Zeitschriftenartikel zum Thema „CMP polishing“
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Lou, Chun Lan, Hai Yan Di, Qiang Fang, Tao Kong, Wei Feng Yao und Zhao Zhong Zhou. „Study on Groove Shape of CMP Polishing Pad: A Review“. Advanced Materials Research 497 (April 2012): 278–83. http://dx.doi.org/10.4028/www.scientific.net/amr.497.278.
Liu, Zhi Xiang, Jian Guo Yao, Song Zhan Fan und Jian Xiu Su. „Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing“. Applied Mechanics and Materials 602-605 (August 2014): 485–88. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.485.
Tso, Pei Lum, Shi Guo Liu und J. C. Wang. „The Development of an Ultrasonic Head for CMP Pad Conditioning“. Advanced Materials Research 500 (April 2012): 275–80. http://dx.doi.org/10.4028/www.scientific.net/amr.500.275.
Son, Jungyu, und Hyunseop Lee. „Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction“. Micromachines 11, Nr. 9 (08.09.2020): 843. http://dx.doi.org/10.3390/mi11090843.
Zhang, Hui, Zi Feng Ni und Qing Zhong Li. „A Fine Atomization CMP Slurry for Copper“. Advanced Materials Research 279 (Juli 2011): 271–74. http://dx.doi.org/10.4028/www.scientific.net/amr.279.271.
Zhang, Sheng Fang, Jian Xiu Su, Jia Xi Du und Ren Ke Kang. „Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior“. Materials Science Forum 704-705 (Dezember 2011): 313–17. http://dx.doi.org/10.4028/www.scientific.net/msf.704-705.313.
Sugimoto, Taku, Seiichi Suda und Koichi Kawahara. „Change in Slurry/Glass Interfacial Resistance by Chemical Mechanical Polishing“. MRS Advances 2, Nr. 41 (2017): 2205–10. http://dx.doi.org/10.1557/adv.2017.335.
Fang, Treliant, Ping Chung Chen und Ming Hsun Lee. „A New Permanganate-Free Slurry for GaN-SiC CMP Applications“. Materials Science Forum 1004 (Juli 2020): 199–205. http://dx.doi.org/10.4028/www.scientific.net/msf.1004.199.
Guo, Zhi Xue, Jing Zhai, Hui Zhang und Qing Zhong Li. „The Effect of Speed Matching on the CMP Uniformity“. Advanced Materials Research 189-193 (Februar 2011): 4154–57. http://dx.doi.org/10.4028/www.scientific.net/amr.189-193.4154.
Zhang, Zhu Qing, und Kang Lin Xing. „Study on 6H-SiC Crystal Substrate (0001) C Surface in FA-CMP Based on Diamond Particle“. Applied Mechanics and Materials 727-728 (Januar 2015): 244–47. http://dx.doi.org/10.4028/www.scientific.net/amm.727-728.244.
Su, J. X., Jia Xi Du, X. L. Liu, H. N. Liu und R. K. Kang. „Study on Lubricating Behavior in Chemical Mechanical Polishing“. Key Engineering Materials 487 (Juli 2011): 243–47. http://dx.doi.org/10.4028/www.scientific.net/kem.487.243.
Tso, Pei Lum, und Yang Liang Pai. „Amorphous Diamond Dresser for CMP Fixed Abrasives Pad“. Key Engineering Materials 329 (Januar 2007): 157–62. http://dx.doi.org/10.4028/www.scientific.net/kem.329.157.
Ha, Taeho, Keiichi Kimura, Takashi Miyoshi und Yasuhiro Takaya. „Laser-Assisted CMP for Copper Wafer“. Materials Science Forum 502 (Dezember 2005): 351–60. http://dx.doi.org/10.4028/www.scientific.net/msf.502.351.
Kim, Seong-In, Gi-Ppeum Jeong, Seung-Jae Lee, Jong-Chan Lee, Jun-Myeong Lee, Jin-Hyung Park, Jae-Young Bae und Jea-Gun Park. „Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO2-Abrasive Dispersant Stability Enhancement and Related Tungsten-Film Surface Chemical–Mechanical Planarization“. Nanomaterials 11, Nr. 12 (04.12.2021): 3296. http://dx.doi.org/10.3390/nano11123296.
Sharma, Mohit, und Chao-Chang A. Chen. „Analytical Modelling of Material Removal in Copper Chemical Mechanical Polishing Incorporating the Scratch Hardness of the Passivated Layer on Copper Thin Film Wafer“. ECS Journal of Solid State Science and Technology 11, Nr. 4 (01.04.2022): 044007. http://dx.doi.org/10.1149/2162-8777/ac6624.
Wen, Yan Wu, Xin Chun Lu, Hui Zhang, Kai Zhou und Pei Qing Ye. „Identification Research on CMP Multi-Zones Pressure System“. Advanced Materials Research 605-607 (Dezember 2012): 1074–79. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.1074.
