Literatura académica sobre el tema "Fan out"
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Artículos de revistas sobre el tema "Fan out"
Goodman, Joseph W. "Fan-in and Fan-out with Optical Interconnections." Optica Acta: International Journal of Optics 32, no. 12 (1985): 1489–96. http://dx.doi.org/10.1080/713821684.
Texto completoBecker, Karl-Friedrich, Tanja Braun, S. Raatz, et al. "On the Way from Fan-out Wafer to Fan-out Panel Level Packaging." International Symposium on Microelectronics 2016, S2 (2016): S1—S23. http://dx.doi.org/10.4071/isom-2016-slide-4.
Texto completoPalesko, Chet, and Amy Lujan. "Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based Packaging." International Symposium on Microelectronics 2016, no. 1 (2016): 000180–84. http://dx.doi.org/10.4071/isom-2016-wa32.
Texto completoJohnson, Donald W., and Bin-Hong Tsai. "SUEX Laminates for Fan-In, Fan-Out and eWLB Development." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 000635–65. http://dx.doi.org/10.4071/2011dpc-ta31.
Texto completoSchneider, M. L., and K. Segall. "Fan-out and fan-in properties of superconducting neuromorphic circuits." Journal of Applied Physics 128, no. 21 (2020): 214903. http://dx.doi.org/10.1063/5.0025168.
Texto completoWang, Yu-ying, Qing-shan Li, Ping Chen, and Chun-de Ren. "Dynamic fan-in and fan-out metrics for program comprehension." Journal of Shanghai University (English Edition) 11, no. 5 (2007): 474–79. http://dx.doi.org/10.1007/s11741-007-0507-2.
Texto completoAsthana, Praveen, Gregory P. Nordin, Armand R. Tanguay, and B. Keith Jenkins. "Analysis of weighted fan-out/fan-in volume holographic optical interconnections." Applied Optics 32, no. 8 (1993): 1441. http://dx.doi.org/10.1364/ao.32.001441.
Texto completoKuixian, CHEN, WANG Yu, HE Taotao, et al. "Metasurface fan-out diffractive optical elements." Journal of Applied Optics 40, no. 2 (2019): 119–25. http://dx.doi.org/10.5768/jao201940.0205001.
Texto completoZwenger, Curtis, Ron Huemoeller, JinHan Kim, DongJean Kim, WonChul Do, and SeongMin Seo. "Silicon Wafer Integrated Fan-out Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000217–47. http://dx.doi.org/10.4071/2015dpc-ta22.
Texto completoZwenger, Curtis, George Scott, Ron Huemoeller, WonChul Do, WonGeol Lee, and JiHun Yi. "Silicon Wafer Integrated Fan-out Technology." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–23. http://dx.doi.org/10.4071/2017dpc-tp2_presentation4.
Texto completoTesis sobre el tema "Fan out"
Cawte, Paul Stephen. "The theory of volume holographic fan-out elements." Thesis, Imperial College London, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.283137.
Texto completoRoberts, M. W. "Logic circuit testability for reconvergent fan-out nodes." Thesis, University of York, 1986. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.374197.
Texto completoAbuelyaman, Eltayeb Salih. "Sequential circuits fault simulation using fan out stem based techniques." Diss., The University of Arizona, 1988. http://hdl.handle.net/10150/184466.
Texto completoKlink, Madeline LeNore. "Laugh out loud in real life : women's humor and fan identity." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/59730.
Texto completoStrömberg, Malin. "Paper dimensional stability in sheet-fed offset printing : Papperets dimensionsstabilitet i en arkoffsetpress." Thesis, Högskolan Dalarna, Grafisk teknik, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:du-1400.
Texto completoBerglund, Martin. "Optical measuring system using a camera and laser fan-out for narrow mounting on a miniaturized submarine." Thesis, Uppsala University, Ångström Space Technology Centre, ÅSTC, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-112681.
Texto completoWhetten, Jonathan M. "Using Operator Teams for Supervisory Control." BYU ScholarsArchive, 2009. https://scholarsarchive.byu.edu/etd/2033.
Texto completoPelini, Nicholas Michael. "Netlist Security Algorithm Acceleration Using OpenCL on FPGAs." University of Dayton / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1501861339318045.
