Thematische Bibliographien / Polymeric heat sinks

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Auswahl der wissenschaftlichen Literatur zum Thema „Polymeric heat sinks“

Autor: Grafiati

Veröffentlicht am 28. Juni 2021

Zuletzt aktualisiert am 29. Juli 2025

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Zeitschriftenartikel zum Thema "Polymeric heat sinks"

Marchetto, Daniel Borba, and Gherhardt Ribatski. "An experimental study on flow boiling heat transfer of HFO1336mzz(Z) in microchannels-based polymeric heat sinks." Applied Thermal Engineering 180 (November 2020): 115815. http://dx.doi.org/10.1016/j.applthermaleng.2020.115815.

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Bagatella, Simone, Annacarla Cereti, Francesco Manarini, Marco Cavallaro, Raffaella Suriano, and Marinella Levi. "Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling." Polymers 16, no. 3 (2024): 432. http://dx.doi.org/10.3390/polym16030432.

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This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effect

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Balzano, Veronica, Annaluisa Mariconda, Maria Rosaria Acocella, et al. "Synthesis of Nylon 6,6 with Pyrene Chain-End for Compatibilization with Graphite and Enhancement of Thermal and Mechanical Properties." Polymers 17, no. 13 (2025): 1735. https://doi.org/10.3390/polym17131735.

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The possibility of reinforcing polymeric matrices with multifunctional fillers for improving structural and functional properties is widely exploited. The compatibility between the filler and the polymeric matrix is crucial, especially for high filler content. In this paper, polymeric matrices of Nylon 6,6 with pyrene chains were successfully synthesized to improve the compatibility with carbonaceous fillers. The compatibility was proven using graphite as a carbonaceous filler. The different properties, including thermal stability, crystallinity, morphology, and local mechanical properties, ha

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Barba, Alessandro, Barbara Musi, and Marco Spiga. "Performance of a polymeric heat sink with circular microchannels." Applied Thermal Engineering 26, no. 8-9 (2006): 787–94. http://dx.doi.org/10.1016/j.applthermaleng.2005.10.015.

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Kominek, Jan, Martin Zachar, Michal Guzej, Erik Bartuli, and Petr Kotrbacek. "Influence of Ambient Temperature on Radiative and Convective Heat Dissipation Ratio in Polymer Heat Sinks." Polymers 13, no. 14 (2021): 2286. http://dx.doi.org/10.3390/polym13142286.

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Miniaturization of electronic devices leads to new heat dissipation challenges and traditional cooling methods need to be replaced by new better ones. Polymer heat sinks may, thanks to their unique properties, replace standardly used heat sink materials in certain applications, especially in applications with high ambient temperature. Polymers natively dispose of high surface emissivity in comparison with glossy metals. This high emissivity allows a larger amount of heat to be dissipated to the ambient with the fourth power of its absolute surface temperature. This paper shows the change in ra

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Guzej, Michal, Martin Zachar, Jan Kominek, Petr Kotrbacek, and Robert Brachna. "Importance of Melt Flow Direction during Injection Molding on Polymer Heat Sinks’ Cooling Efficiency." Polymers 13, no. 8 (2021): 1186. http://dx.doi.org/10.3390/polym13081186.

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Polymers with highly conductive fillers could possibly replace standardly used materials, such as aluminum and copper alloys, for passive cooling purposes. The main problem of the composite polymer-based heat sinks is that their high thermal conductivity is uneven. The orientation of this anisotropy is set according to the position of the highly thermally conductive filler. Its orientation is influenced by the melt flow during the polymer heat sink molding process. This article shows that change of the melt flow inside the mold cavity can improve the overall cooling efficiency of a polymer hea

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Liang, C., J. R. Arias, and A. Velazquez. "Tip Clearance Effects on Microchannel-Based Heat Sink with Polymeric Fluid." Journal of Thermophysics and Heat Transfer 30, no. 2 (2016): 350–58. http://dx.doi.org/10.2514/1.t4592.

