Bibliografie tematiche / Electroless plating

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Letteratura scientifica selezionata sul tema "Electroless plating"

Autore: Grafiati
Pubblicato: 4 giugno 2021
Ultima modifica: 25 luglio 2025

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Articoli di riviste sul tema "Electroless plating"

1

SAITO, Mamoru. "Electroless Plating. Recent Trend of Electroless Plating." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 375–79. http://dx.doi.org/10.4139/sfj.48.375.

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Aal, A. Abdel, V. V. Khutoryanskiy, Z. S. Nurkeeva, and G. A. Mun. "Optimization of Electroless Copper Plating on Polyethylene Films Modified by Surface Grafting of Vinyl Ether of Monoethanolamine." Eurasian Chemico-Technological Journal 9, no. 1 (2007): 63–69. https://doi.org/10.18321/ectj256.

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Metallized plastics have recently received significant interest for their useful applications in electronic devices such as for integrated circuits, packaging, printed circuits and sensor applications. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. There are several techniques for metal deposition on surface of polymers such as evaporation, sputtering, electroless plating and electrolysis. In this work the metallized films were developed by electroless copper plating of polyethylene films graft
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3

Sun, Hua, Xiao Fei Guo, Ke Gao Liu, Hong Fang Ma, and Li Ming Feng. "Influence of Ultrasonic on the Microstructure and Properties of Electroless Plating Ni-Co-P Coating at Low Temperature." Advanced Materials Research 314-316 (August 2011): 259–62. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.259.

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By electron energy spectrometer,X-ray diffractometer,transmission elec-tron microscopy andmicro-hardometer,the depositing speed of electrolessNi-Co-P plating baths,chemical composition,crystal structure and microhardness of the alloy coatings were inspected and analyzed with ultrasonic and rare earth metalcerium intervening in electroless Ni-Co-P plating•The results show that the depositing speed of electroless Ni-Co-P plating isobviously increased under the effect of ultrasonic.The chemical compositions of electroless Ni-Co-P plating are changed，The XRD of coating has a diffuse sexual diffrac
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HARADA, Hisashi. "Electroless Plating." Journal of the Japan Society of Colour Material 69, no. 1 (1996): 60–70. http://dx.doi.org/10.4011/shikizai1937.69.60.

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UCHIDA, Ei. "Electroless Plating. Electroless Palladium Plating and Its Applications." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 400–404. http://dx.doi.org/10.4139/sfj.48.400.

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SAKATA, Takahiro, and Hideo HONMA. "Electroless copper plating by applying electrolysis." Journal of the Surface Finishing Society of Japan 40, no. 3 (1989): 488–89. http://dx.doi.org/10.4139/sfj.40.488.

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Uraz, Canan, and Tuğba Gürmen Özçelik. "ELECTROLESS METAL PLATING OVER ABS PLASTIC." E-journal of New World Sciences Academy 14, no. 2 (2019): 63–70. http://dx.doi.org/10.12739/nwsa.2019.14.2.1a0432.

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SHIBATA, Mitsuo. "Electroless Plating. Direct Electroless Nickel Plating on Magnesium Alloys." Journal of the Surface Finishing Society of Japan 48, no. 4 (1997): 413–16. http://dx.doi.org/10.4139/sfj.48.413.

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KAMIYAMA, Hiroharu. "Electroless copper plating." Circuit Technology 4, no. 6 (1989): 318–26. http://dx.doi.org/10.5104/jiep1986.4.318.

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HONMA, Hideo, Yasunori KOUCHI, and Masaaki OYAMADA. "Electroless Solder Plating." Circuit Technology 6, no. 6 (1991): 299–305. http://dx.doi.org/10.5104/jiep1986.6.6_299.

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Tesi sul tema "Electroless plating"

1

Garcia, Alexandre. "Ligand Induced Electroless Plating of Polymers." Palaiseau, Ecole polytechnique, 2011. https://pastel.hal.science/docs/00/64/69/62/PDF/ThA_seAGARCIA.pdf.

