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Artículos de revistas sobre el tema "Integrated circuits Very large scale integration"

Autor: Grafiati

Publicado: 4 de junio de 2021

Última modificación: 30 de julio de 2024

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1

Yang, Boyu. "Very Large-Scale Integration Circuit and Its Current Status Analysis." Highlights in Science, Engineering and Technology 71 (November 28, 2023): 421–27. http://dx.doi.org/10.54097/hset.v71i.14627.

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The development of Very Large Scale Integration (VLSI) has become very relevant to our lives, and although many of the technologies have matured, scientists are still actively exploring and innovating them. This article is a basic introduction to the composition and advanced technology of large-scale integrated circuits, focusing on transistors and the basic components it consists of, as well as the design of integrated circuits, manufacturing and measurement technology. Very Large Scale Integration Circuit, the transistor is the most basic component of the original, to the low-power CMOS tube

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2

M, Thillai Rani, Rajkumar R, Sai Pradeep K.P, Jaishree M, and Rahul S.G. "Integrated extreme gradient boost with c4.5 classifier for high level synthesis in very large scale integration circuits." ITM Web of Conferences 56 (2023): 01005. http://dx.doi.org/10.1051/itmconf/20235601005.

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High-level synthesis (HLS) is utilized for high-performance and energy-efficient heterogeneous systems designing. HLS is assist in field-programmable gate array circuits designing where hardware implementations are refined and replaced in target device. However, the power-process-voltage-temperature-delay (PPVTD) variation in VLSI circuits undergoes many problems and reduced the performance. In order to address these problems, C4.5 with eXtreme Gradient Boosting Classification based High Level Synthesis (C4.5-XGBCHLS) Method is designed for afford better runtime adaptability (RA) with minimal

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3

Patel, Ambresh, and Ritesh Sadiwala. "Performance Analysis of Various Complementary Metaloxide Semiconductor Logics for High Speed Very Large Scale Integration Circuits." SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology 15, no. 01 (January 30, 2023): 91–95. http://dx.doi.org/10.18090/10.18090/samriddhi.v15i01.13.

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The demand for VLSI low voltage high-performance low power systems are increasing significantly. Today's deviceapplications necessitate a system that consumes little power and conserves performance. Recent battery-powered lowvoltagedevices optimize power and high-speed constraints. Aside from that, there is a design constraint with burst-modetype integrated circuits for small devices to scale down. Low voltage low power static CMOS logic integrated circuitsoperate at a slower rate and cannot be used in high performance circuits. As a result, dynamic CMOS logic is used inintegrated circuits bec

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4

Iwai, Hiroshi, Kuniyuki Kakushima, and Hei Wong. "CHALLENGES FOR FUTURE SEMICONDUCTOR MANUFACTURING." International Journal of High Speed Electronics and Systems 16, no. 01 (March 2006): 43–81. http://dx.doi.org/10.1142/s0129156406003539.

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The downsizing of CMOS devices has been accelerated very aggressively in both production and research in recent years. Sub-100 nm gate length CMOS large-scale integrated circuits (LSIs) have been used for many applications and five nanometer gate length MOS transistor was even reported. However, many serious problems emerged when such small geometry MOSFETs are used to realize a large-scale integrated circuit. Even at the 'commercial 45 nm (HP65nm) technology node', the skyrocketing rise of the production cost becomes the greatest concern for maintaining the downsizing trend towards 10 nm. In

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5

Madhura, S. "A Review on Low Power VLSI Design Models in Various Circuits." Journal of Electronics and Informatics 4, no. 2 (July 8, 2022): 74–81. http://dx.doi.org/10.36548/jei.2022.2.002.

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Low power design is one of the primary goals for any integrated circuits. Very Large-Scale Integration (VLSI) is a kind of Integrated Circuit (IC) that consists of hundreds and hundreds of transistor connection into a small chip. The communication and computer applications have grown very faster in the past decade due to the development of VLSI circuit design as microcontroller and microprocessors. However, still the research on VLSI are moving faster towards the scope of power and area minimization. The paper gives an overview about the recent methodologies that have been developed for the pe

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6

Im, James S., and Robert S. Sposili. "Crystalline Si Films for Integrated Active-Matrix Liquid-Crystal Displays." MRS Bulletin 21, no. 3 (March 1996): 39–48. http://dx.doi.org/10.1557/s0883769400036125.

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The fabrication of thin-film-transistor (TFT) devices on a transparent substrate lies at the heart of active-matrix-liquid-crystal-display (AMLCD) technology. This is both good and bad. On one hand it is a difficult task to manufacture millions of intricate semiconductor devices reliably over such large display substrates. On the positive side, AMLCD technology can aspire to become much more than a “display” technology. The idea is as follows: It is possible for one to readily fabricate additional transistors to execute various electronic functions—those that would otherwise be handled by sepa

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7

Beck, Anthony, Franziska Obst, Mathias Busek, Stefan Grünzner, Philipp Mehner, Georgi Paschew, Dietmar Appelhans, Brigitte Voit, and Andreas Richter. "Hydrogel Patterns in Microfluidic Devices by Do-It-Yourself UV-Photolithography Suitable for Very Large-Scale Integration." Micromachines 11, no. 5 (May 2, 2020): 479. http://dx.doi.org/10.3390/mi11050479.

