Libros sobre el tema "Interconnects (Integrated circuit technology) Copper"

Gupta, Tapan. Copper interconnect technology. Dordrecht: Springer, 2009.

Kondo, K. Morphological evolution of electrodeposits and electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV: Proceedings of the international symposia. Editado por Electrochemical Society Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division, Electrochemical Society Electronics Division y Electrochemical Society Meeting. Pennington, NJ: Electrochemical Society, 2005.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Editado por Tsui Ting Y y Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Editado por Tsui Ting Y y Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Editado por Tsui Ting Y y Materials Research Society Meeting. Warrendale, Pa: Materials Research Society, 2006.

S, Ho P., ed. Stress-induced phenomena in metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. Melville, N.Y: American Institute of Physics, 2004.

International, Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin Texas). Stress-induced phenomena in metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008. Melville, N.Y: American Institute of Physics, 2009.

International, Workshop on Stress-Induced Phenomena in Metallization (9th 2007 Kyoto Japan). Stress-induced phenomena in metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007. Melville, N.Y: American Institute of Physics, 2007.

International Workshop on Stress-Induced Phenomena in Metallization (11th 2010 Bad Schandau, Germany). Stress-induced phenomena in metallization: Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010. Editado por Zschech Ehrenfried, Ho P. S y Ogawa Shinʼichi. Melville, N.Y: American Institute of Physics, 2010.

International Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas). Stress-induced phenomena in metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008. Editado por Ho P. S, Ogawa Shinichi Dr y Zschech Ehrenfried. Melville, N.Y: American Institute of Physics, 2009.

Advanced interconnects for ULSI technology. Hoboken, NJ: Wiley, 2012.

Hübner, René. Advanced Ta-based diffusion barriers for Cu interconnects. New York: Nova Science Publishers, 2009.

Hubner, Rene. Advanced Ta-based diffusion barriers for Cu interconnects. New York: Nova Science Publishers, 2008.

Symposium, on High Performance Interconnects (14th 2006 Stanford Calif ). 14th IEEE Symposium on High-Performance Interconnects: Hot Interconnects : proceedings : 23-25 August, 2005, Stanford, CA. Los Alamitos, Calif: IEEE Computer Society, 2006.

Symposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. Los Alimitos, Calif: IEEE Computer Society, 2007.

Symposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. Los Alimitos, Calif: IEEE Computer Society, 2007.

Symposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. Los Alimitos, Calif: IEEE Computer Society, 2007.

Symposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. Los Alimitos, Calif: IEEE Computer Society, 2007.

Symposium on High Performance Interconnects (12th 2004 Stanford University). 12th Annual IEEE Symposium on High Performance Interconnects: Hot interconnects : 25-27 August, 2004, Stanford University, Stanford, California, USA : proceedings. Los Alamitos, CA: IEEE Computer Society, 2004.

Integrated interconnect technologies for 3D nanoelectronic systems. Boston, Mass: Artech House, 2009.

Huang, Ai. Recent advances in dielectric materials. Hauppauge, N.J: Nova Science Publishers, 2009.

1958-, Long John R., ed. Circuit and interconnect design for RF and high bit-rate applications. [Dordrecht]: Springer, 2008.

Integrated circuit packaging, assembly and interconnections: Trends and options. New York: Springer, 2006.

Calif.) Annual Symposium on High-Performance Interconnects (21st 2013 San Jose. 2013 IEEE 21st Annual Symposium on High-Performance Interconnects (HOTI 2013): San Jose, California, USA, 21-23 August 2013. Piscataway, NJ: IEEE, 2013.

RapidIO: The embedded system interconnect. Chichester: J. Wiley, 2004.

Symposium on High Performance Interconnects (16th 2008 Stanford, Calif.). 16th Annual IEEE Symposium on High-Performance Interconnects: Proceedings, Stanford, California, August 26-28, 2008. Los Alamitos, Calif: IEEE Computer Society, 2008.

Poland) European Microelectronics Packaging & Interconnection Symposium (2002 Kraków. European Microelectronics Packaging & Interconnection Symposium: Proceedings : IMAPS Europe Cracow 2002 : 16-18 June 2002, Cracow Poland : IMAPS Poland. Cracow [Poland]: International Microelectronics and Packaging Society, Poland Chapter, 2002.

Coupled data communication techniques for high-performance and low-power computing. New York: Springer, 2010.

Multi-point interconnects for globally-asynchronous locally-synchronous systems. Konstanz: Hartung-Gorre Verlag, 2005.

Kyoto, Japan) International Interconnect Technology Conference (2013. 2013 IEEE International Interconnect Technology Conference (IITC 2013): Kyoto, Japan, 13-15 June 2013. Piscataway, NJ: IEEE, 2013.

International, Interconnect Technology Conference (2007 Burlingame Calif ). Proceedings of the IEEE 2007 International Interconnect Technology Conference: Burlingame, CA, June 4-6, 2007. Piscataway, NJ: IEEE, 2007.

Burlingame, Calif ). International Interconnect Technology Conference (2006. Proceedings of the IEEE International Interconnect Technology Conference: Burlingame, CA : June 5-7, 2006 ... IITC. Piscataway, N.J: IEEE, 2006.

Electromigration in thin films and electronic devices: Materials and reliability. Oxford: Woodhead Publishing, 2011.

1962-, Pileggi Lawrence y Odabasioglu Altan 1973-, eds. IC interconnect analysis. Boston, Mass: Kluwer Academic Publishers, 2002.

IEEE Workshop on Signal Propagation on Interconnects (10th 2006 Berlin, Germany). 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings. Piscataway, N.J: IEEE, 2006.

Sharma, Rohit. Compact Models and Measurement Techniques for High-Speed Interconnects. Boston, MA: Springer US, 2012.

Three-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Munich: Hanser Publishers, 2014.

Pasricha, Sudeep. On-Chip Communication Architectures: System on Chip Interconnect. Burlington: Elsevier, 2008.

Gunawan, Indra. Fundamentals of reliability engineering: Applications in multistage interconnection networks. Hoboken, N.J: John Wiley & Sons, Inc., 2014.

Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics" (2011 San Francisco, Calif.). Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Editado por Baklanov Mikhail R y Materials Research Society Meeting. Warrendale, Penn: Materials Research Society, 2012.

Ree, Moonhor. Low-k nanoporous interdielectrics: Materials, thin film fabrications, structures and properties. Hauppauge, N.Y: Nova Science Publishers, 2010.

Zürich, Eidgenössische Technische Hochschule, ed. Static inductance extraction by means of the Monte Carlo method and comparison with related approaches. Konstanz: Hartung-Gorre, 2001.

Martin, Gall y Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009: Symposium held April 14-17, 2009, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2009.

R, Baklanov Mikhail y Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Warrendale, Penn: Materials Research Society, 2012.

IMAPS Conference and Exhibition on Ceramic Interconnect Technology (2003 Denver, Colo.). Proceedings: IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado. Bellingham, Wash., USA: SPIE, 2003.

Celik, Mustafa. IC interconnect analysis. Boston: Kluwer Academic Publishers, 2002.

Borst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Boston: Kluwer Academic Publishers, 2002.

Lemieux, Guy. Design of interconnection networks for programmable logic. Boston, MA: Kluwer Academic, 2003.

David, Lewis, ed. Design of interconnection networks for programmable logic. Boston: Kluwer Academic Publishers, 2004.

Pasricha, Sudeep. On-chip communication architectures: System on chip interconnect. Boston: Elsevier/Morgan Kaufmann, 2008.