Thematische Bibliographien / Encapsulation for electronic

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Auswahl der wissenschaftlichen Literatur zum Thema „Encapsulation for electronic“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 29. Juli 2025

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Zeitschriftenartikel zum Thema "Encapsulation for electronic"

Winkler, Sebastian, Jan Edelmann, Christine Welsch, and Roman Ruff. "Different encapsulation strategies for implanted electronics." Current Directions in Biomedical Engineering 3, no. 2 (2017): 725–28. http://dx.doi.org/10.1515/cdbme-2017-0153.

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AbstractRecent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined

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Kulkarni, Romit, Peter Wappler, Mahdi Soltani, et al. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages." Journal of Manufacturing and Materials Processing 3, no. 1 (2019): 18. http://dx.doi.org/10.3390/jmmp3010018.

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation

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Kinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack, and Gerhard Tröster. "Encapsulation for Flexible Electronic Devices." IEEE Electron Device Letters 32, no. 12 (2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.

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Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved becau

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Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

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Yu, Yong Peng. "Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials." Advanced Materials Research 391-392 (December 2011): 332–35. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.332.

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Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.

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Guo, Jiahui, Yunru Yu, Dagan Zhang, Han Zhang, and Yuanjin Zhao. "Morphological Hydrogel Microfibers with MXene Encapsulation for Electronic Skin." Research 2021 (March 3, 2021): 1–10. http://dx.doi.org/10.34133/2021/7065907.

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Electronic skins with distinctive features have attracted remarkable attention from researchers because of their promising applications in flexible electronics. Here, we present novel morphologically conductive hydrogel microfibers with MXene encapsulation by using a multi-injection coflow glass capillary microfluidic chip. The coaxial flows in microchannels together with fast gelation between alginate and calcium ions ensure the formation of hollow straight as well as helical microfibers and guarantee the in situ encapsulation of MXene. The resultant hollow straight and helical MXene hydrogel

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Setaro, Antonio. "(Invited) Effect of the Encapsulation of Small Moieties in SWNTs." ECS Meeting Abstracts MA2025-01, no. 12 (2025): 1007. https://doi.org/10.1149/ma2025-01121007mtgabs.

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Single-walled carbon nanotubes (SWNTs) are versatile nanoscale containers for encapsulating small molecular systems. In this work we focus on polyaromatic hydrocarbons and fluorinated organic compounds, enabling novel hybrid materials with new functionalities. Small aromatic hydrocarbons benefit from confinement within CNTs, where π-π interactions and spatial restriction stabilize their structure and modify their optical and electronic behaviors. Fluorinated organic compounds, characterized by high electronegativity and stability, might affect the SWNTs with improved solubility, chemical resis

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Jeon, Yongmin, Hyeongjun Lee, Hyeunwoo Kim, and Jeong-Hyun Kwon. "A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs." Micromachines 13, no. 9 (2022): 1478. http://dx.doi.org/10.3390/mi13091478.

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As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations through material and structural design. In particular, TFEs, which protect OLEDs from the external environment, including reactive gases, heat, sunlight, dust, and particles, have technical difficulties to be solved. This review covers various encapsulation technologies that have been developed wit

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Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (2019): 508. http://dx.doi.org/10.3390/mi10080508.

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorgan

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Dissertationen zum Thema "Encapsulation for electronic"

Kaabeche, Nessima. "Transparent high barrier coatings for electronic encapsulation." Thesis, Manchester Metropolitan University, 2017. http://e-space.mmu.ac.uk/618981/.

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Barrier coatings are a category of functional films designed to enhance enduse properties to the underlying substrate. When used for electronic applications (such as flexible displays, digital paper, lighting, OLEDs and solar cells), the barrier characteristics are meant to protect the device from environmental influence, especially the permeation of oxygen and water vapour that can degrade and corrode the active layers of the devices (causing mal-functioning). In this project, silicon oxide barrier layers were deposited onto a non-treated BO-PET via plasma enhanced chemical vapour deposition,

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Pascarella, Nathan William. "Advanced encapsulation processing for low cost electronics assembly." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/19031.

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Evans, Michael 1977. "Encapsulation of electronic components for a retinal prosthesis." Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/9077.

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Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000. Includes bibliographical references (p. 65). Long-term success of an implantable retinal prosthesis depends on the ability to hermetically seal sensitive electronics from a saline environment with an encapsulant material. Furthermore, the retinal implant project's proposed laser-driven prosthesis requires that the encapsulation material be transparent. The device itself has two components that must protrude out of the encapsulation material. The first is an electro

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Teh, Nee-Joo. "Direct polymeric encapsulation of electronic systems for automotive applications." Thesis, Loughborough University, 2004. https://dspace.lboro.ac.uk/2134/33881.