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The interest in large-scale integrated (LSI) microfluidic systems that perform high-throughput biological and chemical laboratory investigations on a single chip is steadily growing. Such highly integrated Labs-on-a-Chip (LoC) provide fast analysis, high functionality, outstanding reproducibility at low cost per sample, and small demand of reagents. One LoC platform technology capable of LSI relies on specific intrinsically active polymers, the so-called stimuli-responsive hydrogels. Analogous to microelectronics, the active components of the chips can be realized by photolithographic micro-pa

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8

Siddesh, K. B., S. Roopa, Parveen B. A. Farzana, and T. Tanuja. "Design of duty cycle correction circuit using ASIC implementation for high speed communication." i-manager’s Journal on Electronics Engineering 13, no. 3 (2023): 33. http://dx.doi.org/10.26634/jele.13.3.19969.

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This research proposed an accurate Duty Cycle Correction (DCC) circuit for high-frequency systems with high measurement accuracy. It is a crucial component of Very Large Scale Integration (VLSI) circuits and is applied as a percentage of the measured average power of a modulated signal to obtain the signal power. This circuit uses two stages of correction, with the first stage performing course correction and the second stage performing fine corrections. This allows the power to be determined during the pulse given the measurement of the average power of a modulated signal with a known duty cy

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9

Li, Jian, Robert Blewer, and J. W. Mayer. "Copper-Based Metallization for ULSI Applications." MRS Bulletin 18, no. 6 (June 1993): 18–21. http://dx.doi.org/10.1557/s088376940004728x.

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Multilevel metallization of very large-scale integrated (VLSI) circuits has become an area of intense research interest as devices are scaled down in order to increase circuit density. As device dimensions approach the submicron regime, reliability becomes more of an issue. Metallization generally requires good conductivity, electromigration resistance, controllable contact performance, corrosion resistance, adherence, thermal stability, bondability, ability to be patterned into a desirable geometry, and economic feasibility.Aluminum and its alloys have been commonly used as the main metalliza

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10

Dove, Lewis. "Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS." Journal of Microelectronics and Electronic Packaging 6, no. 1 (January 1, 2009): 38–41. http://dx.doi.org/10.4071/1551-4897-6.1.38.

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Mixed-signal Application Specific Integrated Circuits (ASICs) have traditionally been used in test and measurement applications for a variety of functions such as data converters, pin electronics circuitry, drivers, and receivers. Over the past several years, the complexity, power density, and bandwidth of these chips has increased dramatically. This has necessitated dramatic changes in the way these chips have been packaged. As the chips have become true VLSI (Very Large Scale Integration) ICs, the number of I/Os have become too large to interconnect with wire bonds. Thus, it has become neces

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11

Boychenko, Dmitry, Oleg Kalashnikov, Alexander Nikiforov, Anastasija Ulanova, Dmitry Bobrovsky, and Pavel Nekrasov. "Total ionizing dose effects and radiation testing of complex multifunctional VLSI devices." Facta universitatis - series: Electronics and Energetics 28, no. 1 (2015): 153–64. http://dx.doi.org/10.2298/fuee1501153b.

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Total ionizing dose (TID) effects and radiation tests of complex multifunctional Very-large-scale integration (VLSI) integrated circuits (ICs) rise up some particularities as compared to conventional ?simple? ICs. The main difficulty is to organize informative and quick functional tests directly under irradiation. Functional tests approach specified for complex multifunctional VLSI devices is presented and the basic radiation test procedure is discussed in application to some typical examples.

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12

Wong, C. P. "An Overview of Integrated Circuit Device Encapsulants." Journal of Electronic Packaging 111, no. 2 (June 1, 1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

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The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of

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13

IKEDA, SHOJI, HIDEO SATO, MICHIHIKO YAMANOUCHI, HUADONG GAN, KATSUYA MIURA, KOTARO MIZUNUMA, SHUN KANAI, et al. "RECENT PROGRESS OF PERPENDICULAR ANISOTROPY MAGNETIC TUNNEL JUNCTIONS FOR NONVOLATILE VLSI." SPIN 02, no. 03 (September 2012): 1240003. http://dx.doi.org/10.1142/s2010324712400036.

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We review recent developments in magnetic tunnel junctions with perpendicular easy axis (p-MTJs) for nonvolatile very large scale integrated circuits (VLSIs). So far, a number of material systems such as rare-earth/transition metal alloys, L10-ordered ( Co, Fe )– Pt alloys, Co /( Pd, Pt ) multilayers, and ferromagnetic-alloy/oxide stacks have been proposed as electrodes in p-MTJs. Among them, p-MTJs with single or double ferromagnetic-alloy/oxide stacks, particularly CoFeB–MgO , were shown to have high potential to satisfy major requirements for integration.

