Thèses sur le sujet « In-Sn »
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Benedict, Michael Scott. « Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints ». Diss., Online access via UMI:, 2007.
Trouver le texte intégralYassin, Amal M. « Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys ». Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.
Texte intégralLowe, Geoffrey T. « The columnar to equiaxed transition in Pb-Sn and Sn-Pb alloys ». Thesis, University of British Columbia, 1990. http://hdl.handle.net/2429/29658.
Texte intégralApplied Science, Faculty of
Materials Engineering, Department of
Graduate
Gruner, Thomas. « Neuartige RET2(Sn,In)-Systeme ». Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-205468.
Texte intégralFischer, David S. Ph D. Massachusetts Institute of Technology. « Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems ». Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/44424.
Texte intégralVita.
Includes bibliographical references (leaves 112-113).
A fluxless low temperature transient liquid phase (LTTLP) bonding process was studied as a method of producing Cu/Cu joints below 125°C and 75°C using interlayer alloys from the In-Sn and In-Sn-Bi systems. Using thermodynamic models, three different compositions (wt. %) of base alloys were chosen to accomplish this task: 50In-43.6Sn-6.4Bi (Tm = 110°C) and eutectic 50.9In-49.1Sn (Tm = 120°C) alloys were used for bonding at 125°C and a eutectic 48.3In-15.6Sn-36.1Bi (Tm = 60°C) alloy was used for bonding at 75°C. In addition, novel approaches to TLP bonding, including the addition of base material to the interlayer alloy and application of an electroless Ni diffusion barrier layer, were employed in an attempt to optimize this joining method. The LTTLP processes were assessed based on their abilities to produce joints with minimal thickness, high reflow temperatures, and good mechanical properties at room/elevated temperatures. It was found that interlayer alloys containing higher Bi contents produced the thinnest joints, with the 48.3In-15.6Sn-36.1Bi alloy producing joints on the order of 10 gm. Increases in nominal Cu composition of the interlayer alloy tended to form larger joints. Application of the Ni layer was observed to decrease the growth rate of the eutectic In-Sn joints made with 5 wt % Cu additions. Shear tests were performed on the joints at room (25°C) and operating (service) temperatures (100°C). Most of the TLP joints had room temperature shear strengths around 13,000 - 17,000 psi (= 90 - 120 MPa), although increases in strength were observed for eutectic In-Sn joints with 2.5 and 5 wt% Cu additions. At operating temperature, TLP joints made within the In-Sn-Cu system were found to have strengths an order of magnitude higher than those made in the In-Sn-Bi-Cu system.
(cont.) Poor mechanical response of the Bicontaining joints was due to the presence of low melting In-Bi IPs present in the reaction zone. Eutectic In-Sn TLP joints made with 2.5 and 5 wt% Cu additions were found to have operational temperature shear strengths of 6,000 - 7,500 psi ( 40 - 50 MPa) and 7,500 - 9,500 psi (= 50 65 MPa), respectively.
by David S. Fischer.
S.M.
Monterrubio, Martínez Carles. « Delivery of SN-38 in pediatric solid tumors ». Doctoral thesis, Universitat de Barcelona, 2016. http://hdl.handle.net/10803/399596.
Texte intégralMa, Xiang. « Willmore surfaces in Sn : transforms and vanishing theorems ». [S.l.] : [s.n.], 2005. http://edocs.tu-berlin.de/diss/2005/ma_xiang.pdf.
Texte intégralImaz, Inigo. « The search for CC SN in unobscured AGN ». Thesis, Uppsala universitet, Observationell astrofysik, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-297458.
Texte intégralBelyakov, Sergey Aleksandrovich. « Microstructure formation and soldering in Sn-Ni alloys ». Thesis, Imperial College London, 2013. http://hdl.handle.net/10044/1/17998.
Texte intégralLinnen, Robert L. « Contrasting origins of Sn-W mineralization in western Thailand ». Thesis, McGill University, 1992. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=70272.
Texte intégralCassiterite was saturated in the late-stage melt in the Nong Sua granitic pegmatite and subsequently with wolframite in orthomagmatic fluids. The latter mixed with external aqueous and aqueous-carbonic fluids of evolved meteoric or metamorphic origin at $ le$650$ sp circ$C and $ le$3.8 kbar. Hydrothermal cassiterite and wolframite crystallized as a result of increasing $fO sb2,$ fluid mixing, and cooling. At the Pilok stockwork deposits tourmalinization was followed by successive wolframite-K-feldspar deposition and cassiterite-sulphide greisen mineralization. Tin was remobilized by reduced metamorphic or evolved magmatic-meteoric aqueous-carbonic fluids. Cassiterite was deposited at 300-450$ sp circ$C in response to increasing $fO sb2,$ pH, or decreasing temperature. Limited data on the Takua Pit Thong replacement suggest that cassiterite was deposited from aqueous fluids at $ ge$500$ sp circ$C, but metamorphic aqueous-carbonic fluids were also involved.
The depth of emplacement was one of the major controls on mineralization style. Aqueous-carbonic fluids in the western Thai, and other Sn-W belts, are a consequence of a moderately deep level of emplacement; hypersaline orthomagmatic fluids are associated with sub-volcanic Sn-W mineralization.
Yasensky, David. « Solute-driven melting kinetics in the Sn-Bi system ». [Gainesville, Fla.] : University of Florida, 2006. http://purl.fcla.edu/fcla/etd/UFE0015847.
Texte intégralOh, Minseok. « Growth kinetics of intermetallic phases in the Cu-Sn binary and the Cu-Ni-Sn ternary systems at low temperatures ». access full-text online access from Digital Dissertation Consortium, 1994. http://libweb.cityu.edu.hk/cgi-bin/er/db/ddcdiss.pl?9513132.