Texto completoBarnard, Timothy L. ""Far out past": Hemingway, manhood, and modernism." W&M ScholarWorks, 2005. https://scholarworks.wm.edu/etd/1539623462.
Texto completoMurray, Delaney. "DAUGHTERS OF THE DIGITAL: A PORTRAIT OF FANDOM WOMEN IN THE CONTEMPORARY INTERNET AGE." Ohio University Honors Tutorial College / OhioLINK, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=ouhonors1587738612384951.
Texto completoLibros sobre el tema "Fan out"
Lau, John H. Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1.
Texto completoXia, Wang, ed. Zuo chu hei dong: Wu bi fang fan yu shi bie zhi dao = Get out of the trap : to identify & prevent fraudulent practices. Guangdong jing ji chu ban she, 2006.
Buscar texto completoNellist, M. E. A comparison of fan and heater control policies for near-ambient drying: Astudy carried out for the Electricity Council and ADAS Mechanisation. AFRC Institute of Engineering Research, 1988.
Buscar texto completoZhao, Yiheng. The River Fans Out. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7724-6.
Texto completoKurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1997.
Buscar texto completoKurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1996.
Buscar texto completoKurtzweil, Paula. Taking the fat out of food. Dept. of Health and Human Services, Public Health Service, Food and Drug Administration, 1997.
Buscar texto completoRob, Merrills, ed. "Dicks out!": The definitive work on British football songs. Chatsby Publishing, 1992.
Buscar texto completoCapítulos de libros sobre el tema "Fan out"
Weik, Martin H. "fan-out." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_6793.
Texto completoKaneshiro, Kenneth Y., and Alan T. Ohta. "7. The Flies Fan Out." In The Natural History Reader in Evolution, edited by Niles Eldredge. Columbia University Press, 1987. http://dx.doi.org/10.7312/eldr92092-011.
Texto completoLau, John H. "Fan-Out Panel-Level Packaging (FOPLP)." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_9.
Texto completoLau, John H. "Patent Issues of Fan-Out Wafer-Level Packaging." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_1.
Texto completoLau, John H. "3D Integration." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_10.
Texto completoLau, John H. "3D IC Heterogeneous Integration by FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_11.
Texto completoLau, John H. "Flip Chip Technology Versus FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_2.
Texto completoLau, John H. "Fan-in Wafer-Level Packaging Versus FOWLP." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_3.
Texto completoLau, John H. "Embedded Chip Packaging." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_4.
Texto completoLau, John H. "FOWLP: Chip-First and Die Face-Down." In Fan-Out Wafer-Level Packaging. Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-8884-1_5.
Texto completoActas de conferencias sobre el tema "Fan out"
Olsen, Dan R., and Stephen Bart Wood. "Fan-out." In the 2004 conference. ACM Press, 2004. http://dx.doi.org/10.1145/985692.985722.
Texto completoBraun, T., K. F. Becker, S. Raatz, et al. "From fan-out wafer to fan-out panel level packaging." In 2015 European Conference on Circuit Theory and Design (ECCTD). IEEE, 2015. http://dx.doi.org/10.1109/ecctd.2015.7300046.
Texto completoSchwab, Markus, Norbert Lindlein, Johannes Schwider, Yaakov Amitai, Asher A. Friesem, and Silviu Reinhorn. "Achromatic diffractive fan-out systems." In OE/LASE '94, edited by Ivan Cindrich and Sing H. Lee. SPIE, 1994. http://dx.doi.org/10.1117/12.178071.
Texto completoWang, Tie, and Raymond Arrathoon. "Limits of optical and electrical fan-out versus power and fan-out versus bandwidth." In Hybrid Image and Signal Processing II, edited by David P. Casasent and Andrew G. Tescher. SPIE, 1990. http://dx.doi.org/10.1117/12.21307.
Texto completoKar, Ajoy Kumar. "Laser-inscribed multicore fan-out devices." In 2012 Opto-Electronics and Communications Conference (OECC). IEEE, 2012. http://dx.doi.org/10.1109/oecc.2012.6276571.
Texto completoBraun, T., K. F. Becker, S. Raatz, et al. "Foldable Fan-Out Wafer Level Packaging." In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE, 2016. http://dx.doi.org/10.1109/ectc.2016.90.