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14

Rajaei, Ramin. "A Reliable, Low Power and Nonvolatile MTJ-Based Flip-Flop for Advanced Nanoelectronics." Journal of Circuits, Systems and Computers 27, no. 13 (August 3, 2018): 1850205. http://dx.doi.org/10.1142/s0218126618502055.

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Very large-scale integrated circuit (VLSI) design faces many challenges with today’s nanometer CMOS technology, including leakage current and reliability issues. Magnetic tunnel junction (MTJ) hybrid with CMOS transistors can offer many advantages for future VLSI design such as high performance, low power consumption, easy integration with CMOS and also nonvolatility. However, MTJ-based logic circuits suffer from a reliability challenge that is the read disturbance issue. This paper proposes a new nonvolatile magnetic flip-flop (MFF) that offers a disturbance-free sensing and a low power write

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15

Sun, Chongjun, and Chao Ding. "Study on Calibration Method for Testing During Burn In equipment of integrated circuits." Journal of Physics: Conference Series 2029, no. 1 (September 1, 2021): 012035. http://dx.doi.org/10.1088/1742-6596/2029/1/012035.

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Abstract In order to implement Method 1015 of GJB 548B, TDBI(Testing During Burn In) technology of integrated circuit is widely used in the aging process of core VLSI(Very Large Scale Integration) which is included of FPGA, DSP, CPU and dedicated chips. Many models of TDBI equipment at home or abroad have been come into use. It is an important task to calibrate TDBI equipment in system level and ensure the traceability of its measurement value. At present, the calibration device of TDBI equipment has been successfully finalized and put into production, which has the advantages of convenient us

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16

Murarka, S. P., J. Steigerwald, and R. J. Gutmann. "Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing." MRS Bulletin 18, no. 6 (June 1993): 46–51. http://dx.doi.org/10.1557/s0883769400047321.

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Continuing advances in the fields of very-large-scale integration (VLSI), ultralarge-scale integration (ULSI), and gigascale integration (GSI), leading to the continuing development of smaller and smaller devices, have continually challenged the fields of materials, processes, and circuit designs. The existing metallization schemes for ohmic contacts, gate metal, and interconnections are inadequate for the ULSI and GSI era. An added concern is the reliability of aluminum and its alloys as the current carrier. Also, the higher resistivity of Al and its use in two-dimensional networks have been

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17

Chen, Xiangyu, Takeaki Yajima, Isao H. Inoue, and Tetsuya Iizuka. "An ultra-compact leaky integrate-and-fire neuron with long and tunable time constant utilizing pseudo resistors for spiking neural networks." Japanese Journal of Applied Physics 61, SC (February 18, 2022): SC1051. http://dx.doi.org/10.35848/1347-4065/ac43e4.

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Abstract Spiking neural networks (SNNs) inspired by biological neurons enable a more realistic mimicry of the human brain. To realize SNNs similar to large-scale biological networks, neuron circuits with high area efficiency are essential. In this paper, we propose a compact leaky integrate-and-fire (LIF) neuron circuit with a long and tunable time constant, which consists of a capacitor and two pseudo resistors (PRs). The prototype chip was fabricated with TSMC 65 nm CMOS technology, and it occupies a die area of 1392 μm2. The fabricated LIF neuron has a power consumption of 6 μW and a leak t

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18

Chowdary, M. Kalpana, Rajasekhar Turaka, Bayan Alabduallah, Mudassir Khan, J. Chinna Babu, and Ajmeera Kiran. "Low-Power Very-Large-Scale Integration Implementation of Fault-Tolerant Parallel Real Fast Fourier Transform Architectures Using Error Correction Codes and Algorithm-Based Fault-Tolerant Techniques." Processes 11, no. 8 (August 8, 2023): 2389. http://dx.doi.org/10.3390/pr11082389.

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As technology advances, electronic circuits are more vulnerable to errors. Soft errors are one among them that causes the degradation of a circuit’s reliability. In many applications, protecting critical modules is of main concern. One such module is Fast Fourier Transform (FFT). Real FFT (RFFT) is a memory-based FFT architecture. RFFT architecture can be optimized by its processing element through employing several types of adder and multipliers and an optimized memory usage. It has been seen that various blocks operate simultaneously in many applications. For the protection of parallel FFTs

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19

Zhang, Ai Rong. "The Integration on Electrical Control Systems Based on Optimized Method." Advanced Materials Research 490-495 (March 2012): 2604–8. http://dx.doi.org/10.4028/www.scientific.net/amr.490-495.2604.

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Very large scale integration (VLSI) applications have improved control implementation performance. Indeed, an application specific integrated circuit (ASIC) solution can exploit efficiently specificities of the control algorithms that fixed hardware architecture cannot do. For example, parallel calculation cannot be included in a software solution based on sequential processing. In addition, ASIC can reduce wire and electromagnetic field interference by a fully system on a chip (SoC) integration. However, there are still two main drawbacks to an integrated circuit solution: design complexity a

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20

Shan, Tianchang. "Advancements in VLSI low-power design: Strategies and optimization techniques." Applied and Computational Engineering 41, no. 1 (February 22, 2024): 22–28. http://dx.doi.org/10.54254/2755-2721/41/20230706.