Texte intégralPetzel, V. « Vein and replacement type Sn and Sn-W mineralization in the Southern Kaoko Zone, Damara Province, South West Africa/Namibia ». Thesis, Rhodes University, 1986. http://hdl.handle.net/10962/d1007633.
Texte intégralXu, Yi. « Microstructural configuration influence on electromigration in Sn/Cu thin films ». Diss., Georgia Institute of Technology, 1994. http://hdl.handle.net/1853/31039.
Texte intégralSengupta, Surajit. « Comparative study of Bi-In-Sn ternary eutectic cast wires ». Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0007/MQ45600.pdf.
Texte intégralHe, Hui. « Phase transitions in Sn-modified lead zirconate titanate antiferroelectric ceramics ». [Ames, Iowa : Iowa State University], 2007.
Trouver le texte intégralQuincey, Paul. « Production of Nb3̲Sn superconductors by the in situ technique ». Thesis, University of Oxford, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.379838.
Texte intégralPorter, Amber L., Mark D. Leising, G. Grant Williams, Peter Milne, Paul Smith, Nathan Smith, Christopher Bilinski, Jennifer L. Hoffman, Leah Huk et Douglas C. Leonard. « ASYMMETRIES IN SN 2014J NEAR MAXIMUM LIGHT REVEALED THROUGH SPECTROPOLARIMETRY ». IOP PUBLISHING LTD, 2016. http://hdl.handle.net/10150/622057.
Texte intégralZhao, E. « Role and production of secretoneurin (SN) in the goldfish pituitary ». Thesis, University of Ottawa (Canada), 2003. http://hdl.handle.net/10393/26551.
Texte intégralStein, Jendrik Verfasser], et Eric J. [Akademischer Betreuer] [Mittemeijer. « Stress relaxation mechanisms in thin Sn films and its alloys : Sn whisker formation and its mitigation / Jendrik Stein. Betreuer : Jan Eric Mittemeijer ». Stuttgart : Universitätsbibliothek der Universität Stuttgart, 2015. http://d-nb.info/1070219037/34.
Texte intégralStein, Jendrik [Verfasser], et Eric J. [Akademischer Betreuer] Mittemeijer. « Stress relaxation mechanisms in thin Sn films and its alloys : Sn whisker formation and its mitigation / Jendrik Stein. Betreuer : Jan Eric Mittemeijer ». Stuttgart : Universitätsbibliothek der Universität Stuttgart, 2015. http://d-nb.info/1070219037/34.
Texte intégralJahel, Ali. « Étude de l'ajout d'un promoteur au système Pt-Sn supporté sur alumine chlorée utilisé en reformage catalytique ». Thesis, Montpellier 2, 2010. http://www.theses.fr/2010MON20233.
Texte intégralThis work consists of a detailed study on the effect of indium in alumina supported trimetallic PtSnIn-based naphtha reforming catalysts. These catalysts were reproduced using different preparation protocols and the indium effect was investigated using 119Sn Mössbauer spectroscopy, XANES, EXAFS spectroscopies, IR-CO, STEM, CO chemisorption, TPR and TPD. It appears that the nature of the metallic active centres depends on the method with which indium was introduced. When co-precipitating the indium precursor with the Al source, PtxSn alloys were formed, whereas when metals were impregnated on the surface, substitutional Pt-Sn alloys were observed. Increasing the In content in the frst type of catalysts leads to an increase in the Sn concentration in PtxSn alloys, whereas a gradual replacement of Sn by indium in susbstitutinal alloys is observed in the second type of catalysts. These results allowed preparing catalysts with high Pt3Sn alloy contents using the effect of indium in catalysts prepared by Sn organometallic controlled surface reactions (CSR). From a catalytic point of view, n-heptane reforming tests show that trimetallic PtSnIn-based catalysts are less selective to hydrogenolysis and hydrocracking reactions, and highly selective to isomerisation, compared to the bimetallic PtSn-based catalyst
Woodmansee, Michael W. « Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder ». Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/17259.
Texte intégralPerry, Laura Katherine. « Anisotropic contributions to the transferred hyperfine field in magnetic Sn compounds ». Thesis, McGill University, 2006. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=98767.
Texte intégralIn this study, we show how both the temperature-induced SR and field-induced SF allow for the anisotropic field to be isolated from the isotropic contribution. The consistency between the two measurements of the anisotropic field indicates that the magnitude of the anisotropic contribution is independent of the driving force of the reorientation. We show that a complete 90° spin reorientation occurs in the ErMn6Sn5.89Ga0.11 and TbMn 6Sn6-xGax compounds (0.2 ≤ x ≤ 0.8), as well as in TbMn 6Sn5.46In0.54 at room temperature for an applied field of 0.57(3) T. The site preference for Ga substitution is investigated and compared with former results. Finally, the anisotropic contribution at one of the Sn sites is shown to exceed 40% in all of the compounds investigated, and this site assignment is confirmed.
Tätte, Tanel. « High viscosity sn(OBu)₄ oligomeric concentrates and their applications in technology / ». Online version, 2006. http://dspace.utlib.ee/dspace/bitstream/10062/812/5/tattetanel.pdf.
Texte intégralCornejo, Orlando A. « Aging effects on microstructure and creep in Sn-3.8Ag-0.7Cu solder ». Thesis, Monterey, Calif. : Naval Postgraduate School, 2007. http://bosun.nps.edu/uhtbin/hyperion-image.exe/07Sep%5FCornejo.pdf.
Texte intégralThesis Advisor(s): Dutta, Indranath. "September 2007." Description based on title screen as viewed on October 22, 2007. Includes bibliographical references (p. 75-78). Also available in print.
Plummer, C. J. G. « The critical current density and inhomogeneity in Nb3̲Sn superconducting composites ». Thesis, University of Cambridge, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.383875.