Jia, Ying Qian, Xin Huan Niu, Li Li und Ning Li. „The Study of Stability of Tungsten Plug CMP Slurry for IC Multilevel Interconnect“. Advanced Materials Research 834-836 (Oktober 2013): 658–61. http://dx.doi.org/10.4028/www.scientific.net/amr.834-836.658.
Yuan, Ze Wei, Zhu Ji Jin, B. X. Dong und Ren Ke Kang. „Polishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP“. Advanced Materials Research 53-54 (Juli 2008): 111–18. http://dx.doi.org/10.4028/www.scientific.net/amr.53-54.111.
Su, Jian Xiu, Zhu Qing Zhang, Jian Guo Yao, Li Jie Ma und Qi Gao Feng. „Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive“. Advanced Materials Research 797 (September 2013): 261–65. http://dx.doi.org/10.4028/www.scientific.net/amr.797.261.
Uneda, Michio, Keiichi Takano, Koji Koyama, Hideo Aida und Ken-ichi Ishikawa. „Investigation into Chemical Mechanical Polishing Mechanism of Hard-to-Process Materials Using a Commercially Available Single-Sided Polisher“. International Journal of Automation Technology 9, Nr. 5 (05.09.2015): 573–79. http://dx.doi.org/10.20965/ijat.2015.p0573.
Sato, Ryunosuke, Yoshio Ichida, Yoshitaka Morimoto und Kenji Shimizu. „Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives“. Key Engineering Materials 389-390 (September 2008): 515–20. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.515.
Li, Wei, Ming Ming Ma und Bin Hu. „A Study on Surface Quality of GaN with CMP Polishing Process“. Advanced Materials Research 291-294 (Juli 2011): 1764–67. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.1764.
Su, Jian Xiu, Yan An Peng, Zhen Hui Liu, Zhan Kui Wang und Su Fang Fu. „Analysis on the Action of Oxidant in Chemical Mechanical Polishing of 304 Ultra-Thin Stainless Steel“. Materials Science Forum 893 (März 2017): 234–39. http://dx.doi.org/10.4028/www.scientific.net/msf.893.234.
Doy, Toshiroh Karaki. „Polishing Technique and CMP (Chemical & Mechanical Polishing) in Semiconductor Process“. Journal of the Society of Mechanical Engineers 103, Nr. 979 (2000): 372–74. http://dx.doi.org/10.1299/jsmemag.103.979_372.
Tso, Pei Lum, Zhe Hao Huang, Sheng Wei Chou und Cheng Yi Shih. „Study on the CMP Pad Life with its Mechanical Properties“. Key Engineering Materials 389-390 (September 2008): 481–86. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.481.
Su, Jian Xiu, Xi Qu Chen, Jia Xi Du, Xiu Ying Wan und Xin Ning. „Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer“. Advanced Materials Research 102-104 (März 2010): 658–62. http://dx.doi.org/10.4028/www.scientific.net/amr.102-104.658.
Grim, J. R., Marek Skowronski, W. J. Everson und V. D. Heydemann. „Selectivity and Residual Damage of Colloidal Silica Chemi-Mechanical Polishing of Silicon Carbide“. Materials Science Forum 527-529 (Oktober 2006): 1095–98. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.1095.
Evans, David. „The Future of CMP“. MRS Bulletin 27, Nr. 10 (Oktober 2002): 779–83. http://dx.doi.org/10.1557/mrs2002.250.
Liu, Xiao Peng, Xiao Chun Chen und Qing Zhong Li. „Principle and Experiment of Ultrasonic Subtle Atomization in CMP“. Advanced Materials Research 279 (Juli 2011): 287–90. http://dx.doi.org/10.4028/www.scientific.net/amr.279.287.
Pipat, PHAISALPANUMAS, Keiichi KIMURA, Keisuke SUZUKI und KHAJORNRUNGRUANG Panart. „608 Study on Variable Rotation Polishing in CMP Process“. Proceedings of Conference of Kyushu Branch 2012.65 (2012): 207–8. http://dx.doi.org/10.1299/jsmekyushu.2012.65.207.
Yang, Wei Ping, Yong Bo Wu und Hong Fei Yang. „Mechanism and Experimental Investigation on Silicon Wafer Hybrid Polishing by Ultrasonic-Elliptic-Vibration Chemical-Mechanical“. Advanced Materials Research 314-316 (August 2011): 829–36. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.829.
Wang, Yong Guang, und Liang Chi Zhang. „A Review on the CMP of SiC and Sapphire Wafers“. Advanced Materials Research 126-128 (August 2010): 429–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.429.
Wang, Sheng Li, Y. J. Yuan, Yu Ling Liu und X. H. Niu. „Study on Chemical Mechanical Polishing Technology of Copper“. Key Engineering Materials 373-374 (März 2008): 820–23. http://dx.doi.org/10.4028/www.scientific.net/kem.373-374.820.
Zhang, Ke Hua, und Dong Hui Wen. „An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel“. Advanced Materials Research 69-70 (Mai 2009): 98–102. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.98.
