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Thematische Bibliographien / Encapsulation for electronic / Dissertationen

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Dissertationen zum Thema „Encapsulation for electronic“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 29. Juli 2025

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1

Kaabeche, Nessima. "Transparent high barrier coatings for electronic encapsulation." Thesis, Manchester Metropolitan University, 2017. http://e-space.mmu.ac.uk/618981/.

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Barrier coatings are a category of functional films designed to enhance enduse properties to the underlying substrate. When used for electronic applications (such as flexible displays, digital paper, lighting, OLEDs and solar cells), the barrier characteristics are meant to protect the device from environmental influence, especially the permeation of oxygen and water vapour that can degrade and corrode the active layers of the devices (causing mal-functioning). In this project, silicon oxide barrier layers were deposited onto a non-treated BO-PET via plasma enhanced chemical vapour deposition,

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2

Pascarella, Nathan William. "Advanced encapsulation processing for low cost electronics assembly." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/19031.

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3

Evans, Michael 1977. "Encapsulation of electronic components for a retinal prosthesis." Thesis, Massachusetts Institute of Technology, 2000. http://hdl.handle.net/1721.1/9077.

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Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.<br>Includes bibliographical references (p. 65).<br>Long-term success of an implantable retinal prosthesis depends on the ability to hermetically seal sensitive electronics from a saline environment with an encapsulant material. Furthermore, the retinal implant project's proposed laser-driven prosthesis requires that the encapsulation material be transparent. The device itself has two components that must protrude out of the encapsulation material. The first is an electro

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4

Teh, Nee-Joo. "Direct polymeric encapsulation of electronic systems for automotive applications." Thesis, Loughborough University, 2004. https://dspace.lboro.ac.uk/2134/33881.

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Over the past forty years, compelling demands for safer, cleaner and more efficient vehicles have given rise to a drastic increase in the replacement of many traditional mechanical and electrical mechanisms by more advanced electronic systems. Due to their harsh operating environments, automotive electronic systems are subject to failures from thermomechanical stresses and corrosive breakdown, adversely affecting their reliability and lifespan. Furthermore, the development of bus communication protocols for improved control capabilities has prompted wider systems distribution within the restri

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5

Kim, Namsu. "Fabrication and characterization of thin-film encapsulation for organic electronics." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/31772.

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Thesis (Ph.D)--Mechanical Engineering, Georgia Institute of Technology, 2010.<br>Committee Chair: Samuel Graham; Committee Member: Bernard Kippelen; Committee Member: David McDowell; Committee Member: Sankar Nair; Committee Member: Suresh Sitaraman. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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6

Zhang, Rong. "Wafer level LED packaging with integrated DRIE trenches for encapsulation /." View abstract or full-text, 2008. http://library.ust.hk/cgi/db/thesis.pl?MECH%202008%20ZHANGR.

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7

Bowman, Amy Catherine. "A selective encapsulation solution for packaging an optical micro electro mechanical system." Link to electronic thesis, 2002. http://www.wpi.edu/Pubs/ETD/Available/etd-0108102-140953.

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Thesis (M.S.)--Worcester Polytechnic Institute.<br>Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).

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8

Visweswaran, Bhadri. "Encapsulation of organic light emitting diodes." Thesis, Princeton University, 2014. http://pqdtopen.proquest.com/#viewpdf?dispub=3665325.

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<p> Organic Light Emitting Diodes (OLEDs) are extremely attractive candidates for flexible display and lighting panels due to their high contrast ratio, light weight and flexible nature. However, the materials in an OLED get oxidized by extremely small quantities of atmospheric moisture and oxygen. To obtain a flexible OLED device, a flexible thin-film barrier encapsulation with low permeability for water is necessary. </p><p> Water permeates through a thin-film barrier by 4 modes: microcracks, contaminant particles, along interfaces, and through the bulk of the material. We have developed

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9

Lelong, Sandrine. "Étude de la fiabilité technologique de modules multipuces par des essais de vieillissement accéléré et par la modélisation de leur comportement thermomécanique." Grenoble INPG, 1998. http://www.theses.fr/1998INPG0030.

