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Artículos de revistas sobre el tema "Integrated circuits"

Autor: Grafiati

Publicado: 4 de junio de 2021

Última modificación: 25 de julio de 2025

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1

Wu, Jian, Yi-an Liu, and Tingting Luo. "Research on Talents Training Mode for integrated circuit major under the Background of the Science-education and Industry-education Integration." SHS Web of Conferences 171 (2023): 03028. http://dx.doi.org/10.1051/shsconf/202317103028.

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With the rapid development of information technology, the requirements for integrated circuits, which are the key elements of information technology, are becoming higher and higher. However, the gap of integrated circuit talents is still large. The national and social development has an extremely urgent demand for integrated circuit talents. To meet the national needs, UESTC integrates ideological and political elements, reconstructs the curriculum teaching matrix, creates a challenge system step by step, and adheres to multiple synergies to build a “cross-integration, system integration, and

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2

Shepherd, Paul, Dillon Kaiser, Michael Glover, Sonia Perez, A. Matt Francis, and H. Alan Mantooth. "Integrated Protection Circuits for an NMOS Silicon Carbide Gate Driver Integrated Circuit." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (2014): 000218–23. http://dx.doi.org/10.4071/hitec-wp14.

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Recent work has been done to build a Silicon Carbide (SiC) gate driver IC for use with a 1,200V SiC power MOSFET. Protection circuits form an important part of the complete gate driver/power device system. Under-voltage lockout (UVLO) protection disables the gate driver when power supplies are insufficient to turn the power device fully on. Desaturation detection provides protection to the power device by recognizing over-current conditions and disabling the gate driver for a set duration. The protection circuits described in this paper are integrated with a novel SiC gate-driver architecture

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3

Rajeshwari, Bhat, Rashid Ansari Mohammad, and Khanam Ruqaiya. "Effect of integrated power and clock networks on combinational circuits." International Journal of Reconfigurable and Embedded Systems 9, no. 3 (2021): 242–48. https://doi.org/10.11591/ijres.v9.i3.pp242-248.

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Reduction of power consumption is necessary in a system on chip. To achieve this, power and clock networks can be integrated. This leads to a significant reduction in power consumption in a circuit. This paper explores the effect of such a network on various combinational circuits and compares the power consumption of these circuits with conventional combinational circuits. The combinational circuits which are powered by the proposed circuit consume lesser power as compared to conventional combinational circuits.

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4

Farah, Wahaj, and Vinay M. "Integrated Circuits - Its Development and Uses." Advancement of Signal Processing and its Applications 4, no. 3 (2022): 1–4. https://doi.org/10.5281/zenodo.6349270.

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<em>An integrated circuit, sometimes known as a monolithic integrated circuit, is a set of electrical circuits on a single compact flat piece (or "chip") of semiconductor material, usually silicon. A compact chip has a large number of tiny MOSFETs (metal–</em><em>oxide</em><em>–</em><em>semiconductor field</em><em>–effect transistors). As a result, circuits created with discrete electrical components are orders of magnitude smaller, quicker, and less expensive. Because of the IC's mass production capability, dependability, and building-block approach to integrat

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5

Kinanah, Afrah Abdulridha Jumaah. "Optical Integrated Circuits: Review Study." Scholars Journal of Physics, Mathematics and Statistics 12, no. 04 (2025): 107–13. https://doi.org/10.36347/sjpms.2025.v12i04.004.

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Integrated optical circuit (IOC) is a multi-functional component of the display and electronic display on the same side, the main application of these devices is fiber optic communication networks, and now "IOC" can be used in the aviation, automotive, computer or medical device industry to manufacture data transmission networks, regulators or sensors. This study was to know the Integrated optical circuit. Photonic Integrated Circuits Industry Overview the photonic integrated circuits market is moderately competitive and consists of several major players such as Neophotonics Corporation, Poet

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6

Li, Zihan. "Application of Integrated Circuits in Cardiac Pacemakers." Highlights in Science, Engineering and Technology 62 (July 27, 2023): 84–89. http://dx.doi.org/10.54097/hset.v62i.10428.

