91.
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Magnesium alloys are widely used in engineering applications, including aerospace and automobile industries, due to their desirable properties, such as lower density, high damping capacity, relatively high thermal conductivity, good machinability, and recyclability. Researchers have, therefore, been developing new magnesium materials. However, mechanical and corrosion properties are still limiting many commercial applications of magnesium alloys. In this Ph.D. thesis research, I developed Mg-Ti composite materials to offer some solutions to further improve the mechanical behavior of magnesium, such as titanium-magnesium (Ti-Mg) claddings, Mg-Ti multilayers, and Ti particle enforced Mg alloys. Low cost manufacturing processes, such as hot roll-bonding (RB) and accumulative roll-bonding (ARB) techniques, were used to produce Mg-Ti composites and sheets. The microstructural evolution and mechanical properties of composites were investigated using optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), electron backscatter diffraction (EBSD), nanoindentation, and tensile tests.
In the first part of this study, I investigated the bonding strength of the AZ31/Ti to understand the mechanical properties of Mg/Ti composites. Using a single pass RB process, I fabricated AZ31/Ti multilayers with the thickness reduction in a range of 25% to 55%. The hot-rolled AZ31/Ti multilayers were heat-treated at 400 °C for 6, 12, and 24 hours, respectively, in an argon atmosphere. Tensile-shear tests were designed to measure the bonding strength between AZ31/Ti multilayers. Furthermore, the experimental results revealed good bonding of the AZ31/Ti multilayers without forming any intermetallic compounds in the as-rolled and heat-treated AZ31/Ti multilayers. The good bonding between Ti and AZ31 is the result of diffusion bonding whose thickness increases with increasing heat-treatment time and thickness reduction. The shear strength of the Ti/AZ31 multilayer increases with increasing bonding layer thickness.
In the second part of this study, I characterized the microstructure and texture of three-layered Ti/AZ31/Ti clad sheets which were produced by single-pass hot rolling with a reduction of thickness 38% (sheet I) and 50% (sheet II). The AZ31 layer in sheets I and II exhibited shear bands and tensile twins {1012}⟨1001⟩ . The shear bands acted as local strain concentration areas which led to failure of the clad sheets with limited elongation. Heat treatment caused changes in the microstructure and mechanical properties of clad sheets due to static recrystallization (SRX) on twins and shear bands in the AZ31 layer. Recrystallized grains usually randomize the texture which causes weaken the strong deformed (0001) basal texture. Twins served as nucleation sites for grain growth during SRX. Tensile tests at room temperature showed significantly improved ductility of the clad sheets after heat treatment at 400°C for 12h. The results showed that the mechanical properties of clad sheets II are better than clad sheet I: The clad sheet II shows elongation 13% and 35% along the rolling direction (RD) for as-rolled and annealed clad sheet, respectively whereas the clad sheet I shows elongation 10% and 22% along RD for as-rolled and annealed clad sheet, respectively.
In the final part of this study, I examined the effects of dispersed pure titanium particles (150 mesh) with 0, 2.3, 3.5, 4.9, and 8.6 wt. % on the microstructure and mechanical properties of AZ31-Mg alloy matrix. Mg-Ti composites were processed through three accumulative roll bonding (ARB) steps using thickness reductions of 50% in each pass followed by heat treatment at 400 °C for 12 h in an argon atmosphere. ARB is an efficient process to fabricate Mg-Ti composites. Mechanical properties of Mg- 0Ti and Mg-2.3Ti composite were enhanced by ~ 8% and 13 % in yield strength and ~ 30% and 32 % in ultimate tensile strength, respectively. Meanwhile, the elongation of the composites were decreased by 63% and 70%, respectively. After heat treatment, the results showed a decrease in yield strength and increase in elongation to fracture. The mechanical properties of the Mg-0 and Mg-2.3Ti composite were enhanced: ultimate tensile strength by 9% and 7%, and elongation by 40% and 67%, while the yield strength was decreased by 28% and 36% compared with the initial AZ31. Enhancements of strength and ductility were the results of two mechanisms: a random matrix texture by ARB and ductile titanium particle dispersion.
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Skiles, Jean Ann. "Chromic acid anodized Ti-6Al-4V: its characterization and its single lap bond strength to heat resistant adhesives". Diss., Virginia Polytechnic Institute and State University, 1987. http://hdl.handle.net/10919/53661.
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Anodized Ti-6Al-HV/adhesive bonds exhibit improved corrosion resistance and a higher strength-to-weight ratio compared to conventional metal bonding techniques for primary and/or secondary structural applications. This work was conducted to identify chromic acid (CA) anodization and bond process conditions which produced durable, structural anodized Ti-6Al-4V/heat resistant single lap bonds and to understand why these conditions were necessary. A structural single lap bond was defined as a bond tested at 298K ≤ 0.5 month after bonding and with a strength ≥ 6.9 MPa, based upon values reported in structural adhesive manufacturers' product literature. A durable, structural single lap bond was defined as a bond with a strength ≥ 6.9 MPa strength at 298K after 9 months aging at 433K. Heat resistant adhesives tested had reported service temperatures ≥ 423K, and were: polysulfone; eolyethersulfone; polyphenylquinoxaline; polyetherimide, both unfilled and 20% glass filled; and 50% calcium carbonate filled polyimide.
Hydrofluoric acid (HF) added to the CA anodization solution was necessary to produce structural bonds. CA/HF oxide was more porous, and thicker than the CA anodic oxide (140 nm vs. 20 nm), perhaps promoting physical and oxide/adhesive interphase mechanical interlock. Structural, durable CA/HF anodized Ti-6Al-4V-adhesive bonds were produced for all adhesives tested except for the filled polyimide (5.5 MPa). The filler may have occluded oxide pores and prevented optimal adhesive/oxide interphase interlock, and there may have been competition of polyimide for calcium carbonate filler and for oxide. Average oxide thickness values of 65 to 410 nm did not affect bond strength; structural bonds were produced in all cases. CA/HF initial current density of 20 Amperes per square meter produced 33% stronger polysulfone bonds than 30 Amperes per square meter. Polysulfone microstructure may have been chemically degraded by the unnecessarily high fluoride concentration in the oxide from the higher current density. Lica® 44 titanate primer did not significantly influence bond strength or durability, except when unfilled polyetherimide was the adhesive. Polyphenylquinoxaline bond processing influenced bond strength. Structural bonds resulted for all the CA/HF anodization and process conditions described above. Single Iap bond fracture initiated in the adhesive (polymer) fillet. Fracture propagation in the bond overlap was through the polymer/anodic oxide interphase and/or cohesively in the polymer.Ph. D.
9
Tsukanaka, Masako. "Evaluation of bioactivity of alkali- and heat-treated titanium using fluorescent mouse osteoblasts". Kyoto University, 2014. http://hdl.handle.net/2433/188658.
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Fujibayashi, Shunsuke. "Bioactive titanium : Effect of sodium removal on the bone-bonding ability of bioactive titanium prepared by alkali and heat treatment". Kyoto University, 2003. http://hdl.handle.net/2433/148689.
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Yi, Tian. "In vivo study of the early bone-bonding ability of Ti meshes formed with calcium titanate via chemical treatments". Kyoto University, 2016. http://hdl.handle.net/2433/215392.