Texte intégralRen, Zhensong. « Combined neutron, transport and material based investigation in Ca₃Ir₄Sn₁₃ ». Thesis, Boston College, 2015. http://hdl.handle.net/2345/bc-ir:104538.
Texte intégralThis dissertation investigates the cubic type II superconductor, Ca₃Ir₄Sn₁₃, discovered by Remeika and the coauthors more than 30 years ago. It was originally discovered be to a superconductor and later suggested to host ferromagnetic spin fluctuations, which lead to a peak-like anomaly in thermodynamic and transport measurements. Later detailed x-ray single crystal structural refinement associated the peak-like anomaly in transport and magnetization measurements with a charge density wave phase transition at the same temperature. The potential charge density wave phase transition T* can be suppressed either by pressure or chemical potential through substitution on the Ca and Ir site such that a temperature-pressure/composition phase diagram can be constructed. Upon investigating magnetism in this compound, polarized neutron scattering and μSR data from our group and other researchers did not reveal any magnetic order or magnetic spin fluctuations at the time scale of μSR . However, through the partial substitution of Ir by Rh, we realized a structural quantum critical point at ambient pressure with 30% of Ir substituted by Rh--providing the research community a valuable material's platform for studying the interplay between 3D charge density wave order and superconductivity. On the other hand, our surprising discovery of the weak HHL (L=odd) type of super-lattice peaks from neutron scattering led us to a tentative model of a distorted Ca sublattice in this material. The similarity of the lattice instabilites of the Remeika compound and A15 superconductors are discussed, which may give us more insight into its role in the formation of the superconducting phase
Thesis (PhD) — Boston College, 2015
Submitted to: Boston College. Graduate School of Arts and Sciences
Discipline: Physics
David, Nicolas. « Modélisation thermodynamique du système (Al, Cu, Fe, In, Pb, Sn, Zn) ». Nancy 1, 2001. http://www.theses.fr/2001NAN10120.
Texte intégralPark, Joochun (Jason). « Decay spectroscopy of N ~ Z nuclei in the vicinity of ¹⁰⁰Sn ». Thesis, University of British Columbia, 2017. http://hdl.handle.net/2429/61074.
Texte intégralScience, Faculty of
Physics and Astronomy, Department of
Graduate
Mosimann, Roger. « Photorefractive effects in Sn₂P₂S₆ at near bandgap and telecommunication wavelengths / ». Zürich : ETH, 2008. http://e-collection.ethbib.ethz.ch/show?type=diss&nr=18140.
Texte intégralNiklas, Mårtensson. « Evaluation of charge carrier concentration in particle assisted, Sn doped GaAs nanowires ». Thesis, Linköpings universitet, Halvledarmaterial, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-105934.
Texte intégralBORGES, RENATO MARÇULLO. « DETERMINATION OF SN IN HUMAN MILK BY GRAPHITE FURNACE ATOMIC ABSORPTION SPECTROMETRY ». PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2008. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=14735@1.
Texte intégralO estanho é um metal de ocorrência natural que é extraído do minério de cassiterita na forma de SnO2. É lançado na natureza através de fontes naturais e antrópicas e ocorre na natureza tanto na forma inorgânica, quanto orgânica. Quanto menor a cadeia orgânica associada ao metal, maior a toxicidade do composto. Compostos orgânicos podem penetrar na membrana celular e interromper a fosforilação oxidativa e danificar as mitocôndrias. Podem ser ainda genotóxicos e imunotóxicos. O leite humano é a principal fonte de alimentação e nutrição para recém-nascidos, e é encorajada até os 2 anos de idade. Entretanto, é também a principal fonte de exposição de substâncias exógenas para bebês, incluindo o estanho e seus compostos, já que pode ser a rota de excreção de poluentes ambientais oriundos da mãe. A determinação direta do leite por EAA-FG é interessante do ponto de vista analítico pois reduz o tempo de preparação e a possibilidade de contaminação da amostra. Neste trabalho, foi utilizado um forno de grafite com aquecimento transversal. Curvas de pirólise e atomização levaram a temperaturas de pirólise e atomização de 1300 e 2200ºC, respectivamente, usando um volume de amostra de 20 µL. Os melhores resultados foram obtidos com a diluição 1+1 em HNO(3) 0,2% v/v e com a massa de 10+5 μg de paládio+magnésio, para um volume de 10 μL. Em todos os casos, a atenuação de fundo foi adequada para o corretor baseado no efeito Zeeman. A curva analítica foi linear até 300 µg.L-1, tanto no meio aquoso quanto na presença da matriz, entretanto a calibração teve que ser realizada com a adição de soluções de calibração à matriz. O limite de detecção (n=10, k=3) foi de 0,6 μg Sn.L(-1) na amostra original. Foi verificado que a presença de Cl(-1) e Ca(+2) em concentrações acima de 100 e 40 mg.L(-1), respectivamente, depreciam fortemente o sinal de estanho. Por outro lado, o aumento do sinal de estanho ocorre devido a presença de P em concentrações que variam entre 5 e 150 mg.L(-1). Recuperações maiores que 95% de iSn no leite humano foram obtidas como parte do estudo de calibração. A metodologia desenvolvida provou ser adequada para a determinação de Sn, quando na forma de MMT, através da calibração de iSn como analito de calibração.
