Thematische Bibliographien / Hybrid integrated circuits industry

Inhaltsverzeichnis

  1. Zeitschriftenartikel
  2. Dissertationen
  3. Bücher
  4. Buchteile
  5. Konferenzberichte
  6. Berichte der Organisationen

Auswahl der wissenschaftlichen Literatur zum Thema „Hybrid integrated circuits industry“

Autor: Grafiati
Veröffentlicht am 4. Juni 2021
Zuletzt aktualisiert am 29. Juli 2025

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Zeitschriftenartikel zum Thema "Hybrid integrated circuits industry"

1

Mishra, Brijendra, Vivek Singh Kushwah, and Rishi Sharma. "MODELING OF HYBRID MOS FOR THE IMPLEMENTATION OF SWITCHED CAPACITOR FILTER USING SINGLE ELECTRON TRANSISTOR." International Journal of Engineering Technologies and Management Research 5, no. 2 (2020): 294–300. http://dx.doi.org/10.29121/ijetmr.v5.i2.2018.659.

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In digital integrated circuit architectures, transistors serve as circuit switches to charge and discharge capacitors to the required logic voltage levels. A transistor is a three terminal semiconductor device used to amplify and switch electronic signals and electrical power. It has been observed that the Scaling down of electronic device sizes has been the fundamental strategy for improving the performance of ultra-large-scale integrated circuits (ULSIs). Metaloxide-semiconductor field-effect transistors (MOSFETs) have been the most prevalent electron devices for ULSI applications. A better
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Brijendra, Mishra *1, Singh Kushwah 1. Vivek, and Sharma 2. Rishi. "MODELING OF HYBRID MOS FOR THE IMPLEMENTATION OF SWITCHED CAPACITOR FILTER USING SINGLE ELECTRON TRANSISTOR." International Journal of Engineering Technologies and Management Research 5, no. 2 (SE) (2018): 294–300. https://doi.org/10.5281/zenodo.1247477.

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In digital integrated circuit architectures, transistors serve as circuit switches to charge and discharge capacitors to the required logic voltage levels. A transistor is a three terminal semiconductor device used to amplify and switch electronic signals and electrical power. It has been observed that the Scaling down of electronic device sizes has been the fundamental strategy for improving the performance of ultra-large-scale integrated circuits (ULSIs). Metaloxide-semiconductor field-effect transistors (MOSFETs) have been the most prevalent electron devices for ULSI applications. A better
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3

Bhartia, Prakash, Jim Angeloni, and Will Bolinger. "Flexible Hand-Free Microelectronics assembly Line for the Chip and Wire industry." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000790–826. http://dx.doi.org/10.4071/2015dpc-tp35.

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This paper presents Natel's effort in pioneering the design and development of the first Touch-Free Microelectronics assembly Line for the Chip and Wire industry. When the Surface Mount Technology (SMT) industry first started, it began as a series of discrete pieces of equipment that performed the functions required to populate Circuit Cards. Over the years, the technology has evolved as has the industry such that fully integrated, automated lines are available where the circuit cards are installed at one end of the line, reels or tubes of components, such as packaged resistors, inductors, cap
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Huang, Yuan-Chiu, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, and Kuan-Neng Chen. "Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application." Nanomaterials 13, no. 17 (2023): 2490. http://dx.doi.org/10.3390/nano13172490.

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Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu) bonding has become the preferred choice due to its excellent electrical and thermal properties. However, one of the major challenges of Cu-Cu bonding is the high thermal budget of the bonding process caused by Cu oxidation, which can result in wafer warpage and other back-end-of-line process issues in some cases. Thus, for specific applications, reducing
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Nambiar, Jitesh Sreedharan. "Best Practices for Building Semiconductor Chip Bills of Material." European Journal of Computer Science and Information Technology 13, no. 33 (2025): 65–75. https://doi.org/10.37745/ejcsit.2013/vol13n336575.