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Final publication is available at http://link.springer.com/article/10.1007%2Fs10856-015-5612-2Kyoto University (京都大学)
0048
新制・課程博士
博士(医学)
甲第19566号
医博第4073号
新制||医||1013(附属図書館)
32602
京都大学大学院医学研究科医学専攻
(主査)教授 安達 泰治, 教授 戸口田 淳也, 教授 鈴木 茂彦
学位規則第4条第1項該当
12
Mylavarapu, Sai Kiran. "Design, Fabrication, Performance Testing, and Modeling of Diffusion Bonded Compact Heat Exchangers in a High-Temperature Helium Test Facility". The Ohio State University, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=osu1321996306.
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Шилінцева, Тетяна Михайлівна. "Технологія одержання композиційних нетканих матеріалів функціонального призначення". Магістерська робота, Київський національний університет технологій та дизайну, 2021. https://er.knutd.edu.ua/handle/123456789/19565.
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Розглянуто сучасний стан питань в галузі одержання композиційних нетканих матеріалів функціонального призначення та дослідження їх властивостей. Визначений раціональний рецептурний склад та розроблений процес одержання термоскріплених нетканих матеріалів з використанням бікомпонентних волокон типу "ядро/оболонка" та покращеними еластичними характеристиками. Встановлено, що збільшення кількості бікомпонентних волокон в волокнистій композиції з 10 до 25 мас.% приводить до зростання абсолютної міцності нетканих матеріалів в 1,6 раз з одночасним збільшенням розривного видовження до 80%. Встановлено, що волого-теплова обробка нетканих матеріалів типу "синтетичний пух" призводить до їх усадження. При цьому ступінь усадження визначається як умовами проведення процесу, так і складом волокнистої суміші. Визначено вплив складу волокнистої суміші при одержанні нетканих матеріалів типу "синтетичний пух" на їх здатність до водопоглинення. Показано, що збільшення кількості бікомпонентних волокон в волокнистій композиції до 25 мас.% зумовлює поступове зниження водопоглинення ~ до 2 разів. Проведено аналіз шкідливих, небезпечних факторів пожежної безпеки та енергозбереження при виробництві композиційних нетканих матеріалів функціонального призначення.The current state of issues in the field of obtaining composite nonwovens for functional purposes and research of their properties is considered. The rational recipe composition has been determined and the process of obtaining heat-bonded nonwovens with the use of bicomponent fibers of the core/shell type and improved elastic characteristics has been developed. It is established that the increase in the number of bicomponent fibers in the fibrous composition from 10 to 25 wt.% Leads to an increase in the absolute strength of nonwovens by 1.6 times with a simultaneous increase in tensile elongation to 80%. fluff "leads to their shrinkage. The degree of shrinkage is determined by both the conditions of the process and the composition of the fibrous mixture. The influence of the composition of the fibrous mixture in the production of nonwovens such as "synthetic down" on their ability to absorb water was determined. It is shown that increasing the number of bicomponent fibers in the fibrous composition to 25 wt.% Causes a gradual decrease in water absorption ~ up to 2 times. The analysis of harmful, dangerous factors of fire safety and energy saving in the production of composite nonwovens for functional purposes.
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Ferreira, Bruno Santos [UNESP]. "Avaliação do desempenho de compensados de Pinus taeda submetidos a tratamento térmico e químico". Universidade Estadual Paulista (UNESP), 2017. http://hdl.handle.net/11449/151720.
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O setor madeireiro tem crescido nos últimos anos no Brasil, visto que o país possui vastas áreas com florestas de reflorestamento. Entretanto, com o passar dos anos, tem crescido a consciência de uma melhor utilização das matérias-primas, inclusive da madeira. Neste contexto, surgem os painéis à base de madeira, os quais utilizam melhor as toras, que podem ser de diferentes dimensões. Dentre estes painéis, destaca-se o compensado laminado, que é um painel produzido com um número ímpar de lâminas de madeira, dispostas perpendicularmente umas às outras com relação a direção da grã. Este painel possui ampla utilização, principalmente na indústria moveleira e na construção civil, podendo ser utilizado em construções do tipo wood frame. Além disso, o compensado necessita passar por algum processo de tratamento contra o ataque de fungos, insetos e intempéries. Assim, este estudo teve o objetivo de analisar a influência de tratamentos preservativos nas propriedades físicas e mecânicas do compensado laminado de Pinus taeda. Para isso, foi realizada a termorretificação, com três diferentes temperaturas (160°C, 180°C e 200°C) e o tratamento químico com CCA. Foram realizados os tratamentos das lâminas antes da produção do compensado e os tratamentos dos painéis já produzidos, sem prévio tratamento das lâminas, com o intuito de avaliar qual forma de tratamento é a mais adequada. Foram realizadas as análises de teor de extrativos totais, molhabilidade das lâminas, microscopia eletrônica de varredura e testes físicos e mecânicos. Os resultados obtidos mostraram que os tratamentos de termorretificação e o tratamento com CCA melhoraram a estabilidade dimensional do painel compensado, devido às alterações químicas ocorridas na madeira. Além disso, ambos os tratamentos diminuíram a resistência mecânica à flexão estática e a qualidade de colagem. Entretanto, todos os tratamentos continuaram a atender as especificações mínimas de órgãos normativos. Com base em todas as análises concluiu-se que a termorretificação do painel a 200°C mostrou-se mais adequada.
The forestry sector has grown recently in Brazil, since the country has vast reforestation fields. However, over the years, there has been growing the consciousness of a better use of raw materials, including wood. In this context arise the wood based panels, which make better use of logs, which may be of different dimensions. Among these panels is highlighted the plywood, which is a panel produced with an odd number of wood veneers arranged perpendicularly to each other with respect to the grain direction. This panel has wide application, especially in the furniture industry and in construction and can be used in wood frame type construction. Besides that, the plywood needs to undergo some treatment process against the attack of fungi, insects and weatherproof. Thus, this study aims to analyze the influence of preservative treatments on physical and mechanical properties of Pinus taeda plywood. To this were performed the heat treatment with three different temperatures (160 °, 180 ° C and 200 ° C) and chemical treatment with CCA. It was carried out the veneers treatments before the production of plywood and the panel treatment, without prior veneers treatment, in order to assess which form of treatment is most appropriate. The analyzes of extractive content, veneers wettability, scanning electron microscopy and physical and mechanical tests were performed. The results showed that the heat treatment and CCA treatment improved the dimensional stability of the plywood due to chemical changes in the wood. In addition, both treatments decreased mechanical strength in static bending and bonding quality. However, all treatments continued to meet the minimum specifications of specialized organs. Based on all the analyzes it was concluded that the heat treatment of the panel at 200°C was more adequate.
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Pic, Axel. "Numerical and experimental investigations of self-heating phenomena in 3D Hybrid Bonding imaging technologies". Thesis, Lyon, 2019. http://www.theses.fr/2019LYSEI054.