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Awais, Muhammad, Saeed Awan, A. Aqsa, Nimra Muqaddass, Saeed Rehman, and Muhammad Raja. "Numerical and analytical approach for Sakiadis rheology of generalized polymeric material with magnetic field and heat source/sink." Thermal Science 24, no. 2 Part B (2020): 1183–94. http://dx.doi.org/10.2298/tsci180426284a.

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In this analysis, Sakiadis rheology of the generalized polymeric material has been presented with magnetic field and heat source/sink. Convective heating process with thermal radiations have been incorporated. Mathematical modeling has been performed for the conversion of physical problem into set of non-linear equations. Suitable transformations have been employed in order to convert the derived PDE into set of non-linear ODE. Analytical as well as finite difference method based numerical solutions for the velocity and temperature profiles are computed. Graphical and numerical illustrations h

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Bég, O. Anwar, Atul Kumar Ray, Rama S. R. Gorla, et al. "Homotopy Simulation of Dissipative Micropolar Flow and Heat Transfer from a Two-Dimensional Body with Heat Sink Effect." Chemical & biochemical engineering quarterly 34, no. 4 (2021): 257–75. http://dx.doi.org/10.15255/cabeq.2020.1849.

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Non-Newtonian flow from a wedge constitutes a fundamental problem in chemical<br /> engineering systems and is relevant to processing of polymers, coating systems, etc. Motivated by such applications, the homotopy analysis method (HAM) was employed to<br /> obtain semi-analytical solutions for thermal convection boundary layer flow of incompressible micropolar fluid from a two-dimensional body (wedge). Viscous dissipation<br /> and heat sink effects were included. The non-dimensional boundary value problem<br /> emerges as a system of nonlinear coupled ordinary differen

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McBride, Daniel, and Chin Su. "Near-field scanning optical microscopy probes with heat sinks for higher power operations." Materials Research Express 2, no. 10 (2015): 105202. http://dx.doi.org/10.1088/2053-1591/2/10/105202.

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Dissertationen zum Thema "Polymeric heat sinks"

Brachna, Róbert. "Stanovení anizotropie tepelné vodivosti polymerních chladičů pro chlazení elektroniky." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-445460.

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The master's thesis focuses on creating a numerical model of a polymeric heat sink with emphasis on its significant thermal conductivity anisotropy. This anisotropy is caused by highly thermally conductive graphite filler. Its final orientation is given by the melt flow inside the mould cavity during injection molding. The numerical model is created on the basis of a heat sink prototype subjected to experimental measurements, whose physical conditions are reliably replicated by the model. The determination of anisotropy is divided into two parts. The qualitative part is based on the fracture a

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"Thermal and Vibration Characterization of Flexible Heat Sinks." Master's thesis, 2019. http://hdl.handle.net/2286/R.I.54915.

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abstract: In nature, it is commonly observed that animals and birds perform movement-based thermoregulation activities to regulate their body temperatures. For example, flapping of elephant ears or plumage fluffing in birds. Taking inspiration from nature and to explore the possibilities of such heat transfer enhancements, augmentation of heat transfer rates induced by the vibration of solid and well as novel flexible pinned heatsinks were studied in this research project. Enhancement of natural convection has always been very important in improving the performance of the cooling mechanisms. I

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Khan, Muhammad Omer. "Thermally Conductive Polymer Composites for Electronic Packaging Applications." Thesis, 2012. http://hdl.handle.net/1807/32473.

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Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. In response to this shift, finding multifunctional materials with excellent thermal conductivity and tailored electrical properties are becoming increasingly important. For this research thesis, three different studies were conducted to develop and characterize thermally conductive polymer composites. In the first study, a PPS matrix was combined with different types of carbon-based fillers to determine the effects of filler’s size, sh

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Buchteile zum Thema "Polymeric heat sinks"

Gooch, Jan W. "Heat Sink." In Encyclopedic Dictionary of Polymers. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_5859.

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Rastogi, Prasansha, Neha Katiyar, Swaroop Gharde, and Balasubramanian Kandasubramanian. "Nano-functionalized Polycarbonate Coatings for Heat Sink Applications." In Handbook of Polymer and Ceramic Nanotechnology. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-10614-0_17-1.