Tin is a metal of natural occurrence which is mainly extracted from the mineral cassiterite, SnO2. Tin may be released to the atmosphere from both natural and anthropogenic sources. In nature, it occurs in both inorganic and organic forms, and the shorter the organic chain associated to the metal, the higher the toxicity of the compound. Organotin compounds can penetrate cell membranes and cause damage to cell, interrupt oxidative phosphorylation and damage mitochondria. They can be immunotoxic and genotoxic. Human milk is the ideal food for newborns due to its composition and availability. Human milk is the fundamental food for infants, thus breast feeding is greatly encouraged up to 2 years. However, it is also the major source of exposition to exogenous substances for newborns, including tin and its compounds, since breast milk can also be a route of maternal excretion of undesired environmental pollutants. The direct GF AAS analysis of products such as milk is very attractive, due to the inherent simplicity, and decrease in the sample preparation time and contamination chances. In the present work, a transversally heated graphite atomizer was used. Pyrolysis and atomization temperatures curves led to pyrolysis and atomization temperatures of 1300 and 2200ºC, respectively, using a sample volume of 20 µL. The use of a 1+1 dilution factor using 0.2% v/v HNO(3) as diluent showed to be the best choice, as well as a modifier mass of 10+5 µg of palladium+magnesium, respectively. The modifier solution volume was 10µL. In all cases, the background attenuation was well within the limits of the Zeeman effect based background corrector. The analytical curve was linear up to 300 µg L(-1), in both aqueous medium as well as in the presence of the matrix. Calibration had to be performed with matrix matched calibration solutions, using a blank level sample. The limit of detection (n=10, k=3) in the original sample was 0.6 µg L(-1). It was verified that Cl(-1) and Ca(2) + influence on tin absorbance signal is markedly depreciated at concentrations above 100 and 40 mgL(-1), respectively. On the other hand, the increase of tin signal is caused by the presence of P in concentrations between 5 and 150 mg.L(-1). In a calibration study, recovery was higher than 95% in human milk. The methodology was able in determine Sn, as MMT, when iSn is used for the calibration.
Sahu, Sucharita. « Thermal state of Sn-Pb droplets in the droplet-based manufacturing process ». Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/34081.
Texte intégralKao, Ching-ya, et 高靖雅. « Interfacial reactions in Sn/V、Sn-Ag/V、Sn/(Ni,V) and Sn-Ag/ (Ni,V) systems ». Thesis, 2004. http://ndltd.ncl.edu.tw/handle/623wm5.
Texte intégralYeh, Chien-Hsuan, et 葉建弦. « Grain Boundary Wetting Phase Transition in Sn-Rich Region of Sn-In and Sn-Bi Phase Diagram ». Thesis, 2010. http://ndltd.ncl.edu.tw/handle/06608780868312084617.
Texte intégral國立中興大學
材料科學與工程學系所
98
When alloy and ceramic materials are applied in high-temperature environment, the grain structure of materials appears the liquid phase and the solid/liquid phase boundary. The appearance of the grain boundary and solid/liquid phase boundary in alloys or ceramics will affect their properties drastically, such as brittleness, plasticity, sintering rate and electrical performance, etc. Therefore, the wetting phase transition of grain boundaries in polycrystalline materials is an important phenomenon in (liquid+ solid) two phase region of bulk phase diagram. Sn–In and Sn–Bi alloys were melted and annealed at different temperatures in the solid–liquid two phase region of alloy phase diagrams in order to study the behavior of grain boundary wetting transition. The results of Sn-In alloy reveal the liquid phase first appeared at the triple junction and then penetrated into partial grain boundaries and continued until the solid grains could be separated from each other by the liquid phase at boundaries. The fraction of completely wetted GBs depended on the temperature of heat treatment. The average compositions in grains of Sn70In30, Sn75In25, Sn80In20, and Sn85In15 specimens correspond to the solidus concentrations, and the solidus line and (b–In3Sn+ g–InSn4)/g–InSn4 phase boundary can be determined as a fit to these temperature composition points. The electric conductivity of Sn75In25 alloy increased because the connected eutectic lamellar g–InSn4 phase structure formed and the Sn content increased. Besides, the electrical conductivity of Sn-rich In alloys annealed at 125°C reduced because the granular g-InSn4 phase structure existed in the matrix of b-In3Sn phase and the amount of solid g-InSn4 grains decreased after quenching. Three Sn–Bi alloys with 20, 14.5 and 6 at.% Bi were annealed between 139 and 215°C for 24 h. The micrographs of Sn–Bi alloys reveal that the small amount of liquid phase prevented the grain boundary wetting transition to occur during the heat treatment close to the solidus line. With the temperature increasing, the liquid layers among solid grains promoted the diffusion of Bi atoms and the fraction of completely wetted boundaries increased drastically. When the amount of liquid phase exceeded 34 wt.% during heat treatment, increasing temperature has not affected the wetting behavior of grain boundaries noticeably and led only to the increase of the amount of liquid phase among solid grains in the microstructure. The XRD results show that the phase structure and crystallinity remained unchanged after quenching from various the temperatures of heat treatment. The microstructure evolution of annealed Sn85.5Bi14.5 alloy affected the electric conductivity.
Hsiao, Wen-Chu, et 蕭文助. « On the Electrochemical Polishing of In, Sn, In-Sn Alloy and Their Oxides ». Thesis, 2002. http://ndltd.ncl.edu.tw/handle/80590625674142810542.
Texte intégral國立中央大學
機械工程研究所
90
In this thesis, electrochemical polishing of In, Sn and 90.5In-9.5Sn alloy was explored. Anodic potentiodynamic polarization was used to screen the adequate conditions for various polishing systems. Anodic potentiostatic method was applied to confirm the electropolishing results. The concept of electrochemical polishing on metals and alloys was applied to metal oxide systems, such as ITO (indium-tin oxide) system to estimate the feasibility of electrochemical polishing. Results from electropolishing of metallic indium showed that, the solution containing component G2 and S2 is a suitable electrolyte. The component G is for adjusting the viscosity of electrolyte and the component S acts either as a passive reagent or a contaminant reagent. Passive reagent provides a passive film but contaminate reagent breaks-down the oxide film. The compromise of passivation and oxide-broken down gives rise to electropoishing thereby leading to a smooth and bright surface. The application of electropolishing to indium tin oxide (ITO) film in the solution containing a series of GS1010 is successfully. The maximum roughness for the ITO film prior to electropolishing is 16 nm, but diminished to 9 nm after electropolishing.