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The semiconductor manufacturing industry relies on precise Bills of Material (BOM) management to navigate the complex transition from raw silicon wafers to functional integrated circuits. This comprehensive article explores best practices for building semiconductor chip BOMs across the entire manufacturing lifecycle. From wafer fabrication through die conversion, testing, burn-in, and final packaging, each manufacturing stage introduces unique BOM management requirements. The distinction between Engineering BOMs and Production BOMs represents a critical consideration, with each serving differe
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Mrs., P. Thilagavathi*, Basha Dr.A.Mahabub, and G.Navinraj. "SoC BASED MODERN HYBRID TEST COMPRESSION." International Journal OF Engineering Sciences & Management Research 3, no. 4 (2016): 19–26. https://doi.org/10.5281/zenodo.49821.

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Test vector compression is an emerging trend in the field of VLSI testing. According to these trends, increasing test data volume is one of the biggest challenges in the testing industry. In order to reduce on-chip storage as well as testing time ,the large volume of test data input is compressed in hybrid manner before being downloaded into the processer. Test compression involves compressing the large volumes of test data to small test sets that fit in the memory of Automatic Test Equipment. As the density of VLSI circuit increases, high test quality in smaller geometries can be achieved onl
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Wang, Min, Zhiwei Fang, Haisu Zhang, et al. "Recent Progresses on Hybrid Lithium Niobate External Cavity Semiconductor Lasers." Materials 17, no. 18 (2024): 4453. http://dx.doi.org/10.3390/ma17184453.

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Thin film lithium niobate (TFLN) has become a promising material platform for large scale photonic integrated circuits (PICs). As an indispensable component in PICs, on-chip electrically tunable narrow-linewidth lasers have attracted widespread attention in recent years due to their significant applications in high-speed optical communication, coherent detection, precision metrology, laser cooling, coherent transmission systems, light detection and ranging (LiDAR). However, research on electrically driven, high-power, and narrow-linewidth laser sources on TFLN platforms is still in its infancy
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Zhou, Xiaoyang, Hao Chen, Jian Chai, Shouyang Wang, and Benjamin Lev. "Performance evaluation and prediction of the integrated circuit industry in China: A hybrid method." Socio-Economic Planning Sciences 69 (March 2020): 100712. http://dx.doi.org/10.1016/j.seps.2019.05.003.

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Shimada, Kunio. "Morphological Configuration of Sensory Biomedical Receptors Based on Structures Integrated by Electric Circuits and Utilizing Magnetic-Responsive Hybrid Fluid (HF)." Sensors 22, no. 24 (2022): 9952. http://dx.doi.org/10.3390/s22249952.

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Biomedical receptors such as cutaneous receptors or intelligent cells with tactile, auditory, gustatory, and olfactory sensations function in the five senses of the human body. Investigations focusing on the configuration of such receptors are useful in the fields of robotics and sensors in the food industry, among others, which involve artificial organs or sensory machines. In the present study, we aimed to produce the receptors for four senses (excepting vision) by morphologically mimicking virtual human ones. The mimicked receptors were categorized into eight types of configured structure.
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Virendra Jain. "Sustainable Energy Harvesting in IoT Devices: A Review of Piezoelectric and Triboelectric Nanogenerators." Journal of Information Systems Engineering and Management 10, no. 39s (2025): 968–81. https://doi.org/10.52783/jisem.v10i39s.7330.

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Internet-of-Things (IoT) deployments now span wearables, smart infrastructure, biomedical implants and industrial monitoring—yet they still rely heavily on batteries that add cost, maintenance overhead and e-waste. Piezoelectric and triboelectric nanogenerators (PENGs and TENGs) have emerged as ultra-compact transducers that convert ubiquitous mechanical vibrations, bending, pressure, acoustic waves and even raindrops into usable electrical energy. In the past five years both technologies have matured from laboratory curiosities to components integrated in commercial sensor nodes and printed c
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Dissertationen zum Thema "Hybrid integrated circuits industry"

1

Smuk, Jeffrey William Carleton University Dissertation Engineering Electrical. "Hybrid semiconductive/superconductive microwave integrated circuits." Ottawa, 1991.

