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Articoli di riviste sul tema "HIGH-POWER APPLICATIONS"

Autore: Grafiati

Pubblicato: 11 settembre 2023

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1

Carroll, E. I. "Power electronics for very high power applications". Power Engineering Journal 13, n. 2 (1 aprile 1999): 81–87. http://dx.doi.org/10.1049/pe:19990208.

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2

Anlin Yi, Anlin Yi, Lianshan Yan Lianshan Yan, Bin Luo Bin Luo, Wei Pan Wei Pan e Jia Ye Jia Ye. "Effects of pattern dependence on high-power polarization-division-multiplexing applications". Chinese Optics Letters 10, n. 1 (2012): 010601–10603. http://dx.doi.org/10.3788/col201210.010601.

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3

Pottier, Sebastien B., Franck Hamm, Dominique Jousse, Patrick Sirot, Friedman Tchoffo Talom e Rene Vezinet. "High Pulsed Power Compact Antenna for High-Power Microwaves Applications". IEEE Transactions on Plasma Science 42, n. 6 (giugno 2014): 1515–21. http://dx.doi.org/10.1109/tps.2014.2321416.

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4

Sethakul, P., S. Rael, B. Davat e P. Thounthong. "Fuel cell high-power applications". IEEE Industrial Electronics Magazine 3, n. 1 (marzo 2009): 32–46. http://dx.doi.org/10.1109/mie.2008.930365.

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5

Pervak, V., O. Pronin, O. Razskazovskaya, J. Brons, I. B. Angelov, M. K. Trubetskov, A. V. Tikhonravov e F. Krausz. "High-dispersive mirrors for high power applications". Optics Express 20, n. 4 (8 febbraio 2012): 4503. http://dx.doi.org/10.1364/oe.20.004503.

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6

Aralikatti, Sachin, e Reshma Nadaf. "High Speed Implementation of Floating Point Multiplier for Low Power Design Applications". Bonfring International Journal of Research in Communication Engineering 6, Special Issue (30 novembre 2016): 108–12. http://dx.doi.org/10.9756/bijrce.8213.

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7

Kumar, Srisanthosh. "Single Power-Conversion Ac–Dc Converter with High Power Factor Based On ZVZCS for Dc Drive Applications". International Journal of Psychosocial Rehabilitation 23, n. 4 (20 dicembre 2019): 627–38. http://dx.doi.org/10.37200/ijpr/v23i4/pr190397.

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8

Pokryvailo, Alex, Costel Carp e Clifford Scapellati. "A High-Power High-Voltage Power Supply for Long-Pulse Applications". IEEE Transactions on Plasma Science 38, n. 10 (ottobre 2010): 2604–10. http://dx.doi.org/10.1109/tps.2010.2044810.

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9

Yeh, Ping-Chun, Hwann-Kaeo Chiou, Chwan-Ying Lee, John Yeh, Yi-Hung Tsai, Denny Tang e John Chern. "High power density, high efficiency 1W SiGe power HBT for 2.4GHz power amplifier applications". Solid-State Electronics 52, n. 5 (maggio 2008): 745–48. http://dx.doi.org/10.1016/j.sse.2007.11.003.

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10

Pearton, S. J., F. Ren, A. P. Zhang, G. Dang, X. A. Cao, H. Cho, C. R. Abernathy et al. "GaN Electronics for High Power, High Temperature Applications". Electrochemical Society Interface 9, n. 2 (1 giugno 2000): 34–39. http://dx.doi.org/10.1149/2.f06002if.

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11

Sugawara, Yoshitaka. "SiC Devices for High Voltage High Power Applications". Materials Science Forum 457-460 (giugno 2004): 963–68. http://dx.doi.org/10.4028/www.scientific.net/msf.457-460.963.

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12

Pearton, S. J., F. Ren, A. P. Zhang, G. Dang, X. A. Cao, K. P. Lee, H. Cho et al. "GaN electronics for high power, high temperature applications". Materials Science and Engineering: B 82, n. 1-3 (maggio 2001): 227–31. http://dx.doi.org/10.1016/s0921-5107(00)00767-4.

