Articoli di riviste sul tema "CMP polishing"
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Lou, Chun Lan, Hai Yan Di, Qiang Fang, Tao Kong, Wei Feng Yao e Zhao Zhong Zhou. "Study on Groove Shape of CMP Polishing Pad: A Review". Advanced Materials Research 497 (aprile 2012): 278–83. http://dx.doi.org/10.4028/www.scientific.net/amr.497.278.
Liu, Zhi Xiang, Jian Guo Yao, Song Zhan Fan e Jian Xiu Su. "Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing". Applied Mechanics and Materials 602-605 (agosto 2014): 485–88. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.485.
Tso, Pei Lum, Shi Guo Liu e J. C. Wang. "The Development of an Ultrasonic Head for CMP Pad Conditioning". Advanced Materials Research 500 (aprile 2012): 275–80. http://dx.doi.org/10.4028/www.scientific.net/amr.500.275.
Son, Jungyu, e Hyunseop Lee. "Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction". Micromachines 11, n. 9 (8 settembre 2020): 843. http://dx.doi.org/10.3390/mi11090843.
Zhang, Hui, Zi Feng Ni e Qing Zhong Li. "A Fine Atomization CMP Slurry for Copper". Advanced Materials Research 279 (luglio 2011): 271–74. http://dx.doi.org/10.4028/www.scientific.net/amr.279.271.
Zhang, Sheng Fang, Jian Xiu Su, Jia Xi Du e Ren Ke Kang. "Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior". Materials Science Forum 704-705 (dicembre 2011): 313–17. http://dx.doi.org/10.4028/www.scientific.net/msf.704-705.313.
Sugimoto, Taku, Seiichi Suda e Koichi Kawahara. "Change in Slurry/Glass Interfacial Resistance by Chemical Mechanical Polishing". MRS Advances 2, n. 41 (2017): 2205–10. http://dx.doi.org/10.1557/adv.2017.335.
Fang, Treliant, Ping Chung Chen e Ming Hsun Lee. "A New Permanganate-Free Slurry for GaN-SiC CMP Applications". Materials Science Forum 1004 (luglio 2020): 199–205. http://dx.doi.org/10.4028/www.scientific.net/msf.1004.199.
Guo, Zhi Xue, Jing Zhai, Hui Zhang e Qing Zhong Li. "The Effect of Speed Matching on the CMP Uniformity". Advanced Materials Research 189-193 (febbraio 2011): 4154–57. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.4154.
Zhang, Zhu Qing, e Kang Lin Xing. "Study on 6H-SiC Crystal Substrate (0001) C Surface in FA-CMP Based on Diamond Particle". Applied Mechanics and Materials 727-728 (gennaio 2015): 244–47. http://dx.doi.org/10.4028/www.scientific.net/amm.727-728.244.
Su, J. X., Jia Xi Du, X. L. Liu, H. N. Liu e R. K. Kang. "Study on Lubricating Behavior in Chemical Mechanical Polishing". Key Engineering Materials 487 (luglio 2011): 243–47. http://dx.doi.org/10.4028/www.scientific.net/kem.487.243.
Tso, Pei Lum, e Yang Liang Pai. "Amorphous Diamond Dresser for CMP Fixed Abrasives Pad". Key Engineering Materials 329 (gennaio 2007): 157–62. http://dx.doi.org/10.4028/www.scientific.net/kem.329.157.
Ha, Taeho, Keiichi Kimura, Takashi Miyoshi e Yasuhiro Takaya. "Laser-Assisted CMP for Copper Wafer". Materials Science Forum 502 (dicembre 2005): 351–60. http://dx.doi.org/10.4028/www.scientific.net/msf.502.351.
Kim, Seong-In, Gi-Ppeum Jeong, Seung-Jae Lee, Jong-Chan Lee, Jun-Myeong Lee, Jin-Hyung Park, Jae-Young Bae e Jea-Gun Park. "Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO2-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization". Nanomaterials 11, n. 12 (4 dicembre 2021): 3296. http://dx.doi.org/10.3390/nano11123296.
Sharma, Mohit, e Chao-Chang A. Chen. "Analytical Modelling of Material Removal in Copper Chemical Mechanical Polishing Incorporating the Scratch Hardness of the Passivated Layer on Copper Thin Film Wafer". ECS Journal of Solid State Science and Technology 11, n. 4 (1 aprile 2022): 044007. http://dx.doi.org/10.1149/2162-8777/ac6624.
Wen, Yan Wu, Xin Chun Lu, Hui Zhang, Kai Zhou e Pei Qing Ye. "Identification Research on CMP Multi-Zones Pressure System". Advanced Materials Research 605-607 (dicembre 2012): 1074–79. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.1074.