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This article briefly describes the application of integrated circuits in the medical field, such as wearable and implantable medical devices. The article introduces the development process of integrated circuits used in cardiac pacemakers, explaining how it evolved from bipolar junction transistors integrated circuits in the past to today's complementary metal oxide semiconductor integrated circuits. The basic components of the pacemaker are described from a system level, including the signal amplifier, pulse generator, battery management system, and analog-to-digital converter. This allows fo

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7

Jackson, Keit, and JeffreyA Niehaus. "4752729 Test circuit for VSLI integrated circuits." Microelectronics Reliability 29, no. 2 (1989): 291. http://dx.doi.org/10.1016/0026-2714(89)90600-8.

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8

Guang, Yang, Bin Yu, and Huang Hai. "Design of a High Performance CMOS Bandgap Voltage Reference." Advanced Materials Research 981 (July 2014): 90–93. http://dx.doi.org/10.4028/www.scientific.net/amr.981.90.

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Bandgap voltage reference, to provide a temperature and power supply insensitive output voltage, is a very important module in the analog integrated circuits and mixed-signal integrated circuits. In this paper, a high performance CMOS bandgap with low-power consumption has been designed. It can get the PTAT (Proportional to absolute temperature) current, and then get the reference voltage. Based on 0.35μm CMOS process, using HSPICE 2008 software for circuit simulation, the results showed that , when the temperature changes from -40 to 80 °C, the proposed circuit’s reference voltage achieve to

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9

Moldovan, Emilia, Nazih Khaddaj Mallat, and Serioja Ovidiu Tatu. "MHMIC Six-port Interferometer for W-band Transceivers: Design and Characterization." International Journal of Electrical and Computer Engineering (IJECE) 9, no. 4 (2019): 2703. http://dx.doi.org/10.11591/ijece.v9i4.pp2703-2714.

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The study has presented an extensive analysis of an integrated millimeter wave six-port interferometer, operating over a 10 GHz band, from 80 to 90 GHz. It has covered both semi-unlicensed point-to-point links (81-86 GHz), and imaging sensor system frequencies (above 85 GHz). An in-house process is used to fabricate miniaturized hybrid millimeter wave integrated circuits on a very thin ceramic substrate. Two-port S-parameter measurements are performed on a minimum number of circuits integrated on the same die, exploiting the circuit’s physical symmetry and chosen to collect enough data for ful

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10

Lim, Taek-Kyu, Kunal Sandip Garud, Jae-Hyeong Seo, Moo-Yeon Lee, and Dong-Yeon Lee. "Experimental Study on Heating Performances of Integrated Battery and HVAC System with Serial and Parallel Circuits for Electric Vehicle." Symmetry 13, no. 1 (2021): 93. http://dx.doi.org/10.3390/sym13010093.

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The objective of the present study is to conduct experiments for investigating heating performances of integrated system with serial and parallel circuits for battery and heating ventilation and air conditioning system (HVAC) of electric vehicles under various operating conditions. In addition, the artificial neural network (ANN) model is proposed to accurately predict the heating performances of integrated system with serial and parallel circuits for battery and HVAC. A test bench of integrated system with serial and parallel circuits has been developed for establishing the trade-off between

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11

Lim, Taek-Kyu, Kunal Sandip Garud, Jae-Hyeong Seo, Moo-Yeon Lee, and Dong-Yeon Lee. "Experimental Study on Heating Performances of Integrated Battery and HVAC System with Serial and Parallel Circuits for Electric Vehicle." Symmetry 13, no. 1 (2021): 93. http://dx.doi.org/10.3390/sym13010093.

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The objective of the present study is to conduct experiments for investigating heating performances of integrated system with serial and parallel circuits for battery and heating ventilation and air conditioning system (HVAC) of electric vehicles under various operating conditions. In addition, the artificial neural network (ANN) model is proposed to accurately predict the heating performances of integrated system with serial and parallel circuits for battery and HVAC. A test bench of integrated system with serial and parallel circuits has been developed for establishing the trade-off between

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12

Deng, Jingxi. "Systematic Analysis and Research on Integrated Circuit Design Optimization." Highlights in Science, Engineering and Technology 81 (January 26, 2024): 197–201. http://dx.doi.org/10.54097/q42hbs73.

