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Tesi sul tema "Electroless plating"

Autore: Grafiati

Pubblicato: 4 giugno 2021

Ultima modifica: 25 luglio 2025

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1

Garcia, Alexandre. "Ligand Induced Electroless Plating of Polymers." Palaiseau, Ecole polytechnique, 2011. https://pastel.hal.science/docs/00/64/69/62/PDF/ThA_seAGARCIA.pdf.

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Ce projet de recherche avait pour objectif de répondre à un enjeu industriel: Développer un procédé " propre " de métallisation des polymères sans satinage à l'acide chromique (CrVI). Au cours de ce travail, un procédé alternatif s'appuyant sur une technologie innovante de revêtement de surface (la technologie Graftfast®) a été développé. Ce procédé utilisable dans l'eau et à température ambiante permet de greffer chimiquement des polymères vinyliques sur une large gamme de surfaces de natures différentes. Par cette méthode, une couche d'acide polyacrylique (PAA) a été greffée de manière coval

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2

Sullivan, Anne M. "Autocatalytic electroless gold deposition at low pH." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10079.

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3

Krishnan, Vidya. "Electroless deposition of copper for microelectronic applications." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11752.

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4

Noren, Martin. "Electroless Copper Plating to Achieve Solderless Connections." Thesis, Luleå tekniska universitet, Institutionen för system- och rymdteknik, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-86533.

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As the world has woken up to the change in climate in recent years, people's environmental concerns are forcing companies to change and find ways to manufacture products without harming nature. One area of serious concern is the electronics industries where an ever-increasing number of products gets updated with sensors and microcomputers to be part of the internet of things. Wen more things are upgraded with electronics, it's important that the production process is as environmentally friendly as possible and that the techniques used introduces a minimum amount of disturbance to the circuits

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5

Shi, Zhongliang 1965. "Electroless deposited palladium membranes and nanowires." Thesis, McGill University, 2007. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=111872.

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Hydrogen is considered to be the fuel of the future as it is clean and abundant. Together with the rapidly developing fuel cell technology, it can sustain an environmentally sound and efficient energy supply system. Developing the technologies of palladium-based membrane for hydrogen separation and palladium nanostructured materials for hydrogen sensing and hydrogenation catalysts makes the "hydrogen economy" possible. This is because these technologies will allow for commercially viable production of comparatively cheap and high-quality hydrogen, and safety of its application. Based on the ma

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6

Shemesh, Ely 1962. "TERNARY COMPLEXES OF COPPER(I), CYANIDE, AND 2,9-DIMETHYL-1,10-PHENANTHROLINE." Thesis, The University of Arizona, 1986. http://hdl.handle.net/10150/291268.

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7

Owen, S. A. "Corrosion resistance of electroless nickel deposits from aged and synthetic solutions." Thesis, University of Nottingham, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.311914.

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8

Sutch, Peter John F. "Consumption and loss of formaldehyde in electroless copper plating." Master's thesis, University of Central Florida, 1993. http://digital.library.ucf.edu/cdm/ref/collection/RTD/id/21775.

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University of Central Florida College of Engineering Thesis<br>The objectives of this research were to quantify formaldehyde consumption due to plating and parasitic reactions and determine the magnitude and distribution of formaldehyde losses from the electroless copper plating process. Plating and rinse bath samples obtained from three electroless copper plating operations were analyzed for formaldehyde and copper in order to develop a mass balance analysis about the plating bath for periods of active production and no production. Fugitive air and stack releases of formaldehyde were estima

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9

Zeszut, Ronald Anthony Jr. "Effects of Transport and Additives on Electroless Copper Plating." Case Western Reserve University School of Graduate Studies / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=case1497271315649528.

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10

Hayden, Harley T. "Enhanced Adhesion Between Electroless Copper and Advanced Substrates." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22615.

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In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. In order to meet these requirements two approaches were taken: smoothing the surface of traditional epoxy dielectric materials while maintaining adhesion, and increasing ad

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11

Tian, Bo. "Modified electroless plating technique for preparation of palladium composite membranes." Thesis, Link to the online version, 2005. http://hdl.handle.net/10019/1243.

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12

Bird, Elliott J. "Investigation of Additives for Use in Electroless Plating Solutions for Fabrication of Nanowires." BYU ScholarsArchive, 2009. https://scholarsarchive.byu.edu/etd/2125.