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Ce projet de recherche avait pour objectif de répondre à un enjeu industriel: Développer un procédé " propre " de métallisation des polymères sans satinage à l'acide chromique (CrVI). Au cours de ce travail, un procédé alternatif s'appuyant sur une technologie innovante de revêtement de surface (la technologie Graftfast®) a été développé. Ce procédé utilisable dans l'eau et à température ambiante permet de greffer chimiquement des polymères vinyliques sur une large gamme de surfaces de natures différentes. Par cette méthode, une couche d'acide polyacrylique (PAA) a été greffée de manière coval
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Sullivan, Anne M. "Autocatalytic electroless gold deposition at low pH." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10079.

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Krishnan, Vidya. "Electroless deposition of copper for microelectronic applications." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11752.

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Noren, Martin. "Electroless Copper Plating to Achieve Solderless Connections." Thesis, Luleå tekniska universitet, Institutionen för system- och rymdteknik, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-86533.

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As the world has woken up to the change in climate in recent years, people's environmental concerns are forcing companies to change and find ways to manufacture products without harming nature. One area of serious concern is the electronics industries where an ever-increasing number of products gets updated with sensors and microcomputers to be part of the internet of things. Wen more things are upgraded with electronics, it's important that the production process is as environmentally friendly as possible and that the techniques used introduces a minimum amount of disturbance to the circuits
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Shi, Zhongliang 1965. "Electroless deposited palladium membranes and nanowires." Thesis, McGill University, 2007. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=111872.

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Hydrogen is considered to be the fuel of the future as it is clean and abundant. Together with the rapidly developing fuel cell technology, it can sustain an environmentally sound and efficient energy supply system. Developing the technologies of palladium-based membrane for hydrogen separation and palladium nanostructured materials for hydrogen sensing and hydrogenation catalysts makes the "hydrogen economy" possible. This is because these technologies will allow for commercially viable production of comparatively cheap and high-quality hydrogen, and safety of its application. Based on the ma
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Shemesh, Ely 1962. "TERNARY COMPLEXES OF COPPER(I), CYANIDE, AND 2,9-DIMETHYL-1,10-PHENANTHROLINE." Thesis, The University of Arizona, 1986. http://hdl.handle.net/10150/291268.

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Owen, S. A. "Corrosion resistance of electroless nickel deposits from aged and synthetic solutions." Thesis, University of Nottingham, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.311914.

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Sutch, Peter John F. "Consumption and loss of formaldehyde in electroless copper plating." Master's thesis, University of Central Florida, 1993. http://digital.library.ucf.edu/cdm/ref/collection/RTD/id/21775.

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University of Central Florida College of Engineering Thesis<br>The objectives of this research were to quantify formaldehyde consumption due to plating and parasitic reactions and determine the magnitude and distribution of formaldehyde losses from the electroless copper plating process. Plating and rinse bath samples obtained from three electroless copper plating operations were analyzed for formaldehyde and copper in order to develop a mass balance analysis about the plating bath for periods of active production and no production. Fugitive air and stack releases of formaldehyde were estima
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Zeszut, Ronald Anthony Jr. "Effects of Transport and Additives on Electroless Copper Plating." Case Western Reserve University School of Graduate Studies / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=case1497271315649528.

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Hayden, Harley T. "Enhanced Adhesion Between Electroless Copper and Advanced Substrates." Diss., Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22615.

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In this work, adhesion between electrolessly deposited copper and dielectric materials for use in microelectronic devices is investigated. The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. In order to meet these requirements two approaches were taken: smoothing the surface of traditional epoxy dielectric materials while maintaining adhesion, and increasing ad
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Libri sul tema "Electroless plating"

1

O, Mallory Glenn, Hajdu Juan B, and American Electroplaters and Surface Finishers Society., eds. Electroless plating: Fundamentals and applications. The Society, 1990.

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American Electroplaters and Surface Finishers Society, ed. Electroless plating: Fundamentals and applications. AESF, 1990.

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3

Parkinson, Ron. Properties and applications of electroless nickel. Nickel Development Institute, 1997.

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4

Electroless, Nickel '93 Conference (1993 Orlando Fla ). EN Conference 93, November 10-12, 1993, Orlando Airport Marriott, Orlando, Florida: Proceedings. Gardner Publications, 1993.