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L'objectif de cette etude est d'evaluer la fiabilite technologique de plusieurs types de mcm ou modules multipuces par des essais de vieillissement accelere et par des modelisations thermomecaniques par elements finis. Le but est de pouvoir correler les resultats experimentaux et les modelisations, afin de valider ces dernieres. Compte tenu de leurs performances (la miniaturisation et l'amelioration des performances electriques), les mcm sont susceptibles d'etre utilises dans des applications avioniques, militaires et spatiales. Mais, les technologies mcm etant recentes, leur fiabilite est enc

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10

Colin, Charlotte. "Synthèse et caractérisation de copolymères Silicone/Polyuréthane réticulés pour l'encapsulation de modules de puissance." Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLV028/document.

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L’électronique embarquée, notamment les modules de puissance, permet la gestion de l’énergie électrique et donc le développement de véhicules « décarbonés ». Toutefois, en vue d’être positionnés près du moteur thermique, ces composants électroniques devront résister à des environnements très divers et parfois à de sévères contraintes (humidité, agression chimique (huiles), vibrations…). Or, les matériaux d’encapsulation qui les protègent ne sont pas, aujourd’hui, assez performants pour répondre à ces nouvelles contraintes. Ainsi, le but de ces travaux de thèse est donc de développer de nouveau

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11

Rudy, Veronika. "Technologie zalévání LED pásků epoxidovými hmotami." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-443229.

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The thesis deals with the pouring of epoxy materials over LED strips. The research part contains an introduction to photometry and summarizes the types of potting compounds along with their characteristics. The practical part delves into the effect different amount of pigment has on the photometric properties. This is assessed based on verified measurements performed with the help of a goniophotometer on samples with different amounts of pigment, which were created using an integration sphere. Furthermore, a brightness analysis and a long-term outdoor test were performed.

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12

Podkoscielny, Dagmara Izabella. "Encapsulation of Redox Active Centers by Deep-Cavity Cavitands." Scholarly Repository, 2009. http://scholarlyrepository.miami.edu/oa_dissertations/244.

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This dissertation describes the effective encapsulation of redox active compounds inside deep-cavity cavitands: Gibb's octaacid40 and Rebek's 41 tetracarboxylate cavitand. Gibb's octaacid is a water-soluble, deep-cavity cavitand that forms well-characterized dimeric molecular capsules around hydrophobic guests. Both 1H NMR spectroscopic and voltammetric experiments clearly reveal that ferrocene plays the role of hydrophobic guest effectively. Ferrocene derivatives (ferrocenylmethyltrimethylammonium (FcNMe3+), ferrocenemethanol (FcOH), and ferrocene carboxylic acid (FcCOOH)) were also found to

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13

Czajkowski, J. (Jakub). "Optical coherence tomography as a characterization method in printed electronics." Doctoral thesis, Oulun yliopisto, 2013. http://urn.fi/urn:isbn:9789526202600.

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Abstract This Thesis proposes and describes the use of optical coherence tomography (OCT) as a non-contact and non-destructive characterization technique for printed electronics. It is based on and includes the first published results of such an application of the OCT technique. Several different types of structures were studied to evaluate the feasibility of the application. The measurement data was used to define the surface topography, physical dimensions of the specimen features, and to evaluate the ability to characterize multi-layered and multi-material structures. Presented OCT measurem

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14

Vastesson, Alexander. "Thiol-ene and Thiol-ene-epoxy Based Polymers for Biomedical Microdevices." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-215110.

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Within healthcare there is a market pull for biomedical devices that can rapidly perform laboratory processes, such as diagnostic testing, in a hand-held format. For this reason, biomedical devices must become smaller, more sophisticated, and easier to use for a reasonable cost. However, despite the accelerating academic research on biomedical microdevices, and especially plastic-based microfluidic chips, there is still a gap between the inventions in academia and their benefit to society. To bridge this gap there is a need for new materials which both exhibit similar properties as industrial

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15

Channa, Iftikhar Ahmed [Verfasser], Josef [Akademischer Betreuer] Breu, and Christoph [Gutachter] Brabec. "Development of Solution Processed Thin Film Barriers for Encapsulating Thin Film Electronics / Iftikhar Ahmed Channa ; Gutachter: Christoph Brabec ; Betreuer: Josef Breu." Erlangen : Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 2019. http://d-nb.info/120214604X/34.

