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Bibliographies thématiques / Computer-cooling system

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Articles de revues

Littérature scientifique sur le sujet « Computer-cooling system »

Auteur : Grafiati

Publié le 4 juin 2021

Mis à jour le 15 février 2022

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Articles de revues sur le sujet "Computer-cooling system"

1

Levin, Il’ya, Aleksey Dordopulo, Yuriy Doronchenko, Maksim Raskladkin, and Aleksandr Fedorov. "Immersion cooling system for FPGA-based reconfigurable computer systems." Program Systems: Theory and Applications 7, no. 4 (2016): 65–81. http://dx.doi.org/10.25209/2079-3316-2016-7-4-65-81.

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Mhammad, Aree A., Faraidun K. Hama Salh, and Najmadin W. Abdulrahman. "Numerical Solution for Non-Stationary Heat Equation in Cooling of Computer Radiator System." Journal of Zankoy Sulaimani - Part A 12, no. 1 (2008): 97–102. http://dx.doi.org/10.17656/jzs.10199.

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Levin, I. I., A. I. Dordopulo, Y. I. Doronchenko, M. K. Raskladkin, A. M. Fedorov, and Z. V. Kalyaev. "Immersion liquid cooling FPGA-based reconfigurable computer system." IFAC-PapersOnLine 49, no. 25 (2016): 366–71. http://dx.doi.org/10.1016/j.ifacol.2016.12.070.

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Lee, Dae Hee, Jun Sik Lee, Yoon Seok Cha, Dae Keun Lee, and Myeong Chan Jo. "P-48 Measurements of Air Temperature Distribution and Optimum Cooling Condition inside the Computer System." Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics 2007.6 (2007): _P—48–1_—_P—48–5_. http://dx.doi.org/10.1299/jsmeatem.2007.6._p-48-1_.

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Ahmad Khalid, Shamsul Kamal, Noor Azah Samsudin, Nor Amirul Amri Nordin, and Muhammad Syariff Aripin. "Laptop Cooling Pad Temperature Monitoring System." Indonesian Journal of Electrical Engineering and Computer Science 12, no. 1 (2018): 420. http://dx.doi.org/10.11591/ijeecs.v12.i1.pp420-427.

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Cooling pads are commonly used to reduce temperature of laptop to avoid overheating problem. However, existing cooling pads are prone to various limitations: fixed voltage in the hardware component, inaccurate temperature readings and lacked of computer-based temperature monitoring functions. In this paper, a laptop cooling system with multivoltage fan speed controller using real-time processor temperature readings is proposed. A graphical user interface (GUI) and color coded LEDs are also implemented to provide visual inspection of the temperature values captured from the laptop. The temperature values are displayed in graph and tabular form. The performance of the proposed cooling pad with computer-based monitoring application is evaluated against two other types of existing cooling pad systems. The experiments have shown that the temperature values can be monitored clearly with the proposed GUI. More importantly, the proposed cooling pad system has the potential to achieve lower temperature faster than the rest of the existing cooling pad systems.

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Kwon, T. H. "Mold Cooling System Design Using Boundary Element Method." Journal of Engineering for Industry 110, no. 4 (1988): 384–94. http://dx.doi.org/10.1115/1.3187898.

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Cooling system design in injection molding industries is of great importance because it significantly affects productivity and the quality of the final part. It would thus be very helpful for mold designers to be able to use a computer aided design tool in determining locations of cooling channels and process conditions to achieve uniform cooling and minimum cooling time. Towards this goal, the Boundary Element Method (BEM) has been applied to develop a system of computer aided cooling system design programs: (a) an interactive design program using a two-dimensional BEM and (b) a cooling analysis program using a three-dimensional BEM. In the present work, the injection molding cooling process is simplified by quasi-steady-state heat transfer in terms of cycle-averaged temperature. In this regard, a cycle-averaged heat transfer coefficient between a mold and polymeric material has been introduced for a cycle-averaged boundary condition. In the present paper, discussion centers on the fundamental modeling of the cooling process and the features of the BEM mold cooling design systems.