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This study focused on improvement of electroless plating methods by use of particular bath additives. The techniques developed here can enable us to plate very thin layers selectively on a nonconductive substrate and thus create metallized features on a nanoscale. Through the development of such bottom-up techniques this work contributes a key technology to achieving self-assembled nanocircuits. The use of additives in an electroless plating environment can modify the barriers to nucleation (or seeding) and growth. Two additives, namely 3-mercapto-1-propanesulfonic Acid (MPS) and 1,3-propanedi

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13

Song, Li. "Application of electroless plating for fabrication of flexible and integrated piezoelectric ultrasonic sensors." Thesis, McGill University, 2008. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=21961.

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Integrated (IUTs) and flexible ultrasonic transducers (FUTs) have been found to be of great interest for structural health monitoring (SHM) of graphite/epoxy (Gr/Ep) composite parts and structures. Because certain Gr/Ep composites do not have sufficient electrical conductivity, bottom electrodes are required for the IUT fabrication. Also FUTs using insulating polyimide (PI) membrane which offers high flexibility, bottom electrode is required as well. One main objective is to develop the electroless plating technique to deposit nickel (Ni) or silver (Ag) onto Gr/Ep composites and PI for IUT or

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14

Lin, Ting-yu, and 林廷育. "Electrolysis recovery of nickel from spent electroless nickel plating solution." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/17399091443936885802.

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碩士<br>朝陽科技大學<br>環境工程與管理系碩士班<br>99<br>Nickel is a really rare and expensive metal, and it can cause cancer. Nickel''s price is getting higher recently and the production cost is increasing, and therefore it is really important to take care of spent electroless nickel plating solution. If the spent solution is treated improperly, it would not only cause heavy metal contamination, but also resource wasting. The focus of this study is on the adoption of electrolysis method to recover nickel from spent electroless nickel plating solution. Unlike traditional chemical precipitation method w

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15

Chen, Jenn Ray, and 陳振瑞. "Electroless Nickel Plating on Silicon." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/58524198318750932265.

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16

Chen, Shu Hui, and 陳淑惠. "Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders." Thesis, 1993. http://ndltd.ncl.edu.tw/handle/64913003417166320744.

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17

Chen, Hung-Sheng, and 陳宏生. "Study of Electroless Nickel Plating on Copper." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/94583332216719405604.

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18

Hsien, Wang Hsiao, and 王孝賢. "Research for electroless copper plating on POM." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/26099699012480466603.

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碩士<br>淡江大學<br>機械工程學系<br>87<br>This research aims to improve the platability and adhesive strength of electroless plating copper on POM by modifying the surface morphology using sulfuric acid or hydrogen chloride solution and various conditions. It is found: High concentration of etching solution has an increasing rate on weight loss per unit area of POM in etching process. It means that the reaction rate increases with etchant concentration, and the reaction rate as well as concentration adapt to the following equation: Ln (rate) = n  Ln (concentration) + cons

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19

She, Te-Chin, and 佘德勤. "Synthesis Ni-P Nanoarrays with Electroless Plating." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/44564053869031672898.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>97<br>Nanoarrays of nickel-phosphorous is developed by electroless plating into anodic aluminum oxide(AAO) template. Unlike traditional template electroless plating, which needs to sensitize and activate inside of the pores in anodic aluminum oxide template, we sensitized and activated the substrate then stock one side of anodic aluminum oxide template on the substrate and started electroless plating. Nckel is self-activated, so that there is no need to sensitize and activate inside the pores in anodic aluminum oxide template. Deposited nickel will be the new cat

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20

Chen, Yan-Bin, and 陳彥彬. "Development of Interconnects by Electroless Nickel Plating." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/26720310789069034050.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>104<br>As the progress of the electronic packaging, the critical dimension continues to reduce in size. At the scale of micro bump, solder joints would encounter some issues affecting its reliability. A low temperature process of interconnection technology of chips without using solder was researched in this paper. Because of selective plating and uniformity in thickness, electroless nickel plating was applied to pillar interconnection in flip chip bonding. Copper pillars were interconnected by electroless nickel plating at 74 ℃ and the plating time was decided b

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21

Huang, Kuan-Ning, and 黃冠寧. "Study of Electroless Cu Plating on Graphene." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/rm3fvg.

