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Thematische Bibliographien / Encapsulation for electronic / Zeitschriftenartikel

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Zeitschriftenartikel zum Thema „Encapsulation for electronic“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 7. Februar 2022

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1

Winkler, Sebastian, Jan Edelmann, Christine Welsch, and Roman Ruff. "Different encapsulation strategies for implanted electronics." Current Directions in Biomedical Engineering 3, no. 2 (2017): 725–28. http://dx.doi.org/10.1515/cdbme-2017-0153.

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AbstractRecent advancements in implant technology include increasing application of electronic systems in the human body. Hermetic encapsulation of electronic components is necessary, specific implant functions and body environments must be considered. Additional functions such as wireless communication systems require specialized technical solutions for the encapsulation.In this paper 3 different implant strategies based on the material groups silicone, ceramics and titanium alloys are evaluated. With the background of a specific application the requirements for the encapsulation are defined and include the implementation of electrical feedthroughs, wireless communication and wireless energy transfer as well as biomedical specifications such as hermetic sealing, mechanical stability and biocompatibility. The encapsulations are manufactured and qualified experimentally.

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2

Kulkarni, Romit, Peter Wappler, Mahdi Soltani, et al. "An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages." Journal of Manufacturing and Materials Processing 3, no. 1 (2019): 18. http://dx.doi.org/10.3390/jmmp3010018.

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation serves as an added advantage by reducing the thermo-mechanical stresses occurring due to thermal-cyclic loading, compared to block-sized or thicker encapsulations. This paper assesses the encapsulation process of a board-level package by means of thermoset injection molding. Various aspects reviewed in this paper include the conception of a demonstrator, investigation of the flow simulation of the injection molding process, execution of molding trials with different encapsulation thicknesses, and characterization of the packages. The process shows a high dependence on the substrate properties, injection molding process parameters, device mounting tolerances, and device geometry tolerances. Nevertheless, the thermoset injection molding process is suitable for the encapsulation of board-level packages limiting itself only with respect to the thickness of the encapsulation material, which depends on other external aforementioned factors.

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3

Kinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack, and Gerhard Tröster. "Encapsulation for Flexible Electronic Devices." IEEE Electron Device Letters 32, no. 12 (2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.

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4

Kaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.

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Kaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.

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Abstract Enhancements on power electronic systems with reduced chip area and miniaturized passive components are subject of several research activities in academics and industry. To realize such future electronic devices, it is necessary to incorporate wide bandgap semiconductor technology such as silicon carbide and gallium nitride operating at higher temperatures. Therefore, the development of novel materials with high thermal conductivities and stability, withstanding harsh environments up to 300°C is of major interest. Especially, polymeric encapsulation materials have to be improved because of common degradation effects above 175°C. Ceramic (nonpolymeric) materials with thermal conductivities above 5 W/(m·K) already illustrated promising results for the encapsulation of power electronics. The present work illustrates recent developments and improvements on novel ceramic encapsulation materials, which finally avoid critical interactions with the chip surface. Furthermore, advances in reliability will be discussed in terms of passed high-temperature reverse bias and humidity tests correlated with relevant material properties.

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6

Guo, Jiahui, Yunru Yu, Dagan Zhang, Han Zhang, and Yuanjin Zhao. "Morphological Hydrogel Microfibers with MXene Encapsulation for Electronic Skin." Research 2021 (March 3, 2021): 1–10. http://dx.doi.org/10.34133/2021/7065907.

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Electronic skins with distinctive features have attracted remarkable attention from researchers because of their promising applications in flexible electronics. Here, we present novel morphologically conductive hydrogel microfibers with MXene encapsulation by using a multi-injection coflow glass capillary microfluidic chip. The coaxial flows in microchannels together with fast gelation between alginate and calcium ions ensure the formation of hollow straight as well as helical microfibers and guarantee the in situ encapsulation of MXene. The resultant hollow straight and helical MXene hydrogel microfibers were with highly controllable morphologies and package features. Benefiting from the easy manipulation of the microfluidics, the structure compositions and the sizes of MXene hydrogel microfibers could be easily tailored by varying different flow rates. It was demonstrated that these morphologically conductive MXene hydrogel microfibers were with outstanding capabilities of sensitive responses to motion and photothermal stimulations, according to their corresponding resistance changes. Thus, we believe that our morphologically conductive MXene hydrogel microfibers with these excellent features will find important applications in smart flexible electronics especially electronic skins.