Yen, Yee-wen, et 顏怡文. « Phase Equilibria of the ternary Ag-Sn-Cu and Ag-Sn-Au systems, and interfacial reactions in Ag-Sn/Cu and Ag-Sn/Au couples ». Thesis, 2002. http://ndltd.ncl.edu.tw/handle/08127430255592728429.
Texte intégral國立清華大學
化學工程學系
91
Sn-Ag alloys are the most promising lead-free solders. Cu and Au are popular substrate materials. Experimental and CALPHAD methods have been carried out to investigate the phase equilibria of the Ag-Sn-Cu ternary system. Various Ag-Sn-Cu alloys were prepared to determine the isothermal sections of the Ag-Sn-Cu ternary system at 240 and 450℃. The results indicate that the e1 phase is a very stable phase in the Ag-Sn-Cu ternary system. Based on literature data, phase diagrams of three binary systems, Ag-Cu, Ag-Sn, Cu-Sn, Au-Sn, and Ag-Au, have been calculated by using CALPHAD methods. According to these binary thermodynamic models, the ternary thermodynamic models of the Ag-Sn-Cu and Ag-Au-Sn systems have been established. Owing to these ternary thermodynamic model, isothermal sections of the Ag-Sn-Cu system and stability diagrams about Cu and Sn elements at 240 and 450℃, and the Ag-Au-Sn system at 200 and 150 ℃ can been calculated. The stability diagrams of Au and Sn elements at 200 ℃ also can be calculated. The calculated results are reasonable and accepted when compared to experimental results. The e1 phase has the lowest value of Gibbs formation energy; this can explain why e1 phase is a very stable phase in the Ag-Sn-Cu ternary system. Several Ag-Sn alloys reacting with Cu or Au substrates have been examined by using reaction couples. The thickness of the reaction layers increased with higher temperature and longer reaction time. Their growth rates in all the couples followed the parabolic law. Based on the interfacial morphology in the reaction couples, the phase formation relationship and the concept of Kirkendall effect, it is concluded the Sn is the fastest diffusion species in these couples.
Yang, Wen-Chung, et 楊文忠. « High-temperature Mechanical Behavior of Eutectic Sn-In and Sn-In-Ag Lead-free solders ». Thesis, 2001. http://ndltd.ncl.edu.tw/handle/80511588874574344800.
Texte intégral中華大學
機械與航太工程研究所
89
Soldering is widely used for electronic packaging, wherein the traditional Pb-Sn solders have been most commonly used. However, since Pb toxicity will induce environmental and health issues in the Pb-containing solders. The development of lead-free solders should be of vital importance for the electronic industry in the future. In this study, the mechanical properties of eutectic lead-free solders (Sn-52In and Sn-20In-2.8Ag)were investigated. Tensile tests were carried out on a mechanical testing machine at strain rates of 10-3 s-1 and 10-4 s-1 at various temperatures. The ultimate tensile strength and elongation of Sn-52In alloy were 7.6MPa and above 600% at a strain rate of 10-3 s-1 at room temperature, respectively. On the other hand, the mechanical properties of Sn-20In-2.8Ag alloy were strong function of test strain rates and temperatures. The flow stress level of this alloy at high strain rates (or low temperatures) was higher than that at low strain rates (or high temperatures). It was also found that the intergranular creep was the dominant fracture mode in the Sn-20In-2.8Ag alloy.
Chang, Shih-Chang, et 張世璋. « Interfacial Reactions of Sn-Zn, Sn-Zn-Al, and Sn-Zn-Bi Solder Balls with Au/Ni Pad in BGA Package ». Thesis, 2005. http://ndltd.ncl.edu.tw/handle/52115737848689416418.
Texte intégral國立中山大學
材料科學研究所
93
The interfacial reactions of Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish under aging at 150℃ were investigated. With microstructure evolution, quantitative analysis, elemental distribution by X-ray color mapping from an electron probe microanalyzer (EPMA), the reaction procedure of phase transformation was proposed. During the reflow, Au dissolved into the solder balls and reacted with Zn to form γ-Au3Zn7. As aging time increased, γ-Au3Zn7 transformed to γ3-AuZn4. Finally, Zn precipitated near the Au-Zn intermetallic compound. On the other hand, Zn reacted with the Ni layer and formed Ni5Zn21. But the Al-Au-Zn IMC formed at the interface of Sn-Zn-Al solder balls, the reaction of Ni with Zn was inhibited. Even though the aging time increased to 50 days, no Ni5Zn21 was observed. The Joule effect was more apparent than the electromigration in the biased solder balls. First of all, the new phase (Au, Ni)Zn4 was proposed in the biased condition and in 175℃aging. Secondly, the thickness of the Ni5Zn21 IMC were the same between the anode and the cathode. Finally, We directly measure the temperature of the biased solder balls which was up to 173℃.
Huang, Yukon C. Y., et 黃清育. « Phase equilibria of the ternary In-Sn-Ni system and interfacial reactions in the In-Sn/Ni couples ». Thesis, 2001. http://ndltd.ncl.edu.tw/handle/58224959926702841671.
Texte intégralChang, Chia-Ming, et 張家銘. « The Study of Pb/Sn and Au/Sn Solder Joints in a Laser Module Package ». Thesis, 2002. http://ndltd.ncl.edu.tw/handle/41565979917048339126.