Jia, Ying Qian, Xin Huan Niu, Li Li e Ning Li. "The Study of Stability of Tungsten Plug CMP Slurry for IC Multilevel Interconnect". Advanced Materials Research 834-836 (ottobre 2013): 658–61. http://dx.doi.org/10.4028/www.scientific.net/amr.834-836.658.
Yuan, Ze Wei, Zhu Ji Jin, B. X. Dong e Ren Ke Kang. "Polishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP". Advanced Materials Research 53-54 (luglio 2008): 111–18. http://dx.doi.org/10.4028/www.scientific.net/amr.53-54.111.
Su, Jian Xiu, Zhu Qing Zhang, Jian Guo Yao, Li Jie Ma e Qi Gao Feng. "Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive". Advanced Materials Research 797 (settembre 2013): 261–65. http://dx.doi.org/10.4028/www.scientific.net/amr.797.261.
Uneda, Michio, Keiichi Takano, Koji Koyama, Hideo Aida e Ken-ichi Ishikawa. "Investigation into Chemical Mechanical Polishing Mechanism of Hard-to-Process Materials Using a Commercially Available Single-Sided Polisher". International Journal of Automation Technology 9, n. 5 (5 settembre 2015): 573–79. http://dx.doi.org/10.20965/ijat.2015.p0573.
Sato, Ryunosuke, Yoshio Ichida, Yoshitaka Morimoto e Kenji Shimizu. "Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives". Key Engineering Materials 389-390 (settembre 2008): 515–20. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.515.
Li, Wei, Ming Ming Ma e Bin Hu. "A Study on Surface Quality of GaN with CMP Polishing Process". Advanced Materials Research 291-294 (luglio 2011): 1764–67. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.1764.
Su, Jian Xiu, Yan An Peng, Zhen Hui Liu, Zhan Kui Wang e Su Fang Fu. "Analysis on the Action of Oxidant in Chemical Mechanical Polishing of 304 Ultra-Thin Stainless Steel". Materials Science Forum 893 (marzo 2017): 234–39. http://dx.doi.org/10.4028/www.scientific.net/msf.893.234.
Doy, Toshiroh Karaki. "Polishing Technique and CMP (Chemical & Mechanical Polishing) in Semiconductor Process". Journal of the Society of Mechanical Engineers 103, n. 979 (2000): 372–74. http://dx.doi.org/10.1299/jsmemag.103.979_372.
Tso, Pei Lum, Zhe Hao Huang, Sheng Wei Chou e Cheng Yi Shih. "Study on the CMP Pad Life with its Mechanical Properties". Key Engineering Materials 389-390 (settembre 2008): 481–86. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.481.
Su, Jian Xiu, Xi Qu Chen, Jia Xi Du, Xiu Ying Wan e Xin Ning. "Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer". Advanced Materials Research 102-104 (marzo 2010): 658–62. http://dx.doi.org/10.4028/www.scientific.net/amr.102-104.658.
Grim, J. R., Marek Skowronski, W. J. Everson e V. D. Heydemann. "Selectivity and Residual Damage of Colloidal Silica Chemi-Mechanical Polishing of Silicon Carbide". Materials Science Forum 527-529 (ottobre 2006): 1095–98. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.1095.
Evans, David. "The Future of CMP". MRS Bulletin 27, n. 10 (ottobre 2002): 779–83. http://dx.doi.org/10.1557/mrs2002.250.
Liu, Xiao Peng, Xiao Chun Chen e Qing Zhong Li. "Principle and Experiment of Ultrasonic Subtle Atomization in CMP". Advanced Materials Research 279 (luglio 2011): 287–90. http://dx.doi.org/10.4028/www.scientific.net/amr.279.287.
Pipat, PHAISALPANUMAS, Keiichi KIMURA, Keisuke SUZUKI e KHAJORNRUNGRUANG Panart. "608 Study on Variable Rotation Polishing in CMP Process". Proceedings of Conference of Kyushu Branch 2012.65 (2012): 207–8. http://dx.doi.org/10.1299/jsmekyushu.2012.65.207.
Yang, Wei Ping, Yong Bo Wu e Hong Fei Yang. "Mechanism and Experimental Investigation on Silicon Wafer Hybrid Polishing by Ultrasonic-Elliptic-Vibration Chemical-Mechanical". Advanced Materials Research 314-316 (agosto 2011): 829–36. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.829.
Wang, Yong Guang, e Liang Chi Zhang. "A Review on the CMP of SiC and Sapphire Wafers". Advanced Materials Research 126-128 (agosto 2010): 429–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.429.
Wang, Sheng Li, Y. J. Yuan, Yu Ling Liu e X. H. Niu. "Study on Chemical Mechanical Polishing Technology of Copper". Key Engineering Materials 373-374 (marzo 2008): 820–23. http://dx.doi.org/10.4028/www.scientific.net/kem.373-374.820.