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7

Yu, Yong Peng. "Research Progress of Heat Hv Insulation Resistance of Macromolecular Composite Materials." Advanced Materials Research 391-392 (December 2011): 332–35. http://dx.doi.org/10.4028/www.scientific.net/amr.391-392.332.

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Epoxy resin (EP) with excellent performance was widely used as electronic encapsulation materials, but the traditional EP can not meet require of nowadays electronic encapsulation materials in wet-heat resistance, flame retardant, insulation and other performance. So the current research progress of EP with wet-heat resistance and high-performance was summarized in the field of electronic encapsulation.

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8

Wong, C. P. "An Overview of Integrated Circuit Device Encapsulants." Journal of Electronic Packaging 111, no. 2 (1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

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The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.

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Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (2019): 508. http://dx.doi.org/10.3390/mi10080508.

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.

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Elshabini, Aicha, Fred Barlow, Sharmin Islam, and Pin-Jen Wang. "Advanced Devices and Electronic Packaging for Harsh Environment." International Symposium on Microelectronics 2013, no. 1 (2013): 000937–50. http://dx.doi.org/10.4071/isom-2013-thp61.

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The paper addresses the challenges in electronic packaging for extreme environment based on experimental work of the researchers and conducted reliability testing to evaluate high speed devices suitable for these applications, substrates, die attach, wire bonding, and encapsulation and housing. In particular, the researcher's work has focused on SiC power devices with low loss high voltage Schottky diodes with significant applications, high temperature JFETs and SiC MOSFETs (double trench), and GaN microwave devices. The paper provides recommendations for selection of devices, substrates, die attach, and encapsulation and housing for these applications.

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Han, S., K. K. Wang, and D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation." Journal of Electronic Packaging 119, no. 4 (1997): 247–54. http://dx.doi.org/10.1115/1.2792245.

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In this study, the wire-sweep problem has been studied by performing experiments using a commercial-grade epoxy molding compound, a real chip assembly, and an industrial encapsulation process. After encapsulating the chip, the deformed wire shape inside the plastic package has been determined by X-ray scanning. A procedure for the wire-sweep calculation during encapsulation process has been developed. The wire sweep values have been calculated using this procedure with material properties measured from experiments. The calculated wire-sweep values are compared with experimental values measured at different mold temperatures, fill times, and cavities. In most cases, the calculated values are in good agreement with the experimental values.

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SAKAI, Tadamoto, Shinji YAMAMOTO, Tsukasa SHIROGANEYA, and Akira KOSAKI. "Development of encapsulation moulding equipment for electronic devices." Journal of the Japan Society for Precision Engineering 54, no. 12 (1988): 2277–82. http://dx.doi.org/10.2493/jjspe.54.2277.

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13

Pecht, Michael, and Yuliang Deng. "Electronic device encapsulation using red phosphorus flame retardants." Microelectronics Reliability 46, no. 1 (2006): 53–62. http://dx.doi.org/10.1016/j.microrel.2005.09.001.

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14

de Beeck, Maaike Op, John O'Callaghan, Karen Qian, et al. "Biocompatible encapsulation and interconnection technology for implantable electronic devices." International Symposium on Microelectronics 2012, no. 1 (2012): 000215–24. http://dx.doi.org/10.4071/isom-2012-ta65.

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A biocompatible packaging process for implantable electronic systems is under development at imec, combining biocompatibility, hermeticity, extreme miniaturization and cost aspects. In a first phase of this packaging sequence, hermetic chip sealing is performed by encapsulating all chips to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, biostability, diffusion barrier properties and sensitivity to corrosion. Material selection and integration aspects are modified until good properties are obtained. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme. We selected the use of Pt due to its excellent biocompatibility and corrosion resistance. Since Pt is very expensive, a cost effective Pt-selective plating process is developed. During the third packaging step, all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all components are finally embedded using a medical grade elastomer such as PDMS or Poly-urethane.