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After decades of development of integrated circuits, there has been great progress in all aspects. These advances are reflected in the optimization of manufacturing processes and circuits. When designing a circuit, considering the production cost and the performance of the circuit, the optimal design of the circuit is always a very important link. In this paper, two kinds of optimization ideas are introduced. One is from the point of view of the physical design of the circuit, two methods are introduced, which are adjusting the input power and reducing the circuit device. The other is to optim

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13

Koo, Jae-Mo, Sungjun Im, Linan Jiang, and Kenneth E. Goodson. "Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures." Journal of Heat Transfer 127, no. 1 (2005): 49–58. http://dx.doi.org/10.1115/1.1839582.

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The semiconductor community is developing three-dimensional circuits that integrate logic, memory, optoelectronic and radio-frequency devices, and microelectromechanical systems. These three-dimensional (3D) circuits pose important challenges for thermal management due to the increasing heat load per unit surface area. This paper theoretically studies 3D circuit cooling by means of an integrated microchannel network. Predictions are based on thermal models solving one-dimensional conservation equations for boiling convection along microchannels, and are consistent with past data obtained from

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14

Yordanov, Hristomir, and Peter Russer. "Integrated on-chip antennas for communication on and between monolithic integrated circuits." International Journal of Microwave and Wireless Technologies 1, no. 4 (2009): 309–14. http://dx.doi.org/10.1017/s1759078709990407.

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The rate of signal transmission on or between monolithic integrated circuits is limited by the cross-talk and the dispersion due to the wired interconnects. The bandwidth limitations can be overcome by wireless chip-to-chip and on-chip interconnects via integrated antennas. In this work the utilization of the electronic circuit ground planes as radiating elements for the integrated antennas has been proposed. This allows for optimal usage of chip area, as the antennas share the same metallization structure as the circuits. By exciting the interconnects between the patch areas in transmission l

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15

Gao, Sirui. "Analog integrated circuit design with machine learning." Theoretical and Natural Science 5, no. 1 (2023): 788–95. http://dx.doi.org/10.54254/2753-8818/5/20230495.

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Due to the widespread application of semiconductor technology in integrated circuits, more and more design studies on analog integrated circuits are gradually being implemented. However, due to the nature of analog integrated circuits, it is time-consuming and inefficient. Therefore, there are lots of experts studying how to reduce the design cycle of analog ICs. The use of machine learning in analog circuits stands out, as machine learning-based design methods have significantly reduced the analog cycle time. This review report will first introduce the algorithms related to machine learning,

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16

Bhat, Rajeshwari, Mohammad Rashid Ansari, and Ruqaiya Khanam. "Effect of integrated power and clock networks on combinational circuits." International Journal of Reconfigurable and Embedded Systems (IJRES) 9, no. 3 (2020): 242. http://dx.doi.org/10.11591/ijres.v9.i3.pp242-248.

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<p class="western" align="JUSTIFY"><span style="font-size: small;"><span style="color: #000000;"><span style="font-family: 'Times New Roman', serif;"><span><span>Reduction of power consumption is necessary in a system on chip. To achieve this, power and clock networks can be integrated. This leads to a significant reduction in power consumption in a circuit. This paper explores the effect of such a network on various combinational circuits and compares the power consumption of these circuits with conventional combinational circuits. The combinational circuit

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17

He, Qi. "Advanced Integrated Circuit Manufacturing Technology Process Industry Development." Highlights in Science, Engineering and Technology 71 (November 28, 2023): 402–7. http://dx.doi.org/10.54097/hset.v71i.14606.