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Over the past forty years, compelling demands for safer, cleaner and more efficient vehicles have given rise to a drastic increase in the replacement of many traditional mechanical and electrical mechanisms by more advanced electronic systems. Due to their harsh operating environments, automotive electronic systems are subject to failures from thermomechanical stresses and corrosive breakdown, adversely affecting their reliability and lifespan. Furthermore, the development of bus communication protocols for improved control capabilities has prompted wider systems distribution within the restri

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Kim, Namsu. "Fabrication and characterization of thin-film encapsulation for organic electronics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31772.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010. Committee Chair: Samuel Graham; Committee Member: Bernard Kippelen; Committee Member: David McDowell; Committee Member: Sankar Nair; Committee Member: Suresh Sitaraman. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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Zhang, Rong. "Wafer level LED packaging with integrated DRIE trenches for encapsulation /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20ZHANGR.

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Bowman, Amy Catherine. "A selective encapsulation solution for packaging an optical micro electro mechanical system." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0108102-140953.

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Thesis (M.S.)--Worcester Polytechnic Institute. Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).

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Visweswaran, Bhadri. "Encapsulation of organic light emitting diodes." Thesis, Princeton University, 2014. http://pqdtopen.proquest.com/#viewpdf?dispub=3665325.

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Organic Light Emitting Diodes (OLEDs) are extremely attractive candidates for flexible display and lighting panels due to their high contrast ratio, light weight and flexible nature. However, the materials in an OLED get oxidized by extremely small quantities of atmospheric moisture and oxygen. To obtain a flexible OLED device, a flexible thin-film barrier encapsulation with low permeability for water is necessary. Water permeates through a thin-film barrier by 4 modes: microcracks, contaminant particles, along interfaces, and through the bulk of the material. We have developed

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Lelong, Sandrine. "Étude de la fiabilité technologique de modules multipuces par des essais de vieillissement accéléré et par la modélisation de leur comportement thermomécanique." Grenoble INPG, 1998. http://www.theses.fr/1998INPG0030.

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L'objectif de cette etude est d'evaluer la fiabilite technologique de plusieurs types de mcm ou modules multipuces par des essais de vieillissement accelere et par des modelisations thermomecaniques par elements finis. Le but est de pouvoir correler les resultats experimentaux et les modelisations, afin de valider ces dernieres. Compte tenu de leurs performances (la miniaturisation et l'amelioration des performances electriques), les mcm sont susceptibles d'etre utilises dans des applications avioniques, militaires et spatiales. Mais, les technologies mcm etant recentes, leur fiabilite est enc

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Colin, Charlotte. "Synthèse et caractérisation de copolymères Silicone/Polyuréthane réticulés pour l'encapsulation de modules de puissance." Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLV028/document.

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L’électronique embarquée, notamment les modules de puissance, permet la gestion de l’énergie électrique et donc le développement de véhicules « décarbonés ». Toutefois, en vue d’être positionnés près du moteur thermique, ces composants électroniques devront résister à des environnements très divers et parfois à de sévères contraintes (humidité, agression chimique (huiles), vibrations…). Or, les matériaux d’encapsulation qui les protègent ne sont pas, aujourd’hui, assez performants pour répondre à ces nouvelles contraintes. Ainsi, le but de ces travaux de thèse est donc de développer de nouveau

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Bücher zum Thema "Encapsulation for electronic"

Ardebili, Haleh. Encapsulation technologies for electronic applications. William Andrew, 2009.

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Pecht, Michael G., Jiawei Zhang, Haleh Ardebili, and James J. Licari. Encapsulation Technologies for Electronic Applications. Elsevier, 2018.

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Encapsulation Technologies for Electronic Applications. Elsevier, 2019. http://dx.doi.org/10.1016/c2016-0-01829-6.

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Encapsulation Technologies for Electronic Applications. Elsevier - Health Sciences Division, 2018.

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Pecht, Michael G., and Haleh Ardebili. Encapsulation Technologies for Electronic Applications. Elsevier Science & Technology Books, 2009.

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Flexible Electronic Packaging and Encapsulation Technology. Wiley & Sons, Limited, John, 2024.

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Encapsulation of electronic devices and components. M. Dekker, 1987.

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Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics. IPC Publishing Group, Inc., 2024.

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Buchteile zum Thema "Encapsulation for electronic"

Su, Wenming. "Encapsulation Technology for Organic Electronic Devices." In Printed Electronics. John Wiley & Sons Singapore Pte. Ltd, 2016. http://dx.doi.org/10.1002/9781118920954.ch8.

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Jalar, Azman, Syed Mohamad Mardzukey Syed Mohamed Zain, Fakhrozi Che Ani, Mohamad Riduwan Ramli, and Maria Abu Bakar. "Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package." In Advances in Robotics, Automation and Data Analytics. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70917-4_33.

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Pyun, Jeffrey, and Todd Emrick. "Polymer Encapsulation of Metallic and Semiconductor Nanoparticles: Multifunctional Materials with Novel Optical, Electronic and Magnetic Properties." In Macromolecular Engineering. Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527631421.ch58.

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Hackett, Nigel. "Materials for Advanced Encapsulation." In Plastics for Electronics. Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-2700-6_6.

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Fahlteich, John, Andreas Glawe, and Paolo Vacca. "Encapsulation of Organic Electronics." In Organic and Printed Electronics, 2nd ed. Jenny Stanford Publishing, 2024. http://dx.doi.org/10.1201/9781003484417-10.

