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Auswahl der wissenschaftlichen Literatur zum Thema „Packaging matrix“
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Zeitschriftenartikel zum Thema "Packaging matrix"
Zweben, Carl. „Metal-matrix composites for electronic packaging“. JOM 44, Nr. 7 (Juli 1992): 15–23. http://dx.doi.org/10.1007/bf03222270.
Der volle Inhalt der QuelleRobbani, Syifa, Farah Fahma und Sugiarto Sugiarto. „CELLULOSIC PADS AS MATRIX SACHET ANTIMICROBIAL: A REVIEW“. AGROINTEK 15, Nr. 2 (03.06.2021): 554–65. http://dx.doi.org/10.21107/agrointek.v15i2.9366.
Der volle Inhalt der QuelleAintila, A., und E. Järvinen. „Packaging of Dot‐matrix Electroluminescent Display Module“. Microelectronics International 2, Nr. 2 (Februar 1985): 14–17. http://dx.doi.org/10.1108/eb044170.
Der volle Inhalt der QuelleKhurana, Amrik L., und Chi-Tang Ho. „Determination of Interaction of Packaging and Food Components with Packaging Matrix by HPLC“. Journal of Liquid Chromatography 12, Nr. 9 (Juli 1989): 1679–86. http://dx.doi.org/10.1080/01483918908049534.
Der volle Inhalt der QuelleTajuddin, Tamrin, Irman Amri, Syach Reza Syamsuddin und Asih Ahistasari. „Proposed Packaging of Assar Fish Products with Methods Quality Function Deployment“. Journal of Industrial System Engineering and Management 1, Nr. 2 (20.10.2022): 41–47. http://dx.doi.org/10.56882/jisem.v1i2.8.
Der volle Inhalt der QuelleBastarrachea, Luis, Dana Wong, Maxine Roman, Zhuangsheng Lin und Julie Goddard. „Active Packaging Coatings“. Coatings 5, Nr. 4 (06.11.2015): 771–91. http://dx.doi.org/10.3390/coatings5040771.
Der volle Inhalt der QuelleShao, Linying, Yuewei Xi und Yunxuan Weng. „Recent Advances in PLA-Based Antibacterial Food Packaging and Its Applications“. Molecules 27, Nr. 18 (13.09.2022): 5953. http://dx.doi.org/10.3390/molecules27185953.
Der volle Inhalt der QuelleDörnyei, Krisztina Rita, Anna-Sophia Bauer, Victoria Krauter und Carsten Herbes. „(Not) Communicating the Environmental Friendliness of Food Packaging to Consumers—An Attribute- and Cue-Based Concept and Its Application“. Foods 11, Nr. 9 (09.05.2022): 1371. http://dx.doi.org/10.3390/foods11091371.
Der volle Inhalt der QuelleZhao, Zhan Feng. „High Power LED Packaging Materials and Tooling“. Advanced Materials Research 763 (September 2013): 229–33. http://dx.doi.org/10.4028/www.scientific.net/amr.763.229.
Der volle Inhalt der QuelleMuzeza, Celia, Veronica Ngole-Jeme und Titus Alfred Makudali Msagati. „The Mechanisms of Plastic Food-Packaging Monomers’ Migration into Food Matrix and the Implications on Human Health“. Foods 12, Nr. 18 (07.09.2023): 3364. http://dx.doi.org/10.3390/foods12183364.
Der volle Inhalt der QuelleDissertationen zum Thema "Packaging matrix"
Kim, Joong-Ho. „Modeling of package and board power distribution networks using transmission matrix and macro-modeling methods“. Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/13864.
Der volle Inhalt der QuelleSun, Meng. „Retrovirus-Specific Differences in Matrix (MA) and Nucleocapsid (NC) Protein-Nucleic Acid Interactions: Implications for Genomic RNA Packaging“. The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1343844761.
Der volle Inhalt der QuelleThomas, Ian MacIntyre. „The blending and permeability of polymers for packaging applications“. Thesis, Brunel University, 1995. http://bura.brunel.ac.uk/handle/2438/5504.
Der volle Inhalt der QuelleMossor, Charles W. „Electrical Breakdown of Thermal Spray Alumina Ceramic Applied to AlSiC Baseplates Used in Power Module Packaging“. Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/33543.
Der volle Inhalt der QuelleMaster of Science
Penelope, Raphaël. „Développement de filtres solides pour un piégeage irréversible de l'iode gazeux et directement convertibles en matrice de conditionnement“. Electronic Thesis or Diss., Montpellier, Ecole nationale supérieure de chimie, 2022. http://www.theses.fr/2022ENCM0020.
