Literatura académica sobre el tema "Micro-embossing"
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Artículos de revistas sobre el tema "Micro-embossing"
Wu, Cheng Hsien, Chen Hao Hung y Ya Zhen Hu. "Parametric Study of Hot Embossing on Micro-Holes". Advanced Materials Research 74 (junio de 2009): 251–54. http://dx.doi.org/10.4028/www.scientific.net/amr.74.251.
Texto completoDu, L. Q., C. Liu, H. J. Liu, J. Qin, N. Li y Rui Yang. "Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry". Key Engineering Materials 339 (mayo de 2007): 246–51. http://dx.doi.org/10.4028/www.scientific.net/kem.339.246.
Texto completoSu, Qian, Jie Xu, Lei Shi, De Bin Shan y Bin Guo. "Micro-Embossing Process in Ultrafine-Grained Pure Aluminum Processed by Equal-Channel Angular Pressing with Elevated Temperature". Key Engineering Materials 821 (septiembre de 2019): 244–49. http://dx.doi.org/10.4028/www.scientific.net/kem.821.244.
Texto completoZhang, Xiang, Jiang Ma, Ran Bai, Qian Li, Bing Li Sun y Chang Yu Shen. "Polymer Micro Hot Embossing with Bulk Metallic Glass Mold Insert". Advanced Materials Research 510 (abril de 2012): 639–44. http://dx.doi.org/10.4028/www.scientific.net/amr.510.639.
Texto completoWeng. "Development of Belt-Type Microstructure Array Flexible Mold and Asymmetric Hot Roller Embossing Process Technology". Coatings 9, n.º 4 (22 de abril de 2019): 274. http://dx.doi.org/10.3390/coatings9040274.
Texto completoAizawa, Tatsuhiko, Kenji Wasa, Abdelrahman Farghali y Hiroshi Tamagaki. "Plasma Printing of Micro-Punch Assembly for Micro-Embossing of Aluminum Sheets". Materials Science Forum 920 (abril de 2018): 161–66. http://dx.doi.org/10.4028/www.scientific.net/msf.920.161.
Texto completoLi, Kangsen, Gang Xu, Xinfang Huang, Zhiwen Xie y Feng Gong. "Manufacturing of Micro-Lens Array Using Contactless Micro-Embossing with an EDM-Mold". Applied Sciences 9, n.º 1 (26 de diciembre de 2018): 85. http://dx.doi.org/10.3390/app9010085.
Texto completoTang, C. W., Y. C. Chang, T. T. Wu, J. C. Huang y C. T. Pan. "Micro-Forming of Au49Ag5.5Pd2.3Cu26.9Si16.3 Metallic Glasses in Supercooled Region". Advanced Materials Research 47-50 (junio de 2008): 266–69. http://dx.doi.org/10.4028/www.scientific.net/amr.47-50.266.
Texto completoShen, Yung Kang, Yi Lin, Dong Yea Sheu, Ming Der Ger, Yi Han Hu, Rong Hong Hong y Shung Mang Wang. "Study on Micro Fabrication of Mold Insert for Microlens Arrays by Micro Dispensing". Key Engineering Materials 364-366 (diciembre de 2007): 48–52. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.48.
Texto completoLee, Hye Jin, Nak Kyu Lee y Hyoung Wook Lee. "A Study on the Micro Property Testing of Micro Embossing Patterned Metallic Thin Foil". Key Engineering Materials 345-346 (agosto de 2007): 335–38. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.335.
Texto completoTesis sobre el tema "Micro-embossing"
Firko, Megan (Megan Rose). "Hot micro-embossing of thermoplastic elastomers". Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/54461.
Texto completo"June 2008." Cataloged from PDF version of thesis.
Includes bibliographical references (p. 69-71).
Microfluidic devices have been a rapidly increasing area of study since the mid 1990s. Such devices are useful for a wide variety of biological applications and offer the possibility for large scale integration of fluidic chips, similar to that of electrical circuits. With this in mind, the future market for microfluidic devices will certainly thrive, and a means of mass production will be necessary. However PDMS, the current material used to fabricate the flexible active elements central to many microfluidic chips, imposes a limit to the production rate due to the curing process used to fabricate devices. Thermoplastic elastomers (TPEs) provide a potential alternative to PDMS. Soft and rubbery at room temperature, TPEs become molten when heated and can be processed using traditional thermoplastic fabrication techniques such as injection molding or casting. One promising fabrication technique for TPEs is hot micro-embossing (HME) in which a material is heated above its glass transition temperature and imprinted with a micromachined tool, replicating the negative of the tools features. Thus far, little research has been conducted on the topic of hot embossing TPEs, and investigations seeking to determine ideal processing conditions are non-existent. This investigation concerns the selection of a promising TPE for fabrication of flexible active elements, and the characterization of the processing window for hot embossing this TPE using a tool designed to form long winding channels, with feature heights of 66Cpm and widths of 80jpm. Ideal processing conditions for the tool were found to be pressures in the range of 1MPa-1.5MPa and temperatures above 1400.