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13

Zhang, Shujun, Ru Xia, Laurent Lebrun, Dean Anderson e Thomas R. Shrout. "Piezoelectric materials for high power, high temperature applications". Materials Letters 59, n. 27 (novembre 2005): 3471–75. http://dx.doi.org/10.1016/j.matlet.2005.06.016.

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14

Megel, Stefan, Mihails Kusnezoff, Nikolai Trofimenko, Viktar Sauchuk, Alexander Michaelis, Andreas Venskutonis, Klaus Rissbacher et al. "High Efficiency CFY-Stack for High Power Applications". ECS Transactions 35, n. 1 (16 dicembre 2019): 269–77. http://dx.doi.org/10.1149/1.3570002.

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15

Pisau, Cătălin Dumitru. "High Power Lasers in Military Applications". Journal of Military Technology 2, n. 1 (26 giugno 2019): 53–56. http://dx.doi.org/10.32754/jmt.2019.1.10.

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16

BELING, Andreas, Joe C. CAMPBELL, Kejia LI, Qinglong LI, Ye WANG, Madison E. WOODSON, Xiaojun XIE e Zhanyu YANG. "High-Power Photodiodes for Analog Applications". IEICE Transactions on Electronics E98.C, n. 8 (2015): 764–68. http://dx.doi.org/10.1587/transele.e98.c.764.

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17

Kuk, Seung-Han, Sung-Myun Kim, Won-Gu Kang, Bumsoo Han, Nikolai K. Kuksanov e Kwang-Young Jeong. "High-power Accelerator for Environmental Applications". Journal of the Korean Physical Society 59, n. 6(1) (15 dicembre 2011): 3485–88. http://dx.doi.org/10.3938/jkps.59.3485.

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18

YAMANAKA, Chiyoe, e Shuji SAKABE. "Prospects of High Power Laser Applications". Review of Laser Engineering 30, n. 4 (2002): 185–92. http://dx.doi.org/10.2184/lsj.30.185.

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19

MIYANAGA, Noriaki. "Extending Applications of High-Power Lasers". Review of Laser Engineering 36, n. 9 (2008): 530–37. http://dx.doi.org/10.2184/lsj.36.530.

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20

SASOH, Akihiro, e Toshikazu EBISUZAKI. "High Power Laser Applications to Aerospace". Review of Laser Engineering 43, n. 9 (2015): 611. http://dx.doi.org/10.2184/lsj.43.9_611.

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21

DOBREF, VASILE. "HIGH POWER APPLICATIONS OF ELECTROMAGNETIC DEVICES". Scientific Bulletin of Naval Academy 19, n. 1 (15 giugno 2016): 206–9. http://dx.doi.org/10.21279/1454-864x-16-i1-036.

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22

Dableh, Joseph H., Raymond D. Findlay, Ian L. Colquhoun e Morley E. Truemner. "Cable for High Pulse Power Applications". IEEE Power Engineering Review PER-5, n. 8 (agosto 1985): 23–24. http://dx.doi.org/10.1109/mper.1985.5526367.

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23

Benford, James. "Space Applications of High-Power Microwaves". IEEE Transactions on Plasma Science 36, n. 3 (giugno 2008): 569–81. http://dx.doi.org/10.1109/tps.2008.923760.

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24

Chen, Makan, Lise Donzel, Martin Lakner e Willi Paul. "High temperature superconductors for power applications". Journal of the European Ceramic Society 24, n. 6 (gennaio 2004): 1815–22. http://dx.doi.org/10.1016/s0955-2219(03)00443-6.

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25

Janzén, E., e O. Kordina. "SiC material for high-power applications". Materials Science and Engineering: B 46, n. 1-3 (aprile 1997): 203–9. http://dx.doi.org/10.1016/s0921-5107(96)01984-8.

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26

Berger, T., J. Dreher, M. Krausa e J. Tübke. "Lithium accumulator for high-power applications". Journal of Power Sources 136, n. 2 (ottobre 2004): 383–85. http://dx.doi.org/10.1016/j.jpowsour.2004.03.039.

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27

Dableh, Joseph, Raymond Findlay, Ian Colquhoun e Morley Truemner. "Cable for High Pulse Power Applications". IEEE Transactions on Power Apparatus and Systems PAS-104, n. 8 (agosto 1985): 1963–67. http://dx.doi.org/10.1109/tpas.1985.318768.