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Dans cette thèse, les phénomènes d’auto-échauffement ont été étudié pour guider la conception de circuits intégrés 3D de nouvelle génération. Grâce à des études expérimentales et numériques, la dissipation thermique dans des imageurs 3D par collage hybride a été analysée et l’impact de l’augmentation de température résultante a été évalué. Premièrement, afin de développer des modèles précis, les propriétés thermiques des matériaux utilisés dans les circuits intégrés ont dû être déterminées. Différents films minces diélectriques impliquant des oxydes, des nitrures et des composés low-k ont été étudiés. Pour ce faire, la microscopie thermique à sonde locale (SThM) et la méthode électrothermique 3ω, sensibles à la conductivité thermique effective faible et élevée, ont été mises en œuvre. Dans un deuxième temps, des modèles éléments finis de circuits intégrés 3D ont été développés. Une méthode numérique nécessitant homogénéisations et approches multi-échelles a été proposée pour surmonter des grands rapports de forme inhérents à la microélectronique. La procédure numérique a été validée en comparant les calculs et les mesures expérimentales effectuées par SThM, la thermométrie résistive et la microscopie infrarouge sur une puce de test par collage hybride simplifiée. Il a été montré que la dissipation de chaleur est principalement limitée par la conductance du puit thermique ainsi que les pertes par l'air. Enfin, des études numériques et expérimentales ont été réalisées sur des imageurs 3D par collage hybride fonctionnels. Le champ de température a été mesuré par SThM et comparé aux calculs par éléments finis à la surface de la matrice. Les résultats numériques ont montré que la température de la surface des pixels est égale à celle du Front-End-Of-Line de l’imageur. L'influence de l'échauffement sur les performances optiques de l'imageur a été déduite de cette analyse. Cette étude a permis également d'évaluer les différentes méthodes numériques et expérimentales pour la caractérisation de la dissipation de chaleur en microélectroniqueIn this PhD thesis, self-heating phenomena are studied for guiding the design of next-generation 3D Integrated Circuits (ICs). By means of experimental and numerical investigations, associated heat dissipation in 3D Hybrid Bonding imagers is analyzed and the impact of the resulting temperature rise is evaluated. First, in order to develop accurate models, the thermal properties of materials used in ICs are to be determined. Different dielectric thin films involving oxides, nitrides, and low-k compounds are investigated. To do so, Scanning Thermal Microscopy (SThM) and the 3ω electrothermal method, sensitive to low and large effective thermal conductivity, are implemented. In a second step, finiteelement models of 3D ICs are developed. A numerical method involving homogenization and a multiscale approach is proposed to overcome the large aspect ratios inherent in microelectronics. The numerical procedure is validated by comparing calculations and experimental measurements performed with SThM, resistive thermometry and infrared microscopy on a simplified Hybrid Bonding test chip. It is shown that heat dissipation is mainly limited by the heat sink conductance and the losses through air. Finally, numerical and experimental studies are performed on fully-functional 3D Hybrid Bonding imagers. The temperature field is measured with SThM and compared with finite-element computations at the die surface. The numerical results show that the temperature of the pixel surface is equal to that of the imager Front-End-Of-Line. The influence of the temperature rise on the optical performance of the imager is deduced from the analysis. The study also allows assessing the various numerical and experimental methods for characterizing heat dissipation in microelectronics
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Monin, Thomas. "Études de systèmes thermo-fluidiques auto-oscillants pour des applications de récupération d'énergie thermique". Thèse, Université de Sherbrooke, 2017. http://hdl.handle.net/11143/11868.
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Les progrès technologiques considérables menés depuis ces dernières décennies
nous permettent aujourd’hui de disséminer dans notre environnement une nuée de
noeuds de capteurs communicants combinant la taille micrométrique et la consommation
dérisoire caractéristiques des MEMS avec la puissance des protocoles de
communications Internet. L’Internet des Objets, formé par ce réseau de capteurs,
possède le potentiel d‘optimiser un grand panel d’applications industrielles et domotiques.
Le nouveau défi, que la communauté du Energy Harvesting tente de relever
depuis une décennie maintenant, est de rendre ces noeuds de capteurs autonomes
en les alimentant grâce à l’énergie perdue dans leur environnement.
Dans ces travaux de recherche, nous explorons le potentiel d’un principe thermo-fluidique
auto-oscillant pour la génération d’énergie utile à partir d’une source thermique
de faible qualité. L’implémentation de cette technologie en tant que machine
thermique est étudiée et mène à la caractérisation d’un nouveau cycle thermodynamique
caractéristique du SOFHE (Self Oscillating Fluidic Heat Engine).
Nous montrons, par une approche phénoménologique, que notre machine thermique
se comporte comme un oscillateur mécanique, excité par les évaporations
et condensations successives du fluide de travail. Ces changements de phase alternatifs
mettent en mouvement une colonne d’eau, jouant le rôle de masse, couplée
à une zone de vapeur, jouant le rôle d’un ressort.
Une étude de l’influence du couplage du SOFHE avec un transducteur électromécanique,
représenté par un oscillateur, mène à la conception et la fabrication d’une spirale
piézoélectrique. L’intégration de cette spirale à notre machine thermique forme
un générateur thermo-électrique dont les capacités de conversion sont démontrées
par la charge d’une capacité.
Finalement, la miniaturisation du principe thermo-fluidique SOFHE est rendue possible
par la réalisation d’un procédé de fabrication utilisant les techniques MEMS.
Des dispositifs miniatures parviennent à exhiber un comportement oscillatoire montrant
le potentiel d’intégration de cette technologie.Abstract : The tremendous technological progresses realized in the last decades allow us to swarm our environment with Wireless Sensors Networks. These WSNs combine the MEMS’ miniature size and low energy consumption, and the powerful Internet communication protocols. This Internet of Things shows great potential in many applications such as industry or housing. For a decade now, the Energy Harvesting community wants to build autonomous WSNs by enabling them to feed off energy wastes. In this work, we study the electricity generation capabilities of a Self-Oscillating Fluidic Heat Engine (SOFHE) and present its characteristic thermodynamic cycle. Our model shows that the SOFHE acts as a mechanical resonator excited by the successive evaporation and condensation processes underwent by the working fluid. These phase changes put a liquid mass in motion, coupled with a vapor spring. The coupling of our heat engine with an electromechanical transducer is studied and leads to a piezoelectric spiral conception and fabrication. Their association forms a thermo-electrical generator able to power and charge an electrical capacitor. Eventually, we demonstrate the miniaturization prospects and integration potential of this SOFHE technology. A micro-fabrication process enables a SOFHE MEMS implementation. Our process includes a deep glass wet etching step as well as a Au-Si eutectic wafer bonding.
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Alba, Diego Rafael. "Soldagem híbrida por difusão através de fricção (HFDB) para a união de tubos e flanges de alumínio". reponame:Biblioteca Digital de Teses e Dissertações da UFRGS, 2015. http://hdl.handle.net/10183/127863.