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Integrated circuits are circuits with specific functions that are integrated together by semiconductor processes and are a new type of semiconductor device developed in the late 1950s through the 1960s. Integrated circuits are the foundation of information development and the benchmark for high quality development of national economy. This paper introduces the concept of integrated circuits as well as the integrated circuit process, and the application areas of integrated circuits, which account for an expanding and growing share of information, communication, consumer electronics, automotive

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18

Li, Chengxuan. "A review of physical heat dissipation methods for 3D integrated technology." Applied and Computational Engineering 89, no. 1 (2024): 43–47. http://dx.doi.org/10.54254/2755-2721/89/20241052.

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Three-dimensional integrated circuits have higher integration than two-dimensional integrated circuits, and can obtain higher performance and lower power consumption in a certain space. In order to fulfill higher efficiency, thermal management becomes particularly important in 3D integration technology. However, the traditional heat dissipation method cannot satisfy the heat dissipation needs of three-dimensional integrated circuits, which require better heat dissipation methods to be developed. This paper introduces the realization of three-dimensional integrated circuit using silicon via (TS

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19

BARNABY, H. J. "TOTAL DOSE EFFECTS IN LINEAR BIPOLAR INTEGRATED CIRCUITS." International Journal of High Speed Electronics and Systems 14, no. 02 (2004): 519–41. http://dx.doi.org/10.1142/s0129156404002491.

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Electronics systems that operate in space or strategic environments can be severely damaged by exposure to ionizing radiation. Space-based systems that utilize linear bipolar integrated circuits are particularly susceptible to radiation-induced damage because of the enhanced sensitivity of these circuits to the low rate of radiation exposure. The phenomenon of enhanced low-dose-rate sensitivity (ELDRS) demonstrates the need for a comprehensive understanding of the mechanisms of total dose effects in linear bipolar circuits. The majority of detailed bipolar total dose studies to date have focus

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20

He, Yucheng. "Application of Artificial Intelligence in Integrated Circuits." Journal of Physics: Conference Series 2029, no. 1 (2021): 012090. http://dx.doi.org/10.1088/1742-6596/2029/1/012090.

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Abstract Integrated circuit and artificial intelligence technology are inseparable. Artificial intelligence technology depends on the learning ability and computing ability of computers and other machines. In this process, integrated circuits provide hardware support for the operation of artificial intelligence algorithms. For a long time, the application research of artificial intelligence technology in the field of integrated circuit mainly focuses on circuit fault analysis and artificial intelligence chips. Especially in recent years, due to the rapid development of technology, the combinat

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21

M., Kalmuratov, and Dauletmuratova R. "INTEGRATED CIRCUITS AND THEIR APPLICATIONS IN ELECTRONICS." American Journal of Applied Science and Technology 4, no. 4 (2024): 24–27. http://dx.doi.org/10.37547/ajast/volume04issue04-05.

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The article deals with the integrated circuits and their applications in electronics. Integrated circuits (ICs) have revolutionized the field of electronics by enabling the integration of multiple components onto a single chip. This miniaturization has led to significant advancements in various electronic devices and systems. ICs offer numerous benefits, including compact size, energy efficiency, reliability, high speed, cost-effectiveness, flexibility, and scalability. The ability to combine different functions on a single chip has made ICs indispensable in a wide range of applications, from

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22

Yuan, Kangbo. "Simulation And Analysis of Various Bandgap Reference Circuits." Highlights in Science, Engineering and Technology 103 (June 26, 2024): 115–24. http://dx.doi.org/10.54097/kvnm1t65.

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In analog integrated circuits, it is essential to provide accurate and undisturbed circuits. Bandgap reference circuits could use a Bipolar transistor to generate positive temperature coefficient voltage and negative temperature coefficient voltage, which could reduce the influence of temperature. Therefore, it is used widely in analog integrated circuits. This paper first introduces the basic notion of a bandgap reference circuit, including its characteristics that are not affected by voltage, temperature, and process, so that the circuit works stably in a stable state. Then, the circuit stru

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23

HARUNA, Masamitsu, and Hiroshi NISHIHARA. "Optical integrated circuits." Journal of the Japan Society for Precision Engineering 56, no. 3 (1990): 469–72. http://dx.doi.org/10.2493/jjspe.56.469.