Texte intégral國立中山大學
光電工程研究所
90
Abstract The influence of thermal aging on joint strength and fracture surface of PbSn and AuSn solders in laser module packages has been studied experimentally and numerically. Al2O3-Solder-Substrate assembled samples were aged at 150oC for one, four, nine, sixteen, twenty-five, thirty-six, and forty-nine days. It was found that the joint strength decreased as the aging time increased. This joint strength decrease is due to the increase of void and crack formations in solder joints. There is a correlation between the intermetallic compound (IMC) growth and the joint strength for PbSn and AuSn solders under aging test. The fracture surface of PbSn specimen is gradually changed from the ductile dominated morphology of as-soldered status to the brittle dominated morphology. The section view indicates Kirkendall voids appeared around the interface of bulk solder and IMC layers after 49 days of aging. However, AuSn specimen still shows a ductile dominated morphology and no Kirkendall voids observed even after 49 days of aging. Through 49 days of aging, the shear force drops of 2μm Au-coated PbSn and AuSn specimens are 9.48kg and 7.65kg, respectively; the shear force drops of 10μm Au-coated PbSn and AuSn specimens are 9.42kg and 5.88kg,respectively. A finite-element method (FEM) analysis was performed on the calculation of joint strength variation of PbSn and AuSn solders in thermal aging tests. Simulation results were in good agreement with the experimental measurements that the solder joint strength decreased as the aging time increased. Another study is based on the well-known result of thermal induced fiber alignment shifts of fiber-solder-ferrule (FSF) joints in laser diode package. It indicates fiber alignment shift under temperature cycling tests can be reduced significantly if the fiber can be located closer to the center of the ferrule. An approach to make an FSF with the minimum eccentric offset is studied, an in-house design machine set is used for this purpose, which includes a hot plate, a fiber fix stage, an image capture camera, and a PC with offset analysis program. A preliminary target is set to achieve a maximum 20μm offset FSF. It was believed that a less than 0.5μm fiber shift could be measured after 500 temperature cycles. After the practical experiment trial, FSF with around 10 and 12μm offset is available. However, the continuous improvement is necessary for process stability.
Li, Chia-Ying, et 李佳蔭. « Phase equilibria in the Sn-rich corner of the Sn-Cu-Ni ternary alloy system ». Thesis, 2004. http://ndltd.ncl.edu.tw/handle/49157458433148202389.
Texte intégral國立清華大學
材料科學工程學系
92
The interfacial reactions between solders and under bump metallization (UBM) are of highly interests recently in flip chip technology. Intermetallic compounds (IMCs), i.e. (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, formed between solders and UBM. To fully understand the interfacial reactions and phase transformation phenomenon, a suitable phase diagram concerning solder, IMCs and UBM material is required. As a result, Sn-riched phase in Sn-Cu-Ni ternary phase diagram is very critical in determining the concentration tendency of x and y values in (Ni1-x,Cux)3Sn4 and (Cu1-y,Niy)6Sn5 compounds. In this study, ternary Sn-Cu-Ni alloys were prepared and annealed at 240℃. Three equilibrium phases, Sn, Ni3Sn4 and Cu6Sn5, were identified by XRD analysis, and also evidenced in BEI micrograph. Using EPMA quantitave analysis, three acme compositions of the ternary region in the Sn-Cu-Ni isotherm near the Sn-riched corner were determined as 98.5 at.%Sn, (Ni0.80, Cu0.20)3Sn4 and (Cu0.59,Ni0.41)6Sn5. Furthermore, the degree of composition homogeneity and the distribution of the forming phases were evaluated by X-ray color mapping and phase analysis technique. By way of software program to convert the concentration measured with EPMA, the exact compositions could be mapped on the Sn-Cu-Ni ternary isotherm. In addition, the solubility of the Cu and Ni in (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 compounds was evaluated. Finally, the isothermal section of the ternary Sn-Cu-Ni system at 240℃ was proposed on the basis of experimental results in this study. Furthermore, the related phase transformation was also discussed with respect to the formation of the IMCs around 240℃.
Jao, Chien-Chung, et 饒建中. « Investigations of Lead free Solders of Sn-Cu and Sn-Zn series in Microelectronic Packaging ». Thesis, 2006. http://ndltd.ncl.edu.tw/handle/60694914777488678198.
Texte intégral國立臺灣科技大學
化學工程系
95
The isothermal section of the Sn-Cu-Au ternary and the isoplethal section of the Sn-Ag-Cu-Au quaternary system at 200℃were experimentally established. In the Sn-Cu-Au ternary system, there existed two continuous solid solution phases. One was the Au5xCu6(1-x)Sn5 phase that had a complete solid solubility between AuSn and Cu6Sn5 phases and was marked as χ phase, and the other was the (Au,Cu) phase. Three ternary IMCs A, B, and C were found at 200℃. Cu atoms could dissolve in the ζ phase in considerable quantities. In the Sn-Ag-Cu-Au quaternary system, no quaternary compound was found. In addition, the isothermal section of the Sn-Zn-Ag ternary system at 260℃was experimentally established. The solubility of Sn in Zn or in AgZn3 phases were small. On the other hand, the maximum solubility of Zn in the α-Ag phase was approximately 45 at.% and that of Zn in the Ag4Sn phase was 32 at.%. Three interfacial reaction were investigated in this study. The effect of Cu, Au, and Ag additions on the interfacial reaction between Sn-3ag-0.5Cu Solder and Cu substrate were studied at 240℃. When Cu was added to the Sn-Ag-Cu alloy, two kind of intermetallic compounds (IMCs), Cu6Sn5 and Cu3Sn phases were formed. If Au was added to the Sn-Ag-Cu alloy, the same Cu-Sn IMCs, Cu6Sn5 and Cu3Sn, were formed. However, the thickness of IMC between Sn-Ag-Cu + Au / Cu was thinner than that of IMC between Sn-Ag-Cu / Cu. The addition of Au into Sn-Ag-Cu alloy caused the growth rate of IMC to decrease. If Ni was added to the Sn-Ag-Cu alloy, the morphology changed and took the shape of micro-islands on the interface. Three Ag-Zn intermetallic compounds (IMCs), ε-AgZn3, γ-Ag5Zn8, and ζ-AgZn, were formed on the Sn-9Zn/Ag interface at 260℃. While Zn content was decreased in Sn-Zn alloy, microstructures of IMCs changed. If the Zn content was less than 2 wt % in the Sn-Zn alloy, Ag-Sn IMCs were formed on the Ag surface and massive spalling of Ag-Zn IMC layers from the Ag surface. Furthermore, the Effect of Cu added eutectic Sn-9Zn solder reacting with the Ag substrate has been investigated. While Cu was gradually added to the Sn-9Zn alloy, the IMC microstructures became loose and Sn and Cu atoms in the Ag-Zn IMCs increased. If more than 3 wt % of Cu was added to the Sn-9Zn alloy, Ag-Sn IMCs were formed on the Ag surface and massive spalling of Ag-Zn IMC layers from the Ag surface occurred in a short reaction time.