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28

Lubkin, Gloria B. "Power Applications of High‐Temperature Superconductors". Physics Today 49, n. 3 (marzo 1996): 48–51. http://dx.doi.org/10.1063/1.881492.

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29

Capel, A., D. O'Sullivan e J. C. Marpinard. "High-power conditioning for space applications". Proceedings of the IEEE 76, n. 4 (aprile 1988): 391–0408. http://dx.doi.org/10.1109/5.4425.

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30

Boni, Arthur A., David I. Rosen, Steven J. Davis e Leslie A. Popper. "High-power laser applications to medicine". Journal of Quantitative Spectroscopy and Radiative Transfer 40, n. 3 (settembre 1988): 449–67. http://dx.doi.org/10.1016/0022-4073(88)90133-1.

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31

Boettcher, Lars, Lars Boettcher, S. Karaszkiewicz, D. Manessis e A. Ostmann. "Embedded Power Modules – A new approach using Power Core and High Power PCB". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (1 gennaio 2015): 000906–37. http://dx.doi.org/10.4071/2015dpc-tp42.

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Abstract (sommario):

Power electronics packaging applications has strong demands regarding reliability and cost. The fields of developments reach from low power converter modules, over single or multichip MOSFET or IGBT packages, up to high power applications, like needed e.g. for solar inverters and automotive applications. This paper will give an overview about these applications and a description of each ones demand. The spectrum of conventional power electronics packaging reaches from SMD packages for power chips to large power modules. In most of these packages the power semiconductors are connected by bond wires, resulting in large resistances and parasitic inductance. Additionally bond wires result in a high stray inductance which limits the switching frequency. The embedding of chips using Printed Circuit Board (PCB) technology offers a solution for many of the problems in power packaging. This paper will show today's available power packages and power modules, realized in industrial production as well as in European research projects. All technologies which are used are based on PCB materials and processes. Chips are mounted to Cu foils, lead frames, high power PCBs or even ceramic substrates, embedded by vacuum lamination of laminate sheets and electrically connected by laser drilling and Cu plating. A new approach for embedded power modules will be presented in detail. In this project, different application fields are covered, ranging from 50 W over 500 W to 50kW power modules for different applications like single chip packages, over power control units for pedelec (Pedal Electric Cycle), to inverter modules for automotive applications. This approach will focus on a power core base structure for the embedded semiconductor, which is then connected to a high power PCB. The connection to the embedded die is realized by direct copper connection only. The technology principle will be described in detail. Frist manufactured demonstrators will be presented. The presented new approach for the realization of a power core structure offers new possibilities for the module manufacturing, avoiding soldering or Ag sintering of the power semiconductors and the handling of thick copper substrates during the embedding process.

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32

Lima, G. B., L. C. Freitas, J. B. Vieira, E. A. A. Coelho, V. J. Farias, L. C. G. Freitas, C. A. Canesin e A. P. Finazzi. "Single-phase high power factor hybrid rectifier suitable for high-power applications". IET Power Electronics 5, n. 7 (1 agosto 2012): 1137–46. http://dx.doi.org/10.1049/iet-pel.2011.0172.

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33

Banaei, M. R., e E. Salary. "Power Exchange by Using Micro-grid Inverter with High-Voltage Gain for Photovoltaic Applications". Journal of Clean Energy Technologies 4, n. 4 (2015): 237–40. http://dx.doi.org/10.7763/jocet.2016.v4.288.

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34

P. Divya Sri, P. Divya Sri, e Dr P. Hari Krishna Prasad. "Single Phase Dual Full Bridge Bi-directional DC-DC Converter for High power applications". Indian Journal of Applied Research 3, n. 5 (1 ottobre 2011): 259–65. http://dx.doi.org/10.15373/2249555x/may2013/79.

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35

Baranov, G. A., e A. A. Kuchinsky. "High-power, high-pressure pulsed CO2lasers and their applications". Quantum Electronics 35, n. 3 (31 marzo 2005): 219–29. http://dx.doi.org/10.1070/qe2005v035n03abeh002856.