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碩士<br>國立虎尾科技大學<br>材料科學與綠色能源工程研究所<br>102<br>Graphene owns high specific surface area, large surface to volume ratio and high stability and is a suitable catalyst support. Electroless plating is a low cost and easy method to deposit nano-metals on substrate. In this study, Graphene（reduced graphene oxide, rGO）was fabricated by using Sodium borohydride to reduce Graphene oxide（GO）which was prepared from natural graphite by using modified Hummers method, and then went through electroless Copper plating to form nano-composite material. The effect of electroless Copper parameters on graphene were in

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22

Kutnahorsky, Marika Renée. "Electroless Copper Deposition: A Sustainable Approach." Thesis, 2009. http://hdl.handle.net/1807/30125.

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A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was th

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23

"A study on the chemical and physical properties of electroless nickel on carbon-steel." 2000. http://library.cuhk.edu.hk/record=b5890502.

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by Lam Ka.<br>Thesis (M.Phil.)--Chinese University of Hong Kong, 2000.<br>Includes bibliographical references (leaves 54-60).<br>Abstracts in English and Chinese.<br>ABSTRACT --- p.i<br>ACKNOWLEDGEMENT --- p.ii<br>TABLE OF CONTENT --- p.iii<br>LIST OF TABLES --- p.v<br>LIST OF FIGURES --- p.vii<br>Chapter CHAPTER ONE: --- INTRODUCTION --- p.1<br>Chapter 1.1 --- Metal deposition --- p.1<br>Chapter 1.2 --- Electroless Nickel Plating --- p.3<br>Chapter 1.2.1 --- Historical Review and Applications --- p.3<br>Chapter 1.2.2 --- General Chemical Principles --- p.5<br>Chapter 1.2.3 --- Previ

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24

Wu, Chih–Hsiang, and 吳致翔. "Reproduce the Moth-Eye Structure by Electroless Plating." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/16173160691654522728.

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碩士<br>國立雲林科技大學<br>材料科技研究所<br>103<br>This thesis replicated a nano mold with moth-eye structure. Firstly polydimethylsiloxane (PDMS) was used to replicate a negative mold. The catalytic seeds needed in electroless nickel plating were adsorbed on the negative mold by sensitization and activation of the mold, then nickel alloy positive nano mold was obtained through electroless nickel plating. The thickness of the nickel layer was increased by plating. Finally, the PDMS negative mold could be separated from the nickel positive mold successfully. The bath composition, time of deposition, temperatu

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25

Lin, Kuen-Hsing, and 林坤興. "A Study on Electroless Copper Plating for VLSI." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/53906994765703038252.

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26

Chen, Yen-Wen, and 陳彥文. "Electroless plating and its application to Bio-Chips." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/65578341825230021288.

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碩士<br>國立屏東科技大學<br>材料工程研究所<br>93<br>Traditional microchip are performed using optical detection, utilizing either absorbance or laser–induced-fluorescence. However, these optical detection methods have some drawbacks. During the past few years, contactless conductivity detection has been presented as a valuable extension to optical detection technology. The current study reports a simple and reliable method of micro fabrication technology, electroplating, and electroless technology to fabricate an integrated capacitive detection microfluidic bio-chip. This bio-chip have become a firmly accepted

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27

Liu, Chen-Lang, and 劉貞郎. "Preparation the Polymer microspheres of Electroless nickel plating." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/bbnbw3.

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碩士<br>中正理工學院<br>應用化學研究所<br>88<br>The polystyrene micro-spheres in the micron diameter range were made by polymerizations. The magnetic fine particles were prepared by electroless nickel-plating after sensitization and activation. The concentration of monomer and initiator, the amount of surfactant used, and polymerization temperature will affect the particle size and disparity of microspheres. The amount of nickel deposited on microspheres is strongly dependent on the pH value of plating bath and bath composition. The experimental results have shown that the magnetic fine particles can be made

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28

Wu, Tzu-Yu, and 吳梓渝. "Preparation of Core-Shell Nanocomposites by Electroless Plating." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/77673556551153454338.

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碩士<br>國立高雄大學<br>應用物理學系碩士班<br>99<br>The controlled organization of metal nanosized particles into ordered structures has the unique optical, electrical, magnetic, and catalytic properties, which were important for various fields. For the core-shell nanocomposites synthesis technology in current literatures, most of disadvantages are too loose on metal shell structure and are complicated synthetic steps, resulting in affecting its nature and application.In this study, we present an electroless method for the fabrication of core-shell silica-silver nanocomposite spheres. The technique for electro

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29

Chen, Chin-Te, and 陳金德. "Study of Electroless Nickel Plating with Auxiliary Electric-Field." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/18402639989106638246.