Der volle Inhalt der QuelleThe project involves the development of iodine filters based on silver phosphates or lead vanadates to capture and package ultimate waste. The current iodine filters, based on alumina or silica, require complex treatments, sources of secondary waste, to ensure a compatible form with the contemplated packaging. Rather than qualify new conditioning materials adapted to these filters, a pragmatic solution is therefore to develop filters which are, at a heat treatment step, a precursor of the conditioning matrix. Through this thesis, we propose to develop porous supprt controlled/hierarchical majority based on silver phosphate or lead vanadate. In materials with hierarchical porosity, the species are first transported in the macropores, then pass into the mesopores to finally reach the micropores. It is therefore essential to control the initial pore structure according to the different synthesis conditions. These supports will then be functionalized to generate active sites, based on silver in the first case and lead based in the second, for the capture of iodine. The functionalized supports will then be tested on an iodine capture bench with stable iodine 127 under different conditions to qualify the impact of different parameters on the capture efficiency. After having been loaded in iodine until reaching their maximum fixing capacity, the transformation of the filters into a conditioning matrix by heat treatment will be studied
Cozzo, Giulia Maria Angela. „Materiali e tecnologie per l'elettronica di potenza“. Doctoral thesis, Università di Catania, 2015. http://hdl.handle.net/10761/3824.
Der volle Inhalt der QuelleJones, Christopher P. „Primer tRNA annealing by human immunodeficiency virus type 1“. The Ohio State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=osu1337962197.
Der volle Inhalt der QuellePerron, Christophe. „Définition et mise en oeuvre d'un matériau composite à matrice métallique pour les packagings d'électronique embarquée“. Thesis, Bordeaux, 2017. http://www.theses.fr/2017BORD0646/document.
Der volle Inhalt der QuelleEmbedded electronic packagings are currently made of aluminum. A first study – basedupon a material selection method completed by numerical analysis – showed that a metal matrixcomposite made of aluminum and highly thermal conductive continuous carbon fibers represents ahigh potential upon weight savings for those equipments. Though, coupling these componentsrepresents numerous challenges due to their incompatibility such as a really low wetting of carbonliquidaluminum system and its unavoidable chemical reactivity that leads to the formation ofaluminum carbides that are harmful for the final material. Two manufacturing routes were considered: A liquid route using a wetting agent (fluorinated salts) led the metal to rise alongcarbon fibers by capillarity. A solid route based upon a novel technique of aluminum foils and carbon fibersstacking using the Spark Plasma Sintering (SPS) process.This second technique revealed to be very promising and allowed to obtain multilayer samples with noporosities, highly limited fiber damages and controlled composite architecture. Our study shows thataluminum carbides formation is limited. Moreover, a deeper comprehension of SPS process or thedeposit of fiber coatings would prevent this carbide formation. Attempts of mechanical and thermalcharacterization led upon such samples give a first overview of the efficiency of the aluminumreinforcement by carbon fibers
Foschi, Eleonora <1990>. „System innovation and life cycle thinking in packaging value chain: the circularity of plastics“. Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2020. http://amsdottorato.unibo.it/9460/1/Foschi_Eleonora_Tesi.pdf.
Der volle Inhalt der QuelleLemettre, Sylvain. „Encapsulation sous vide de micro-bolomètres à basse température“. Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLS524.
Der volle Inhalt der QuelleSome kinds of MEMS like micro-bolometers require vacuum to operate optimally. This IR sensor is the cornerstone for uncooled infrared detection. Its best sensing capacity is achieved by thermal insulation, which is realized by placing it under vacuum (< 10-2 mbar). The vacuum is maintained throughout the camera lifetime thanks to a microvolume packaging (0.5 to 30 µL).The MEMS vacuum packaging implies the combination of two complementary technical solutions: first hermetic sealing, then getter device integration absorbing internal gas. The sealing technique retained (which enables leak rate <10-14 atm.cm3.s-1) is the metallic bonding. The getter is a thin transition metal film. When activated by an annealing, its surface traps gaseous molecules. The sorption process of the getter is ideally activated during the sealing process of the bonding.The typical temperature packaging process for micro-bolometers is 300°C. It is expected that sensibility of new types of micro-bolometers materials will be degraded if they are exposed to temperatures higher than 280°C. Consequently, their encapsulation require the elaboration of a new low temperature packaging technology.Such a technology has been developed based on experimental studies in laboratory and tests under industrial conditions
Bücher zum Thema "Packaging matrix"
Randall, Michael S. Processing, characterization and modelling of borosilicate glass matrix-particulate silicon nitride composites, containing controlled additions of porosity, for use in high speed electronic packaging. 1993.
Den vollen Inhalt der Quelle findenGo, Simon. Hong Kong Apothecary: A Visual History of Chinese Medicine Packaging. MCCM Creations, 2003.
Den vollen Inhalt der Quelle findenGo, Simon. Hong Kong Apothecary: A Visual History of Chinese Medicine Packaging. Princeton Architectural Press, 2003.
Den vollen Inhalt der Quelle findenBuchteile zum Thema "Packaging matrix"
Alam, Md Aftab, Rizwana Khatoon, Shamsul Huda und Pramod Kumar Sharma. „Review on Advanced Food Packaging Materials Based on Functional Biopolymer Matrix“. In Biomaterials in Food Packaging, 181–218. New York: Jenny Stanford Publishing, 2022. http://dx.doi.org/10.1201/9781003256786-8.