(cont.) The best replication occurred at 1500 C and 1.5 MPa, and at these conditions channel depth was within 5% of the tool, and width was within 10%. For some processing conditions a smearing effect due to bulk material flow was observed. No upper limit on temperature was found, suggesting that fabrication processes in which the material is fully melted may also be suitable for fabrication of devices from TPEs.
by Megan Firko.
S.B.
Zhao, Jie. "Hot embossing of polymeric tubular micro-components". Thesis, University of Strathclyde, 2016. http://digitool.lib.strath.ac.uk:80/R/?func=dbin-jump-full&object_id=27561.
Texto completoGanesan, Balamurugan 1976. "Process control for micro embossing : initial variability study". Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/17925.
Texto completo"June 2004."
Includes bibliographical references (leaves 178-182).
The objective of this research is to study the dimensional variations in micro embossed parts. By measuring multiple parts produced with a fixed set of control inputs, it could be determined if the process is in statistical control, if the parts produced have any noticeable trends and if there are any other forms of deterministic or assignable disturbances that were overlooked. The experiment resulted in 50 sets of data consisting of 10 runs, resulting in 50 control charts. By using both classic SPC rules for and by observation it was determined that about 42/50 control charts show traits of a process that is stationary and in-control. In the remaining 8 charts, some distinct trends were observable. These trends were postulated to be produced by unintentional disturbances caused by the experimental procedure. There were some distinct observable trends in the results from the experiment. The first is the location and frequency of the occurrence of the 8 distinctive run charts mentioned above and 4 run charts that were also observed to have marginally trend-like characteristic though it seems more data points are required to make a more sound judgment. Out of these 12 run charts, 9 of them are from the left side of the part. Out of this 9, 5 of them are from the 3rd feature scale. This trend leads to a conclusion that the disturbance responsible for this behavior is localized to a graphic region of that part. The second observable trend is the strong correlation between feature scale size and the mean of the die-part difference. As the feature size increases, the mean difference between the die and part measurement increases. This can be because bigger features involve a larger volume of polymer material to form the shape and as the material
(cont.) shrinks after being embossing and cooled, the reduction in relative dimension is greater. The third observable trend is the strong correlation between the feature scale size and the standard deviation of the die-part difference. The variance in this dimension is larger as the feature size increases. As larger features produce a larger mean die-part difference, this might also produce an opportunity for a larger variation in this measurement.
by Balamurugan Ganesan.
S.M.
Shoji, Grant T. (Grant Tatsuo). "Modeling and control of a hot micro-embossing machine". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35621.
Texto completo"June 2006."
Includes bibliographical references (p. 268-273).
As the market for polymer micro- and nano-devices expands there is an ever-present need for a manufacturing standard to mass produce these parts. A number of techniques for fabricating these devices are soft lithography, micro-injection molding, and micro-embossing. Micro-embossing shows great promise in terms of versatility in creating various structures, but its shortcoming is a relatively long cycle time. Therefore, it is imperative to find efficient ways of heating and cooling in addition to having good control of critical processing parameters. This thesis will address the modeling and control of a hot micro-embossing system which utilizes oil as the heating and cooling medium. There were three thermal requirements addressed for the system: steady state temperatures within 1 C, fast as possible heating and cooling cycles, and being robust to various embossing and de-embossing processing temperatures. A model of the major thermal components in the system was developed and correlated well with experimental data. It was confirmed with simulation and experimentation that a lower flow rate achieved faster heating and a higher flow rate produced faster cooling. In order to address the steady state temperature requirement a variable gain PI controller was implemented.
(cont.) During heating the feedback signal was the platen temperature and during cooling the feedback signal was the mixing valve fluid outlet temperature. This variable gain PI controller in combination with the variable flow rates produced steady state temperatures for both platens from 55 to 120 °C within 1 C in 138 seconds. Cooling for both platens from 120 to 55 °C was achieved in 190 seconds. This controller worked for a variety of processing temperatures. A Labview interface was developed to automate this process for temperature step changes. Polymer microfluidic channels were successfully fabricated using this hot micro-embossing system with automated thermal control in a short cycle time.
by Grant T. Shoji.