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2

Korn, Dietmar [Verfasser]. "Silicon-Organic Hybrid Platform for Photonic Integrated Circuits / Dietmar Korn." Karlsruhe : KIT Scientific Publishing, 2015. http://www.ksp.kit.edu.

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3

Blais, Bruno. "Model-based visual inspection of hybrid circuits." Thesis, McGill University, 1987. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=63928.

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Ezzine, Jelel. "On stabilization and control of hybrid systems." Diss., Georgia Institute of Technology, 1989. http://hdl.handle.net/1853/15626.

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5

Ranganathan, Lavakumar. "Sensor-array chip hybrid for simultaneous multiple analyte detection /." Full text open access at:, 2007. http://content.ohsu.edu/u?/etd,260.

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6

Schulz, Noel Nunnally. "The Role of residual stresses in ceramic substrate materials for hybrid thick film applications." Thesis, This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-05092009-040342/.

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Quilici, James Edwin 1961. "Coupled noise study of thick film circuits." Thesis, The University of Arizona, 1988. http://hdl.handle.net/10150/276697.

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Methods of noise coupling in high speed thick film circuits has been investigated. Parasitic coupling parameters have been experimentally determined for a variety of single and multilayer thick film layouts. In addition, the severity of the problem has been studied by measuring coupled noise induced on carefully constructed test cards. Curves are presented as an aid for predicting noise levels as a function of conductor spacing and signal edge speed. The measurements are discussed quantitatively and guidelines for the design of high speed thick film circuits are summarized.
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Öjefors, Erik. "Integrated Antennas : Monolithic and Hybrid Approaches." Doctoral thesis, Uppsala University, Department of Engineering Sciences, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-7142.

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<p>This thesis considers integration of antennas and active electronics manufactured on the same substrate. The main topic is on-chip antennas for commercial silicon processes, but hybrid integration using printed circuit board technology is also addressed.</p><p>The possible use of micromachining techniques as a means of reducing substrate losses of antennas manufactured on low resistivity silicon wafers is investigated. Compact dipole, loop, and inverted-F antennas for the 20-40 GHz frequency range are designed, implemented, and characterized. The results show significantly improved antenna
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Drolet, Daniel J. (Daniel Joseph). "A hybrid High-Tc superconductor filter/low-noise amplifier microwave integrated circuit." Ottawa, 1994.

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10

Guo, Wei. "Compact modeling of magnetic tunnel junctions and design of hybrid CMOS-magnetic integrated circuits." Grenoble INPG, 2010. http://www.theses.fr/2010INPG0126.

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Le but de cette thèse était d’évaluer les performances de circuits logiques combinant des composants CMOS classiques et des composants magnétiques. Les jonctions tunnel magnétiques sont bien connues comme éléments de base des mémoires magnétiques. Mais l’utilisation de ces composants non-volatiles peut également permettre de repousser certaines limites de la microélectronique actuelle, notamment en contribuant à diminuer la consommation, les problèmes de dissipation thermique, en améliorant la fiabilité des circuits et en apportant de nouvelles fonctionnalités. Cette thèse a consisté en deux p
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Bücher zum Thema "Hybrid integrated circuits industry"

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J, Swenson Edward, American Association of Physicists in Medicine., and Society of Photo-optical Instrumentation Engineers., eds. Laser processing of semiconductors and hybrids: 21-22 January 1986, Los Angeles, California. SPIE--the International Society for Optical Engineering, 1986.

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2

Ripka, Gábor. Hybridschaltungen: Dünn- und Dickschichttechnologie. Akadémiai Kiadó, 1987.

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3

Klimachev, I. I. SVCh GIS: Osnovy tekhnologii i konstruirovanii︠a︡. Tekhnosfera, 2006.