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Nas últimas décadas a soldagem em estado sólido vem se demonstrando como uma ótima alternativa perante os métodos tradicionais de união, os quais envolvem fusão dos materiais. O presente trabalho avalia a aplicação de um novo processo de união em estado sólido, a soldagem híbrida por difusão através de fricção (Hybrid Friction Diffusion Bonding - HFDB). O HFDB pode ser utilizado na união entre chapas finas ou também de chapas finas em substratos de materiais similares ou dissimilares. Através de calor e pressão os mecanismos de difusão são ativados gerando a união entre os materiais. Uma variante do processo de HFDB padrão pode ser utilizada para a fabricação das uniões de tubos e flanges-tubo de trocadores de calor de tubo espiral produzidos em alumínio. Utilizando como materiais duas ligas de alumínio dissimilares da série 5XXX, as amostras foram soldadas e caracterizadas. Visando a aplicação industrial do HFDB, o processo foi desenvolvido e sua viabilidade foi avaliada através de testes de estanqueidade, resistência à tração e análise metalográfica. Em seguida, visou-se a otimização dos parâmetros de soldagem (rotação, força axial e tempo de processo). Através de técnicas estatísticas de projeto de experimentos (DoE) os três fatores foram avaliados por meios de ensaios de tração para maximizar a resposta, limite de resistência. Investigações posteriores relacionadas aos mecanismos de união foram realizadas por meio da medição dos parâmetros de resposta, análise em microscópio ótico, aquisição de temperatura, espectroscopia de energia dispersiva de raios-x (EDX) e análise em elementos finitos (FEA). A primeira e mais importante premissa, a produção de soldas livres de vazamento, foi atingida. Em seguida, através da análise de uma equação de regressão e gráficos de superfície o conjunto de parâmetros otimizado – 1500 min-1 de rotação, 3 kN de força axial e 30 segundos de tempo de processo - atingiu resultados equivalentes a 95% de resistência quando comparados ao material base. O presente trabalho mostra que o processo de HFDB é promissor para aplicações industriais e indica vantagens perante os métodos tradicionais de união utilizados hoje na fabricação de trocadores de calor de alumínio.In past few decades solid state welding has been demonstrating to be a great alternative compared to the traditional joining methods, which involve melting of the materials. This study evaluates the application of a new soliid state joining process called Hybrid Friction Diffusion Bonding (HFDB). The HFDB can be used to join thin plates or thin plates on substrates of similar or dissimilar materials. Through heat and pressure diffusion mechanisms are activated generating the bonding between the materials. A variant of the standard HFDB process can be used to manufacture tubes and tube-sheets of Coil-Wound Heat Exchangers made of aluminum. Using two dissimilar aluminum alloys from the 5XXX series, the samples were welded and characterized. Intending an industrial application of the HFDB, the process was developed and its feasibility was assessed by leak tightness tests, tensile strength tests and metallographic analysis. Subsequently, it was aimed to optimize the welding parameters (speed, axial force and process time). Through statistical analysis of design of experiments (DoE), the three factors were evaluated by tensile tests to maximize the response, ultimate tensile stress. Further investigation related to bonding mechanisms were carried out by measuring the response parameters, optical microscope analysis, temperature acquisition, energy dispersive x-ray spectroscopy (EDX) and finite element analysis (FEA). The first and most important target, the production of leakage free welds was achieved. Then, through the analysis of a regression equation and surface plots, the optimized parameter set – 1500 min-1 of rotational speed, 3kN of Axial force and 30 seconds of process time - achieved 95% of resistance when compared to the base material. This study shows that the HFDB process is very promising for industrial applications and indicates advantages compared to the traditional joining methods used today to manufacture aluminum heat exchangers.
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Спицына, А. Ю. y A. J. Spicyna. "Влияние состояния поверхностей оптических деталей на технические характеристики сборок, склеенных с помощью клея Бальзамин М : магистерская диссертация". Master's thesis, б. и, 2021. http://hdl.handle.net/10995/104694.
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Исследовано влияние состояния поверхностей оптических сборок склеенных из стекол ЛК7 и ТФ7 на технические характеристики сборок, склеенных клеем «Бальзамин М», при воздействии различных климатических условий, их деформации, а также на прочность клеевого соединения при равномерном отрыве сборок, изготовленных из стекла К8, склеенных клеем «Бальзамин М».The influence of the state of the surfaces of optical assemblies glued from LK7 and TF7 glasses on the technical characteristics of assemblies glued with "Balzamin M" glue, under the influence of various climatic conditions, their deformation, as well as on the strength of the adhesive bond with uniform tearing of assemblies made of K8 glass glued with "Balzamin M" glue.
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Palau, José Carlos Fortes. "Avaliação do processo de preparação de superfície de envelope motor foguete para aderência de isolante térmico em aços de ultra-alta-resistência". Universidade de Taubaté, 2011. http://www.bdtd.unitau.br/tedesimplificado/tde_busca/arquivo.php?codArquivo=269.
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O objetivo deste trabalho é avaliar o processo atual de preparação de superfície para aderência de isolantes térmicos em envelopes motores foguetes de 1.000 mm de diâmetro, visando sua utilização no aço Maraging 18Ni300, tendo como parâmetros de comparação a rugosidade superficial e a resistência mecânica adesiva, obtida atualmente na interface colada metal/isolante térmico do aço 300MESR. Para isso, foram realizados experimentos de campo, com uma abordagem quantitativa, por meio da medida de rugosidade (Ra) nas superfícies de amostras de aços, submetidas a tratamento superficial mecânico de jateamento abrasivo a seco com granalha de aço de perfil angular, sendo posteriormente selecionadas e utilizadas como substrato em juntas adesivadas que, por fim, foram submetidas a ensaio mecânico de cisalhamento, para verificação da resistência mecânica adesiva. A utilização de métodos de análise estatísticos (análise de variância, teste de tukey, intervalo de confiança) aplicados aos dados coletados, permitiram estabelecer, para o processo atual uma faixa de resistência mecânica adesiva para cada aço pesquisado. Os resultados obtidos confirmam, com boa margem de segurança, que o processo atual de preparação de superfície para aderência de isolantes térmicos pode ser aplicado ao aço Maraging 18Ni300, sem que ocorra perda significativa de resistência mecânica adesiva na interface colada metal/isolante térmico.The aim of this work is to evaluate the current process of preparing the surface for adherence of thermal insulation in rocket motor of 1,000 mm diameter, seeking their use in Maraging18Ni300 steel, taking as parameters comparison the of surface roughness and mechanical adhesive strength obtained, currently, in the bonded interface metal /heat insulator 300M-ESR steel. A field experiment was conducted with a quantitative approach, by measuring surface roughness (Ra) on the surfaces of steel samples, subjected to mechanical surface treatment of dry abrasive blasting, with steel shot with angular profile and which were, subsequently, selected and used in bonded joints that were finally submitted to mechanical shear tests to verify the mechanical adhesive strength. The use of statistical methods of analysis (variance analysis, Tukey test, confidence interval), applied to selected data, allowed to establish for the current process, a range of mechanical adhesive strength for each steel investigated. The results confirm, with a good safety margin, that the current process of preparing the surface for adhesion of thermal insulation can be applied to the Maraging18Ni300 steel, without significant loss of mechanical adhesive strength in the metal /heat insulator bonded interface.
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Cibie, Anthony. "Substrats innovants pour des composants de puissance à base de GaN". Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAI014/document.
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A l’heure actuelle, le marché de l’électronique de puissance est dominé par les composants silicium. Néanmoins, de nouveaux matériaux comme le nitrure de gallium ont émergé dans ce domaine grâce à leurs propriétés intéressantes. Ces nouveaux composants sont principalement réalisés sur des substrats silicium ce qui induit certaines problématiques lors de leur fabrication ou au niveau de leurs performances. Nous nous sommes intéressés dans cette thèse à des approches d’un point de vue du substrat dans l’objectif de résoudre ces problématiques. Ce travail a permis notamment de mettre en place une succession de procédés technologiques afin de remplacer le substrat silicium de fabrication par d’autres matériaux pour améliorer les performances de ces composants. Cette approche a notamment permis de transférer des composants fonctionnels sur un substrat cuivre. L’impact électrique et thermique du remplacement du substrat initial par un nouveau matériau a été étudié. Ce travail ouvre ainsi la voie du report de composants en nitrure de gallium réalisés sur des substrats silicium de diamètre 200 mm ou plusNew materials such as gallium nitride (GaN) emerge as promising candidates for power electronics. The current trend is to fabricate the AlGaN/GaN power devices directly on (111) silicon substrates. It makes the expitaxy of the GaN challenging and affects the device performances. In this work, we focus on substrate approaches to solve these problems. A transfer process was developed to replace the silicon substrate by another material to enhance electrical performances of the devices. Especially, GaN devices were transferred on copper substrates without electrical degradation. Electrical and thermal characterizations were performed to study the impact of the transfer. This work offers a first approach on the transfer of GaN devices from 8 or even 12 inches silicon substrates
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Mellow, Tessa. "Bonding experiences in mothers of infants with severe congenital heart disease". Thesis, Royal Holloway, University of London, 2014. http://digirep.rhul.ac.uk/items/e3cc9ff4-6364-78a9-6912-8574e4494e34/1/.