Texto completoZhan, Lihua, Hao Li, Fuguo Zhu, and Zhipeng Zhou. "3D Module in Fan-out Packaging." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480828.
Texto completoUemura, Hitoshi, Katsushiro Takenaga, Teijiro Ori, Shoichiro Matsuo, Kunimasa Saitoh, and Masanori Koshiba. "Fused Taper Type Fan-in/Fan-out Device for Multicore EDF." In OptoElectronics and Communications Conference and Photonics in Switching. OSA, 2013. http://dx.doi.org/10.1364/oecc_ps.2013.tus1_4.
Texto completoJung, Y., J. R. Hayes, S. U. Alam, and D. J. Richardson. "Multicore Fibre Fan-In/Fan-Out Device using Fibre Optic Collimators." In 2017 European Conference on Optical Communication (ECOC). IEEE, 2017. http://dx.doi.org/10.1109/ecoc.2017.8345892.
Texto completoThomson, R. R., G. Brown, A. K. Kar, T. A. Birks, and J. Bland-Hawthorn. "An Integrated Fan-Out Device for Astrophotonics." In Frontiers in Optics. OSA, 2010. http://dx.doi.org/10.1364/fio.2010.pdpa3.
Texto completoInformes sobre el tema "Fan out"
Revina, Shintia, Rezanti Putri Pramana, Rizki Fillaili, and Daniel Suryadarma. Systemic Constraints Facing Teacher Professional Development in a Middle-Income Country: Indonesia’s Experience Over Four Decades. Research on Improving Systems of Education (RISE), 2020. http://dx.doi.org/10.35489/bsg-rise-wp_2020/054.
Texto completoRevina, Shintia, Rezanti Putri Pramana, Rizki Fillaili, and Daniel Suryadarma. Systemic Constraints Facing Teacher Professional Developmentin a Middle-Income Country: Indonesia’s Experience Over Four Decades. Research on Improving Systems of Education (RISE), 2020. http://dx.doi.org/10.35489/bsgrisewp_2020/054.
Texto completoSayers, Dave, Rui Sousa-Silva, Sviatlana Höhn, et al. The Dawn of the Human-Machine Era: A forecast of new and emerging language technologies. Open Science Centre, University of Jyväskylä, 2021. http://dx.doi.org/10.17011/jyx/reports/20210518/1.
Texto completoChen, Sunny, Emily Schwartz, Cindy Le, and Elizabeth Davidson Pisacreta. Right in Your Backyard: Expanding Local Community College Transfer Pathways to High-Graduation-Rate Institutions. Ithaka S+R, 2021. http://dx.doi.org/10.18665/sr.315695.
Texto completoStelmakh, Marta. HISTORICAL CONTEXT IN THE COLLECTION OF ARTICLES BY TIMOTHY SNYDER «UKRAINIAN HISTORY, RUSSIAN POLITICS, EUROPEAN FUTURE». Ivan Franko National University of Lviv, 2021. http://dx.doi.org/10.30970/vjo.2021.50.11098.
Texto completoSchulz, Jan, Daniel Mayerhoffer, and Anna Gebhard. A Network-Based Explanation of Perceived Inequality. Otto-Friedrich-Universität, 2021. http://dx.doi.org/10.20378/irb-49393.
Texto completoPerdigão, Rui A. P., and Julia Hall. Spatiotemporal Causality and Predictability Beyond Recurrence Collapse in Complex Coevolutionary Systems. Meteoceanics, 2020. http://dx.doi.org/10.46337/201111.
Texto completoBeiker, Sven. Unsettled Issues Regarding Communication of Automated Vehicles with Other Road Users. SAE International, 2020. http://dx.doi.org/10.4271/epr2020023.
Texto completoIdris, Iffat. Documentation of Survivors of Gender-based Violence (GBV). Institute of Development Studies (IDS), 2021. http://dx.doi.org/10.19088/k4d.2021.103.
Texto completoHorgan, John. Deradicalization Programs: Recommendations for Policy and Practice. RESOLVE Network, 2021. http://dx.doi.org/10.37805/pn2021.18.vedr.
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