Wang, Zhan Kui, Ming Hua Pang, Jian Xiu Su und Jian Guo Yao. „Effect of Different Abrasives on Chemical Mechanical Polishing for Magnesia Alumina Spinel“. Key Engineering Materials 866 (Oktober 2020): 115–24. http://dx.doi.org/10.4028/www.scientific.net/kem.866.115.
Wan, Lin Lin, Zhao Hui Deng, Sheng Chao Li und Piao Long. „Experimental Study of Material Removal Rate for Rotary Curved Surface Workpieces of Si3N4 in Chemical-Mechanical Polishing Using Taguchi Technique“. Advanced Materials Research 497 (April 2012): 273–77. http://dx.doi.org/10.4028/www.scientific.net/amr.497.273.
Lv, Y. S., Nan Li, Jun Wang, Tian Zhang, Min Duan und Xue Ling Xing. „Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern“. Advanced Materials Research 215 (März 2011): 217–22. http://dx.doi.org/10.4028/www.scientific.net/amr.215.217.
Wu, Yong Bo, und Li Jun Wang. „A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer“. Advanced Materials Research 983 (Juni 2014): 208–13. http://dx.doi.org/10.4028/www.scientific.net/amr.983.208.
Peng, De-Xing. „Chemical mechanical polishing of steel substrate using aluminum nanoparticles abrasive slurry“. Industrial Lubrication and Tribology 66, Nr. 1 (04.02.2014): 124–30. http://dx.doi.org/10.1108/ilt-10-2011-0078.
Chen, Chao-Chang A., Jen-Chieh Li, Wei-Cheng Liao, Yong-Jie Ciou und Chun-Chen Chen. „Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System“. Applied Sciences 11, Nr. 1 (27.12.2020): 179. http://dx.doi.org/10.3390/app11010179.
Fu, Su Fang, Jian Guo Yao, Li Jie Ma und Jian Xiu Su. „Analysis of Chemical Action of Oxidants in Chemical Mechanical Polishing of SiC Crystal Substrate“. Advanced Materials Research 1027 (Oktober 2014): 213–16. http://dx.doi.org/10.4028/www.scientific.net/amr.1027.213.
Li, Jun, Yong Zhu und Chuang Tian Chen. „Chemical Mechanical Polishing of Transparent Nd:YAG Ceramics“. Key Engineering Materials 375-376 (März 2008): 278–82. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.278.
Doi, Toshiro K., Tsutomu Yamazaki, Syuhei Kurokawa, Yoji Umezaki, Osamu Ohnishi, Yoichi Akagami, Yasuhide Yamaguchi und Sadahiro Kishii. „Study on the Development of Resource-Saving High Performance Slurry - Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry“. Advances in Science and Technology 64 (Oktober 2010): 65–70. http://dx.doi.org/10.4028/www.scientific.net/ast.64.65.
Cheng, Hai Feng, Li Jie Ma, Jian Guo Yao und Jian Xiu Su. „Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet“. Advanced Materials Research 1027 (Oktober 2014): 58–62. http://dx.doi.org/10.4028/www.scientific.net/amr.1027.58.
ODA, Akiyoshi, Masato OHTA, Junji SHIBATA und Takayasu KIMURA. „A Basic Study on Chemical Mechanical Polishing (CMP)“. Proceedings of The Manufacturing & Machine Tool Conference 2002.4 (2002): 213–14. http://dx.doi.org/10.1299/jsmemmt.2002.4.213.
Sun, Yu Li, Dun Wen Zuo, Yong Wei Zhu, Rong Fa Chen, D. S. Li und M. Wang. „Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders“. Advanced Materials Research 24-25 (September 2007): 177–82. http://dx.doi.org/10.4028/www.scientific.net/amr.24-25.177.
Zhao, Y., Dun Wen Zuo und Yu Li Sun. „Status and Trends of Fixed Abrasive Polishing on Semiconductor“. Key Engineering Materials 499 (Januar 2012): 390–96. http://dx.doi.org/10.4028/www.scientific.net/kem.499.390.
Tang, Heng Xing, Chu Peng Zhang und Lin Lin. „Development of an Ultra-Precision Annular Polishing Machine Tool with Full Gas Static Pressure“. Key Engineering Materials 837 (April 2020): 183–90. http://dx.doi.org/10.4028/www.scientific.net/kem.837.183.
Peng, De-Xing. „Optimization of chemical mechanical polishing parameters on surface roughness of steel substrate with aluminum nanoparticles via Taguchi approach“. Industrial Lubrication and Tribology 66, Nr. 6 (02.09.2014): 685–90. http://dx.doi.org/10.1108/ilt-07-2012-0063.
Son, Jungyu, und Hyunseop Lee. „Contact-Area-Changeable CMP Conditioning for Enhancing Pad Lifetime“. Applied Sciences 11, Nr. 8 (14.04.2021): 3521. http://dx.doi.org/10.3390/app11083521.