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Mothers who have an infant with severe congenital heart disease (CHD) face an uncertain and emotionally challenging postpartum period as their baby is hospitalised and undergoes life-saving cardiac surgical treatment. There are many potential risk factors to mother-infant bonding, that is, the emotional tie a mother develops with her baby, in the context of infant illness. Having an infant with a diagnosis of severe CHD could be seen as a threat to the mother's experience of bonding. However, there is limited understanding about the maternal perception of bonding with an infant with severe CHD. This study aimed to explore mothers' bonding with their infant with severe CHD throughout antenatal, perinatal and postnatal periods and how they coped with any challenges to this bond. Interviews were conducted with eight mothers of infants aged between eight and fifteen months with severe CHD, who were recruited from a children's hospital and who were diagnosed either antenatally or postnatally. Interpretative Phenomenological Analysis was used to identify themes across the mothers' accounts. Four superordinant themes were identified: ‘An Emotional Start to Motherhood and the Mother-Infant Bond', ‘Losing Control in the Context of CHD', ‘Keeping Connected to the Baby' and ‘Moving on Together'. The findings identify mother-infant bonding as a process that can withstand challenges such as maternal-infant separation, potential loss of the infant and maternal feelings of disconnection from the baby. Practical strategies were used by mothers to maintain their bond with their infant following diagnosis and during hospitalisation. These included being close to their infant and taking over caregiving duties from the nurses. Mothers described strength and resilience from the experience and a process of increasingly feeling closer to their infant. Several potential research implications and clinical recommendations for healthcare professionals are suggested.
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Perret, Corinne. "Réalisation et optimisation de refroidisseurs à microcanaux en technologie silicium". Phd thesis, Grenoble INPG, 2001. http://tel.archives-ouvertes.fr/tel-00549755.
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Les convertisseurs d'électronique de puissance sont de plus en plus compacts. Les pertes générées dans les différents composants restent sensiblement constantes, voire croissantes, pourune puissance donnée, car l'augmentation des fréquences de travail 'est pénalisante à ce niveau. Les puissances volumiques à évacuer sont donc en augmentation et nécessitent la conception de· refroidisseurs plus efficaces. Les meilleures performances sont actuellement obtenues par des refroidisseurs en cuivre à microcanaux parcourus par un fluide caloporteur. Afin.de limiter les problèmes de fatigue thermique, due à la présence de différents matériaux, et d'augmenter la compacité, nous présentons dans cette thèse une démarche visant à réaliser des refroidisseurs à microcanaux en technologie silicium. Après avoir rappelé une méthode de calcul des pertes et les lois de la thermique et de l'hydraulique, nous présenterons les avantages attendus par notre approche; puis nous décrirons les technologies disponibles et celles retenues pour la réalisation de prototypes. Les deux derniers chapitres sont consacrés aux simulations des dispositifs comparées aux résultats expérimentaux, ainsi qu'à une recherche de conception optimale.
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Faucher, Jacinthe. "Subjective and Physiological Responses to Acute Stress in Socially Anxious Adults and Healthy Children". Thesis, Université d'Ottawa / University of Ottawa, 2016. http://hdl.handle.net/10393/34128.
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Social anxiety disorder (SAD) is one of the most common anxiety disorders and understanding its symptoms and risk factors is vital for developing treatments and prevention strategies. Atypical physiological responses have been observed in anxious individuals and their consequences present a human and economic burden. This dissertation includes two studies that explore the subjective and physiological responses to an acute stress in the context of treatment and risk factors for SAD.
The goal of the first study was to examine whether cognitive behavioural group therapy (CBGT) and a mindfulness-based stress reduction (MBSR) program differentially influenced the subjective and physiological response to a speech task. Participants in the treatment groups performed two speech tasks, before and after treatment, while a healthy control group completed it only once. Results indicated significant differences for the subjective, but not the physiological measures of stress. Patients with SAD reported higher subjective anxiety than the healthy control group and these scores were significantly reduced following treatment. Greater improvements were noted in the CBGT group; nonetheless, the study did indicate promising results for MBSR.
The second study aimed to explore the effects of behavioural inhibition (BI), parental bonding variables and their interaction on the subjective and physiological responses to a similar speech task in healthy children. BI was related to subjective anxiety in a predictive manner, but was generally unrelated to the physiological measures. Parental bonding variables were not related to any of the stress responses and no interaction between BI and parental bonding was observed.
These studies contribute to the literature by demonstrating treatment differences and their subjective and physiological consequences on stress reactions and exploring the extent to which risk factors for SAD affect the stress response in healthy children.
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Poi, Ming. "Low-barrier hydrogen bonding in bovine pancreatic Phospholipase A₂ and somatic INK4A-ARF locus mutations : a significant mechanism of gene inactivation in head and neck squamous cell carcinomas /". The Ohio State University, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=osu1486402544589967.
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Drehmann, Rico. "Haftmechanismen kaltgasgespritzter Aluminiumschichten auf keramischen Oberflächen". Doctoral thesis, Universitätsbibliothek Chemnitz, 2017. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-229668.
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Aluminiumschichten werden durch Kaltgasspritzen auf fünf verschiedene poly- und monokristalline keramische Werkstoffe (Al2O3 , AlN, SiC, Si3N4 , MgF2 ) appliziert. Dabei erfolgt eine Variation der Substrattemperatur und der Partikelgröße. Ausgewählte Proben werden einer nachfolgenden Wärmebehandlung unterzogen. Die im Fokus der Arbeit stehende Erforschung der an der Grenzfläche zwischen Aluminium und Keramik wirkenden Haftmechanismen erfolgt sowohl mithilfe einer mechanischen Charakterisierung (Stirnzugversuche) als auch durch verschiedene mikroskopische, spektroskopische und hochauflösende Methoden. Die Bewertung der Untersuchungsergebnisse zeigt, dass im Allgemeinen ein Anstieg der Haftzugfestigkeit mit steigender Substrat- und Wärmebehandlungstemperatur sowie mit zunehmender thermischer Effusivität des Substratwerkstoffs zu verzeichnen ist. Eine vergleichbare Auswirkung hat innerhalb bestimmter Grenzen die Zunahme der Partikelgröße. Mit der Heteroepitaxie wird neben der mechanischen Verklammerung ein weiterer wichtiger Haftmechanismus kaltgasgespritzter metallischer Schichten auf keramischen Substraten identifiziert. Die Ausbildung von quasiadiabatischen Scherbändern und statische Rekristallisationsprozesse wirken dabei als wichtige begleitende Mechanismen. Als Nachweis für heteroepitaktisches Wachstum ist die Existenz von (annähernd) parallelen, senkrecht oder geneigt zur Grenzfläche stehenden Ebenenpaaren, die eine geringe Gitterfehlanpassung aufweisen, zu werten. Der Vergleich mit PVD-Schichten zeigt, dass in Bezug auf die Orientierung von Gitterebenen verschiedene Mechanismen der Heteroepitaxie existieren, die von der atomaren Mobilität des Beschichtungswerkstoffs bestimmt werden.
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HUNG, SHIH-CHIEH y 洪士傑. "The development of high- heat-resistant aluminum alloy bonding wire". Thesis, 2016. http://ndltd.ncl.edu.tw/handle/enmex7.