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碩士<br>逢甲大學<br>材料與製造工程所<br>93<br>Low-carbon steel substrate was deposited with Ni-P by electroless plating method assisted with pulse direct current of different duty cycles. Microstructures of Ni-P coatings were analyzed by ICP-AES, EPMA, XRD, SEM. The corrosion behaviors in 3.5%NaCl aqueous solution of Ni-P deposit were studied by electrochemical analysis and dipping test. Plating rate in acidic plating bath is faster at pH 4.8 than that at pH 4.4. The percentage of phosphorus in coating layer is lowered as plating rate is increased. Plating rate is increased as duty cycle of applied puls

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30

HWANG, CHIEN-YAO, and 黃建堯. "Analysis on surface properties of electroless plating copper catalyst." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/59986897635436891447.

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Wu, Shao-Ling, and 吳少鈴. "Metallization by Ink-Jet Printing Based on Electroless Plating." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/71978078241659594409.

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碩士<br>國立臺灣大學<br>化學工程學研究所<br>94<br>Ink-jet printing, as a derivative of direct-write technology, offers the additional advantages of low cost, high material efficiency, elimination of photolithography, low temperature deposition, friendly environment and non-contact processing. Therefore, it has great potentials for applications on electronics fabrication processes, especially on plane and flexible substrate in recent years. In this study, ink-jet printing is combined with electroless plating which has been fully developed and direct writes cooper and silver lines at low temperature. First, the

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32

Hu, Guo-Ren, and 胡國仁. "Electroless Plating Pd Induced Crystallization of Amorphous Thin Films." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/30616060323048690383.

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碩士<br>國立交通大學<br>材料科學與工程系<br>89<br>In this thesis, metal-induced crystallization (MIC) / metal-induced lateral crystallization (MILC) processes using metal seed layer by electroless Pd plating method was proposed. The Pd clusters formed by electroless plating method uniformly distributed on the surface of amorphous silicon (a-Si) films. Needle-liked polycrystalline silicon (poly-Si) films were obtained when the a-Si films with electroless plating Pd were annealed at 550 ℃ for 1 hr. For the pre-patterned a-Si films, Pd clusters were preferred to deposit on the sidewalls of the silico

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TSAI, YUAN-YUAN, and 蔡淵源. "Study of Electroless Nickel Plating Technology and Bath Management." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/04020426897527135254.

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碩士<br>南臺科技大學<br>高階主管企管碩士班<br>105<br>The advantage of electroless nickel plating had on corrosion resistance, uniformity, high hardness and good non-magnetic capability. It was widely used in Machinery, petroleum, chemicals, textiles, electronics, aerospace, military and many other fields. Two key points of plating rate and phosphorus content are major control conditions during the electroless plating process. The trend of the two characteristic was contradictory. The effects of complexing agent, pH values and temperature on plating rate and phosphorus content were investigated. The stronger

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Gafin, Anthony Harold. "Electrochemical studies with the quartz crystal microbalance." Thesis, 1994. https://hdl.handle.net/10539/24912.

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A thesis submitted to the Faculty of Science, University of the Witwatersrand, Johannesburg, in fulfilment of the requirements for the degree of Doctor of Philosophy.<br>A quartz microbalance electrode (QME) was constructed for the investigation of the electrochemistry of electroless plating baths. To this end, the electronic oscillator circuitry required for the microbalance was developed from literature examples, and the techniques of forming electrodes and mounting the crystal in an appropriate holder were established. The device thus developed was compact, allowing for in situ f

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鄭仲甫. "Nanoporous gyroid Platinum with High Catalytic Activity from Block Copolymer Template via Electroless Plating." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/87784829695143766968.