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Kuganathan, Navaratnarajah, and Alexander Chroneos. "Tuning the electronic properties of C12A7 via Sn doping and encapsulation." Journal of Materials Science: Materials in Electronics 31, no. 23 (2020): 21203–13. http://dx.doi.org/10.1007/s10854-020-04633-8.

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AbstractCation doping in electride materials has been recently considered as a viable engineering strategy to enhance the electron concentration. Here we apply density functional theory-based energy minimisation techniques to investigate the thermodynamical stability and the electronic structures of Sn-doped and Sn-encapsulated in stoichiometric and electride forms of C12A7. The present calculations reveal that encapsulation is exoergic and doping is endoergic. The electride form is more energetically favourable than the stoichiometric form for both encapsulation and doping. Encapsulation in the electride results a significant electron transfer (1.52 |e|) from the cages consisting of extra-framework electrons to the Sn atom. The Sn forms almost + 4 state in the doped configuration in the stoichiometric form as reported for the electride form in the experiment. Similar charge state for the Sn is expected for the electride form though the extra-framework electrons localised on the Sn. Resultant complexes of both forms are magnetic. Whilst significant Fermi energy shift is noted for the doping in C12A7:O2− (by 1.60 eV) towards the conduction band, there is a very small shift (0.04 eV) is observed in C12A7:e−. Future experimental study on the encapsulation of Sn in both forms of C12A7 and doping of Sn in the stoichiometric form can use this information to interpret their experimental data.

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Gembaczka, P., M. Görtz, Y. Celik, et al. "Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition." Journal of Sensors and Sensor Systems 3, no. 2 (2014): 335–47. http://dx.doi.org/10.5194/jsss-3-335-2014.

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Abstract. Implantable MEMS sensors are an enabling technology for diagnostic analysis and therapy in medicine. The encapsulation of such miniaturized implants remains a largely unsolved problem. Medically approved encapsulation materials include titanium or ceramics; however, these result in bulky and thick-walled encapsulations which are not suitable for MEMS sensors. In particular, for MEMS pressure sensors the chip surface comprising the pressure membranes must be free of rigid encapsulation material and in direct contact with tissue or body fluids. This work describes a new kind of encapsulation approach for a capacitive pressure sensor module consisting of two integrated circuits. The micromechanical membrane of the pressure sensor may be covered only by very thin layers, to ensure high pressure sensitivity. A suitable passivation method for the high topography of the pressure sensor is atomic layer deposition (ALD) of aluminium oxide (Al2O3) and tantalum pentoxide (Ta2O5). It provides a hermetic passivation with a high conformity. Prior to ALD coating, a high-temperature resistant polyimide–epoxy composite was evaluated as a die attach material and sealing compound for bond wires and the chip surface. This can sustain the ALD deposition temperature of 275 °C for several hours without any measurable decomposition. Tests indicated that the ALD can be deposited on top of the polyimide–epoxy composite covering the entire sensor module. The encapsulated pressure sensor module was calibrated and tested in an environmental chamber at accelerated aging conditions. An accelerated life test at 60 °C indicated a maximum drift of 5% full scale after 1482 h. From accelerated life time testing at 120 °C a maximum stable life time of 3.3 years could be extrapolated.

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Nashed, Mohamad-Nour, Dorothy Hardy, Theodore Hughes-Riley, and Tilak Dias. "A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles." Fibers 7, no. 2 (2019): 12. http://dx.doi.org/10.3390/fib7020012.

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Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%.

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Winkler, Anja, Adrian Ehrenhofer, Thomas Wallmersperger, Maik Gude, and Niels Modler. "Soft robotic structures by smart encapsulation of electronic devices." Procedia Manufacturing 52 (2020): 277–82. http://dx.doi.org/10.1016/j.promfg.2020.11.046.

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19

Fujii, Shintaro, Haruna Cho, Yoshifumi Hashikawa, Tomoaki Nishino, Yasujiro Murata, and Manabu Kiguchi. "Tuneable single-molecule electronic conductance of C60 by encapsulation." Physical Chemistry Chemical Physics 21, no. 23 (2019): 12606–10. http://dx.doi.org/10.1039/c9cp02469g.