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16

Schmidt, Margot Marion [Verfasser], Horst-Christian [Akademischer Betreuer] Langowski, Heiko [Akademischer Betreuer] Briesen, Karl [Akademischer Betreuer] Sommer, and Jens-Peter [Akademischer Betreuer] Majschak. "High barrier materials for flexible and transparent encapsulation of organic electronics / Margot Marion Schmidt. Gutachter: Horst-Christian Langowski ; Heiko Briesen ; Karl Sommer ; Jens-Peter Majschak. Betreuer: Horst-Christian Langowski." München : Universitätsbibliothek der TU München, 2013. http://d-nb.info/1047440946/34.

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17

Delafresnaye, Laura. "Élaboration de latex nanocomposites polymère/argile pour la formation de films barrière à l'oxygène et à la vapeur d'eau." Thesis, Lyon 1, 2015. http://www.theses.fr/2015LYO10349.

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18

Thomas, Daniel. "Réalisation de transistors à un électron par encapsulation d’îlots nanométriques de platine dans une matrice diélectrique en utilisant un procédé ALD." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEI131/document.

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L'introduction du transistor à un électron (SET) a secoué l'industrie des semi-conducteurs, avec des promesses d'efficacité inégalée. Cependant, le coût et la complexité associés à la réalisation d'un fonctionnement stable ont fortement entravé leur adoption. Après être tombé en dehors des grâces de l'industrie, la recherche universitaire a continué à pousser, démontrant des techniques novatrices pour la création de SET. Au cœur de ce problème de stabilité, il y a le besoin de construire de manière contrôlable des nanoislands de moins de 10 nm. Parmi les méthodes disponibles pour cette formati

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19

Ben, Naceur Walim. "Evaluation des solutions d'encapsulation quasi-hermétique pour les composants actifs hyperfréquences." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2013. http://tel.archives-ouvertes.fr/tel-00991023.

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Les composants hyperfréquences embarqués dans des satellites utilisent actuellement l'encapsulation hermétique dans des boîtiers métalliques ou céramiques. La très forte amélioration des matériaux organiques en termes de dégazage et d'impureté ionique notamment rend possible l'utilisation de solutions quasi-hermétiques pour l'environnement spatial. Les encapsulations plastiques ouvrent des perspectives avérées de gain de dimension et de coût. La validation d'une technologie d'encapsulation repose sur la réalisation d'essais de fiabilité normatifs (1000 heures à 85°C et 85% d'humidité relative)

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20

Dollinger, Felix. "Untersuchung von Multilagenbarrieren für die Verkapselung organischer Bauelemente." Master's thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-188948.

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Elektronische Bauteile aus organischen Halbleitern stellen höchste Anforderungen an die Qualität der Verkapselung, die sie vor eindringenden Wasser- und Luftmolekülen schützt. Gleichzeitig soll diese preiswert und mechanisch flexibel sein. Diese Arbeit realisiert Aluminium-Mehrschichtsysteme als wirkungsvolle, biegsame und einfache Verkapselung. Es werden verschiedene Herstellungsmethoden und Zwischenschichtmaterialien untersucht, wobei die Barrierelamination als überlegenes Verfahren etabliert wird. Verkapselungssysteme werden mittels optischer Untersuchung und mit dem elektrischen Calciumtes

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21

Dorji, Chencho. "Etude des propriétés des isolants liquides pour l’encapsulation des substrats d’électronique de puissance." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT022.

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Les modules de puissance basés sur un semi-conducteur à large bande interdite ont le potentiel de résister à des températures élevées (température de jonction >> 200°C) et à des tensions élevées (tension de blocage de 10 kV) contrairement aux modules de puissance à base de silicium. Cependant, le gel de silicone, le matériau d'encapsulation le plus couramment utilisé dans les modules d'alimentation, ne peut pas fonctionner au-dessus de 200°C. De plus, les pannes électriques et les décharges partielles entraînent des dommages permanents au module d'alimentation. Dans ce travail, nous prop

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22

Halawani, Nour. "Innovative materials for packaging." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEI010/document.

