Literatura académica sobre el tema "Plates printed on both sides of leaf"

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Artículos de revistas sobre el tema "Plates printed on both sides of leaf"

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STAMATIS, HARALAMBOS, DIMITRIOS GOURNIS, ANGELIKI POLYDERA, et al. "3D Printed Polylactic Acid (PLA) Well Plates for Enzyme Inhibition Studies: The Case of Pancreatic Lipase." Catalysis Research 02, no. 04 (2022): 1–19. http://dx.doi.org/10.21926/cr.2203032.

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3D printed PLA has already been demonstrated for several biotechnological applications, including enzymes immobilization. The prerequisites for an efficient screening assay include using small volumes of reagents, low cost, and rapid screening of large numbers of compounds and extracts. Hence, assays based on microtiter plates are predominant. Thus, designing and fabricating scaffolds on a similar scale, which could serve as immobilization carriers, and their recruitment in inhibitors screening studies is of great significance, adding both enzyme stability and reuse potentiality of the biocata
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Lin, Xianjing, Zhangrun Weng, Yibin Hong, and Yao Zhang. "A Wideband Circularly Polarized Dipole Antenna with Compact Size and Low-Pass Filtering Response." Sensors 24, no. 12 (2024): 3914. http://dx.doi.org/10.3390/s24123914.

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This paper presents a compact wideband circularly polarized cross-dipole antenna with a low-pass filter response. It consists of two pairs of folded cross-dipole arms printed separately on both sides of the top substrate, and the two dipole arms on the same surface are connected by an annular phase-shifting delay line to generate circular polarization. A bent metal square ring and four small metal square rings around the cross-dipoles are employed to introduce new resonant frequencies, effectively extending the impedance and axial-ratio bandwidth. Four square patches printed on the middle subs
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Wojnarowski, A. E., A. B. Leonteva, and Е. S. Soonvald. "A SIMPLE DEVICE FOR MONITORING CRACKS FROM PHOTOGRAPHS." International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences XLVI-5/W1-2022 (February 3, 2022): 245–50. http://dx.doi.org/10.5194/isprs-archives-xlvi-5-w1-2022-245-2022.

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Abstract. The article presents a simple technological solution PMC (PhotoMicrometer Contrast) for monitoring cracks and deformation joints in buildings and structures. The solution is based on the methods of image processing and photogrammetry. The monitoring equipment includes a special marker, a digital camera and specialized processing software. The marker consists of two thin plastic plates where Aruco marks and special measuring areas are printed. There are two types of markers – for monitoring in one or two directions of crack development. While monitoring is performed, two plates are fi
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Yang, Ying, Andrius Čeponis, Dalius Mažeika, and Vytautas Jūrėnas. "Inertial Piezoelectric Rotary Motor Based on Low Profile Stator with Trapezoidal Waveguides." Mechanics 27, no. 2 (2021): 139–47. http://dx.doi.org/10.5755/j02.mech.28247.

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Results of numerical and experimental investigations of a novel inertial piezoelectric rotary type motor based on a low profile stator with trapezoidal waveguides. The proposed motor has a simple design and is well scalable. Moreover, the proposed design of the motor allows mount it on a printed circuit board and use it in a small-size mobile positioning and actuating systems. The structure of the stator is based on a square type hollowed steel frame with four straight trapezoidal waveguides that are used to transfer vibrations of the stator to the rotation of the rotor. Piezo ceramic plates a
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Fellner, K., P. F. Fuchs, G. Pinter, T. Antretter, and T. Krivec. "Method development for the cyclic characterization of thin copper layers for PCB applications." Circuit World 40, no. 2 (2014): 53–60. http://dx.doi.org/10.1108/cw-09-2013-0032.

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Purpose – The overall aim of this research work was the improvement of the failure behavior of printed circuit boards (PCBs). In order to describe the mechanical behavior of PCBs under cyclic thermal loads, thin copper layers were characterized. The mechanical properties of these copper layers were determined in cyclic four-point bend tests and in cyclic tensile-compression tests, as their behavior under changing tensile and compression loads needed to be evaluated. Design/methodology/approach – Specimens for the four-point bend tests were manufactured by bonding 18-μm-thick copper layers on b
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Perminow, J. I. S., A. Sletten, and M. B. Brurberg. "First Report of Leaf Spot Caused by Xanthomonas axonopodis pv. poinsettiicola on Poinsettia (Euphorbia pulcherrima) in Norway." Plant Disease 95, no. 9 (2011): 1187. http://dx.doi.org/10.1094/pdis-12-10-0904.

