Bibliografie tematiche / Metallizing

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Letteratura scientifica selezionata sul tema "Metallizing"

Autore: Grafiati
Pubblicato: 4 giugno 2021
Ultima modifica: 30 luglio 2024

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Articoli di riviste sul tema "Metallizing"

1

Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 98, no. 1 (January 2000): 381–87. http://dx.doi.org/10.1016/s0026-0576(00)80347-5.

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Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 97, no. 1 (January 1999): 381–87. http://dx.doi.org/10.1016/s0026-0576(00)83098-6.

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Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 99 (January 2001): 380–86. http://dx.doi.org/10.1016/s0026-0576(01)85298-3.

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Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 100 (January 2002): 365–71. http://dx.doi.org/10.1016/s0026-0576(02)82040-2.

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Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 97, no. 1 (January 1999): 388–94. http://dx.doi.org/10.1016/s0026-0576(99)80040-3.

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Davidoff, Charles. "Metallizing nonconductors." Metal Finishing 93, no. 1 (January 1995): 362–68. http://dx.doi.org/10.1016/0026-0576(95)93385-f.

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Liu, Gui Wu, Guan Jun Qiao, Hong Jie Wang, and Zhi Hao Jin. "Microstructure and Strength of Alumina-Metal Joint Brazed by Activated Molybdenum–Manganese Method." Key Engineering Materials 353-358 (September 2007): 2049–52. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2049.

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Abstract (sommario):
High purity alumina/stainless steel joints were produced via activated molybdenummanganese (Mo-Mn) route using 72Ag-28Cu solder. Microstructures of the metallized ceramic and joint sections were observed by scanning electron microscopy. Joint strength was tested by shear-loading method. Some process factors were characterized and analyzed, which include temperature, holding time and heating and cooling rate in ceramic metallization process. The effects of Ni plating and succedent annealing were also investigated. Experimental results show that, migration of glassy phases is the main mechanism
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Gupta, R. K. "Improved Vacuum Metallizing Techniques." Journal of Optics 14, no. 3 (September 1985): 112–14. http://dx.doi.org/10.1007/bf03549132.

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Gebhardt, John, Keith Waryold, Dave Oglesby, and John Graves. "Horizontal processing for metallizing microvias." Circuit World 28, no. 1 (March 2002): 34–39. http://dx.doi.org/10.1108/03056120210407720.

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Rubinstein, M. "ELECTROCHEMICAL METALLIZING OF ADVANCED MATERIALS." Materials and Manufacturing Processes 4, no. 4 (January 1989): 561–78. http://dx.doi.org/10.1080/10426918908956315.

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Tesi sul tema "Metallizing"

1

Chapples, J. "Electrochemical and chemical methods of metallizing plastic films." Thesis, Cranfield University, 1991. http://hdl.handle.net/1826/3240.

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This thesis describes two novel techniques for the metallization of non-electroactive polymer films and thicker sectioned polyethylene and nylon substrates. In the first approach, non-electroactive polymer substrates were impregnated with surface layers of polypyrrole and polyaniline, using electrochemical and chemical methods of polymerization. The relative merits of both these approaches are discussed and compared with other methods in the literature. The resultant composite materials exhibited sufficient conductivity to permit the direct electrodeposition of metal surface coats. Polypyrrole
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Leong, Chuen Shiong. "Repair/strengthening of steel angles using thermal spray metallizing." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 2000. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape3/PQDD_0013/MQ53172.pdf.

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Gall, Martin. "Investigation of electromigration reliability in Al(Cu) interconnects /." Digital version accessible at:, 1999. http://wwwlib.umi.com/cr/utexas/main.

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Contarino, Mark Ryan Chaiken Irwin M. Pourrezaei Kambiz. "Self-assembling, coiled coil interfaces for nanoscale amperometric biosensors /." Philadelphia, Pa. : Drexel University, 2008. http://hdl.handle.net/1860/2819.

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Martini, David M. Kelber Jeffry Alan. "Metallization and modification of low-k dielectric materials." [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-9754.

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Chan, Yu Hin. "Optimization of metallization and process variables in low temperature wire bonding technology /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20CHAN.

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Abstract (sommario):
Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003.<br>Includes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.
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Adedeji, Adetayo V. William John R. "Composite contact metallization on SiC for high temperature applications in air." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/ADEDEJI_ADETAYO_15.pdf.

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Witt, Kevin L. "Development of a Ti:W salicide-nitride based multilayer metallization for VLSI application /." Online version of thesis, 1992. http://hdl.handle.net/1850/11045.

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Pritchett, Merry. "Adherence/Diffusion Barrier Layers for Copper Metallization: Amorphous Carbon:Silicon Polymerized Films." Thesis, University of North Texas, 2004. https://digital.library.unt.edu/ark:/67531/metadc4493/.

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Abstract (sommario):
Semiconductor circuitry feature miniaturization continues in response to Moore 's Law pushing the limits of aluminum and forcing the transition to Cu due to its lower resistivity and electromigration. Copper diffuses into silicon dioxide under thermal and electrical stresses, requiring the use of barriers to inhibit diffusion, adding to the insulator thickness and delay time, or replacement of SiO2 with new insulator materials that can inhibit diffusion while enabling Cu wetting. This study proposes modified amorphous silicon carbon hydrogen (a-Si:C:H) films as possible diffusion barrier
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Manandhar, Sudha. "Free Radical Induced Oxidation, Reduction and Metallization of NiSi and Ni(Pt)Si Surfaces." Thesis, University of North Texas, 2010. https://digital.library.unt.edu/ark:/67531/metadc31542/.