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As production technology advances, integrated circuits are increasing in size, leading to a corresponding rise in power consumption if not properly optimized. Consequently, the optimization of integrated circuit power consumption has gained paramount significance. This paper provides an overview of the theoretical and research developments in Very Large Scale Integration (VLSI) low-power design. Initially, the paper delves into the components of VLSI power consumption, elucidating the origins of various power consumption types and the factors influencing their magnitude. Subsequently, existing

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21

Luo, Guozheng, Xiang Chen, and Shanshan Nong. "Net Clusting Based Low Complexity Coarsening Algorithm In k-way Hypergraph Partitioning." Journal of Physics: Conference Series 2245, no. 1 (April 1, 2022): 012019. http://dx.doi.org/10.1088/1742-6596/2245/1/012019.

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Abstract With the increasing scale of integrated circuits, hypergraph partitioning is usually applied to Very Large Scale Integration (VLSI) circuit layout and other applications to reduce the computational complexity. However, if without properly coarsening, the hypergraph partitioning problem will become intractable along with the increase of the number of vertices. In this paper, we propose a coarsening algorithm in k-way hypergraph partitioning based on net clustering, where net clustering is used to obtain the initial set of vertices with higher internal similarity. Due to the property of

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22

Jayakumar, Ganesh, Per-Erik Hellström, and Mikael Östling. "Monolithic Wafer Scale Integration of Silicon Nanoribbon Sensors with CMOS for Lab-on-Chip Application." Micromachines 9, no. 11 (October 25, 2018): 544. http://dx.doi.org/10.3390/mi9110544.

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Silicon ribbons (SiRi) have been well-established as highly sensitive transducers for biosensing applications thanks to their high surface to volume ratio. However, selective and multiplexed detection of biomarkers remains a challenge. Further, very few attempts have been made to integrate SiRi with complementary-metal-oxide-semiconductor (CMOS) circuits to form a complete lab-on-chip (LOC). Integration of SiRi with CMOS will facilitate real time detection of the output signal and provide a compact small sized LOC. Here, we propose a novel pixel based SiRi device monolithically integrated with

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23

Li, Peng, Shite Zhu, Wei Xi, Changbao Xu, Dandan Zheng, and Kai Huang. "Triple-Threshold Path-Based Static Power-Optimization Methodology (TPSPOM) for Designing SOC Applications Using 28 nm MTCMOS Technology." Applied Sciences 13, no. 6 (March 8, 2023): 3471. http://dx.doi.org/10.3390/app13063471.

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The threshold voltage distribution technique is an effective way to reduce the static power consumption of integrated circuits. Several gate-level-based distribution algorithms have been proposed, but the optimization effect and run time still need further optimization when applied to very large-scale integration (VLSI) designs. This paper presents a triple-threshold path-based static power optimization methodology (TPSPOM) for low-power system-on-chip. This method obtains the path weights and cell weights from paths’ timing constraints and cells’ delay-to-power ratios, then uses them as index

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24

Nagabushanam, M., Skandan Srikanth, Rushita Mupalla, Sushmitha S. Kumar, and Swathi K. "Optimization of Power and Area Using VLSI Implementation of MAC Unit Based on Additive Multiply Module." International Journal of Electrical and Electronics Research 10, no. 4 (December 30, 2022): 1099–106. http://dx.doi.org/10.37391/ijeer.100455.

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The development of Digital Signal Processors (DSPs), graphical systems, Field Programmable Gate Arrays (FPGAs)/ Application-Specific Integrated Circuits (ASICs), and multimedia systems all rely heavily on digital circuits. The need for high-precision fixed-point or floating-point multipliers suitable for Very Large-Scale Integration (VLSI) implementation in high-speed DSP applications is developing rapidly. An integral part of any digital system is the multiplier. In digital systems as well as signal processing, the adder and multiplier seem to be the fundamental arithmetic units. Problems ari

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25

Nagarajan, Sridevi, and Prasanna Kumar Mahadeviah. "On-chip based power estimation for CMOS VLSI circuits using support vector machine." Indonesian Journal of Electrical Engineering and Computer Science 35, no. 2 (August 1, 2024): 804. http://dx.doi.org/10.11591/ijeecs.v35.i2.pp804-811.

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Power estimation has a major impact on the reliability of very-large-scale integration (VLSI) circuits. As a results power estimation is highly needed in VLSI circuits at the early stages. One of the evident challenges in integrated circuit (IC) industry is development and investigation of techniques for the reduction of design complexity due to the growing process variations and reduction of chip manufacturing turnaround time. Under these conditions, the higher design levels of average power estimation before the chip manufacturing process is highly essential for the calculation of power budg

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26

N., Alivelu Manga. "Design of High-Speed Low Power Computational Blocks for DSP Processors." Revista Gestão Inovação e Tecnologias 11, no. 2 (June 5, 2021): 1419–29. http://dx.doi.org/10.47059/revistageintec.v11i2.1768.