S.M.
Wang, Qi S. M. Massachusetts Institute of Technology. "Process window and variation characterization of the micro embossing process". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35651.
Texto completo"June 2006."
Includes bibliographical references.
The micro embossing process on polymethylmethacrylate (PMMA) is demonstrated experimentally to be a useful process to produce micro fluidic and optical devices. Because this process is a one step thermoplastic deformation process, it is possible to reach high production rates and low cost in manufacturing compared to the standard clean room processes. Currently, the research about this process is still on the feasibility level, with not a quantitative work to optimize the process parameters and assure product quality. In this thesis, an experimental study on process window and variation of Micro Embossing is presented. This study includes the design and manufacturing of an embossing die, the development of an embossing product quality assessment protocol, the process window characterization and the process variation identification. The research results based on the experimental set up in this thesis show that we should apply constant 800N embossing force at an embossing velocity of 1000N/min in order to obtain well formed parts to maintain low process cycle time.
(cont.) An embossing temperature of 120°C and de-embossing temperature of 55°C are shown to be the optimal embossing condition to yield good replication and repeatability. These embossing parameters operating window can change with the variation of working piece material, die material and die design.
by Qi Wang.
S.M.
Dirckx, Matthew E. "Design of a fast cycle time hot micro-embossing machine". Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/32367.
Texto completo"June 2005."
Includes bibliographical references (leaves 163-165).
In the coming years, there will be a huge market for mass-produced polymer micro- devices. These devices include microfluidic "labs on a chip," micro-optical chips, and many others. Several techniques exist for producing micron-scale features in polymer materials. One of the most promising of these techniques is Hot Micro-Embossing (HME). In this process, a thermoplastic polymer workpiece is heated above its glass transition temperature and a micro-patterned die is forced into it. The polymer conforms to the workpiece and the features are replicated. Much of the research to date concerning HME has not addressed fundamental issues that will be central to successful mass production using this process. There is a compelling need to study HME from the perspective of manufacturing process control. In order to conduct such a program, a HME machine is needed that allows the operator to precisely control all the potentially significant process parameters. No existing machine fully meets this requirement. This thesis concerns the conceptual and detailed design of a HME system, including the platen assembly and the temperature control system. A parametric model and finite element analysis were used to guide the design of the platen assembly and to assess its thermal and structural performance. A dynamic thermal model of the temperature control system was developed. This model was used to guide the selection of components and to predict the performance of the system as a whole. The new design will have a short cycle time, will permit the use of full wafer-size embossing tools, and will be able to follow a user- programmed trajectory in displacement, force, and temperature.
by Matthew E. Dirckx.
S.M.
Taylor, Hayden Kingsley. "Modeling and controlling topographical nonuniformity in thermoplastic micro- and nano-embossing". Thesis, Massachusetts Institute of Technology, 2009. http://hdl.handle.net/1721.1/54842.
Texto completoThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Cataloged from student submitted PDF version of thesis.
Includes bibliographical references (p. 221-236).
The embossing of thermoplastic polymeric plates is valuable for manufacturing micro- and nanofluidic devices and diffractive optics. Meanwhile, the imprinting of sub-micrometer-thickness thermoplastic layers has emerged as a lithographic technique with exceptional resolution. Yet neither hot micro-embossing nor thermal nanoimprint lithography will be fully adopted without efficient numerical techniques for simulating these processes. This thesis contributes a computationally inexpensive approach to simulating the embossing of feature-rich patterns into thermoplastic polymeric materials. The simulation method employs a linear viscoelastic model for the embossed layer, and computes the distribution of contact pressure between the polymeric surface and an embossing stamp. An approximation to the embossed topography of the polymeric layer is thereby generated as a function of the material being embossed, the stamp's design, and the embossing process's temperature, duration, and applied load. For a stamp design described with an 800 x 800 matrix of topographical heights, simulation can be completed within 30-100 s using a computer with an Intel Pentium 4 processor and 2 GB RAM. This method is sufficiently fast for it to be employed iteratively when designing a pattern to be embossed or when selecting processing parameters. The method is able to build abstracted representations of feature-rich patterns, increasing the simulation speed still further. The viscoelastic properties of three materials - polymethylmethacrylate, polycarbonate, and Zeonor 1060R, a cyclic olefin polymer - have been experimentally calibrated as functions of temperature. For a test-pattern having features with diameters 5 [mu]m to 90 [mu]m, simulated and experimental topographies agree with r.m.s. errors of less than 2 [mu]m across all processing conditions tested, with absolute topographical heights ranging up to 30 [mu]m. In thermal nanoimprint lithography, the key challenge is to minimize spatial variation of the polymeric layer's residual thickness where stamp protrusions press down into the layer. The simulation method is therefore extended to incorporate elastic stamp deflections and their influence on residual layer thickness. Some design-rules are proposed that could help to minimize residual layer thickness variation. A way is also proposed for representing any shear-thinning of the imprinted layer.
by Hayden Kingsley Taylor.