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Левин, И. И., А. И. Дордопуло, Ю. И. Доронченко, М. К. Раскладкин, and А. М. Федоров. "A reconfigurable computer system based on FPGAs with liquid cooling." Numerical Methods and Programming (Vychislitel'nye Metody i Programmirovanie), no. 1 (March 29, 2016): 111–20. http://dx.doi.org/10.26089/nummet.v17r111.

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Статья посвящена проблемам построения перспективных реконфигурируемых вычислительных систем c жидкостным охлаждением для программируемых логических интегральных схем семейства Xilinx Virtex UltraScale. Рассматриваются архитектура, компоновка и сравнительные технические характеристики систем погружного жидкостного охлаждения. Приводятся результаты расчетов, макетирования и экспериментальной проверки основных технических решений созданного вычислительного модуля нового поколения для построения высокопроизводительных вычислительных систем с жидкостным охлаждением с производительностью 1 Пфлопс в стандартном вычислительном шкафу высотой 47U при потребляемой мощности 150 кВт. Реконфигурируемая вычислительная система с жидкостным охлаждением обеспечивает существенное преимущество по таким технико-экономическим параметрам, как реальная и удельная производительность, энергоэффективность, массогабаритные характеристики и другим по сравнению с аналогичными системами. The paper deals with problems of design of promising reconfigurable computer systems with liquid cooling for Xilinx Virtex UltraScale FPGAs. Architecture, placement and comparative technical parameters of systems with immersion liquid cooling are considered. Results of design, prototyping and experimental testing of the principal technical solutions of the designed computational module of the next generation are discussed. The computational module is intended for the creation of high-performance computer systems with liquid cooling with performance of 1 PFlops in a standard 47U computer rack with power of 150 kWatt. The reconfigurable computer system with liquid cooling provides considerable advantage in such technical and economical parameters as the real performance and the specific performance, power efficiency, mass and dimension parameters, etc. in comparison with similar systems.

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Wang, Qi Bing, Zhi Ming Wang, and An Hua Peng. "Optimization Design of Cooling System of Vacuum Calibrator for Plastics Profile Extrusion." Advanced Materials Research 168-170 (December 2010): 959–62. http://dx.doi.org/10.4028/www.scientific.net/amr.168-170.959.

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Plastic profile produced by extrusion die should be cooled down and calibrated by calibrator ,so the proper design of the cooling system in calibrator was very important to the profile quality .The cooling channels in calibrator were preliminarily designed according to target function, and peculiar heterotype optimum designs of the local cooling channels were carried out by means of numerical simulation , the cooling effect was improved obviously ,Based on enterprise resource planning ERP system and parallel project computer aided design/computer aided Engineering CAD/CAE intellectualized data-base network, design for the cooling system was more reasonable, and could meet the demands of customers much better.

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Abu-Mulaweh, Hosni I., and Hossein Oloomi. "Design and Development of a Computer-Controlled Interactive Cooling System." International Journal of Mechanical Engineering Education 42, no. 1 (2014): 18–29. http://dx.doi.org/10.7227/ijmee.42.1.2.

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10

Turng, L. S., and K. K. Wang. "A Computer-Aided Cooling-Line Design System for Injection Molds." Journal of Engineering for Industry 112, no. 2 (1990): 161–67. http://dx.doi.org/10.1115/1.2899560.

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This paper presents a methodology for analyzing the heat-transfer process during the injection molding of plastics as an aid to mold design. A numerical scheme using the Boundary Element Method (BEM) with “zonal” approach has been developed to solve the quasi-steady temperature field and its normal derivative over the entire surface of the mold plates including the cavity wall as well as parting surface. In order to obtain a solution for the temperature field, a cycle-averaged heat-transfer coefficient is introduced from a transient heat-conduction analysis and applied as the boundary condition at the cavity surface. The numerical predictions as compared with the experimental data have shown that the cycle-averaged solution used in this study gives a reasonable representation of the transient temperature variation over the cavity surface. Based on the numerical predictions, the mold designer will be able to design a proper cooling-system for a mold to achieve better part quality and high productivity through more uniform cooling and shorter cycle time, respectively.

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