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碩士國立高雄應用科技大學
模具系碩士在職專班
104
Aluminum bonding wire is currently used as material for large-current semiconductors such as power devices. Recently, however, increased power density requirements for aerospace, automotive and deep well drilling applications mean that higher junction temperatures are to be encountered in power electronics. Wide band gap semiconductors like SiC and GaN can operate at much higher temperatures and are currently being introduced to applications, such as MOSFETs and IGBTs. There have been demands for development of high heat resistant materials as power devices have higher density, become more compact and have higher output, high purity aluminum bonding wire can contribute to improve heat resistance temperature of packages. In this study, the main research projects are development of high purity aluminum alloy bonding wire as the power module , this experiment selected 4N aluminum ingot, with iron , copper and other metals to enhance the strength and heat resistance , Al-Fe-Cu alloy ingot through appropriate deployment under , extruded , and other steps can be cold drawn wire diameter 0.378 mm, breaking load ≧ 900g, elongation ≧ 18%, electrical conductivity ≧ 62% IACS, and its composition is Fe: 0.7%, Cu: 0.1-0.2%, Al: bal. Keywords: semiconductor package, power module, heat-resistant aluminum bonding wire
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HUNG, CHIN-LIN y 洪沁琳. "Research on semiconductor wire bonding process of heat block tooling". Thesis, 2018. http://ndltd.ncl.edu.tw/handle/656gzb.
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碩士國立高雄大學
電機工程學系-電子構裝整合技術產業碩士專班
106
Research on semiconductor of QFN and QFP product structure in IC assembly. Heat block is wire bonding process assisted tooling in IC assembly. Purpose is prevention of ball lifting, finger bonding fail, loop height issue, ball forming issue, etc. We would like to keep wire bonding process stability. In our research we found heat block and leadframe have design rule and satisfying criteria in IC assembly package layout.We also be application to reliability test that confirmed Package design quality. This research use FMEA to be main structure of this study. FMEA(Failure Mode and Effects Analysis)would build up analysis model of wire bonding process versus heat block design.
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Bose, Sumantra. "An internal convective heating technique for diffusion bonding highly parallel microchannel architectures /". 2008. http://hdl.handle.net/1957/9556.
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Wu, Chia-Yu y 吳家聿. "A Study of Underfill on the Heat Conduction Behaviors of Flip-chip Bonding Structure". Thesis, 2016. http://ndltd.ncl.edu.tw/handle/17462753106589006539.
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碩士國立交通大學
材料科學與工程學系所
104
Underfill (UF) may promote the reliability of flip-chip (FC) bonding by the providing adhesion in between integrated circuit chip and substrate. As the increasing demand of heat dispersion of electronic components, the UFs with high thermal conductivities () attracts a lot of research interests. Nevertheless, our previous study found that such high-heat-conduction UFs might not necessarily be a crucial issue for FC technology. In order to clarify this controversy, this study adopts the Fourier’s law of heat conduction to establish a thermal conductivity measurement system in which the platinum (Pt) thin-film electrodes serve as the thermal heater and the temperature sensor. First, the feasibility of established system was verified by the measurement of values of Pyres glass and Al2O3 plates. Afterward, the values of prestine epoxy resins and commercially available UF were evaluated and the results indicated the incorporation of inorganic fillers benefits the thermal conduction of polymeric resins. Analytical results also revealed the influence of thermal boundary resistance (RTBR) at Pt/sample interface increases with the increase of value and the decrease of thickness of sample subjected to the test. Further, this study prepares the FC samples without and with the UF to investigate their thermal conduction behaviors. It was found that the UF changes the thermal transfer mode from radiation to conduction, leading to the thermal conduction improvement of FC sample and reduction of TBR property at Si/UF interface. Moreover, the thermal properties of materials obtained by above measurements were implanted in the calculation of thermal conduction behaviors of FC samples containing various solder bump arrays. With the increase of solder bump density, the influence of UF’s value and TBR property on the total thermal resistance and temperature gradient of FC sample gradually diminished. The utilization of high- UF might promote the thermal conduction of FC samples with low solder bump densities whereas it becomes insignificant in improving the thermal conduction of FC samples with relatively high solder bump densities.
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HUANG, PO-HSIANG y 黃柏翔. "Effect of The Heat Dissipation and Reliability for High-power LEDs with Different Die Bonding Processes". Thesis, 2017. http://ndltd.ncl.edu.tw/handle/376fnv.
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碩士明新科技大學
光電系統工程系碩士班
105
LED from a small electronic component, the development has become the world belong to the objects of the new production line. After 2009, more rapid growth in TV backlight and lighting applications market, create energy efficiency in technology and other factors have led to the growth, attracting manufacturers continue to invest to expand plant. In recent years, LED power boost, the accumulated heat is also getting higher and higher, the thermal spreader is not out of recession and lead to life LED luminous efficiency is reduced and the color temperature to produce the main reason for the change. LED heat conduction path from the inside to the outside, extending from the wafer, plastic timber, cups, brackets to the heat sink, the general conventional packaging methods most commonly used is the use of a solid crystal glue holding the wafer, if the solid crystal gum trouble heat removal, solid crystal plastic will lead to aging, yellowing, or bad, this paper investigate solid crystal plastic material of different thermal conductivity, the manufacturing process to make different thickness of plastic packages for LED brightness and thermal impact.
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Chang, Wei-Yao y 張巍耀. "An Investigation on Heat Affected Zone for Gold Wire/Copper Wire and Dynamic Response on Bonding Process". Thesis, 2008. http://ndltd.ncl.edu.tw/handle/96882539274442073938.
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碩士義守大學
機械與自動化工程學系碩士班
96
The wire bonding process has been widely used in the semiconductor package industry for the past two decades for its easy application and low cost. However, the mechanism of dynamic response for wire bonding process is scarcely reported due to the material data is difficultly to determine. As the price of gold is dramatically increasing in the year of 2008, engineers and researchers have been focused on the replacement material of copper wire. The present research involves two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The tensile mechanical properties of ultra thin gold/copper wires (φ=1mil) before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. Secondary EFO experiments are also conducted to observe the lower hardness of copper wire. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also carefully investigated by micro-hardness as well as nano-indentation tests. An empirical coefficient of hardening exponent was determined for Hell-Petch equation to evaluate the deformation of bond pad. The accurate experimental material data should be reflected as input for the precise finite element analysis. Numerical model based on explicit time integration scheme software ANSYS/LS-DYNA is developed to simulate the ball bond of wire bonding process. The impact effects on structure stressed area during wire bonding process are investigated and the shovel of pad was observed during transient ultrasonic vibration stage. It is noted that the material of bond pad should be Al pad instead pure Al pad. Special emphasizes are focused on the via layouts and the optimal design of microstructure beneath the bond pad. A series of comprehensive parametric studies were conducted in this research.
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Wu, Ting-jui y 吳挺瑞. "The study of heat block thermal distribution to improve epoxy film de-lamination in wire bonding process". Thesis, 2007. http://ndltd.ncl.edu.tw/handle/15646655629107518951.
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碩士國立高雄大學
電機工程學系碩士班
95
In wire bonding process, it is necessary for post curing the epoxy adhesive in order to provide good electrical and thermal conduction between the die and the substrate. In addition, conventional epoxy adhesive process usually cause failure modes of packaging such as dripping and die tilt. There are advantages of applying epoxy film to replace the conventional epoxy adhesive in reducing process steps and failure. However, there is failure mode of bad contact in wire bonding step by simply replacing the epoxy adhesive with epoxy film. The objective of this thesis is to explore the factors in wire bonding process with epoxy film by Taguchi methodology and numerical analysis approach to design the thermal structure of the heat block in wire bonding. We have invented a heat block structure of efficient performance with epoxy film in wire bonding.