Der volle Inhalt der QuelleTong, Xingcun Colin. „Thermally Conductive Polymer Matrix Composites“. In Advanced Materials for Thermal Management of Electronic Packaging, 201–32. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_5.
Der volle Inhalt der QuelleTong, Xingcun Colin. „Thermally Conductive Ceramic Matrix Composites“. In Advanced Materials for Thermal Management of Electronic Packaging, 277–304. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_7.
Der volle Inhalt der QuelleTong, Xingcun Colin. „High Thermal Conductivity Metal Matrix Composites“. In Advanced Materials for Thermal Management of Electronic Packaging, 233–76. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_6.
Der volle Inhalt der QuelleTong, Xingcun Colin. „Monolithic Carbonaceous Materials and Carbon Matrix Composites“. In Advanced Materials for Thermal Management of Electronic Packaging, 169–200. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-7759-5_4.
Der volle Inhalt der QuelleGuo, Linghua, Tiedou Xing, Yan Chen und Guodong Liu. „Application of Matrix Rotating Screening in Halftone Information Hiding Technology“. In Advanced Graphic Communications, Packaging Technology and Materials, 211–19. Singapore: Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_28.
Der volle Inhalt der QuelleCakmak, Hulya, und Ece Sogut. „Functional Biobased Composite Polymers for Food Packaging Applications“. In Reactive and Functional Polymers Volume One, 95–136. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-43403-8_6.
Der volle Inhalt der QuelleKohlhepp, Daniel B., und Kimberly J. Kohlhepp. „Land Packaging“. In Real Estate Development Matrix, 47–75. Routledge, 2018. http://dx.doi.org/10.1201/9781315180779-7.
Der volle Inhalt der QuelleSwain, S. K. „The use of nano-boron nitride reinforcements in composites for packaging applications“. In Advances in Ceramic Matrix Composites, 678–89. Elsevier, 2014. http://dx.doi.org/10.1533/9780857098825.3.678.
Der volle Inhalt der QuelleMizielińska, Małgorzata, und Artur Bartkowiak. „Overview of Food Antimicrobial Packaging“. In Food Preservation and Packaging - Recent Process and Technological Advancements [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.108666.
Der volle Inhalt der QuelleKonferenzberichte zum Thema "Packaging matrix"
Chamund, D. „Bi-directional switch packaging for higher power matrix converters“. In IEE Seminar Matrix Converters. IEE, 2003. http://dx.doi.org/10.1049/ic:20030049.
Der volle Inhalt der QuelleBraunisch, Henning, und Adel Elsherbini. „Crosstalk reduction by matrix matching“. In 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2016. http://dx.doi.org/10.1109/edaps.2016.7874442.
Der volle Inhalt der QuelleBraunisch, Henning, und Adel Elsherbini. „Crosstalk reduction by matrix matching“. In 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2015. http://dx.doi.org/10.1109/epeps.2015.7347163.
Der volle Inhalt der QuelleSahouli, Mohamed, und Anestis Dounavis. „Iterative Loewner Matrix Passivity Correction Technique“. In 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2020. http://dx.doi.org/10.1109/edaps50281.2020.9312904.
Der volle Inhalt der QuelleYue, Cong, Yan Zhang, Zhili Hu, Johan Liu und Zhaonian Cheng. „Effects of the matrix shrinkage and filler hardness on the thermal conductivity of TCA“. In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270540.
Der volle Inhalt der QuelleKnezevic und Ferry. „A quantum many-body density matrix model for sub-femtosecond transport in mesoscopic structures“. In Electrical Performance of Electronic Packaging. IEEE, 2004. http://dx.doi.org/10.1109/iwce.2004.1407325.
Der volle Inhalt der QuelleXie, Bin, Xunqing Shi und Xuejun Fan. „Accelerated Moisture Sensitivity Test Methodology for Stacked-Die Molded Matrix Array Package“. In 2007 9th Electronics Packaging Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/eptc.2007.4469765.
Der volle Inhalt der QuelleHan, Jiale, Haibin Chen, Ke Xue, Fei Wong, Karina Leung, Ivan Shiu und Jingshen Wu. „Wire sweep study for SOT package array matrix molding with simulation and experimental analysis“. In 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066692.
Der volle Inhalt der QuelleIvanov, Artem. „A Printed Electroluminescent Matrix Display: Implementation Details and Technical Solutions“. In 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE, 2018. http://dx.doi.org/10.23919/nordpac.2018.8423861.
Der volle Inhalt der QuelleChou, Chiu-Chih, Thong Nguyen und Jose E. Schutt-Aine. „Impact of Partition Schemes in Loewner Matrix Macromodeling“. In 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2020. http://dx.doi.org/10.1109/edaps50281.2020.9312918.
Der volle Inhalt der QuelleBerichte der Organisationen zum Thema "Packaging matrix"
Galili, Naftali, Roger P. Rohrbach, Itzhak Shmulevich, Yoram Fuchs und Giora Zauberman. Non-Destructive Quality Sensing of High-Value Agricultural Commodities Through Response Analysis. United States Department of Agriculture, Oktober 1994. http://dx.doi.org/10.32747/1994.7570549.bard.
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