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24

Yakushenkov, P. O. "Photonic Integrated Circuits." Photonics Russia 68, no. 8 (2017): 58–67. http://dx.doi.org/10.22184/1993-7296.2017.68.8.58.67.

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25

Mavor, J. "Monolithic Integrated Circuits." Electronics and Power 32, no. 3 (1986): 234. http://dx.doi.org/10.1049/ep.1986.0153.

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26

Simmons, John G. "Analogue Integrated Circuits." Electronics and Power 32, no. 3 (1986): 234. http://dx.doi.org/10.1049/ep.1986.0154.

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27

Chisholm, G. H., S. T. Eckmann, C. M. Lain, and R. L. Veroff. "Understanding integrated circuits." IEEE Design & Test of Computers 16, no. 2 (1999): 26–37. http://dx.doi.org/10.1109/54.765201.

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28

Silva, M. M. "Linear integrated circuits." Proceedings of the IEEE 73, no. 8 (1985): 1340. http://dx.doi.org/10.1109/proc.1985.13290.

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29

Forrest, S. R. "Optoelectronic integrated circuits." Proceedings of the IEEE 75, no. 11 (1987): 1488–97. http://dx.doi.org/10.1109/proc.1987.13910.

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30

Hurst, Stanley L. "Analog integrated circuits." Microelectronics Journal 29, no. 6 (1998): 353–54. http://dx.doi.org/10.1016/s0026-2692(97)00042-6.

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31

Free, C. E. "Microwave integrated circuits." Microelectronics Journal 24, no. 1-2 (1993): 158–59. http://dx.doi.org/10.1016/0026-2692(93)90112-r.

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32

Vardaxoglou, J. C. "Microwave integrated circuits." Microprocessors and Microsystems 20, no. 3 (1996): 197. http://dx.doi.org/10.1016/0141-9331(95)01064-5.

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33

Grierson, J. R., and S. Hollock. "Semicustom integrated circuits." IEE Proceedings E Computers and Digital Techniques 132, no. 2 (1985): 49. http://dx.doi.org/10.1049/ip-e.1985.0006.

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34

Evtikhiev, N. N., and V. N. Morozov. "Integrated optoelectronic circuits." Soviet Journal of Quantum Electronics 17, no. 11 (1987): 1366–74. http://dx.doi.org/10.1070/qe1987v017n11abeh010834.

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35

Chakrabarti, N. B. "GaAs Integrated Circuits." IETE Journal of Research 38, no. 2-3 (1992): 163–78. http://dx.doi.org/10.1080/03772063.1992.11437044.

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36

Ferrell, Ph.D., Thomas L., Charles L. Britton, Ph.D., William L. Bryan, Ph.D., et al. "Telesensor Integrated Circuits." World Journal of Surgery 25, no. 11 (2001): 1412–18. http://dx.doi.org/10.1007/s00268-001-0126-0.

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37

Knight, WilliamL, Mark Paraskeva, and DavidF Burrows. "4764926 Integrated circuits." Microelectronics Reliability 29, no. 4 (1989): 666. http://dx.doi.org/10.1016/0026-2714(89)90535-0.

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38

Koch, Thomas L., and Uziel Koren. "Photonic Integrated Circuits." AT&T Technical Journal 71, no. 1 (1992): 63–74. http://dx.doi.org/10.1002/j.1538-7305.1992.tb00148.x.

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39

Li, Ruotong. "Analysis of Delay Limitation and Circuit Power Balance Optimisation for CMOS Based Circuits." Transactions on Computer Science and Intelligent Systems Research 5 (August 12, 2024): 355–60. http://dx.doi.org/10.62051/505v3198.

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As integrated circuits and technology have advanced, people's requirements for integrated circuits are getting higher and higher, and integrated circuits with high performance, low latency and low power consumption characteristics are needed to satisfy all kinds of human needs. However, meeting these needs requires a balanced optimization of circuit delay and energy consumption. The gate size and voltage need to be varied simultaneously, and the most suitable voltage and gate are found by combining the gate size and voltage ratio using a linear programming solver. This method can find the opti

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40

Takeda, Yasunori, Tomohito Sekine, Rei Shiwaku, et al. "Printed Organic Complementary Inverter with Single SAM Process Using a p-type D-A Polymer Semiconductor." Applied Sciences 8, no. 8 (2018): 1331. http://dx.doi.org/10.3390/app8081331.