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Electroless, Nickel '97 (1997 Cincinnati Ohio). EN Conference 97, Electroless Nickel '97, December 8-10, 1997, Hyatt Regency, Cincinnati, Ohio: Conference proceedings. Gardner Publications, 1997.

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6

Electroless Nickel '91 Conference (1991 Orlando, Fla.). EN Conference 91, November 20-22, 1991, Buena Vista Palace Hotel, Orlando, Florida: Proceedings. Garden Publications, 1991.

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7

Kanani, Nasser. Chemische Vernicklung: Nickel-Phosphor-Sichten : Herstellung, Eigenschaften, Anwendungen. E.G. Leuze, 2007.

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8

Symposium on Electroless Deposition of Metals and Alloys (1987 Honolulu, Hawaii). Proceedings of the Symposium on Electroless Deposition of Metals and Alloys. Electrochemical Society, 1988.

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9

Khoperia, Teimuraz N. Electroless deposition of metals and alloys for new challenges in nanotechnology, electronics and catalysis. Nova Science Publishers, Inc., 2013.

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N, Kanani, ed. Electroplating and electroless plating of copper & its alloys. Finishing Publications, 2003.

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Capitoli di libri sul tema "Electroless plating"

1

Gooch, Jan W. "Electroless Plating." In Encyclopedic Dictionary of Polymers. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4282.

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Gooch, Jan W. "Electroless Plating Equipment." In Encyclopedic Dictionary of Polymers. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4283.

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Broglia, M., P. Pinacci, and A. Basile. "Membranes Prepared via Electroless Plating." In Membranes for Membrane Reactors. John Wiley & Sons, Ltd, 2011. http://dx.doi.org/10.1002/9780470977569.ch11.

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Shacham-Diamand, Yosi, Yelena Sverdlov, Stav Friedberg, and Avi Yaverboim. "Electroless Plating and Printing Technologies." In Nanomaterials for 2D and 3D Printing. Wiley-VCH Verlag GmbH & Co. KGaA, 2017. http://dx.doi.org/10.1002/9783527685790.ch3.

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Senkevich, Jay J. "ALD Seed Layers for Plating and Electroless Plating." In Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. Springer New York, 2009. http://dx.doi.org/10.1007/978-0-387-95868-2_12.

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Viswanathan, B. "Metallization of Plastics by Electroless Plating." In Microwave Materials. Springer Berlin Heidelberg, 1994. http://dx.doi.org/10.1007/978-3-662-08740-4_3.

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Wen, G., Z. X. Guo, and C. K. L. Davies. "Direct Electroless Plating of ZrO2 Powder." In Ceramics - Processing, Reliability, Tribology and Wear. Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527607293.ch54.

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Matsumura, Sowjun, and Ju Sheng Ma. "Properties of Electroless Nickel Composite Plating Film." In Materials Science Forum. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1877.

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Olberding, W. "An Introduction to Electrodeposition and Electroless Plating Processes." In Modern Surface Technology. Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527608818.ch7.

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Mahmoudi, Hacene. "Water Recycling in Electroless Plating by Membrane Operations." In Encyclopedia of Membranes. Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-662-44324-8_1971.

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Atti di convegni sul tema "Electroless plating"

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McNabb, William J. "Quality Assurance in Small Plating Shops." In CORROSION 1993. NACE International, 1993. https://doi.org/10.5006/c1993-93036.

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Abstract The potential for electroless nickel coatings in oil field and petrochemical application is quite high. The largest obstacle to their use, however, has been the reputation for poor quality, due to a lack of quality control by many platers. To overcome this, it is mandatory that electroless nickel shops not only have quality control and assurance in their operation, but also document its use and success. In today's competitive market only those facilities which provide quality products will survive. This paper describes how a plating shop can develop the necessary procedures, manuals.
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Yan-bin, Huang, Liu De-gang, Liang Zhi-jie, et al. "Study on Corrosion Resistance of Electroless Plating Ni-P Complex Coating." In CORROSION 2005. NACE International, 2005. https://doi.org/10.5006/c2005-05207.