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It has been demonstrated that the single-molecule transport properties of fullerene C<sub>60</sub> can be modulated by encapsulating endohedral species, i.e. Li<sup>+</sup> and H<sub>2</sub>O, which exhibit different degrees of van der Waals interactions with the C<sub>60</sub> cage.

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Ho, Tzong-Rann, and Chun-Shan Wang. "Dispersed acrylate rubber-modified epoxy resins for electronic encapsulation." Journal of Polymer Research 1, no. 1 (1994): 103–8. http://dx.doi.org/10.1007/bf01378600.

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21

Sakai, Tadamoto. "Encapsulation process for electronic devices using injection molding method." Advances in Polymer Technology 12, no. 1 (1993): 61–71. http://dx.doi.org/10.1002/adv.1993.060120106.

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22

Kim, Shin Young, Bong Jun Kim, Do Heung Kim, and Sung Gap Im. "A monolithic integration of robust, water-/oil-repellent layer onto multilayer encapsulation films for organic electronic devices." RSC Advances 5, no. 84 (2015): 68485–92. http://dx.doi.org/10.1039/c5ra10425d.

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23

Park, Chan, Hyunsuk Jung, Hyunwoo Lee, Sunguk Hong, Hyonguk Kim, and Seong Cho. "One-Step Laser Encapsulation of Nano-Cracking Strain Sensors." Sensors 18, no. 8 (2018): 2673. http://dx.doi.org/10.3390/s18082673.

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Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cause noise and shorten the sensor lifetimes. This study reports the development of a nano-crack-based flexible sensor with mechanically, thermally, and chemically stable electrical characteristics in external environments using a novel one-step laser encapsulation (OLE) method optimized for thin films. The OLE process allows simultaneous patterning, cutting, and encapsulating of a device using laser cutting and thermoplastic polymers. The processes are simplified for economical and rapid production (one sensor in 8 s). Unlike other encapsulation methods, OLE does not degrade the performance of the sensor because the sensing layers remain unaffected. Sensors protected with OLE exhibit mechanical, thermal, and chemical stability under water-, heat-, dust-, and detergent-exposed conditions. Finally, a waterproof, flexible strain sensor is developed to detect motions around the eye, where oil and sweat are generated. OLE-based sensors can be used in several applications that are exposed to a large amount of foreign matter, such as humid or sweaty environments.

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Mosallaei, Mahmoud, Jarno Jokinen, Mikko Kanerva, and Matti Mäntysalo. "The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects." Micromachines 9, no. 12 (2018): 645. http://dx.doi.org/10.3390/mi9120645.

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The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects. In this paper, the geometry of encapsulation layer is initially investigated using finite element analysis. Then, the stretchable interconnects with a narrow-to-wide layout are screen-printed using silver flake ink as a conductor on a thermoplastic polyurethane (TPU) substrate. Printed ultraviolet (UV)-curable screen-printed dielectric ink and heat-laminated TPU film are used for the encapsulation of the samples. The electromechanical tests reveal a noticeable improvement in performance of encapsulated samples compared to non-protected counterparts in the case of TPU encapsulation. The improvement is even greater with partial coverage of the encapsulation layer. A device with a modified encapsulation layer can survive for 10,000 repetitive cycles at 20% strain, while maintaining the electrical and mechanical performance.

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Yu, Yunru, Jiahui Guo, Lingyu Sun, Xiaoxuan Zhang, and Yuanjin Zhao. "Microfluidic Generation of Microsprings with Ionic Liquid Encapsulation for Flexible Electronics." Research 2019 (June 19, 2019): 1–9. http://dx.doi.org/10.34133/2019/6906275.

