Libros sobre el tema "Interconnects (Integrated circuit technology) Copper"
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Kondo, K. Morphological evolution of electrodeposits and electrochemical processing in ULSI fabrication and electrodeposition of and on semiconductors IV: Proceedings of the international symposia. Edited by Electrochemical Society Electrodeposition Division, Electrochemical Society. Dielectric Science and Technology Division, Electrochemical Society Electronics Division, and Electrochemical Society Meeting. Electrochemical Society, 2005.
Buscar texto completoSymposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Materials Research Society, 2006.
Buscar texto completoSymposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Materials Research Society, 2006.
Buscar texto completoSymposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 San Francisco, Calif.). Materials, technology and reliability of low-k dielectrics and copper interconnects: Symposium held April 18-21, 2006, San Francisco, California, U.S.A. Edited by Tsui Ting Y and Materials Research Society Meeting. Materials Research Society, 2006.
Buscar texto completoS, Ho P., ed. Stress-induced phenomena in metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004. American Institute of Physics, 2004.
Buscar texto completoInternational, Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin Texas). Stress-induced phenomena in metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008. American Institute of Physics, 2009.
Buscar texto completoInternational, Workshop on Stress-Induced Phenomena in Metallization (9th 2007 Kyoto Japan). Stress-induced phenomena in metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization, Kyoto, Japan 4 - 6 April 2007. American Institute of Physics, 2007.
Buscar texto completoInternational Workshop on Stress-Induced Phenomena in Metallization (11th 2010 Bad Schandau, Germany). Stress-induced phenomena in metallization: Eleventh International Workshop on Stress-Induced Phenomena in Metallization, Bad Schandau, Germany, 12-14 April 2010. Edited by Zschech Ehrenfried, Ho P. S, and Ogawa Shinʼichi. American Institute of Physics, 2010.
Buscar texto completoInternational Workshop on Stress-Induced Phenomena in Metallization (10th 2008 Austin, Texas). Stress-induced phenomena in metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 5-7 November 2008. Edited by Ho P. S, Ogawa Shinichi Dr, and Zschech Ehrenfried. American Institute of Physics, 2009.
Buscar texto completoHübner, René. Advanced Ta-based diffusion barriers for Cu interconnects. Nova Science Publishers, 2009.
Buscar texto completoHubner, Rene. Advanced Ta-based diffusion barriers for Cu interconnects. Nova Science Publishers, 2008.
Buscar texto completoSymposium, on High Performance Interconnects (14th 2006 Stanford Calif ). 14th IEEE Symposium on High-Performance Interconnects: Hot Interconnects : proceedings : 23-25 August, 2005, Stanford, CA. IEEE Computer Society, 2006.
Buscar texto completoSymposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. IEEE Computer Society, 2007.
Buscar texto completoSymposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. IEEE Computer Society, 2007.
Buscar texto completoSymposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. IEEE Computer Society, 2007.
Buscar texto completoSymposium on High Performance Interconnects (15th 2007 Stanford, Calif.). Hot interconnects: 15th Annual IEEE Symposium on High-Performance Interconnects : proceedings : 22-24 August, 2007, Stanford, CA. IEEE Computer Society, 2007.
Buscar texto completoSymposium on High Performance Interconnects (12th 2004 Stanford University). 12th Annual IEEE Symposium on High Performance Interconnects: Hot interconnects : 25-27 August, 2004, Stanford University, Stanford, California, USA : proceedings. IEEE Computer Society, 2004.
Buscar texto completoIntegrated interconnect technologies for 3D nanoelectronic systems. Artech House, 2009.
Buscar texto completoHuang, Ai. Recent advances in dielectric materials. Nova Science Publishers, 2009.
Buscar texto completo1958-, Long John R., ed. Circuit and interconnect design for RF and high bit-rate applications. Springer, 2008.
Buscar texto completoIntegrated circuit packaging, assembly and interconnections: Trends and options. Springer, 2006.
Buscar texto completoCalif.) Annual Symposium on High-Performance Interconnects (21st 2013 San Jose. 2013 IEEE 21st Annual Symposium on High-Performance Interconnects (HOTI 2013): San Jose, California, USA, 21-23 August 2013. IEEE, 2013.