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The demonstration of the complementary integrated circuit using printing processes is indispensable for realizing electronic devices using organic thin film transistors. Although complementary integrated circuits have advantages such as low power consumption and a wide output voltage range, complementary integrated circuits fabricated by the printing method have problems regarding driving voltage and performance. Studies on fabrication processes of electronic circuits for printing technology, including optimization and simplification, are also important research topics. In this study, the fabr

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41

Hu, Jian-Guo, Wen-Zhuo Mei, Jin Wu, Jia-Wei Li, and De-Ming Wang. "A Fully Integrated RFID Reader SoC." Micromachines 14, no. 9 (2023): 1691. http://dx.doi.org/10.3390/mi14091691.

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The traditional RFID reader module relies on a discrete original design. This design integrates a microcontroller, high-frequency RFID reader IC and other multiple chips onto a PCB board, leading to bottlenecks in cost, power consumption, stability and reliability. To align with the trend towards high integration, miniaturization and low power consumption in RFID reader, this paper introduces a fully integrated RFID Reader SoC. The SoC employs the open-source Cortex-M0 core to integrate the RF transceiver, analog circuits, baseband protocol processing, memory and interface circuits into one ch

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42

Stavrinidou, Eleni, Roger Gabrielsson, Eliot Gomez, et al. "Electronic plants." Science Advances 1, no. 10 (2015): e1501136. http://dx.doi.org/10.1126/sciadv.1501136.

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The roots, stems, leaves, and vascular circuitry of higher plants are responsible for conveying the chemical signals that regulate growth and functions. From a certain perspective, these features are analogous to the contacts, interconnections, devices, and wires of discrete and integrated electronic circuits. Although many attempts have been made to augment plant function with electroactive materials, plants’ “circuitry” has never been directly merged with electronics. We report analog and digital organic electronic circuits and devices manufactured in living plants. The four key components o

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43

Yagodkin, A., V. Zolnikov, Tatyana Skvortsova, A. Achkasov, Sergey Kuznecov, and F. Makarenko. "Development of algorithms and programs for the analysis of electrical characteristics BIS." Modeling of systems and processes 15, no. 4 (2022): 136–48. http://dx.doi.org/10.12737/2219-0767-2022-15-4-136-148.

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Modern mathematical models for automatic analysis of electrical characteristics of integrated circuits are considered. The requirements for the analysis programs are formulated. A comparative analysis of machine methods for calculating integrated circuits is carried out in terms of their accuracy, RAM volumes and calculation time. The features of the development of modern automation tools for designing integrated circuits are considered. One of the main tasks of designing an integrated circuit is a schematic analysis, which must be carried out both at the preliminary stage and after the develo

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44

Ingty Agnihotri, Pravar, and Ajay Joshi. "PHOTONIC INTEGRATED CIRCUITS: GIANT LEAP IN COMPUTING TECHNOLOGY." International Journal of Advanced Research 12, no. 09 (2024): 366–74. http://dx.doi.org/10.21474/ijar01/19464.

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There is a continued demand for increase in computing requirements from sensor, smartphones, to servers. However, the technology improvements in clock speed, power, and memory bandwidth from traditional electronic integrated circuits (EIC) has started to saturate. This has triggered further research in exploration of photon integrated circuits (PIC) that utilize photons (or particles of light) as opposed to electrons to form a functioning circuit. Research suggests that by integrating the benefits of EIC and PIC, one is able to harness the best of both worlds. The inherent advantages of photon

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45

Deeb, Ali, Abdalrahman Ibrahim, Mohamed Salem, et al. "A Robust Automated Analog Circuits Classification Involving a Graph Neural Network and a Novel Data Augmentation Strategy." Sensors 23, no. 6 (2023): 2989. http://dx.doi.org/10.3390/s23062989.