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4

Dobronravov, O. E. Interaktivnye sistemy proektirovanii͡a︡ gibridnykh integralʹnykh mikroskhem. Ėnergoatomizdat, 1985.

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Kear, Fred W. Hybrid assemblies and multichip modules. M. Dekker, 1993.

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H, Reichl, Eder A, and Arbeitsgemeinschaft SMT/ASIC/Hybrid, eds. SMT/ASIC/Hybrid: Surface mount technologies, Asic & design automation technologies, hybrid & advanced packaging technologies : Tagungsband : Internationale Fachmesse für SMT/ASIC/Hybrid, 17.-19.Mai 1994. vde-verlag, 1994.

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H, Reichl, Eder A, and Arbeitsgemeinschaft SMT/ASIC/Hybrid, eds. SMT/ASIC/Hybrid: Surface mount technologies, Asic & design automation technologies, hybrid & advanced packaging technologies : Tagungsband : Internationale Fachmesse für SMT/ASIC/Hybrid, 2.-4.Juni 1992. vde-verlag, 1992.

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8

Lacoursiere, Catherine. Photonic integrated circuits: New directions. Business Communications Co., 2005.

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Lacoursiere, Catherine. Photonic integrated circuits: New directions. Business Communications Co., 2002.

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Castrovilla, Joseph A. Electronic integrated circuits packaging. Business Communications Co., 1987.

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Buchteile zum Thema "Hybrid integrated circuits industry"

1

Yamada, Yasufumi, Yuji Akahori, and Hiroshi Terui. "Optical Hybrid Integrated Circuits." In Springer Series in Photonics. Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-56466-6_10.

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Swinnen, Bart, Anne Jourdain, Piet De Moor, and Eric Beyne. "Direct Hybrid Bonding." In Integrated Circuits and Systems. Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76534-1_11.

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Huang, Anjun, Rongzheng Ding, Hanwu Xiao, Jian Lu, and Hongwei Luo. "Integrated Circuits Packaging Reliability." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_60.

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Bu, Weihai, Wenbo Wang, and Poren Tang. "Silicon-Based Integrated Circuits." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_46.

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Băjenescu, Titu I., and Marius I. Bâzu. "Reliability of hybrid integrated circuits." In Reliability of Electronic Components. Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/978-3-642-58505-0_8.

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Stan, M. R., G. S. Rose, and M. M. Ziegler. "Hybrid CMOS/Molecular Integrated Circuits." In Into the Nano Era. Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-540-74559-4_10.

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Luo, Le, Jing Wang, and Kun Li. "Standardization of Integrated Circuits Packaging." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_61.

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Wang, Chaohui, Qinsheng Wang, and Qian Peng. "Information Security in Integrated Circuits." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_6.

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Lee, Hakho, Donhee Ham, and Robert M. Westervelt. "CMOS/Microfluidic Hybrid Systems." In Series on Integrated Circuits and Systems. Springer US, 2007. http://dx.doi.org/10.1007/978-0-387-68913-5_4.

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Wang, Yong-Wen, and Min-Zheng Zheng. "Invention and Technological Progresses of Integrated Circuits." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_1.

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Konferenzberichte zum Thema "Hybrid integrated circuits industry"

1

Krishna, Rakesh, Zhongdi Peng, Ashkan Zandi, et al. "Hybrid SiC-LiNbO3 platform for active integrated photonics." In Smart Photonic and Optoelectronic Integrated Circuits 2025, edited by Sailing He and Laurent Vivien. SPIE, 2025. https://doi.org/10.1117/12.3045247.

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Zhu, Kexin, Runjie Zhang, and Qing He. "Hybrid Model-Based Thermal Analysis Methodology for Integrated Circuits." In 2024 2nd International Symposium of Electronics Design Automation (ISEDA). IEEE, 2024. http://dx.doi.org/10.1109/iseda62518.2024.10617791.