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36

Kheraluwala, M. H., D. W. Novotny e D. M. Divan. "Coaxially wound transformers for high-power high-frequency applications". IEEE Transactions on Power Electronics 7, n. 1 (gennaio 1992): 54–62. http://dx.doi.org/10.1109/63.124577.

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37

Sun, Ruize, Jingxue Lai, Wanjun Chen e Bo Zhang. "GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review". IEEE Access 8 (2020): 15529–42. http://dx.doi.org/10.1109/access.2020.2967027.

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38

Jiang, H. C., X. Si, W. L. Zhang, C. J. Wang, B. Peng e Y. R. Li. "Microwave power thin film resistors for high frequency and high power load applications". Applied Physics Letters 97, n. 17 (25 ottobre 2010): 173504. http://dx.doi.org/10.1063/1.3507883.

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39

Chang, Chao, Zhengfeng Xiong, Letian Guo, Xiaolong Wu, Yansheng Liu, Xiaoyue Xing e Zhiguo Li. "Compact four-way microwave power combiner for high power applications". Journal of Applied Physics 115, n. 21 (7 giugno 2014): 214502. http://dx.doi.org/10.1063/1.4880741.

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40

Yuming, Zhou, Yu Yuehui, Chen Haigang e Liang Lin. "A High Power Semiconductor Switch RSD for Pulsed Power Applications". Plasma Science and Technology 9, n. 5 (ottobre 2007): 622–25. http://dx.doi.org/10.1088/1009-0630/9/5/23.

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41

Madawala, U. K., e D. J. Thrimawithana. "Modular-based inductive power transfer system for high-power applications". IET Power Electronics 5, n. 7 (1 agosto 2012): 1119–26. http://dx.doi.org/10.1049/iet-pel.2011.0182.

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42

Meng, Ru, Yulong Xia, Letian Guo, Yuanyue Guo e Qi Zhu. "X‐band compact coaxial power combiner for high‐power applications". IET Microwaves, Antennas & Propagation 13, n. 12 (12 luglio 2019): 2171–76. http://dx.doi.org/10.1049/iet-map.2019.0055.

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43

Keeling, N. A., G. A. Covic e J. T. Boys. "A Unity-Power-Factor IPT Pickup for High-Power Applications". IEEE Transactions on Industrial Electronics 57, n. 2 (febbraio 2010): 744–51. http://dx.doi.org/10.1109/tie.2009.2027255.

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44

Elshafey, Ahmed F., e Mahmoud Abdelrahman Abdalla. "LOW LOSS HIGH POWER AIR SUSPENDED STRIPLINE POWER DIVIDER FOR HIGH POWER DIVISION SUB-SYSTEMS APPLICATIONS". Progress In Electromagnetics Research M 73 (2018): 153–62. http://dx.doi.org/10.2528/pierm18070506.

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45

Eroglu, Abdullah. "PLANAR INDUCTOR DESIGN FOR HIGH POWER APPLICATIONS". Progress In Electromagnetics Research B 35 (2011): 53–67. http://dx.doi.org/10.2528/pierb11081601.

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46

MINAMIDA, Katsuhiro. "High Power Laser Applications in Steel Industries". Review of Laser Engineering 24, Supplement (1996): S25—S28. http://dx.doi.org/10.2184/lsj.24.supplement_s25.

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47

MINAMIDA, Katsuhiro. "High Power Laser Applications in Steel Industry." Review of Laser Engineering 28, n. 11 (2000): 760–64. http://dx.doi.org/10.2184/lsj.28.760.

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48

Nisida, Naoto. "High Power Excimer Laser for Industrial Applications." Journal of the Japan Welding Society 61, n. 8 (1992): 683–87. http://dx.doi.org/10.2207/qjjws1943.61.8_683.

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49

Jovcic, Dragan, Lu Zhang e Masood Hajian. "LCL VSC Converter for High-Power Applications". IEEE Transactions on Power Delivery 28, n. 1 (gennaio 2013): 137–44. http://dx.doi.org/10.1109/tpwrd.2012.2219560.

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50

Jin, H., G. Pan, S. J. Xue e F. P. Wang. "Novel Lithium Titanate for High Power Applications". ECS Transactions 58, n. 48 (25 aprile 2014): 63–69. http://dx.doi.org/10.1149/05848.0063ecst.

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