Chang, Pao-Chang, et 張寶昌. « Interfacial Reactions in Cu/Sn-Co/Ni and Sn-(Fe)-(Mn)/Cu-(Fe)-(Co) Couples ». Thesis, 2016. http://ndltd.ncl.edu.tw/handle/99059994572451674166.
Texte intégral中原大學
化學工程研究所
104
Abstract The purpose of this thesis was to investigate the phase equilibria of the Sn-Cu-Fe ternary system at 250oC near the Sn rich corner and interfacial reactions in Sn/Cu-Fe, Sn-(Fe)-(Mn)/Co and Cu/Sn-0.04wt%Co/Ni couples. Experimental results indicate that the reaction phase in Sn/Cu-xwt%Fe (x=1, 3, 5) couples reacted at 250oC is the Cu6Sn5 phase. The growth rate of the Cu6Sn5 phase is decreased with greater Fe additions. According to the Sn-Cu-Fe ternary phase equilibria experimental results at 250oC, it is a liquid (Sn)-FeSn2-Cu6Sn5 three phase region near the Sn rich corner. The maximum Cu solubility in the FeSn2 phase is 1.6at%, and the maximum Fe solubility in the Cu6Sn5 phase is 7.3at%. The reaction phase in the Sn-0.05wt%Fe/Co and Sn-0.05wt%Mn/Co couples reacted at 250oC is the CoSn3 phase, and their thicknesses of the CoSn3 phase are smaller than that of Sn/Co. Minor Fe and Mn additions in the pure Sn solder can inhibit the reaction rate between the pure Sn solder and the Co substrate. In the Cu/Sn-0.04wt%Co/Ni couple reacted at 180oC, the reaction phases at the Cu side are the Cu3Sn phase and Cu6Sn5phase, and that at the Ni side is the Ni3Sn4 phase. In comparison with Cu/Sn/Ni couples, add 0.04wt%Co in the pure Sn solder can block Cu from the Cu side to the Ni side. Keywords:Sn-Cu-Fe, Sn/Cu-Fe, Sn-(Fe)-(Mn)/Co
Chen, Tung-kai, et 陳東楷. « Liquidus projection of Sn-Ag-Co-Ni quaternary system at the Sn-rich corner and interfacial reactions in the Sn-Ag/Co couples ». Thesis, 2013. http://ndltd.ncl.edu.tw/handle/14323916497931965815.
Texte intégral國立清華大學
化學工程學系
101
Soldering is one of the most important joining technologies in electronic products. During the soldering processes, the molten solders wet the substrates first, and then solidify with lowering temperatures. The phases formed at the joints are critical to the properties of the solder joints. Sn-Ag solders are widely used commercial solders. It has been found that a small amount of cobalt addition can effectively reduce undercooling and improve its mechanical properties. Nickel is the most commonly used diffusion barrier, and (Co,Ni) has also been investigated as possible diffusion barrier material. In the soldering process with Sn-Ag-Co alloys and (Co,Ni) barrier layer, in addition to the formation of intermetallic compounds by interfacial reactions, substrate dissolution occurs, and a Sn-Ag-Co-Ni melt is formed. Understanding of the Sn-Ag-(Co)/(Co,Ni) interfacial reactions and the solidification behaviours of Sn-Ag-Co-Ni melts are important. Liquidus projection is an essential tool for the understanding of solidification behaviours. This study thus investigates the Sn-Ag/Co interfacial reactions and the liquidus projection of Sn-Ag-Co-Ni ternary system at the Sn-rich corner. Since there is no information of the liquidus projection of the Sn-Co-Ni system which is an important constituent ternary system of the Sn-Ag-Co-Ni, this study also studies the liquidus projection of the Sn-Co-Ni system. The results indicate the primary solidification phases of the ternary Sn-Co-Ni system are all terminal solid solution phases and binary compounds which are Sn, CoSn3, CoSn2, CoSn , (Ni,Co)3Sn2, (Ni,Co), Ni3Sn4 and Ni3Sn, respectively. Co3Sn2 and Ni3Sn2 form a solid solution, and no ternary compound is found as the primary solidification phase. At the 90at.%Sn and 95at.%Sn of the Sn-Ag-Co-Ni quaternary system, there are four primary phase regions which are Ag3Sn, CoSn2, CoSn and Ni3Sn4.The Sn-Ag/Co couples reacted at 250oC reveal that the CoSn3 phase is the primary intermetallic compound formed at the interface. The reaction rate is lower with Ag addition. Two reaction layers, CoSn3 and Ag3Sn, are formed in the couples reacted at 200 and 150oC.