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Goosey, Martin T. "Plastic Encapsulation of Semiconductors by Transfer Moulding." In Plastics for Electronics. Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-009-4942-3_5.

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Câmara, João, and Helena Sarmento. "AutoCap: An Automatic Tool Encapsulator." In Electronic Design Automation Frameworks. Springer US, 1995. http://dx.doi.org/10.1007/978-0-387-34880-3_4.

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Enzel, Patricia, and Thomas Bein. "Encapsulation of Conducting Polymers within Zeolites." In Lower-Dimensional Systems and Molecular Electronics. Springer US, 1990. http://dx.doi.org/10.1007/978-1-4899-2088-1_49.

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Goosey, Martin, and Mike Plant. "Recent Developments in the Encapsulation of Semiconductors by Transfer Moulding." In Plastics for Electronics. Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-017-2700-6_5.

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Tong, Colin. "Substrate and Encapsulation Materials for Printed Flexible Electronics." In Advanced Materials for Printed Flexible Electronics. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-79804-8_5.

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Konferenzberichte zum Thema "Encapsulation for electronic"

Wang, Jiaxuan, Xiao Li, Jiayan Zhao, Jinbing Li, Guoqi Zhang, and Pan Liu. "Finite Element Analysis of Planar Inductors With Soft Magnetic Encapsulation Materials." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668611.

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Zhang, Jinyuan, Wei Chen, Hongyu Tang, Xi Zhu, Guoqi Zhang, and Jiajie Fan. "Molecular Dynamics Assisted Corrosion-Resistant Evaluation of Encapsulation Materials on Copper Used in Power Electronics Packaging." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668482.

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Kaabeche, Nessima, P. J. Kelly, and L. Harland. "Transparent High Barrier Coating for Electronic Encapsulation." In Society of Vacuum Coaters Annual Technical Conference. Society of Vacuum Coaters, 2015. http://dx.doi.org/10.14332/svc15.proc.1959.

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Ding, Peng, Renhui Liu, Yu Chen, Guanqiang Song, and Guanhua Li. "Study on encapsulation reliability." In 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922768.

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Young, S. J., D. Janssen, E. A. Wenzel, B. M. Shadakofsky, and F. A. Kulacki. "Electronics cooling with onboard conformal encapsulation." In 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2016. http://dx.doi.org/10.1109/itherm.2016.7517557.

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Rayadhyaksha, Mangesh, and Gordon Sullivan. "The importance of adhesion for electronic module encapsulation." In 2007 Electrical Insulation Conference and Electrical Manufacturing Expo (EIC/EME). IEEE, 2007. http://dx.doi.org/10.1109/eeic.2007.4562648.

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Franck, Laurent, and Rosalba Suffritti. "Multiple Alert Message Encapsulation over Satellite." In Electronic Systems Technology (Wireless VITAE). IEEE, 2009. http://dx.doi.org/10.1109/wirelessvitae.2009.5172503.

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Lall, Pradeep, Sabina Bimali, and Scott Miller. "Thermal Cycling Reliability on Encapsulated Flexible Printed Circuit Fabricated With Water-Based Ink and Room-Temperature Curable Adhesive." In ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2024. http://dx.doi.org/10.1115/ipack2024-141858.

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Abstract The application of room-temperature curable adhesive and water-based ink offers an economical and sustainable method in the field of electronics production. On the other hand, little is known about how encapsulation and thermal cycling affect the functionality of circuits fabricated using these materials. The purpose of this study is to look into how thermal cycling circumstances and encapsulation techniques affect the reliability and performance of circuits made with room-temperature curable adhesive and water-based ink. Understandings from this research will fill this knowledge gap

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dos Santos, Lorrane Soares, Jéssica Silva Medeiros, Antonio Matias Navarrete de Toledo, Letícia Fleury Viana, Maria Inês Rodrigues Machado, and Adriana Rodrigues Machado. "Encapsulation of Aqueous Extract of Hancornia speciosa." In International Electronic Conference on Processes. MDPI, 2024. http://dx.doi.org/10.3390/engproc2024067022.

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Park, Woo-Tae, Rob N. Candler, Huimou J. Li, et al. "Wafer Scale Encapsulation of MEMS Devices." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35032.

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MEMS packaging has always been a field of great importance since it can dominate the cost and size of a final working device. Considering this, we have concentrated on developing a wafer-scale encapsulation scheme which uses a thick epi-poly (epitaxially deposited poly silicon) layer as the sealing layer. This approach allows the use of conventional post processing, such as dicing, wire bonding, and other standard handling and mounting techniques. We also can minimize the chip area used for packaging, in some cases reducing the chip size by ×5 from what was required for silicon fusion bonded c

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Berichte der Organisationen zum Thema "Encapsulation for electronic"

Rogers, John. Inorganic Substrates and Encapsulation Layers for Transient Electronics. Defense Technical Information Center, 2014. http://dx.doi.org/10.21236/ada607424.

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