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Inspired by helical or spiral veins, which endow plants with excellent flexibility and elasticity to withstand storms, we present novel hollow microsprings with ionic liquid encapsulation for flexible and stretchable electronics. The microsprings were generated by using a coaxial capillary microfluidic device to consecutively spin poly(vinylidene fluoride) (PVDF) presolution and an ionic liquid, which formed laminar flows in the coaxial injection microfluidic channels. The fast phase inversion of PVDF helps to form the core-shell structure of a microfiber and guarantees the in situ encapsulation of ionic liquid. The hybrid microfiber can then spiral and be further solidified to maintain the helical structure with increasing flow rates of the injection fluids. Because of the feasible and precise control of the injection fluids during the microfluidic spinning, the resultant microsprings have controlled core-shell structures, helical pitches, and corresponding electromechanical properties. By further embedding them into stretchable films, the simple paradigm of a flexible device shows great conductive performance in tensile tests and even motion cycles, which could be explored as a promising candidate in stretchable sensors, flexible electronics, and electronic skins.

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Dai, Xinyue, Yanyan Jiang, and Hui Li. "BAs nanotubes with non-circular cross section shapes for gas sensors." Physical Chemistry Chemical Physics 22, no. 22 (2020): 12584–90. http://dx.doi.org/10.1039/d0cp01708f.

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27

Chen, Li Xin, Ling Yu Fan, and Li Shuai Gao. "Modification of Epoxy Resin with Silicone for Electronic Encapsulation Application." Advanced Materials Research 936 (June 2014): 643–50. http://dx.doi.org/10.4028/www.scientific.net/amr.936.643.

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The reaction was carried out with a solventless (hot-melt) method using epoxy resin (E-20) as a base material and dihydroxydiphenylsilane (DHDPS) or polymethyltriethoxysilane (PTS) as a modifier. IR spectrum, epoxy value of modified epoxy resins indicated that DHDPS and PTS were incorporated into epoxy resin respectively. The influences of silicone contents on softening point and thermal resistance of cured silicone modified epoxy resin systems were studied. The thermal stability was investigated by thermogravimetic analysis (TGA). Effects of the viscosity of packaging slurry on the performance of encapsulated electronic elements were also investigated. In contrast to ED-20 cured system, the thermal resistance, toughness, humidity resistance of ETS-20 cured systems improved more obvious. And ETS-20 has exhibited excellent resistance to the thermal shock cycling test. It indicated that ETS-20 can be applicated for electronic encapsulation. The viscosity of packaging slurry was most appropriate when it was 170~200 mPas.

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Ho, Tzong-Hann, and Chun-Shan Wang. "Modification of epoxy resins by hydrosilation for electronic encapsulation application." Journal of Applied Polymer Science 54, no. 1 (1994): 13–23. http://dx.doi.org/10.1002/app.1994.070540102.

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29

Lovino, Magalí, M. Fernanda Cardinal, Diana B. V. Zubiri, and Delia L. Bernik. "Electronic nose screening of ethanol release during sol–gel encapsulation." Biosensors and Bioelectronics 21, no. 6 (2005): 857–62. http://dx.doi.org/10.1016/j.bios.2005.02.003.

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30

Sawyer, Eric J., Aliaksandr V. Zaretski, Adam D. Printz, Nathaniel V. de los Santos, Alejandra Bautista-Gutierrez, and Darren J. Lipomi. "Large increase in stretchability of organic electronic materials by encapsulation." Extreme Mechanics Letters 8 (September 2016): 78–87. http://dx.doi.org/10.1016/j.eml.2016.03.012.

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31

Beigi, Homayoon, and Judith A. Markowitz. "Standard audio format encapsulation (SAFE)." Telecommunication Systems 47, no. 3-4 (2010): 235–42. http://dx.doi.org/10.1007/s11235-010-9315-1.

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32

Kuganathan, Navaratnarajah, Ruslan V. Vovk, and Alexander Chroneos. "Mayenite Electrides and Their Doped Forms for Oxygen Reduction Reaction in Solid Oxide Fuel Cells." Energies 13, no. 18 (2020): 4978. http://dx.doi.org/10.3390/en13184978.