Ph.D.
Thaker, Kunal H. (Kunal Harish). "Design of a micro-Functional Testing System for process characterization of a hot micro-embossing machine". Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35647.
Texto completo"June 2006."
Includes bibliographical references (p. 279-284).
Growth in industrial, commercial, and medical applications for micro-fluidic devices has fueled heightened research and development into micro-fluidic design, materials, and increasingly manufacturing. Polymers (Poly(methyl methacrylate)-PMMA in particular) are the current material of choice given their low cost, wide range of material properties, and biocompatibility. Given most fabrication processes have focused on hard materials for the semiconductor industry, an alternate set of processes such as hot micro-embossing (HME) have received increased attention as manufacturing processes for high-volume polymer-based micro-fluidic production. An understanding of the equipment, process physics, control strategy, and metrology for part fabrication are required when moving from the lab to production level. An initial statistical analysis of PMMA parts fabricated on the first generation HME system showed the need to: (1) design a new HME system; and (2) establish alternative methods for characterizing micro-fluidic parts.
(cont.) A second generation HME system was constructed with fellow Manufacturing and Process Control Laboratory (MPCL) graduate students and a FTS (Functional Testing System) was developed to test whether HME parts from the new HME system were capable of flowing fluid and establish output metrics for process control based on fluid pressure and flow rate. The new characterization method was shown to have re-registration error as low as + 1.03% (overall RMS uncertainty of ±1.51%). The experimental data from tests run on the FTS fit a fluid model developed to the expected accuracy of --± 10% for all but the lowest aspect ratio micro-channel. Moreover, the FTS results were consistent with optical scans of a series of parts made with varying HME parameters. The FTS was able to detect differences that a few isolated optical scans could not. The FTS provided a bulk quantity to assess the geometry of the channel rather than at a specified location. These results and the deficiencies in existing metrology techniques warrant further exploration into functional-based testing for micro-fluidic devices to parallel well established testing methods in place in the IC industry. Functional testing does not have the capacity to replace traditional metrology; however, it can add an important output metric-a quantitative measure of the output parts fluid flow.
by Kunal H. Thaker.
S.M.
Lu, Chunmeng. "Development of novel micro-embossing methods and microfluidic designs for biomedical applications". Columbus, Ohio : Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1156820643.
Texto completoNagarajan, Pratapkumar. "Rapid production of polymer microstructures". Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26539.
Texto completoCommittee Chair: Dr. Donggang Yao; Committee Member: Dr. John.Muzzy; Committee Member: Dr. Karl Jacob; Committee Member: Dr. Wallace W. Carr; Committee Member: Dr. Youjiang Wang. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Libros sobre el tema "Micro-embossing"
Capítulos de libros sobre el tema "Micro-embossing"
Burlage, K., C. Gerhardy y W. K. Schomburg. "Ultrasonic Hot Embossing and Welding of Micro Structures". En Mechanisms and Machine Science, 113–23. Dordrecht: Springer Netherlands, 2011. http://dx.doi.org/10.1007/978-94-007-2721-2_11.
Texto completoShen, X. J. y Liwei Lin. "Micro Plastic Embossing Process: Experimental and Theoretical Characterizations". En Transducers ’01 Eurosensors XV, 1612–15. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_381.
Texto completoPhuc, Pham Hong y Dao Viet Dzung. "Fabrication of Polymeric Micro Structures Using Improved Hot Embossing Technique". En Advances in Engineering Research and Application, 342–48. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-37497-6_40.
Texto completoLee, Hye Jin, Nak Kyu Lee y Hyoung Wook Lee. "A Study on the Micro Property Testing of Micro Embossing Patterned Metallic Thin Foil". En The Mechanical Behavior of Materials X, 335–38. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-440-5.335.
Texto completoDu, L. Q., C. Liu, H. J. Liu, J. Qin, N. Li y Rui Yang. "Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry". En Progress of Precision Engineering and Nano Technology, 246–51. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-430-8.246.