Zhang, Ke Hua, e Dong Hui Wen. "An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel". Advanced Materials Research 69-70 (maggio 2009): 98–102. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.98.
Wang, Zhan Kui, Ming Hua Pang, Jian Xiu Su e Jian Guo Yao. "Effect of Different Abrasives on Chemical Mechanical Polishing for Magnesia Alumina Spinel". Key Engineering Materials 866 (ottobre 2020): 115–24. http://dx.doi.org/10.4028/www.scientific.net/kem.866.115.
Wan, Lin Lin, Zhao Hui Deng, Sheng Chao Li e Piao Long. "Experimental Study of Material Removal Rate for Rotary Curved Surface Workpieces of Si3N4 in Chemical-Mechanical Polishing Using Taguchi Technique". Advanced Materials Research 497 (aprile 2012): 273–77. http://dx.doi.org/10.4028/www.scientific.net/amr.497.273.
Lv, Y. S., Nan Li, Jun Wang, Tian Zhang, Min Duan e Xue Ling Xing. "Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern". Advanced Materials Research 215 (marzo 2011): 217–22. http://dx.doi.org/10.4028/www.scientific.net/amr.215.217.
Wu, Yong Bo, e Li Jun Wang. "A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer". Advanced Materials Research 983 (giugno 2014): 208–13. http://dx.doi.org/10.4028/www.scientific.net/amr.983.208.
Peng, De-Xing. "Chemical mechanical polishing of steel substrate using aluminum nanoparticles abrasive slurry". Industrial Lubrication and Tribology 66, n. 1 (4 febbraio 2014): 124–30. http://dx.doi.org/10.1108/ilt-10-2011-0078.
Chen, Chao-Chang A., Jen-Chieh Li, Wei-Cheng Liao, Yong-Jie Ciou e Chun-Chen Chen. "Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System". Applied Sciences 11, n. 1 (27 dicembre 2020): 179. http://dx.doi.org/10.3390/app11010179.
Fu, Su Fang, Jian Guo Yao, Li Jie Ma e Jian Xiu Su. "Analysis of Chemical Action of Oxidants in Chemical Mechanical Polishing of SiC Crystal Substrate". Advanced Materials Research 1027 (ottobre 2014): 213–16. http://dx.doi.org/10.4028/www.scientific.net/amr.1027.213.
Li, Jun, Yong Zhu e Chuang Tian Chen. "Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics". Key Engineering Materials 375-376 (marzo 2008): 278–82. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.278.
Doi, Toshiro K., Tsutomu Yamazaki, Syuhei Kurokawa, Yoji Umezaki, Osamu Ohnishi, Yoichi Akagami, Yasuhide Yamaguchi e Sadahiro Kishii. "Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry". Advances in Science and Technology 64 (ottobre 2010): 65–70. http://dx.doi.org/10.4028/www.scientific.net/ast.64.65.
Cheng, Hai Feng, Li Jie Ma, Jian Guo Yao e Jian Xiu Su. "Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet". Advanced Materials Research 1027 (ottobre 2014): 58–62. http://dx.doi.org/10.4028/www.scientific.net/amr.1027.58.
ODA, Akiyoshi, Masato OHTA, Junji SHIBATA e Takayasu KIMURA. "A Basic Study on Chemical Mechanical Polishing (CMP)". Proceedings of The Manufacturing & Machine Tool Conference 2002.4 (2002): 213–14. http://dx.doi.org/10.1299/jsmemmt.2002.4.213.
Sun, Yu Li, Dun Wen Zuo, Yong Wei Zhu, Rong Fa Chen, D. S. Li e M. Wang. "Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders". Advanced Materials Research 24-25 (settembre 2007): 177–82. http://dx.doi.org/10.4028/www.scientific.net/amr.24-25.177.
Zhao, Y., Dun Wen Zuo e Yu Li Sun. "Status and Trends of Fixed Abrasive Polishing on Semiconductor". Key Engineering Materials 499 (gennaio 2012): 390–96. http://dx.doi.org/10.4028/www.scientific.net/kem.499.390.
Tang, Heng Xing, Chu Peng Zhang e Lin Lin. "Development of an Ultra-Precision Annular Polishing Machine Tool with Full Gas Static Pressure". Key Engineering Materials 837 (aprile 2020): 183–90. http://dx.doi.org/10.4028/www.scientific.net/kem.837.183.
Peng, De-Xing. "Optimization of chemical mechanical polishing parameters on surface roughness of steel substrate with aluminum nanoparticles via Taguchi approach". Industrial Lubrication and Tribology 66, n. 6 (2 settembre 2014): 685–90. http://dx.doi.org/10.1108/ilt-07-2012-0063.
Son, Jungyu, e Hyunseop Lee. "Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime". Applied Sciences 11, n. 8 (14 aprile 2021): 3521. http://dx.doi.org/10.3390/app11083521.