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Rastogi, Prasansha, Neha Katiyar, Swaroop Gharde, and Balasubramanian Kandasubramanian. "Nano-functionalized Polycarbonate Coatings for Heat Sink Applications." In Handbook of Polymer and Ceramic Nanotechnology. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-40513-7_17.

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Sur, Anirban, Swapnil Narkhede, Ajit Netke, and Hritik Palheriya. "Design and Analysis of Polymer Heat Sink for Li-Ion Battery Thermal Management System." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-7709-1_33.

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"Heat sink." In Encyclopedic Dictionary of Polymers. Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_5767.

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Zhong Nan, Lafont Ugo, Garcia Santiago J., and van der Zwaag Sybrand. "Self restoring thermal interface materials based on intrinsic healing polymer matrices." In Self Healing Materials. IOS Press, 2015. https://doi.org/10.3233/978-1-61499-514-2-245.

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Thermal interface materials (TIM) are used in all kind of electrical devices, such as LEDs and ICs, to forward the heat produced during operation into a so called heat-sink. One of the most common reasons for failure of such devices is overheating due to due to loss of adhesion of the TIM to either the device or the heat-sink. In order to extend the service life of such devices self-healing TIMs have been designed using different thermal-triggered self-healing polymeric matrices and different fillers. This chapter shows some of the results obtained for the restoration of the adhesion, cohesion

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Kour, Simrandeep, Rikky Sharma, Sameena Sulthana, and Rupam Mukherjee. "Measurement Techniques for Determining the Thermal Conductivity of Bulk Samples and Thin Films." In Semiconductor Nanoscale Devices: Materials and Design Challenges. BENTHAM SCIENCE PUBLISHERS, 2025. https://doi.org/10.2174/9789815313208125010009.

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Thermal conductivity is one class of basic transport properties of materials that characterizes the flow of heat through it. Over recent years, the transformation of smart materials of atomically thin layers to small-size bulk samples has further made it difficult to determine the thermal conductivity more accurately due to the second law of thermodynamics, which prevents full control over heat flux during measurement. Heat flux and small temperature gradients are the two most important parameters that need to be considered while measuring the thermal properties of small dimensional samples. T

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O’Grady, K., G. Vallejo Fernandez, and A. Hirohata. "Ferrofluids." In Particulate and Granular Magnetism. Oxford University PressOxford, 2023. http://dx.doi.org/10.1093/oso/9780192873118.003.0006.

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Abstract An explanation of the structure and components in a ferrofluid is presented together with a simple preparation process to produce these magnetic liquids. Unusual phenomena such as the surface and labyrinthine instabilities are then described. The properties of ferrofluids are then discussed in terms of their magnetic behaviour. Applications in engineering devices such as rotary vacuum seals, loudspeakers and inclinometers are discussed together with the concept of magnetic sink float separation and the ability to align non-magnetic materials in the fluids. Medical and biomedical appli

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Konferenzberichte zum Thema "Polymeric heat sinks"

Jayaweera, Palitha, and Peter J. Millett. "Stable Solid State Reference Electrodes for High Temperature Water Chemistry." In CORROSION 1995. NACE International, 1995. https://doi.org/10.5006/c1995-95445.

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Abstract A solid state electrode capable of providing a stable reference potential under a wide range of temperatures and chemical conditions has been demonstrated. The electrode consists of a zirconia or yttria-stabilized zirconia tube packed with an inorganic polymer electrolyte and a silver/silver chloride sensing element. The sensing element is maintained near room temperature by a passive cooling heat sink. The electrode stability was demonstrated by testing it in high temperature (280°C) aqueous solutions over extended periods of time. This reference electrode is useful in many applicati

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Duong, Hai M., Dimitrios V. Papavassiliou, Namiko Yamamoto, and Brian L. Wardle. "Off-Lattice Monte Carlo Simulation of the Thermal Conductivity of Single-Walled Carbon Nanotube-Polymer Composites With Inter-Carbon Nanotube Contact." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-66336.