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Ce travail porte sur l'étude du mélange thermodurcissable - thermoplastique (époxyamine / polyetherimide avec séparation de phase) pour évaluer les performances électriques et thermiques. Ces matériaux seraient des nouveaux candidats pour remplacer la couche d'encapsulation dans les semi-conducteurs, par exemple ceux utilisés comme interrupteur dans les applications électroniques de puissance. Les mélanges de polymères seraient un nouveau candidat en tant qu'isolant pour le système. La matrice epoxy-amine seul et les melanges epoxy / Polyetherimide on été caractérisés par microscopie électroni

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Nardes, Alexandre Mantovani. "Condutividade de películas finas de PEDOT:PSS." Universidade de São Paulo, 2007. http://www.teses.usp.br/teses/disponiveis/3/3140/tde-27032015-150109/.

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As interessantes propriedades eletrônicas, mecânicas e óticas dos materiais orgânicos conjugados fizeram emergir diversas aplicações tecnológicas e comerciais em dispositivos baseados nesses materiais, tais como sensores, memórias, células solares e diodos emissores de luz poliméricos (LEDs). Neste sentido, o tema central desta tese é o estudo das propriedades elétricas e morfológicas e os mecanismos de transporte eletrônico de cargas no PEDOT:PSS, uma blenda polimérica que consiste de um policátion condutivo, o poli(3,4- etilenodioxitiofeno) (PEDOT) e do poliânion poli(estirenosulfonado) (PSS

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Wu, Hsuan-Ju, and 吳宣儒. "A Study on Encapsulation Strategy for Electronic Records." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/30770774891437303093.

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碩士<br>淡江大學<br>資訊與圖書館學系<br>92<br>The study is aimed to sum up the concepts of Victorian Electronic Records Strategy from Australia through research articles and content analysis. The study also evaluates the feasibility of our government’s using encapsulation as the electronic records preservation approach through in-depth interviews. The conclusions are as follows: 1.VERS is totally designed for the long-term preservation of the electronic records. And it is a very thorough scheme, which has been implemented for years and still on-going. 2.Encapsulation strateg

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Chen, Li-Chuan, and 陳莉娟. "A Study on Encapsulation Strategy and Tools for Electronic Records." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/19847248378857281258.

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碩士<br>淡江大學<br>資訊與圖書館學系碩士班<br>98<br>This study is aimed to sum up concept of research articles analysis and system implementation. We will focus on encapsulation strategy and relative tools for electronic records. Based on academic theory and the physical demand, to investigate how encapsulation strategy can be applied in electronic records long term preservation. Then construct a dynamic electronic records encapsulation model may solve the electronic records long term preservation by the time. The conclusions are as followed： 1.The dynamic encapsulation strategy ensures electronic record

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26

Sill, Kevin N. "Quantum dot - polymer nanocomposites: New materials for dispersion, encapsulation, and electronic applications." 2006. https://scholarworks.umass.edu/dissertations/AAI3242311.

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Tremendous advances in the synthesis and functionalization of nanoparticles over the past twenty years have resulted in remarkable discoveries in the field of nanotechnology. One such development is found in quantum dots, semiconductor nanoparticles that exhibit unique optical and electronic properties not found in the bulk. Research efforts associated with the combination of quantum dots and polymers center on uniting the mechanical or processing properties of the polymer with the optical properties of the quantum dot. Simply blending polymers with nanoparticles typically leads to nanoparticl

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27

Martins, Inês de Oliveira. "Parylene C as substrate, dielectric and encapsulation for flexible electronics applications." Master's thesis, 2017. http://hdl.handle.net/10362/31877.

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Flexible electronics have received a lot of attention in recent days due to the several possible applications that can be envised. The aim of this work was to produce thin film transistors (TFTs) fully conformal and flexible suitable for skin electronics applications. For that, parylene C was used as a flexible substrate and, since parylene has good electrical properties, being a good insulator, it was also used as dielectric and encapsulation layers of the TFTs, combining all parylene C qualities in one device. Parylene is a semicrystalline polymer, so to study how some parameters such as th

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28

Chang, Chih-Yu, and 張志宇. "Applications of Atomic Layer Deposition Films on Organic Electronic Devices: Photo-Patterning, Encapsulation, and Buffer Layer." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/34522318273781702565.