Buscar texto completoSymposium on High Performance Interconnects (16th 2008 Stanford, Calif.). 16th Annual IEEE Symposium on High-Performance Interconnects: Proceedings, Stanford, California, August 26-28, 2008. IEEE Computer Society, 2008.
Buscar texto completoPoland) European Microelectronics Packaging & Interconnection Symposium (2002 Kraków. European Microelectronics Packaging & Interconnection Symposium: Proceedings : IMAPS Europe Cracow 2002 : 16-18 June 2002, Cracow Poland : IMAPS Poland. International Microelectronics and Packaging Society, Poland Chapter, 2002.
Buscar texto completoCoupled data communication techniques for high-performance and low-power computing. Springer, 2010.
Buscar texto completoMulti-point interconnects for globally-asynchronous locally-synchronous systems. Hartung-Gorre Verlag, 2005.
Buscar texto completoKyoto, Japan) International Interconnect Technology Conference (2013. 2013 IEEE International Interconnect Technology Conference (IITC 2013): Kyoto, Japan, 13-15 June 2013. IEEE, 2013.
Buscar texto completoInternational, Interconnect Technology Conference (2007 Burlingame Calif ). Proceedings of the IEEE 2007 International Interconnect Technology Conference: Burlingame, CA, June 4-6, 2007. IEEE, 2007.
Buscar texto completoBurlingame, Calif ). International Interconnect Technology Conference (2006. Proceedings of the IEEE International Interconnect Technology Conference: Burlingame, CA : June 5-7, 2006 ... IITC. IEEE, 2006.
Buscar texto completoElectromigration in thin films and electronic devices: Materials and reliability. Woodhead Publishing, 2011.
Buscar texto completo1962-, Pileggi Lawrence, and Odabasioglu Altan 1973-, eds. IC interconnect analysis. Kluwer Academic Publishers, 2002.
Buscar texto completoIEEE Workshop on Signal Propagation on Interconnects (10th 2006 Berlin, Germany). 10th IEEE Workshop on Signal Propagation on Interconnects: May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings. IEEE, 2006.
Buscar texto completoSharma, Rohit. Compact Models and Measurement Techniques for High-Speed Interconnects. Springer US, 2012.
Buscar texto completoThree-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Hanser Publishers, 2014.
Buscar texto completoPasricha, Sudeep. On-Chip Communication Architectures: System on Chip Interconnect. Elsevier, 2008.
Buscar texto completoGunawan, Indra. Fundamentals of reliability engineering: Applications in multistage interconnection networks. John Wiley & Sons, Inc., 2014.
Buscar texto completoSymposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics" (2011 San Francisco, Calif.). Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Edited by Baklanov Mikhail R and Materials Research Society Meeting. Materials Research Society, 2012.
Buscar texto completoRee, Moonhor. Low-k nanoporous interdielectrics: Materials, thin film fabrications, structures and properties. Nova Science Publishers, 2010.
Buscar texto completoZürich, Eidgenössische Technische Hochschule, ed. Static inductance extraction by means of the Monte Carlo method and comparison with related approaches. Hartung-Gorre, 2001.
Buscar texto completoMartin, Gall, and Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2009: Symposium held April 14-17, 2009, San Francisco, California, U.S.A. Materials Research Society, 2009.
Buscar texto completoR, Baklanov Mikhail, and Materials Research Society Meeting, eds. Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: Symposium held April 25-29, 2011, San Francisco, California, U.S.A. Materials Research Society, 2012.
Buscar texto completoIMAPS Conference and Exhibition on Ceramic Interconnect Technology (2003 Denver, Colo.). Proceedings: IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado. SPIE, 2003.
Buscar texto completoCelik, Mustafa. IC interconnect analysis. Kluwer Academic Publishers, 2002.
Buscar texto completoBorst, Christopher L. Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses: Fundamental mechanisms and application to IC interconnect technology. Kluwer Academic Publishers, 2002.
Buscar texto completoLemieux, Guy. Design of interconnection networks for programmable logic. Kluwer Academic, 2003.
Buscar texto completoDavid, Lewis, ed. Design of interconnection networks for programmable logic. Kluwer Academic Publishers, 2004.
Buscar texto completoPasricha, Sudeep. On-chip communication architectures: System on chip interconnect. Elsevier/Morgan Kaufmann, 2008.
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