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The oxygen reduction reaction is an important reaction at the cathode in solid oxide fuel cells. Materials that exhibit high chemical and mechanical stability, high ionic and electronic conductivity, and are non-toxic are of great interest as cathodes for the reduction of oxygen. Here, we use density functional theory simulations to examine the efficacy of 12CaO·7Al2O3 and 12SrO·7Al2O3 electrides and their doped forms for the conversion of O2 gas to form O2− in their nanocages via encapsulation. Calculations show that encapsulation is exoergic in the un-doped electrides, and the formation of O2− is confirmed by the charge analysis. A stronger encapsulation is noted for C12A7 electride than the S12A7 electride. The C12A7 electride doped with B or Ga also exhibits exoergic encapsulation, but its encapsulation energy is slightly lower than that calculated for the un-doped C12A7 electride. There is an enhancement in the encapsulation for the S12A7 electride doped with B compared to its un-doped form. Doping of Ga in S12A7 electride exhibits only a very small change in the encapsulation with respect to its un-doped form. The present results can be of interest in the design of cathode material for solid oxide fuel cells.

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Lee, Harrison Ka Hin, Andrew M. Telford, Jason A. Röhr, et al. "The role of fullerenes in the environmental stability of polymer:fullerene solar cells." Energy & Environmental Science 11, no. 2 (2018): 417–28. http://dx.doi.org/10.1039/c7ee02983g.

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34

Kulkarni, Romit, Mahdi Soltani, Peter Wappler, et al. "Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding." Journal of Manufacturing and Materials Processing 4, no. 1 (2020): 26. http://dx.doi.org/10.3390/jmmp4010026.

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A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end.

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35

Horejs, Christine. "Preventing fibrotic encapsulation." Nature Reviews Materials 6, no. 7 (2021): 554. http://dx.doi.org/10.1038/s41578-021-00338-4.

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36

Li, Kan, Xu Cheng, Feng Zhu, et al. "A Generic Soft Encapsulation Strategy for Stretchable Electronics." Advanced Functional Materials 29, no. 8 (2019): 1806630. http://dx.doi.org/10.1002/adfm.201806630.

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37

Manna, Utsab, and Gopal Das. "Halo-methylphenyl substituted neutral tripodal receptors for cation-assisted encapsulation of anionic guests of varied dimensionality." CrystEngComm 20, no. 31 (2018): 4406–20. http://dx.doi.org/10.1039/c8ce00885j.

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38

Choi, Yeon Sik, Jahyun Koo, Young Joong Lee, et al. "Biodegradable Polyanhydrides as Encapsulation Layers for Transient Electronics." Advanced Functional Materials 30, no. 31 (2020): 2000941. http://dx.doi.org/10.1002/adfm.202000941.

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39

Rinaldi, Gilberto, Alessia Catalani, Giulio Rubini, and Daniele Surace. "Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits." Journal of Microelectronics and Electronic Packaging 2, no. 1 (2005): 55–63. http://dx.doi.org/10.4071/1551-4897-2.1.55.

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The chemical modification of a polyalkylene-polyamine by reaction with phenol and formaldehyde allowed the obtainment of a series of curing agents tailored for an epoxy formulation suitable for the “conformal coating” of electronic assemblies. The mechanical, physical and above all electrical properties and durability of the coatings were measured; the presence of inorganic fillers (quartz and mica) into the formulation was also experimented with satisfactory results.

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Majee, Subimal, Maria Fátima Cerqueira, Denis Tondelier, et al. "Flexible organic–inorganic hybrid layer encapsulation for organic opto-electronic devices." Progress in Organic Coatings 80 (March 2015): 27–32. http://dx.doi.org/10.1016/j.porgcoat.2014.11.015.

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41

Brewer, Aaron, Alice Dohnalkova, Vaithiyalingam Shutthanandan, et al. "Microbe Encapsulation for Selective Rare-Earth Recovery from Electronic Waste Leachates." Environmental Science & Technology 53, no. 23 (2019): 13888–97. http://dx.doi.org/10.1021/acs.est.9b04608.

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42

Yu, Duan, Yong-Qiang Yang, Zheng Chen, Ye Tao, and Yun-Fei Liu. "Recent progress on thin-film encapsulation technologies for organic electronic devices." Optics Communications 362 (March 2016): 43–49. http://dx.doi.org/10.1016/j.optcom.2015.08.021.