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Poinsettia (Euphorbia pulcherrima) is the biggest flowering potted-plant culture in Norway with approximately six million plants produced yearly. A considerable percentage is produced from imported cuttings. In September 2010, we received diseased poinsettias with necrotic leaf spots from a commercial poinsettia grower in Hordaland County. Leaf spots on the upper sides of leaves were brownish, necrotic, irregular in shape, and surrounded by yellow halos. Small, grayish brown, water-soaked spots were observed on the abaxial sides of the leaves from the same plants. Some of the latter carried cr
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Bilyk, H. M., Yu V. Kharchenko, and V. K. Ryabchun. "Monitoring of mulberry (Morus L.) plantations to identify samples that combine high productivity and decorativeness." Genetičnì resursi roslin (Plant Genetic Resources), no. 31 (2022): 62–73. http://dx.doi.org/10.36814/pgr.2022.31.06.

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Aim. The purpose of the research was to identify unique mulberry specimens in the existing plantations, adapted to the climatic conditions of the growth zone, with a different combination of economic characteristics. The collection of the dendrological park "Ustimivskyi", protective strips within the land use of the Ustymivska Experimental Station of Plant Production of Plant Production Institute nd. a. V. Ya. Yuriev of NAAS, private estates of residents of the villages of Ustymivka and Novobudova of the Globynska UTC of the Poltava region. Results and Discussion. Among the mulberry plants gro
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Das, Rabindra N., Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz, and Raj Rai. "3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics." International Symposium on Microelectronics 2013, no. 1 (2013): 000531–37. http://dx.doi.org/10.4071/isom-2013-wa43.

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The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Add
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Das, Rabindra, Frank D. Egitto, Steven G. Rosser, Erich Kopp, and Barry Bonitz. "3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 000618–34. http://dx.doi.org/10.4071/2013dpc-tp12.

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The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Add
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Saroj, A., A. Kumar, A. K. Srivastava, et al. "New Report of Black Leaf Spot Mold (Pseudocercospora fuligena) on Withania somnifera from India." Plant Disease 98, no. 9 (2014): 1275. http://dx.doi.org/10.1094/pdis-03-14-0231-pdn.

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Withania somnifera (family solanaceae) commonly known as ashwagandha and Indian ginseng, originated in India is one of the most powerful medicinal plants for more than 3,000 years (1). It is commercially cultivated for its roots, a natural rich source of glycowithanolides, tannins, potassium nitrate, etc., which are an anti-inflammatory, anti-tumor, anti-oxidant, anti-ulcer, and regulator of the nervous system and sleep (2). During the monsoon of July 2011, black spots on the leaves of infected plants were observed in the ashwagandha growing Lucknow, Raibareilly, and adjoining areas of Uttar P
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Capítulos de libros sobre el tema "Plates printed on both sides of leaf"

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West, Anthony James. "Sales and Prices of First Folios: A History from 1623 to the Present." In The Shakespeare First Folio. Oxford University PressOxford, 2001. http://dx.doi.org/10.1093/oso/9780198187691.003.0001.

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Abstract The Shakespeare First Folio appeared in November 1623. The plays were gathered together for publication by John Heminges and Henry Condell, fellow players of Shakespeare’s in the company of the King’s Men. It was printed in London near St Paul’s by William Jaggard and his son Isaac; the principal publishers were Isaac Jaggard and Edward Blount. It has 454 leaves, including nine preliminaries; the sheets are gathered (with some exceptions) into six- leaf quires. The text is printed on handmade paper in pica roman type, in two columns, on both sides of the leaves. The volume contains th
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Actas de conferencias sobre el tema "Plates printed on both sides of leaf"

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Lau, Dennis, and S. W. Ricky Lee. "Correlation Between the Strain on the Printed Circuit Board and the Stress in Chips for the Failure Prediction of Passive Components." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-82084.

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Due to the demand for miniaturization of microelectronic devices, the density of packaging has become higher and higher. Also, the sizes of components have become smaller and smaller. In addition to advanced active components such as chip scale packages (CSPs) and flip chips (FCs), mini sized passive components such as chip capacitors and resistors are also important elements for high density packaging. It is quite common to see dozens up to hundreds of passive components on printed circuit boards (PCBs). Both active and passive components contribute to the function (and also malfunction) of e
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