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Rong-HongTsai y 蔡鎔鴻. "Effect of heat Treatment on the Polymer Adhesive Bonding and the Thermal Failure of Through Silicon Via Structure". Thesis, 2017. http://ndltd.ncl.edu.tw/handle/2be6n3.
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碩士國立成功大學
機械工程學系
105
Three-dimensional chip (3D IC) technology came into being. Mainly Using Through-Silicon Via to build the vertical wafer packaging technology allowed to connect different functional wafers in a stacked manner to achieve high line density and versatility. As a connecting wire, TSV was easy to generate heat when electricity passed through and affected differently to the thermal expansion of every layer with different materials. TSV could result in the instability of the entire structure and even cause defects, which was the problem remaining to be resolved. This study focused on the experimental and numerical results proved by the thermally-induced failures in the components of copper through-silicon via structures. All chips adopted via after bonding method and were stacked with the polymer gel BCB (Benzocyclobutene).This paper used Rapid Thermal Annealing Furnace (RTA) to joint test sample under four different environments, including normal atmosphere, N2, vacuum (2×10-2torr), and high vacuum (5×10-5torr).The thermal destroying experiments were carried out by time-Dependent Dielectric Layer Breakdown (TDDB) with joint test pieces under different environments. Plus, the failure time of each layer was verified by ANSYS / LS-DYNA numerical simulation.
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Paulraj, Prawin. "Adhesive microlamination protocol for low-temperature microchannel arrays". Thesis, 2012. http://hdl.handle.net/1957/28339.
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A new adhesive bonding method is introduced for microlamination architectures, for producing low-temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses and flow features, resulting in approximately 50% fewer laminae over traditional methods. These lamina designs are enabled by reduced bonding pressures required for the new method. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Feasible fill ratios were determined to be 1.1 in general and 1.25 around fluid headers, largely due to gaps between faying surfaces caused by surface roughness. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5-8.5 MPa using a 3X safety factor. Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% (9.6%) after bonding. Patterning tolerance and surface roughness of the faying laminae were found to have a significant influence on the final postbonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints. Operating pressures up to 413 kPa have been satisfied, equating to tensile pressure on bond joints of 1.9 MPa. Higher operating pressures can be accommodated by increasing the bond area of devices. A two-fluid counterflow microchannel heat exchanger has been redesigned, fabricated and tested to demonstrate feasibility of the new method. Results show greater effectiveness and higher heat transfer rates, suggesting a smaller device than the original heat exchanger. A maximum effectiveness of 82.5% was achieved with good agreement between theoretical and experimental values. Although thermal performance was improved, higher pressure drops were noted. Pressure drops were predicted with a maximum error of 16% between theoretical and experimental values. Much of the pressure drop was found to be in the device manifolds, which can be improved in subsequent designs. Fluid flow simulation results show a 45-65X reduction in fluid leakage velocity past sealing bosses, thereby mitigating adhesive erosion concerns. Theoretical models indicate that the worst-case adhesive erosion rate is 1/12th the rate of aluminum and 1/7th the rate of stainless steel, implying satisfactory reliability in high fluid velocity applications. Economic comparison indicates an 83% reduction in material cost and 71% reduction in assembly cost with the new adhesive bonding process, when compared to diffusion bonding for the recuperator investigated in this study. Adhesive compatibility with common refrigerants is reviewed through literature references, with no adverse compatibility issues noted. The findings of this research suggest a fairly quick path to commercialization for the new bonding method. Future studies required to pursue commercialization are liquid and gas permeability evaluations, and long term strength and performance testing of adhesives in targeted applications.Graduation date: 2012
Access restricted to the OSU Community at author's request from Mar. 26, 2012 - Mar. 26, 2013
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Yung-ChenTsai y 蔡咏真. "Electric Flame-Off Characteristics of Fine Ag-2Pd-0.2Au Alloy Wire and Effects of Electrification and Heat on the Bonding Interface". Thesis, 2015. http://ndltd.ncl.edu.tw/handle/xkcnv5.
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碩士國立成功大學
材料科學及工程學系
103
In this study, the tensile properties and hardness of Ag-2Pd-0.2Au alloy wires with Φ = 20 µm (0.8mil) were investigated. The microstructural characteristics before and after electric flame-off (EFO) process were also studied. The microstructures of the free air ball (FAB) were columnar grains and dendrites. To understand the relationship between the distribution of alloying elements and the microstructures of FAB, Electron Probe X-ray analysis (EPMA) was used. Experimental results indicated that Pd atoms segregated at upper region of FAB. Additionally, to verify the capability of Ag-2Pd-0.2Au alloy wires, bonded samples were tested under 175℃ for 24, 72 and 168 h (heat aging test). Ag-2Pd-0.2Au alloy wires retain good bondability that its bonding strength were about 6 gf. The electrical behavior of bonded samples after heat aging test were investigated and compared to the pure Ag wires. Ag wires degraded rapidly after heat aging test. Ag-2Pd-0.2Au alloy wires possessed better bonding performance than Ag wires.
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MING, HUANG YU y 黃羽銘. "A Novel High Power LED Chip on Board (COB) Bonding and Heat Dissipation Performance Study by Packaging Multi-Die in Series and Parallel". Thesis, 2013. http://ndltd.ncl.edu.tw/handle/6475d8.
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碩士中華大學
機械工程學系碩士在職專班
101
This paper presents a novel high power LED COB (Chip On Board) bonding and heat dissipation performance study by packaging multi-die in series and parallel. The die separation distance and the operating voltage are the parameters to tradeoff. The temperatures on the top surface of LED and substrate of the die for the external power supply as 8 and 9 Volts are studied by using thermal couples. If one connects the COB dies in a 3 by 3 square matrix with 1.5mm separation distance and 8 (9) Volts power supply to turn on the LEDs; and the temperatures on the top surface of LED and substrate of the die can be respectively as 75.2 (90.5)℃ and 45.5 (56.5)℃. On the other hand, if the separation distance reduced to 1.0mm with the operating voltage of 8 (9) Volts, then the temperatures at the top and bottom of the LED surface would be increased to 75.7 (115.6) ℃ and 46.7 (59.8)℃, respectively.
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Zhao, Bo-Tang y 趙柏棠. "Establishment of calculation method of bonding energy of Morse potential energy of single-crystal silicon substrate affected by different slurry temperatures and analysis on temperature field and finite-difference heat conduction of nanocutting". Thesis, 2019. http://ndltd.ncl.edu.tw/handle/8evh5a.
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Lee, Kuo-wei y 李國維. "Dynamic Analysis of the Bonding Head Mechanism of the Wire Bonder". Thesis, 2000. http://ndltd.ncl.edu.tw/handle/27299423500013097577.
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碩士國立中正大學
機械系
88
The bonding head mechanism is the most important part of a wire-bonding machine, and a well-designed bonding head mechanism can help the wire-bonding machine achieve the goal of automation, high speed, and high precision. Therefore the destination of this research is to analyze the dynamic response of a new type bonding head mechanism by computer simulations, and the effects of a few variables to the simulation results are also discussed. This research is following these steps: First a lumped-mass model of the bonding head mechanism is set up; next, a set of equations of motion of the lumped-mass model are derived based on Lagrange’s method and solved through Adams-Bashforth Correction method. Finally, the variables of the cam speed, the elastic coefficient of return spring, the coefficient of viscous/Coulomb damping between the follower and the pivot are introduced, so that the effects on the follower’s angle, the wedge lift, and the force acting on the wedge can be recorded. The results and methods of this research can be the reference for the detail design of the bonding head mechanism, and it is to be wished that the research can be helpful to the domestic electronic packaging industry.