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Bradley, Jonathan, Batoul Hashemi, Pooya Torab Ahmadi, et al. "Hybrid monolithic silicon photonic waveguides for on-chip light sources." In Smart Photonic and Optoelectronic Integrated Circuits 2025, edited by Sailing He and Laurent Vivien. SPIE, 2025. https://doi.org/10.1117/12.3051913.

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Li, Zexi, Ruogu Ding, Haojia Sun, Donghao Chen, and Weikang Qian. "Automatic Partition for Hybrid Stochastic-Binary-Based Circuits." In 2025 Conference of Science and Technology of Integrated Circuits (CSTIC). IEEE, 2025. https://doi.org/10.1109/cstic64481.2025.11017806.

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Kwan, Ching Chi, and Andrew W. Poon. "Fourier-domain mode-locked lasers on a hybrid-integrated silicon photonic chip." In Smart Photonic and Optoelectronic Integrated Circuits 2025, edited by Sailing He and Laurent Vivien. SPIE, 2025. https://doi.org/10.1117/12.3042982.

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Lopez Rodriguez, Bruno, Zizheng Li, Roald van der Kolk, Naresh Sharma, Dmytro Kolenov, and Iman Esmaeil Zadeh. "Low temperature, and high-quality silicon carbide photonics for hybrid photonic integration." In Smart Photonic and Optoelectronic Integrated Circuits 2025, edited by Sailing He and Laurent Vivien. SPIE, 2025. https://doi.org/10.1117/12.3041147.

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Campbell, Joe C., Robert A. Mayer, Kim H. Jung, and Dim-Lee Kwong. "GexSi1-x optical directional coupler." In Integrated Photonics Research. Optica Publishing Group, 1991. http://dx.doi.org/10.1364/ipr.1991.tha1.

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Historically, GaAs- and InP-based compounds have been the dominant materials for optoelectronic devices, whereas Si has been the material of choice in the commercial electronics industry because of its ease of handling, ease of processing, and low manufacturing costs. For this reason, hybrid techniques have frequently been used to combine optoelectronic devices and electronic circuits. Since this can be costly, there has been a concentrated effort to develop III-V compound optoelectronic integrated circuits.1 A promising alternative involves the use of Ge x Si1- x layers, grown on Si substrate
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Prakash Reddy, Siddavatam Ravi, Soumen Kar, and Kaushik Rajashekara. "Resistive SFCL Integrated Ultra-fast DC Hybrid Circuit Breaker for Subsea HVDC Transmission Systems." In 2021 IEEE Industry Applications Society Annual Meeting (IAS). IEEE, 2021. http://dx.doi.org/10.1109/ias48185.2021.9677248.

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Yadav, Vikaskumar, and Nilesh Bhade. "Implementation of a Hybrid Hardware-in-the-Loop (HIL) Test System for Automotive Software Validation and Verification." In 11th SAEINDIA International Mobility Conference (SIIMC 2024). SAE International, 2024. https://doi.org/10.4271/2024-28-0252.

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&lt;div class="section abstract"&gt;&lt;div class="htmlview paragraph"&gt;The automotive industry relies heavily on software to enhance safety, performance, and user experience. The increasing complexity of automotive software demands rigorous testing methodologies. Ensuring the quality and reliability of this software is critical. In this paper, an innovative approach to software validation and verification using a Hybrid Hardware-In-the-Loop (HIL) test system has been proposed. This methodology integrates diverse hardware and software tools to establish a flexible and efficient testing envir
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Elshaari, A. W., I. Esmaeil Zadeh, A. Fognini, et al. "Hybrid quantum photonic integrated circuits." In 2018 International Conference Laser Optics (ICLO). IEEE, 2018. http://dx.doi.org/10.1109/lo.2018.8435508.

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Berichte der Organisationen zum Thema "Hybrid integrated circuits industry"

1

Resnick, Douglas, and Konstantin Likharev. Hybrid CMOS/Nanodevice Integrated Circuits Design and Fabrication. Defense Technical Information Center, 2008. http://dx.doi.org/10.21236/ada487894.

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