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43

Abbott, Michael B. "The electronic encapsulation of knowledge in hydraulics, hydrology and water resources." Advances in Water Resources 16, no. 1 (1993): 21–39. http://dx.doi.org/10.1016/0309-1708(93)90027-d.

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44

Ho, Tsung-Han, Jenn-Hwa Wang, and Chun-Shan Wang. "Modification of epoxy resins with polysiloxane TPU for electronic encapsulation. II." Journal of Applied Polymer Science 60, no. 8 (1996): 1097–107. http://dx.doi.org/10.1002/(sici)1097-4628(19960523)60:8<1097::aid-app3>3.0.co;2-g.

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45

Kuganathan, Navaratnarajah, Ratnasothy Srikaran, and Alexander Chroneos. "Stability of Coinage Metals Interacting with C60." Nanomaterials 9, no. 10 (2019): 1484. http://dx.doi.org/10.3390/nano9101484.

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Buckminsterfullerene (C60) has been advocated as a perfect candidate material for the encapsulation and adsorption of a variety of metals and the resultant metallofullerenes have been considered for the use in different scientific, technological and medical areas. Using spin-polarized density functional theory together with dispersion correction, we examine the stability and electronic structures of endohedral and exohedral complexes formed between coinage metals (Cu, Ag and Au) and both non-defective and defective C60. Encapsulation is exoergic in both forms of C60 and their encapsulation energies are almost the same. Exohedral adsorption of all three metals is stronger than that of endohedral encapsulation in the non-defective C60. Structures and the stability of atoms interacting with an outer surface of a defective C60 are also discussed. As the atoms are stable both inside and outside the C60, the resultant complexes can be of interest in different scientific and medical fields. Furthermore, all complexes exhibit magnetic moments, inferring that they can be used as spintronic materials.

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Pahuja, Akshu, and Sunita Srivastava. "Electronic Transport Properties of Doped C28 Fullerene." Physics Research International 2014 (November 26, 2014): 1–7. http://dx.doi.org/10.1155/2014/872381.

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Endohedral doping of small fullerenes like C28 affects their electronic structure and increases their stability. The transport properties of Li@C28 sandwiched between two gold surfaces have been calculated using first-principles density functional theory and nonequilibrium Green’s function formalism. The transmission curves, IV characteristics, and molecular projected self-consistent Hamiltonian eigenstates of both pristine and doped molecule are computed. The current across the junction is found to decrease upon Li encapsulation, which can be attributed to change in alignment of molecular energy levels with bias voltage.

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47

Candler, R. N., Woo-Tae Park, Huimou Li, et al. "Single wafer encapsulation of mems devices." IEEE Transactions on Advanced Packaging 26, no. 3 (2003): 227–32. http://dx.doi.org/10.1109/tadvp.2003.818062.

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48

Huang, Shuyi, Weipeng Xuan, Shuting Liu, et al. "Ultra-thin atom layer deposited alumina film enables the precise lifetime control of fully biodegradable electronic devices." Nanoscale 11, no. 46 (2019): 22369–77. http://dx.doi.org/10.1039/c9nr06566k.

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ALD-grown ultra-thin alumina is proposed as an encapsulation layer to precisely control the lifetimes of biodegradable electronics, which enables surface acoustic wave devices to perform normally within designed period in bio-fluid.

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Persano, Anna, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano, and Jacopo Iannacci. "Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems." Sensors 20, no. 7 (2020): 2133. http://dx.doi.org/10.3390/s20072133.

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In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.

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50

Löffler, Susanne, Axel Wuttke, Bo Zhang, Julian J. Holstein, Ricardo A. Mata, and Guido H. Clever. "Influence of size, shape, heteroatom content and dispersive contributions on guest binding in a coordination cage." Chem. Commun. 53, no. 87 (2017): 11933–36. http://dx.doi.org/10.1039/c7cc04855f.

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Encapsulation of neutral guest molecules inside a self-assembled coordination cage was systematically studied using NMR and MS experiments. Electronic structure calculations reveal substantial contributions of dispersive interactions to binding.

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