Texto completoBecker, Holger, Wolfram Dietz y Peter Dannberg. "Microfluidic Manifolds by Polymer Hot Embossing for μ-Tas Applications". En Micro Total Analysis Systems ’98, 253–56. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5286-0_60.
Texto completoPeças, Paulo, Pedro Dias Pereira, Inês Inês Ribeiro y Elsa Henriques. "Non-Conventional Technologies Selection". En Non-Conventional Machining in Modern Manufacturing Systems, 1–32. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-6161-3.ch001.
Texto completoRamsden, Jeremy. "Micro & Nano Technologies". En Hot Embossing, ii. Elsevier, 2009. http://dx.doi.org/10.1016/b978-0-8155-1579-1.50001-x.
Texto completoWorgull, Matthias. "Hot Embossing". En Micro-Manufacturing Engineering and Technology, 68–89. Elsevier, 2010. http://dx.doi.org/10.1016/b978-0-8155-1545-6.00005-3.
Texto completo"Hot Embossing of Microstructured Surfaces and Thermal Nanoimprinting". En Micro/Nano Replication, 123–56. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118146965.ch5.
Texto completoActas de conferencias sobre el tema "Micro-embossing"
Shan, Xuechuan, S. H. Ling, H. P. Maw, C. W. Lu y Y. C. Lam. "Micro embossing of ceramic green substrates for micro devices". En 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (MEMS/MOEMS). IEEE, 2008. http://dx.doi.org/10.1109/dtip.2008.4753017.
Texto completoDirckx, Matthew, Aaron D. Mazzeo y David E. Hardt. "Production of Micro-Molding Tooling by Hot Embossing". En ASME 2007 International Manufacturing Science and Engineering Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/msec2007-31046.
Texto completoShang, Xiaobing, Jin-Yi Tan, Jelle De Smet, Pankaj Joshi, Esma Islamaj, Dieter Cuypers, Michael Vervaeke, Jürgen Van Erps, Hugo Thienpont y Herbert De Smet. "Replicating micro-optical structures using soft embossing technique". En 30th European Mask and Lithography Conference, editado por Uwe F. W. Behringer. SPIE, 2014. http://dx.doi.org/10.1117/12.2065912.
Texto completoKim, Heon Young. "Micro/nano patterning characteristics in hot embossing process". En MATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications - NUMIFORM 2004 - Proceedings of the 8th International Conference on Numerical Methods in Industrial Forming Processes. AIP, 2004. http://dx.doi.org/10.1063/1.1766736.
Texto completoLu, Chunmeng. "Numerical Simulation of Laser/IR Assisted Micro-embossing". En MATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications - NUMIFORM 2004 - Proceedings of the 8th International Conference on Numerical Methods in Industrial Forming Processes. AIP, 2004. http://dx.doi.org/10.1063/1.1766728.
Texto completoShan, Xue C., Ryutaro Maeda y Yoichi Murakoshi. "Development of a micro hot embossing process for fabricating micro-optical devices". En SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, editado por Dinesh K. Sood, Ajay P. Malshe y Ryutaro Maeda. SPIE, 2002. http://dx.doi.org/10.1117/12.469430.
Texto completoYOUN, SUNG-WON, CHIEKO OKUYAMA, MASHARU TAKAHASHI y RYUTARO MAEDA. "REPLICATION OF NANO/MICRO QUARTZ MOLD BY HOT EMBOSSING AND ITS APPLICATION TO BOROSILICATE GLASS EMBOSSING". En Proceedings of the 9th AEPA2008. WORLD SCIENTIFIC, 2009. http://dx.doi.org/10.1142/9789814261579_0116.
Texto completoChopra, P., Kun Li, William O’Neill y Jack Gabzdyl. "Micromachining of glassy carbon toolsets for micro embossing applications". En ICALEO® 2010: 29th International Congress on Laser Materials Processing, Laser Microprocessing and Nanomanufacturing. Laser Institute of America, 2010. http://dx.doi.org/10.2351/1.5062149.
Texto completoSrinivasan, Visvanathan, Nayan Reddy, Adriana Brasoava y David L. Wells. "Micro-Embossing of Polymeric Substrates for Fluidic Self-Assembly". En ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-14817.
Texto completoOtto, Thomas, Andreas Schubert, Juliana Boehm y Thomas Gessner. "Fabrication of micro-optical components by high-precision embossing". En Micromachining and Microfabrication, editado por Sing H. Lee y Eric G. Johnson. SPIE, 2000. http://dx.doi.org/10.1117/12.395679.
Texto completo