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博士<br>臺灣大學<br>材料科學與工程學研究所<br>98<br>This study utilized atomic layer deposition (ALD) to develop solutions to critical problems of organic electronics, including patterning-enabling and electron-injection- enhancing dual-functioning films for organic light-emitting diodes (OLEDs), gas-permeation barriers for the thin-film encapsulation of organic solar cells (OSCs), and permeation-blocking and electron-collecting dual-functioning films for flexible air-stable OSCs. On OLEDs, we demonstrated that with a 10-Å ALD Al2O3 film overcoated on a poly[1-methoxy-4-(2’-ethyl-hexyloxy)-2,5-phenylenevinylen

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Ahmad, Jakaria. "Synthesis and characterization of plasma polymer thin films from γ-terpinene for encapsulation of electronic devices". Thesis, 2015. https://researchonline.jcu.edu.au/39960/1/39960-ahmad-2015-thesis.pdf.

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The rapid development of polymers and polymer based materials is leading to a number of promising organic devices e.g., solar cells and solid-state lighting, advancing display technology, sensors, and thin-film transistors. One obstacle to this development is the susceptibility of these devices to water vapor and oxygen that causes rapid degradation in many organic electronic devices. In order to maintain the efficiency and guarantee the minimum lifetime needed for various applications, high barrier performance encapsulation materials and structures must be developed. In this work, radio frequ

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Gupta, Satyajit. "Development of Hybrid Organic/Inorganic Composites as a Barrier Material for Organic Electronics." Thesis, 2013. http://etd.iisc.ac.in/handle/2005/3408.

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The ultra high barrier films for packaging find applications in a wide variety of areas where moisture and oxygen barrier is required for improved shelf-life of food/beverage products and for microbial free pharmaceutical containers. These materials also find applications in micro electro mechanical systems such as ICs, and for packaging in industrial and space electronics. Flexible and portable organic electronics like OLEDs (Organic Light Emitting Diodes), OPVDs (Organic Photo Voltaic Devices) and dye sensitized solar cells (DSSCs) have a good potential in next generation solar powered dev

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Gupta, Satyajit. "Development of Hybrid Organic/Inorganic Composites as a Barrier Material for Organic Electronics." Thesis, 2013. http://etd.iisc.ernet.in/2005/3408.

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The ultra high barrier films for packaging find applications in a wide variety of areas where moisture and oxygen barrier is required for improved shelf-life of food/beverage products and for microbial free pharmaceutical containers. These materials also find applications in micro electro mechanical systems such as ICs, and for packaging in industrial and space electronics. Flexible and portable organic electronics like OLEDs (Organic Light Emitting Diodes), OPVDs (Organic Photo Voltaic Devices) and dye sensitized solar cells (DSSCs) have a good potential in next generation solar powered dev

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Tsai, Fang-Jing, and 蔡芳菁. "Encapsulating the contact pads of electronic devices with spacer process." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/jqdy8b.

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碩士<br>國立臺北科技大學<br>材料科學與工程研究所<br>101<br>Recently, the optoelectronic industry develops rapidly to increase the requirement of thinner and lighter properties for flat panel display products. Undoubtedly, the fabrication of organic light emitting diode (OLED) on flexible plastic substrate was the major technique in the next flat display generation. The encapsulation of organic semiconductor devices with the concept of multilayer films onto the devices and conductors is the major trend of producing thin and light weight devices for the industrial and research. However, ,the low process temperature

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Arora, Himani. "Charge transport in two-dimensional materials and their electronic applications." 2020. https://tud.qucosa.de/id/qucosa%3A74071.

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Semiconducting two-dimensional (2D) materials have gained considerable attention in recent years owing to their potential in future electronics. On the one hand, the conventional 2D semiconductors, such as transition metal dichalcogenides (TMDCs (MoS2, WS2, etc.) are being exhaustively studied, on the other hand, search for novel 2D materials is at a rapid pace. In this thesis, we explore 2D materials beyond graphene and TMDCs in terms of their intrinsic electronic properties and underlying charge transport mechanisms. We introduce 2D semiconducting materials of indium selenide (InSe) and gall

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