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In today’s deep submicron VLSI (Very Large-Scale Integration) Integrated Circuits, power optimization and speed play a very important role. This importance for low power has initiated the designs where power dissipation is equally important as performance and area. Power reduction and power management are the key challenges in the design of circuits down to 100nm. For power optimization, there are several techniques and extension designs are applied in the literature. In real time Digital Signal Processing applications, multiplication and accumulation are significant operations. The primary pe

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Zhu, Ziran, Zhipeng Huang, Jianli Chen, and Longkun Guo. "Topology-Aware Bus Routing in Complex Networks of Very-Large-Scale Integration with Nonuniform Track Configurations and Obstacles." Complexity 2021 (April 14, 2021): 1–12. http://dx.doi.org/10.1155/2021/8843271.

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As one of the most important routing problems in the complex network within a very-large-scale integration (VLSI) circuit, bus routing has become much more challenging when witnessing the advanced technology node enters the deep nanometer era because all bus bits need to be routed with the same routing topology in the context. In particular, the nonuniform routing track configuration and obstacles bring the largest difficulty for maintaining the same topology for all bus bits. In this paper, we first present a track handling technique to unify the nonuniform routing track configuration with ob

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MOHANA KANNAN, LOGANATHAN, and DHANASKODI DEEPA. "LOW POWER VERY LARGE SCALE INTEGRATION (VLSI) DESIGN OF FINITE IMPULSE RESPONSE (FIR) FILTER FOR BIOMEDICAL IMAGING APPLICATION." DYNA 96, no. 5 (September 1, 2021): 505–11. http://dx.doi.org/10.6036/10214.

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Nowadays, the medical image processing techniques are using Very Large Scale Integrated (VLSI) designs for improving the availability and applicability. The digital filters are important module of Digital Signal Processing (DSP) based systems. Existing Finite Impulse Response (FIR) design approach performed with Partial Full Adder (PFA) based Carry Lookahead Adder (CLA) and parallel prefix adder logic in Vedic multiplier. Objective of this approach is to improve the performance of VLSI circuit by obtaining the result of area, power and delay, also, effective incorporation between VLSI circuit

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Meher, Sukanya S., M. Eren Çelik, Jushya Ravi, Amol Inamdar, and Deepnarayan Gupta. "An Integrated Approach towards VLSI Implementation of SFQ Logic using Standard Cell Library and Commercial Tool Suite." Journal of Physics: Conference Series 2776, no. 1 (June 1, 2024): 012007. http://dx.doi.org/10.1088/1742-6596/2776/1/012007.

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Abstract The semiconductor industry seeks energy-efficient alternatives as Moore’s law nears its limits. The Single Flux Quantum (SFQ) integrated circuits (ICs) using thousands of niobium Josephson junctions (JJs) and operating at 4 K show great promise for digital computing circuits at high speed (>20 GHz) and low power (a few nW per junction). The leading logic families are Rapid Single Flux Quantum (RSFQ), and its energy-efficient variant (ERSFQ). IARPA’s SuperTools program aims to develop integrated design tools for superconductor electronics, targeting SFQ and Adiabatic Quantum-Flux-Pa

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Cheng, Yi Lung, Yi Shiung Lu, and Tai Jung Chiu. "Comparative Study of Low Dielectric Constant Material Deposited Using Different Precursors." Advanced Materials Research 233-235 (May 2011): 2480–85. http://dx.doi.org/10.4028/www.scientific.net/amr.233-235.2480.

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Two kinds of organosilicate precursors, trimethylsilane (3MS) and diethoxymethylsilane (DEMS), were used to produce low-k films by plasma-enhanced chemical vapor deposition (PECVD) in this work. The experimental results indicate that DEMS-based low-k films have superior electrical performance and better thermal stability as compared to 3MS-based low-k films. Therefore, DEMS-based films are the promising low-k materials which can be integrated in very large scale integration circuit as an inter-layer dielectric material.

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Dharanika, T., J. Jaya, and E. Nandakumar. "Design of Fostered Power Terahertz VLSI Testing Using Deep Neural Network and Embrace User Intent Optimization." Journal of Nanoelectronics and Optoelectronics 19, no. 7 (July 1, 2024): 724–36. http://dx.doi.org/10.1166/jno.2024.3619.

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VLSI (Very Large-Scale Integration) testing is a crucial step in ensuring the reliability and functionality of integrated circuits. However, conventional testing methods often lack the ability to address user-specific requirements, resulting in suboptimal outcomes. Terahertz technology offers unique capabilities for non-destructive testing, yet its integration with VLSI testing methodologies remains limited. Additionally, the neglect of user preferences in testing processes poses a challenge to tailoring testing procedures to specific user needs. This research presents a novel approach for fos

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32

Ahmad, Afaq, Sabir Hussain, M. A. Raheem, Ahmed Al Maashri, Sayyid Samir Al Busaidi, and Medhat Awadalla. "ASIC vs FPGA based Implementations of Built-In Self-Test." International Journal of Advanced Natural Sciences and Engineering Researches 7, no. 6 (July 13, 2023): 14–20. http://dx.doi.org/10.59287/ijanser.942.