Sluzewski, David Allen. « Oxidation studies of lead-rich (Pb, Sn), (Pb, Sn, Bi), and (Pb, Sn, In) alloys using auger electron spectroscopy and scanning auger microscopy ». 1991. http://catalog.hathitrust.org/api/volumes/oclc/25683833.html.
Texte intégralTypescript. Vita. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 179-183).
Tsou, Meng-Yu, et 鄒孟妤. « Investigation of Sn Whisker Growth in the Matte Sn/Alloy 42 Substrate Coated Different Metallic Layers ». Thesis, 2010. http://ndltd.ncl.edu.tw/handle/75809384603961882306.
Texte intégral國立臺灣科技大學
工程技術研究所
98
In this study, the multi-layer structure effect on the Sn whisker growth in the matte Sn/Fe-42 wt% Ni (Alloy 42) systems was investigated. It was expected that the optimal processing parameters to prevent the whisker growth could be found. The Alloy 42 substrates were electroplated with 1.8 ?慆-thick of the Cu layer (CuE), electrolessplated with 0.3 ?慆-thick Cu layer (CuC), and electroplated with 1.8 ?慆-thick Ni layer, respectively. Thus, 4 kinds of multilayer specimens, CuE/Sn/Alloy 42, CuC/Sn/Alloy 42, Ni/Sn/Alloy 42, and Sn/Alloy 42 were prepared. Finally, thermal treatment at 60°C for 500 hours and thermal cycle tests were applied to each specimen. The thermal cycle is one hour from -35 to 85 oC. The results indicate that the Sn layer with the thicker thickness was observed under passing the higher current density. The surface morphology was different at different metallic layers and various current densities. When current density was 5.0ASD, increasing numbers of the thermal cycle produces more thermal stress to induce the Sn whisker formation. The order of the Sn whisker length and density in each specimen is : Sn/Alloy 42 > Sn/CuE/Alloy 42 > Sn/CuC/Alloy 42. The copper layer could eliminate the thermal stress which was generated due to coefficient of thermal expansion (CTE) mismatch between Sn layer and Alloy 42 during thermal cycling. However, no Sn whiskers were formed in the Ni/Sn/Alloy 42 system. Because tin atoms diffusion to nickel layer. The tension stress built up in the tin layer. This tension stress could mitigate thermal stress. At different current density, current density and Sn whisker length were proportional. But current density and the Sn whisker density were inversely proportional. No Sn whiskers were found in each specimen after 60 oC for 500 hours.
Gultom, Vina Agustina, et 古亦娜. « Enhanced superconductivity in Ni-doped Sn nanoparticles ». Thesis, 2019. http://ndltd.ncl.edu.tw/handle/ra5u82.
Texte intégral國立中央大學
物理學系
107
Herein, this study reports the superconductivity (SC) phenomena of Sn and Ni nanoparticles (NPs) composite systems. We analyzed the influence of the synthesis pressure of Sn-doped Ni in the formation of the tetragonal phase. Sn and Ni nanoparticles have been fabricated by the thermal evaporation method with two decoupled evaporation sources for separate evaporation; and the size of particles with various inert gas pressures was controlled. The heating current is ~50 A for Sn side and ~80 A for Ni side with the respective argon pressure of 0.18 torr and 0.08 torr. The characterization of crystal structure was performed using experimental techniques such as X-ray diffraction method, then allied with Rietveld refinement to determine the sample composition and crystallite size. The crystallite size of these samples were achieved 34.6(9) nm, 33.8(9) nm and 30.1(2), respectively for the sample 1, sample 2 and sample 3. The AC susceptibility of these samples was measured at 1.8 K and zero applied magnetic field, thus the superconducting state appeared. Each sample was tested using the Scalapino fitting. Scalapino fitting is a good description to determine the superconducting parameters by relating the magnetic susceptibility and temperature. In addition, when applied magnetic field Ha = 0 Oe, the penetration depth becomes larger as the particle size of the sample decreases and the electron gap δ become larger as well, 0.192(8) nm with δ = 0.00206(4) kBTC, 0.26(1) nm with δ = 0.01(7) kBTC, 1.1(2) nm with δ = 0.08(4) kBTC, respectively, indicating that the applied magnetic field will completely penetrate the nanoparticles, and causing the diamagnetic effect to be completely destroyed. Surprisingly, the critical temperature of 30.1(2) nm is achieve higher 108 times than that of the bulk (the accepted experimental value of the tin boundary temperature is 3.722K) kOe. This interesting sample has SnO2 structure and it made an enhancement on the critical temperature.
Ahmad et Zainollah. « Superconductivity and Spin Polarization in Sn Nanoparticles ». Thesis, 2019. http://ndltd.ncl.edu.tw/handle/mw5g4r.
Texte intégral國立中央大學
物理學系
107
Sn nanoparticles are fabricated by a thermal evaporated method with single source chamber. X-ray diffraction performed the characterization of the crystal structure is utilized to determine the mean particle diameter (sample 1 and sample 2 is 56 nm and 152 nm, respectively) of the Sn nanoparticle as grown. The composition of Sn is an analysis of the X-ray diffraction pattern using the General Structure Analysis System (GSAS) program. In our study, the superconducting diamagnetic screening effect was measured through AC magnetic susceptibility (χ_AC=χ^'+iχ''). The temperature dependence of magnetic susceptibility χ'(T) can be described by Scalapino’s expression, which allows extracting the superconducting transition temperature. The critical temperature of sample 1 and sample 2 is 3.8 K and 3.6 K, respectively. The spin polarization effects are seen in field dependence of the magnetic susceptibility χ'(H) curve, which can be described by derivative Langevin function, both of sample 1 and sample 2 revealing of superconductivity and spin polarization.