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碩士<br>國立清華大學<br>材料科學工程學系<br>102<br>Block copolymers (BCPs) that consist of chemically different components can self-assemble into various ordered nanostructures due to the incompatibility of constituted blocks. In recent decades, BCPs have been extensively investigated because of their ability to self-assemble into various ordered nanostructures, such as sphere, cylinder, lamellae, and gyroid. Among all of the nanostructures resulting from BCPs self-assembly, gyroid is one of the most appealing morphologies for practical applications because of its unique texture with a matrix and two continuo

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Yang, ShangRay, and 楊尚叡. "The Study of Electroless Nickel Plating on the Silicon Wafer." Thesis, 2001. http://ndltd.ncl.edu.tw/handle/09468540294882463931.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>89<br>This research is to investigate the direct electroless Ni-P plating on the n-type (100) silicon wafer. We also study the pretreatment process for the silicon substrate, and the relationship between the composition of the plating solution and the threshold plating temperature, the plating rate, and the phosphorous content and the crystallinity of the as-plated layer. For the pretreatment of the silicon wafer, the simple ethanol process is more convenient and better than the traditional roughening, sensitizing, and activation processes. When the o

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Chu, Rong-Shian, and 朱容賢. "Hermetically Copper-Coated Optical Fibers Prepared by Electroless Plating Method." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/20690002757965960535.

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碩士<br>逢甲大學<br>材料科學所<br>92<br>In this work, the hermetically copper-coated optical fibers were prepared by electroless plating method. The bath composition of electroless copper includes copper sulfate, formaldehyde, sodium hydroxide, ethylene diamine tetraacetic acid, potassium ferrocyanide and 2,2’-bipyridine. The experimental process includes: changing the concentration of formaldehyde and controlling the plating time. The surface appearance that film thickness and surface roughness of copper coatings were investigated using the optical microscope (OM), scanning electron microscope (SEM) and

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凃亭婷. "The effects of additive on polyimide for electroless copper plating." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/18366453952392427264.

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碩士<br>明新科技大學<br>化學工程研究所<br>97<br>In this research,conductive polyimide films were prepared by used the potassium hydroxide microetching,followed by electroless copper plating. The discussion polyvinyl alcohol(PVA) and potassium iodide two kinds of additives analyze to the electroless copper plating influence on the plating rate,surface morphology,crystal and resistivity of copper deposition. The surface of these films was treated with additives which exhibited low resistivity and excellent conductivity. These films were investigated by the X-ray, to analysis crystallization change,by using EPM

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Hsueh, Han-Yu, and 薛涵宇. "Synthesis with Electroless Plating and Characterization of Metal Inverse Opals." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/06888907550138465697.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>95<br>Construct dielectric materials with different refractive indexes to stack and to form two - dimensional or three - dimensional of periodic nanostructures. Such unique structures have characteristic photonic band gaps, and can control and manipulate the flow of light. We call the structures be photonic crystal. Consequently, photonic crystals are of great interest in applied research and lead to broad applications, like tunable optical filters, photonic crystal fiber, light emitting diode, sensor, etc. The research of photonic crystal is really an important

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Chan, Wei-hsiang, and 詹惟翔. "Surface Modification of Nanocrystalline Iron Oxide Powders by Electroless Plating." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/00051956883652213455.

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碩士<br>逢甲大學<br>材料科學所<br>94<br>In the present study, nanocrystalline iron oxide powders were prepared by an inert gas condensation technique under different oxygen partial pressure, i.e., 50, 100, and 150 mbar, respectively. Surface modification of nanocrystalline iron oxide powders and commercial available nanocrystalline iron powders was preformed by electroless nickel plating. The original and modified powders where characterized by X-ray diffraction, transmission electron microscopy, thermogravimetric analysis, and synchrotron X-ray absorption techniques. The experimental results showed that

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Sher, Kun-Lin, and 佘坤霖. "Applications of Imprint and Electroless Silver Plating on TFT Processes." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/02005771004558972582.

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碩士<br>國立中山大學<br>機械與機電工程學系研究所<br>93<br>This study presents thin film transistor (TFT) electrode structures in flat panel displays by imprint and electroless silver plating techniques. Imprint technique is not limited to the physical properties of optical lithography. In the imprinting process, the glass mold designed for imprinting process is fabricated by semiconductor manufacturing technology to imprint photoresist (AZ-650). The material is evaluated for imprint process. In addition, at present, electrode materials used in TFT process are aluminum (Al), chromium (Cr) and so on. In other resea

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Guo, I.-Ling, and 郭衣玲. "The Behavior of Electroless Copper Plating through Photosensitive Polymer Films." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/59981711837465942278.

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Chu, Chung-Ming, and 朱崇銘. "Application of pH-Sensitive Catalyst Ink on Electroless Copper Plating." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/73586523938153974567.