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Linear Feedback Shift Registers (LFSRs) are play key role in testing of for Very Large Scale Integration (VLSI) Integrated Circuits (ICs) testing. Due to tremendous IC complex growth, testing of recent VLSI ICs technology have become more complicated. This led to develop a popular alternate viable solution in the form of Built-In Self-Test (BIST) technology as compared to Automatic Test Equipment (ATE). However, the challenges of BIST technology remain the subject of research. Furthermore, implementation of BIST’s LFSR on Application Specific Integrated Circuit (ASIC) versus Field Programmable

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Rasheed, Israa Mohammed, and Hassan Jasim Motlak. "Performance parameters optimization of CMOS analog signal processing circuits based on smart algorithms." Bulletin of Electrical Engineering and Informatics 12, no. 1 (February 1, 2023): 149–57. http://dx.doi.org/10.11591/eei.v12i1.4128.

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Designing ideal analogue circuits has become difficult due to extremely large-scale integration. The complementary metal oxide semiconductor (CMOS) analog integrated circuits (IC) could use an evolutionary method to figure out the size of each device. The CMOS operational transconductance amplifier (CMOS OTA) and the CMOS current conveyor second generation (CMOS CCII) are designed using advanced nanometer transistor technology (180 nm). Both CMOS OTA and CMOS CCII have high performance, such as a wide frequency, voltage gain, slew rate, and phase margin, to include very wide applications in si

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NIRANJAN, VANDANA, ASHWANI KUMAR, and SHAIL BALA JAIN. "COMPOSITE TRANSISTOR CELL USING DYNAMIC BODY BIAS FOR HIGH GAIN AND LOW-VOLTAGE APPLICATIONS." Journal of Circuits, Systems and Computers 23, no. 08 (June 18, 2014): 1450108. http://dx.doi.org/10.1142/s0218126614501084.

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In this work, a new composite transistor cell using dynamic body bias technique is proposed. This cell is based on self cascode topology. The key attractive feature of the proposed cell is that body effect is utilized to realize asymmetric threshold voltage self cascode structure. The proposed cell has nearly four times higher output impedance than its conventional version. Dynamic body bias technique increases the intrinsic gain of the proposed cell by 11.17 dB. Analytical formulation for output impedance and intrinsic gain parameters of the proposed cell has been derived using small signal a

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35

Sun, Ben. "Interpretable machine learning in VLSI physical design." Applied and Computational Engineering 4, no. 1 (June 14, 2023): 13–19. http://dx.doi.org/10.54254/2755-2721/4/20230338.

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Today's popularisation of portable devices largely depends on the progress in integrated circuits. Modern Very Large Scale Integration technology (VLSI) allows billions of transistors to be packed into the same chip. In the past years, digital design in VLSI has been developed compared to analogue design. The traditional method is hard to model the performance change in analogue or mixed-signal components caused by physical design. In the early 2000s, rapid advances in machine learning and computing power made analogue design automation possible. Despite their outstanding performance, the tran

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36

Eppili, Jaya, Sri B. Sai, Kumar P. Akshay, Kumar O. Hem, D. Sunil, and R. Rajesh. "VLSI implementation of Kogge-Stone Adder for low-power applications." i-manager's Journal on Digital Signal Processing 11, no. 1 (2023): 9. http://dx.doi.org/10.26634/jdp.11.1.19372.

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The adder is a vital part of the Central Processing Unit (CPU) that can perform computational operations. It is used in digital components, mainly in the design of integrated circuits. Recent decades have seen a sharp rise in demand for mobile electronics, which has increased the need for highly efficient Very Large-Scale Integration (VLSI) structures. All operations must be computed using low-power, space-efficient designs that run faster. The Kogge-Stone adder (KSA) is an extension of the carry look-ahead adder which is used for performing fast addition in high-performance computing systems.

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37

Soref, Richard. "Applications of Silicon-Based Optoelectronics." MRS Bulletin 23, no. 4 (April 1998): 20–24. http://dx.doi.org/10.1557/s0883769400030220.

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Silicon-based optoelectronics is a diversified technology that has grown steadily but not exponentially over the past decade. Some applications—such as smart-pixel signal processing and chip-to-chip optical interconnects—have enjoyed impressive growth, whereas other applications have remained quiescent. A few important applications such as optical diagnosis of leaky metal-oxide-semiconductor-field-effect-transistor circuits, have appeared suddenly. Over the years, research and development has unveiled some unique and significant aspects of Si-based optoelectronics. The main limitation of this

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38

Yadav, Vishal, and Brij Bihari Tiwari. "Design and analysis of low power sense amplifier for static random access memory." Indonesian Journal of Electrical Engineering and Computer Science 35, no. 3 (September 1, 2024): 1447. http://dx.doi.org/10.11591/ijeecs.v35.i3.pp1447-1455.