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A computational model is developed to study the thermal conductivity of single-walled carbon nanotube (SWNT)–polymer composites. An off-lattice Monte Carlo simulation was used to model the effects of interfacial resistance at the SWNT-polymer interface and at the SWNT-SWNT contact on the heat flow for different orientations of SWNTs dispersed in the polymers. A primary focus is the non-isotropic heat conduction in aligned-SWNT polymeric composites that are of interest for various heat conduction applications such as microelectronic heat sinks, and also because this geometry constitutes a repre

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Ansari, Ajmal. "A Study on Polymer Pin Fin Based Heat Sinks." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33968.

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Recent developments in polymer additives and formulations have made available resins that have thermal conductivity that is one to two orders of magnitude higher than that of typical engineering polymers. Such polymers can be potentially used for designing heat sinks. There are two primary advantages of polymer heat sinks: ability to form shapes that may not be feasible with metal and flexibility that allows the heat sink to be bent in various shapes. This paper presents results from a study that was conducted to determine the suitability of commercially available Flexible Heat Sink Material f

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Lu, Lu, Shan Hu, and Yayue Pan. "3D Printed Particle-Polymer Composites With Acoustically Localized Particle Distribution for Thermal Management Applications." In ASME 2018 13th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/msec2018-6643.

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The particle-polymer composite can perform multiple functionalities according to particle property, local particle distribution, and alignment. This paper shows thermal management applications of in situ manipulations of particle dispersion patterns within a 3D printed polymeric composite architecture. A 3D printed particle-polymer composite with enhanced thermal conductive properties was developed. Composite structures containing 30-micron-sized aluminum particles embedded in the acrylate polymer were produced using a novel acoustic field assisted projection based Stereolithography process. T

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Koyuncuog˘lu, Aziz, Tuba Okutucu, and Haluk Ku¨lah. "A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications." In 2010 14th International Heat Transfer Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/ihtc14-23212.

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A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding

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Kate, Kunal H., Krishna Sai Aparna Munjuluri, Kameswara Pavan Kumar Ajjarapu, Thomas J. Roussel, and Bikram Bhatia. "Production of High-temperature Structural Materials Using a Slurry-based Feedstock Process Material Extrusion Additive Manufacturing (MEX-AM) Of Copper Heat Sinks: Process Development, Product Design, And Process Optimization." In Euro Powder Metallurgy 2024 Congress & Exhibition. EPMA, 2024. http://dx.doi.org/10.59499/ep246275809.

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This study explores the utilization of two types of gyroid lattice structures in the design of copper heat sinks manufactured through extrusion metal 3D printing. Feedstocks and filaments of copper powder-polymer system with 61 vol% were made and used to 3D print circular and rectangular gyroid lattice structures. After fabrication, the heat sinks underwent crucial processes including debinding, sintering, and HIP treatments to ensure structural robustness and density. The efficiency of the heat sinks was assessed based on their stabilization temperature and time required for stabilization und

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Pashah, Sulaman, and Abul Fazal M. Arif. "Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52181.

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Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A

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Virik, Niven Singh, Samuel D. Marshall, Rerngchai Arayanarakool, et al. "Evaluation of Heat Transfer Performance of a Spiral Microfluidic Heatsink and Heat Exchanger Device." In ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/icnmm2018-7804.

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Developments in micro-technology have seen vast improvements in the design and the thermal performance of heat sinks and heat exchangers, particularly in the case of spiral microfluidic devices which deals with the flow of liquids inside curved micrometer-sized channels. The current research deals with a specially designed curved microfluidic channel used to employ the fluid mixing characteristics of Dean vortices and thus transfer heat more efficiently. This curved microfluidic channel is deployed as a spiral channel to create an effective heat sink and a heat exchanger. The novel micro heat

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Borba Marchetto, Daniel, Debora Carneiro Moreira, and Gherhardt Ribatski. "A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS." In Brazilian Congress of Thermal Sciences and Engineering. ABCM, 2018. http://dx.doi.org/10.26678/abcm.encit2018.cit18-0394.

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Leung, Siu N., Omer M. Khan, Hani E. Naguib, Francis Dawson, and Vincent Adinkrah. "Applications of multifunctional polymer-matrix composites in hybrid heat sinks." In SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, edited by Nakhiah C. Goulbourne and Zoubeida Ounaies. SPIE, 2012. http://dx.doi.org/10.1117/12.917242.

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