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Analog mixed-signal (AMS) verification is one of the essential tasks in the development process of modern systems-on-chip (SoC). Most parts of the AMS verification flow are already automated, except for stimuli generation, which has been performed manually. It is thus challenging and time-consuming. Hence, automation is a necessity. To generate stimuli, subcircuits or subblocks of a given analog circuit module should be identified/classified. However, there currently needs to be a reliable industrial tool that can automatically identify/classify analog sub-circuits (eventually in the frame of

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46

Goswami, Neelaksha, and Satendra Singh. "Learning on Proposal and Optimization of Stumpy Influence CMOS Transconductance Operational Amplifier." RESEARCH REVIEW International Journal of Multidisciplinary 6, no. 12 (2021): 184–90. http://dx.doi.org/10.31305/rrijm.2021.v06.i12.028.

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Portable systems, such as wireless communication systems, laptops, smart phones, consumer electronics, and implanted medical devices, are in high demand in the rapidly expanding consumer market. When it comes to extending the running duration of these portable devices, low-power and low-voltage integrated circuits are used almost universally to achieve this. The design of an analogue integrated circuit with somewhat excellent processing characteristics, when compared to its digital equivalent, is a difficult undertaking, especially when it comes to applications requiring low voltage and low po

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47

Hu, Xiao Ming. "A Study on Wafer and Feature Size." Advanced Materials Research 1049-1050 (October 2014): 762–66. http://dx.doi.org/10.4028/www.scientific.net/amr.1049-1050.762.

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the paper introduced the bare silicon crystal how to become a wafer .then, it told the processing of wafers to produce integrated circuits .Today, most integrated circuits (ICs) are made of silicon. every integrated circuit is tested and functional and formed a dies. At last , the article explain feature size and the number of gross die per wafer (DPW).

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48

Shibata, Tadashi, and Tadahiro Ohmi. "Implementing Intelligence in Silicon Integrated Circuits Using Neuron-Like High-Functionality Transistors." Journal of Robotics and Mechatronics 8, no. 6 (1996): 508–15. http://dx.doi.org/10.20965/jrm.1996.p0508.

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The primary objective of this article is not to present integrated circuit implementation of neural networks in the sense that neurophysiological models are constructed in electronic circuits, but to describe new-architecture intelligent electronic circuits built using a neuron-like high-functionality transistor as a basic circuit element. This has greatly reduced the VLSI hardware/software burden in carrying out intelligent data processing and would find promising applications in robotics. The transistor is a multiple-input-gate thresholding device called a neuron MOSFET (neuMOS or νMOS) due

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49

Xu, Zulin. "An intelligent fault detection approach for digital integrated circuits through graph neural networks." Mathematical Biosciences and Engineering 20, no. 6 (2023): 9992–10006. http://dx.doi.org/10.3934/mbe.2023438.

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<abstract><p>To quickly and accurately realize the fault diagnosis of analog circuits, this paper introduces the graph neural network method and proposes a fault diagnosis method for digital integrated circuits. The method filters the signals present in the digital integrated circuit to remove noise signals and redundant signals and analyzes the digital integrated circuit characteristics after the filtering process to obtain the digital integrated circuit leakage current variation. To the problem of the lack of a parametric model for Through-Silicon Via (TSV) defect modeling, the m

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50

Qiu, Tian. "Application and possibility of machine learning in integrated circuit design." Applied and Computational Engineering 6, no. 1 (2023): 60–66. http://dx.doi.org/10.54254/2755-2721/6/20230457.

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Artificial Intelligence has had an impact on the field of integrated circuits. Artificial Intelligence technology is gradually replacing the traditional methodology of implementing Integrated Circuit tasks, which consumes a lot of time, funding, and labor. Traditionally, electronic products, like chips, which consist of a large number of circuits, were very slow and costly to process, because it was done by humans. The engineers have to design the layout, carry out operations, verify, and test the circuits, and this is actually extremely inefficient and expensive. However, with the help of Art

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