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<p>Today’s era is a digital world where each and every section of the society is experiencing and encountering with semiconductor chips. In very large-scale integration (VLSI) circuits the design of static random-access memory (SRAM) plays a crucial role in ensuring both low-power consumption and high-speed performance. The sense amplifiers (SA) are integral parts for information accessing storage in SRAM IC design. This paper introduces a dual voltage latch sense amplifier (DVLSA) for SRAM integrated circuits (IC). The comparative analyses of various SA are studied and then design a low

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39

Shanavas, I. Hameem, and R. K. Gnanamurthy. "Optimal Solution for VLSI Physical Design Automation Using Hybrid Genetic Algorithm." Mathematical Problems in Engineering 2014 (2014): 1–15. http://dx.doi.org/10.1155/2014/809642.

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In Optimization of VLSI Physical Design, area minimization and interconnect length minimization is an important objective in physical design automation of very large scale integration chips. The objective of minimizing the area and interconnect length would scale down the size of integrated chips. To meet the above objective, it is necessary to find an optimal solution for physical design components like partitioning, floorplanning, placement, and routing. This work helps to perform the optimization of the benchmark circuits with the above said components of physical design using hierarchical

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40

NAKADA, KAZUKI, TETSUYA ASAI, and HATSUO HAYASHI. "ANALOG VLSI IMPLEMENTATION OF RESONATE-AND-FIRE NEURON." International Journal of Neural Systems 16, no. 06 (December 2006): 445–56. http://dx.doi.org/10.1142/s0129065706000846.

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We propose an analog integrated circuit that implements a resonate-and-fire neuron (RFN) model based on the Lotka-Volterra (LV) system. The RFN model is a spiking neuron model that has second-order membrane dynamics, and thus exhibits fast damped subthreshold oscillation, resulting in the coincidence detection, frequency preference, and post-inhibitory rebound. The RFN circuit has been derived from the LV system to mimic such dynamical behavior of the RFN model. Through circuit simulations, we demonstrate that the RFN circuit can act as a coincidence detector and a band-pass filter at circuit

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41

Akita, Junichi. "Open-source, multi-layer LSI design & fabrication framework for distributed IP development and education." International Journal of Innovative Research and Scientific Studies 6, no. 4 (September 22, 2023): 936–45. http://dx.doi.org/10.53894/ijirss.v6i4.2102.

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Continuous development of Large Scale Integration (LSI) technologies based on Moore's law results in highly developed LSI technologies, as well as very high costs in design and fabrication and high design complexity. This fact prevents various users from contributing to the activities of designing LSIs, fabricating LSIs, and developing Intellectual Properties (IPs). On the other hand, the trend towards open-source has been attracting attention to overcome these problems and extend the potential of LSI technologies. The purpose of this research is to develop an open-source LSI design framework

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42

Sanadhya, Minakshi, Devendra Kumar Sharma, and Alfilh Raed Hameed Chyad. "Adiabatic technique based low power synchronous counter design." International Journal of Electrical and Computer Engineering (IJECE) 13, no. 4 (August 1, 2023): 3770. http://dx.doi.org/10.11591/ijece.v13i4.pp3770-3777.

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<p>The performance of integrated circuits is evaluated by their design architecture, which ensures high reliability and optimizes energy. The majority of the system-level architectures consist of sequential circuits. Counters are fundamental blocks in numerous very large-scale integration (VLSI) applications. The T-flip-flop is an important block in synchronous counters, and its high-power consumption impacts the overall effectiveness of the system. This paper calculates the power dissipation (PD), power delay product (PDP), and latency of the presented T flip-flop. To create a 2-bit syn

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43

Huang, Chen‐Wei, Shing‐Kwong Wong, Yi‐Xiang Gao, and Xin Wang. "13‐1: A Lightweight Inference Network‐based Algorithm for Low‐Light Image Brightness Adjustment." SID Symposium Digest of Technical Papers 55, S1 (April 2024): 121–24. http://dx.doi.org/10.1002/sdtp.17014.

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Low‐light images pose a challenge due to their compressed dynamic range, often resulting in loss of detail. To address this, enhancement techniques are evolving, aiming to better represent these images on modern displays. In this paper, we propose a novel algorithm that utilizes two cascaded neural networks to adjust image illumination effectively. Our approach begins with the first architecture, which employs 2D separable convolutional layers, ReLU, and sigmoid functions to extract essential features from RGB images. Subsequently, the second architecture, a U‐ shaped network, hierarchically a

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Yu, Shenglu, Shimin Du, and Chang Yang. "A Deep Reinforcement Learning Floorplanning Algorithm Based on Sequence Pairs." Applied Sciences 14, no. 7 (March 29, 2024): 2905. http://dx.doi.org/10.3390/app14072905.