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Tai, Kuang-Chu y 戴光助. "Investigation of the Wire Bonding Technique in the GaN HEMT Packaging". Thesis, 2012. http://ndltd.ncl.edu.tw/handle/56715030139832463509.
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碩士國立交通大學
工學院半導體材料與製程設備學程
100
GaN material has good properties in heat resistance, breakdown voltage, current density, and electron mobility. Hence, it becomes an excellent choice in high-speed switching, high temperature and high power applications. It has been extensive research with good results. There is rarely research about the GaN power transistor package. The topic of this thesis is the wire bonding technique in the GaN HEMT package. The experiments of this thesis are planned by the experimental design method. The relation between wire bonding parameters and bonding strength is studied. The bonding parameters include bonding times, bonding pressure, bonding frequency, and bonding temperature. The electrical characteristic of GaN HEMT varies with the wire bonding parameters. The applicable or optimal electrical characteristic of GaN HEMT can be obtained by the wire bonding parameters selected by this thesis procedure.
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Keng, Chen-Yeu y 耿震宇. "Design of the Bonding Head Mechanism of the High Speed Automatic Wire Bonder". Thesis, 1997. http://ndltd.ncl.edu.tw/handle/35891736429793638916.
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碩士國立中正大學
機械工程學系
85
In a high speed automatic wire bonder, a bonding head mechanism is an important device that contains a cam, a Z-axis motion device, a bonding wedge,and a wire clamper.The Z-axis motion device driven by the cam movesthe wedge along a designed path to guide the aluminum wire forming a proper loop between the first and the second bonds. The wire clamper separates the wire for the next loop. The purpose of this research is to setup a design ability of the bonding head mechanism, including the type synthesis of the Z-axis motiondevice and the wire clamper and the dimensional synthesis of the wire bonding device and the cam profile. First, we collect some correlated papers, catalogues and patents in order to set the design requirements and contraints. Next, a methodology of creative mechanism design is utilized to synthesis all possible mechanisms. According to the result ofthis research, we obtained 61 new types of the Z-axis motion device and 10 new types of the wire clamper. Then, a new Z-axis motion device isseleted as the prototype for the next dimensional synthesis. The path generation theory and the optimization theory are used to generate a set of proper dimensions in order that the device has a more exact Z-axis motion. Finally, the displacement curve of the wedge is set, the profileof the cam is designed, and the motion animation of the bonding headmechanism is showed.
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吳東陽. "The Design and Control of the Driving Mechanism and Path for the Bonding Head". Thesis, 1998. http://ndltd.ncl.edu.tw/handle/53040760435913754741.
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碩士國立中正大學
機械工程研究所
86
We have searched most U. S. Patents about the driving emchanism of the bonding head of most brand to get an idea to design a new on. In the process of design, we have the demand to design other mechanisms, such as the LEAF SPRING to avoid the friction. According to our design of the driving mechanism of bonding heads, we also design a set of bonding path for using including the position control and the force control, and modify its practicability by computer simulation. In the process of experiment, we encounter some problems, resulting in experiment results being not good, but we find out all the factors to influence the experiment results and discuss them. In conclusion, we provide a new driving method of bonding heads and a new bonding path as a reference for the industry.
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YEN, HUI-TING y 顏暉庭. "Thermoplastic Polyurethane Hot Melt Adhesive Synthe-sized by Using 2-HEA as Terminal Agent for Seamless Bonding of Nylon Fiber Fabric". Thesis, 2018. http://ndltd.ncl.edu.tw/handle/3q6h78.
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碩士國立臺灣科技大學
材料科學與工程系
106
This study uses 2-hydroxyethyl acrylate (2-HEA) as terminal agent, and introduces terminal concept into thermoplastic polyu-rethane (TPU) hot melt adhesive, applied to seamless bonding of nylon fiber fabric. It aims to solve the high processing temperature of general TPU hot melt adhesive, and the degumming and poor adhesion resulted from colloid contraction after ultraviolet (UV) curing of acrylic polyurethane adhesive. Thereby achieving zero solvent, low temperature bonding and quick production. This study comprises 2-HEA terminal agent synthesized TPU hot melt adhesive, TPU hot melt adhesive process optimization parameter design and benefit analysis. Part Ι is 2-HEA synthesized TPU hot melt adhesive. The soft segment material is ether polytetramethylene glycol (PTMG) providing the flexible and soft properties, and it has favorable hydrolytic stability and excellent mechanical performance. The hard segment is diphenylmethane diisocyanate (MDI), giving the TPU hot melt adhesive rigid and hard properties. In the TPU hot melt adhesive reaction system, the hydroxyl of 2-HEA reacts with the isocyanato of TPU hot melt adhesive segment for terminal agent, the molecular weight decreases, and the softening point temperature is reduced. The effect of terminal agent agent concen-tration on TPU hot melt adhesive is discussed. The molecular structure is determined by using 1H NMR, the functional group is analyzed by FTIR, the molecular weight and profile exponent are tested by GPC. The peaks of 1H-NMR at δ=5.8,6.1 and 6.4ppm are of terminal ethylene in acrylate. It is obvious that the 2263 cm-1 peak disappears in FTIR spectrum, the molecular weight decreases from 59820 to 11353. Proving that the -OH group of 2-HEA has reacted with the -NCO group of TPU hot melt adhesive. TPU hot melt adhesive is placed between two pieces of nylon fiber fabric for hot pressing bonding test. The results show when the terminal agent agent content is 0.1 mole ratio and the hard segment content is 22.5%, peel strength and shear strength are 3.63 kg/in and 30.1 kg/cm2 respectively. The color difference is 0.39 (ΔE), the adhesive overflow is 1mm, the warpage is 0mm, the softness is 58mm. Peel strength and shear strength are still higher than 2.92 kg/in and 26.99 kg/cm2 after 50 times of washing fastness test, 80℃ high temperature test and -30℃ low temperature test. Part II is TPU hot melt adhesive process optimization pa-rameter design. The Taguchi method and TOPSIS are used to op-timize TPU hot melt adhesive. The number of experiments and cost are reduced effectively by using L9 orthogonal array, and the product optimization parameter combination is determined. After hot pressing bonding with nylon fiber, peel strength and shear strength are 3.87 kg/in and 31.29 kg/cm2 respectively. Part III is benefit analysis, and the processing conditions and performance of TPU hot melt adhesive of optimal parameters in this study are compared with that of the unoptimized hot melt adhesive and commercially available hot melt adhesive. The pro-cessing temperature of TPU hot melt adhesive developed in this study is 30% to 38% lower than the commercially available hot melt adhesive, and the processing pressure is reduced by 65% to 77%. The Peel strength is increased by 6.61 % compared with the unoptimized TPU hot melt adhesive, shear strength is increased by 3.95 %. The adhesion is enhanced effectively, meeting the re-quirements of textile mills for seamless bonding of nylon fiber fabric.
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Deuerlein, Stephan. "Syntheses and Electron Density Determination of Novel Polyimido Sulfur Ylides". Doctoral thesis, 2007. http://hdl.handle.net/11858/00-1735-0000-0006-ACA5-F.
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