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Abstract For components in equipment that are used in the littoral with a high requirement for corrosion resistance, the design project of electroless plated nickel-phosphorus complex deposit was put forward in the paper. The treating process of chromate sealing and organic porosity sealing for the surface of the deposit was optimized. By applying two different types of electroless plating solution, a double layer electroless plating deposit with 120mV of stable potential difference was prepared. The design of complex deposit can efficiently reduce porosity and improve the corrosion resistance
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Hsu, Vincent, Jason Chang, and Shih-Hsun Lin. "Advancements in Electroless Copper Plating for Via Shrinking Technology Trend." In 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2024. https://doi.org/10.1109/impact63555.2024.10818861.

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Quint, Alexander, Fabian Hochberg, Maximilian Eckl, Andreas Frölich, Thomas Zwick, and Akanksha Bhutani. "Pretreatments for Electroless Silver Plating of D-Band Plastic Rectangular Waveguides." In 2025 16th German Microwave Conference (GeMiC). IEEE, 2025. https://doi.org/10.23919/gemic64734.2025.10979101.

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Shao, Yun-Hao, Zi-Hong Ni, Gui Chen, Hao Wang, and Xin-Ping Qu. "Low contact resistance copper-copper bonding with selective electroless plating cobalt interlayer." In 2024 IEEE International Interconnect Technology Conference (IITC). IEEE, 2024. http://dx.doi.org/10.1109/iitc61274.2024.10732083.

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Yan-bin, Huang, Liang Zhi-jie, Zhao Huo-ying, and Liu Bo. "Research on the Corrosion Resistance Properties of Electroless Ni-Cu-P Plating." In CORROSION 2006. NACE International, 2006. https://doi.org/10.5006/c2006-06273.

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Abstract In order to improve the corrosion and wear resistance of the coatings of electroless plating Ni-Cu-P and broaden its application, an optimizing mathematical theory test has been applied in this research. The processing parameters have been optimized and some Ni-Cu-P coatings have been obtained with smooth and glittering appearance. At the same time, the composite complexants can prevent copper from depositing first and obtain coatings with strong adhesion. The porosity of Ni-Cu-P coating (20 μ m) ranked class 9. The coating color changes after at least 800 second when HNO3 dropping on
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Eisner, Steve, and John J. Reilly. "Effect of Corrosion on the EMI Shielding of Composite Electronic Enclosures." In CORROSION 1989. NACE International, 1989. https://doi.org/10.5006/c1989-89043.

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Abstract Two conductive composite materials were injection molded into an electronic enclosure configuration. The two materials used were 30% nickel plated graphite (NiGr) fibers and 20% nickel flakes (NiFlk) in polyphenylene sulfide (PPS) and 30% NiGr fibers and 10% stainless steel (SS) fibers in PPS. These enclosures were electroplated with a nickel strike followed by a 2 mil (51μm) layer of copper and then by an electroless nickel flash. Peel strength tests were performed to evaluate the adhesion of the nickel/copper/electroless nickel plating system to each of the two composites. The avera
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Ebdon, Paul R. "Electroless Nickel/IPTFE Composites." In Annual Aerospace/Airline Plating and Metal Finishing Forum and Exposition. SAE International, 1988. http://dx.doi.org/10.4271/880875.

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Rains, Aaron E., and Ronald A. Kline. "Real time monitoring of electroless nickel plating." In REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: VOLUME 32. AIP, 2013. http://dx.doi.org/10.1063/1.4789211.

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Nanzi Fan, Mingliang Huang, and Lai Wang. "Electroless nickel-boron plating on magnesium alloy." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582328.

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Rapporti di organizzazioni sul tema "Electroless plating"

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Stencel, Nick, and Joyce O'Donnell. Electrolytic Regeneration of Contaminated Electroless Nickel Plating Baths. Defense Technical Information Center, 1995. http://dx.doi.org/10.21236/ada350616.

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Davis, J. S. Waste Reduction for Electroless Nickel Plating Solutions at U.S. Army Depots. Defense Technical Information Center, 1992. http://dx.doi.org/10.21236/ada253404.

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Ilias, Shamsuddin, and Dhananjay Kumar. Fabrication of Pd/Pd-Alloy Films by Surfactant Induced Electroless Plating for Hydrogen Separation from Advanced Coal Gasification Processes. Office of Scientific and Technical Information (OSTI), 2012. http://dx.doi.org/10.2172/1080430.

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