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碩士<br>國防大學理工學院<br>化學工程碩士班<br>102<br>In this study, a pH-responsive palladium catalyst for electroless copper deposition was prepared. The noble metal nanoparticles reduced and stabilized by styrene monomer and 2-(N,N-dimethylamino)-ethyl methacrylate(DMAEMA) monomer by free radical polymerization. Poly(St-co-DMAEMA) showed good dispersion and excellent stability in the aqueous solution without surfactant and reductant in the mixture. The properties of Poly(St-co-DMAEMA) and the nanocomposite catalyst Poly(St-co-DMAEMA)/Pd were characterized by Nuclear Magnetic Resonance Spectrometer(1H-NMR),

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Lin, Chih-Hsien, and 林志憲. "Electroless Nickel Plating on the Surfaces of Different Polymer Nanoparticles." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/89017471860467216221.

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碩士<br>國立臺灣大學<br>材料科學與工程學研究所<br>96<br>Nickel-phosphorus alloys were electrolessly deposited on the surfaces of polystyrene nanoparticles and polyaniline-coated-polystyrene nanopar- ticles using sodium hypophosphite as reducing agent. In this work, the sensitization process was omitted, and the activation process was applied by adsorption of palladium ions on the surfaces of substrates. Products after electroless plating were analyzed by SEM, TEM, EDS and XRD. The efficacy of activation was influenced by the adsorption ability of palladium ions on the surfaces of polymer particles. The adsor

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Lin, Shih-Chieh, and 林士傑. "Applications of Electroless Plating and Electrophoretic to Glass Substrate Deposition." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/22116022318788862252.

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碩士<br>國立中山大學<br>機械與機電工程學系研究所<br>94<br>In this study we present the results of electroless deposition of silver (Ag) and electrophoretic deposition (EPD) of Al2O3 layers on glass for application in thin film transistor (TFT). Since Ag exhibits excellent resistivity, it is selected to be the material of conductive layer. Ag thin film electrical and physical parameters are studied as a function of the deposition time and working temperature. We study the thin-film electrical and mechanical properties using 4-point Probe, surface analyzer and nano indenter. The Ag film, thicker than 200 nm, exhibi

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Wang, Dong-Maw, and 王東茂. "Improved Electroless Ni-P Plating on TiN Sputtered Mild Steel." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/35322519064156917744.

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WANG, XING-YUN, and 王興運. "Study of electroless nickel-boron plating on low-carbon steel." Thesis, 1987. http://ndltd.ncl.edu.tw/handle/83527620140331514147.

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Yang, Chia-Hao, and 楊嘉豪. "Hermetically Nickel-Coated Optical Fibers Prepared by Electroless Plating Method." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/957y48.

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碩士<br>逢甲大學<br>材料科學所<br>91<br>Abstract In this experiment, hermetically nickel-coated optical fibers were prepared by electroless plating method. The experimental process includes changing the sodium hypophosphite concentration, initial pH value, plating time, and plating temperature. The surface appearance, film thickness and surface roughness of nickel coatings were investigated using the optical microscope (OM), scanning electron microscope (SEM) and atomic force microscope (AFM) , respectively. The OM observation shows that if the concentration of sodium hypophosphite is 20g/L, the plati

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YU, Mei-Feng, and 余美鳳. "Preparation of cuprous oxide thin film by Electroless Plating Process." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/51808793216395111070.

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碩士<br>國立高雄應用科技大學<br>化學工程與材料工程系<br>97<br>In this study, the electroless plating with different solutions is applied to fabricate the cuprous oxide film on ITO.The cupric oxide films would be formed while the solution consisting of copper(II) sulfate (CuSO4) and sodium thiosulfate (Na2S2O3) was used. The microstructure was retained after annealing. The cuprous oxide films would be formed by alternative dipping between A solution (CuSO4 and Na2S2O3) and B solution (NaOH ). The thickness of cuprous oxide films monotonically increased with dipping times, but the transmittance of the films would be

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Tsai, Cheng Ta, and 蔡承達. "Glucose biosensor with gold electrode produced by electroless plating method." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/94879172909137068941.

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碩士<br>國立中央大學<br>化學工程與材料工程學系<br>104<br>With the rapid development of technology, biosensors have been used extensively in medical detecting. Glucose biosensors, which have become the convenient and mature product, have great economic value because of huge consume in the world. In this study, in order to prepare lower cost gold electrode glucose biosensors, the screen printed substrate which contained palladium catalyst was prepared. The effects of contents of palladium on the performance of biosensor was investigated. A reactor for electroless plating was designed. Nickel, palladium and gold we

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