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In integrated circuit (IC) design, floorplanning is an important stage in obtaining the floorplan of the circuit to be designed. Floorplanning determines the performance, size, yield, and reliability of very large-scale integration circuit (VLSI) ICs. The results obtained in this step are necessary for the subsequent continuous processes of chip design. From a computational perspective, VLSI floorplanning is an NP-hard problem, making it difficult to be efficiently solved by classical optimization techniques. In this paper, we propose a deep reinforcement learning floorplanning algorithm based

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45

Fujino, Masahisa, Yuuki Araga, Hiroshi Nakagawa, Katsuya Kikuchi, and Noboru Miyata. "(Invited) Direct Bonding and Its Interface for High-Density Integration of Superconducting Qubits." ECS Meeting Abstracts MA2023-02, no. 33 (December 22, 2023): 1620. http://dx.doi.org/10.1149/ma2023-02331620mtgabs.

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Superconducting qubits are one of the intensive approaches to fabricate quantum computing (QC). Qubits can be manufactured by the current Si-based semiconductor manufacturing processes. However, circuits should be superconducting material such as Nb (Tc=9.29 K), Al (Tc=1.18 K), Pb (Tc=7.2 K), In (Tc=3.4 K) , etc. In current technology, qubits are arranged in planar geometry in a chip, and each qubit should wire to control and read signal lines in the same plane. When a large number of qubits are integrated, these wires would be too constrained, and several problems would be actualized, such as

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46

Kumar, Umesh. "Vlsi Interconnection Modelling Using a Finite Element Approach." Active and Passive Electronic Components 18, no. 3 (1995): 179–202. http://dx.doi.org/10.1155/1995/97362.

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In the last decade, an important shift has taken place in the design of hardware with the advent of smaller and denser integrated circuit packages. Analysis techniques are required to ensure the proper electrical functioning of this hardware. An efficient method is presented to model the parasitic capacitance of VLSI (very large scale integration) interconnections. It is valid for conductors in a stratified medium, which is considered to be a good approximation for theSi−SiO2system of which present day ICs are made. The model approximates the charge density on the conductors as a continuous fu

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47

Balodi, Deepak, and Rahul Misra. "Low Power Differential and Ring Voltage Controlled Oscillator Architectures for High Frequency (L-Band) Phase Lock Loop Applications in 0.35 Complementary Metal Oxide Semi Conductor Process." SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology 11, no. 01 (July 25, 2019): 63–70. http://dx.doi.org/10.18090/samriddhi.v11i01.9.

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The design of a high frequency (L Band), low power (2.75mW) Phase Lock Loops with a 350nm Complementary Metal Oxide Semi Conductor (CMOS) technology has been represented. The comparison of Current Starved Voltage Controlled Oscillator (CSVCO) and Differential pair VCO is performed and analyzed for low power and high frequency analysis respectively. Each component of Phase Lock Loop (PLL) is designed with 350nm CMOS technology in Design Architect Integrated Circuit Station by Mentor Graphics (Eldo-Net) as simulator. In this paper both the standard configurations have been simulated under the sa

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48

Yeh, Chung-Huang, and Jwu-E. Chen. "Unbalanced-Tests to the Improvement of Yield and Quality." Electronics 10, no. 23 (December 4, 2021): 3032. http://dx.doi.org/10.3390/electronics10233032.

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An integrated-circuit testing model (DITM) is used to describe various factors that affect test yield during a test process. We used a probability distribution model to evaluate test yield and quality and introduced a threshold test and a guardband test. As a result of the development speed of the semiconductor manufacturing industry in the future being unpredictable, we use electrical properties of existing products and the current manufacturing technology to estimate future product-distribution trends. In the development of very-large-scale integration (VLSI) testing, the progress of testing

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49

Laudis, Lalin L., and N. Ramadass. "A Lion’s Pride Inspired Algorithm for VLSI Floorplanning." Journal of Circuits, Systems and Computers 29, no. 01 (March 15, 2019): 2050003. http://dx.doi.org/10.1142/s0218126620500036.

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The complexity of any integrated circuit pushes the researchers to optimize the various parameters in the design process. Usually, the Nondeterministic Polynomial problems in the design process of Very Large Scale Integration (VLSI) are considered as a Single Objective Optimization Problem (SOOP). However, due to the increasing demand for the multi-criterion optimization, researchers delve up on Multi-Objective Optimization methodologies to solve a problem with multiple objectives. Moreover, it is evident from the literature that biologically inspired algorithm works very well in optimizing a

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50

Smy, T., S. K. Dew, and M. J. Brett. "Simulation of Microstructure and Surface Profiles of Thin Films for VLSI Metallization." MRS Bulletin 20, no. 11 (November 1995): 65–69. http://dx.doi.org/10.1557/s0883769400045619.

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A crucial step in the manufacture of very large-scale integration (VLSI) integrated circuits is the fabrication of reliable, low-resistance metal interconnects between semiconductor devices. The fabrication of these interconnects is generally performed by depositing a blanket metal film and then patterning it by lithographic and etching techniques. The primary means of depositing thin metal films for VLSI interconnects are sputtering and chemical vapor deposition (CVD).The creation of reliable interconnects is, however, complicated by a number of issues. In order to obtain low contact resistan

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