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NiSi and Ni(Pt)Si, and of the effects of dissociated ammonia on oxide reduction was carried out under controlled ultrahigh vacuum (UHV) conditions. X-ray photoelectron spectroscopy (XPS) has been used to characterize the evolution of surface composition. Vicinal surfaces on NiSi and Ni(Pt)Si were formed in UHV by a combination of Ar+ sputtering and thermal annealing. Oxidation of these surfaces in the presence of either O+O2 or pure O2 at room temperature results in the initial formation of a SiO2 layer ~ 7 Å thick. Subsequent exposure to O2 yields no further oxidation. Continued exposure to
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Libri sul tema "Metallizing"

1

Rubinstein, Marvin. Electrochemical metallizing. New York, NY: Van Nostrand Reinhold, 1986.

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2

Moran, Robert. Markets for metallizing technologies. Norwalk, CT: Business Communications Co., 1995.

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Rubinstein, Marvin. Electrochemical metallizing: Principles and practice. New York: Van Nostrand Reinhold, 1987.

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4

Rubinstein, Marvin. Das Tampongalvanisieren. Saulgau/Württ: E.G. Leuze, 1985.

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Richard, Suchentrunk, ed. Metallizing of plastics: A handbook of theory and practice. Materials Park, Ohio: ASM International, 1993.

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6

Munich), NATO Advanced Research Workshop on Metallization and Metal-Semiconductor Interfaces (1988 Technical University of. Metallization and metal-semiconductor interfaces. New York: Plenum Press, 1989.

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7

Symposium on Electromigration of Metals (1984 New Orleans, La.). Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging. Pennington, NJ: Electrochemical Society, 1985.

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8

1951-, Andricacos Panayotis C., ed. Electrochemical synthesis and modification of materials: Symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A. Pittsburgh, Pa: Materials Research Society, 1997.

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9

Krishna, Shenai, ed. VLSI metallization: Physics and technologies. Boston: Artech House, 1991.

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Symposium on Electrochemically Deposited Thin Films (1996 San Antonio, Tex.). Proceedings of the Third Symposium on Electrochemically Deposited Thin Films. Edited by Paunovic Milan, Scherson D, Electrochemical Society Electrodeposition Division, and Electrochemical Society. Physical Electrochemistry Division. Pennington, NJ: Electrochemical Society, 1997.

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Capitoli di libri sul tema "Metallizing"

1

Gooch, Jan W. "Metallizing." In Encyclopedic Dictionary of Polymers, 453. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_7353.

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Gooch, Jan W. "Metallizing Agents." In Encyclopedic Dictionary of Polymers, 453. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_7354.

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Southward, Robin E., D. Scott Thompson, David W. Thompson, Maggie L. Caplan, and Anne K. St. Clair. "Preparation of Silvered Polyimide Mirrors via Self-Metallizing Poly(Amic Acid) Resins." In Metal-Containing Polymeric Materials, 349–56. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4613-0365-7_28.

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"Metallizing." In Encyclopedic Dictionary of Polymers, 607–8. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_7236.

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"Metallizing agents." In Encyclopedic Dictionary of Polymers, 608. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_7237.

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"Metallizing of Plastics." In Engineered Materials Handbook Desk Edition, 356–64. ASM International, 1995. http://dx.doi.org/10.31399/asm.hb.emde.a0003022.

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"metallizing | metalizing, adj." In Oxford English Dictionary. 3rd ed. Oxford University Press, 2023. http://dx.doi.org/10.1093/oed/1170265535.

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"metallizing | metalizing, n." In Oxford English Dictionary. 3rd ed. Oxford University Press, 2023. http://dx.doi.org/10.1093/oed/8056440947.

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9

Bishop, Charles A., and Eldridge M. Mount. "Vacuum metallizing for flexible packaging." In Multilayer Flexible Packaging, 185–202. Elsevier, 2010. http://dx.doi.org/10.1016/b978-0-8155-2021-4.10014-0.

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Bishop, Charles A., and Eldridge M. Mount. "Vacuum Metallizing for Flexible Packaging." In Multilayer Flexible Packaging, 235–55. Elsevier, 2016. http://dx.doi.org/10.1016/b978-0-323-37100-1.00015-6.

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Atti di convegni sul tema "Metallizing"

1

Benson, Lee. "Electrochemical Metallizing, Tooling Design, and Application." In Annual Aerospace/Airline Plating and Metal Finishing Forum and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1988. http://dx.doi.org/10.4271/880870.

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Soukiassian, Patrick G. "Metallizing A Semiconductor Surface With Hydrogen." In PHYSICS OF SEMICONDUCTORS: 27th International Conference on the Physics of Semiconductors - ICPS-27. AIP, 2005. http://dx.doi.org/10.1063/1.1994146.

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Serritella, Eric E. "Electrochemical Metallizing - An Aircraft Turbine Engine Restoration Tool." In Airframe Finishing, Maintenance & Repair Conference & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1991. http://dx.doi.org/10.4271/910930.

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Serritella, Eric E. "Zinc Electrochemical Metallizing for Corrosion Protection of Automobile Wheel Hubs." In SAE Automotive Corrosion and Prevention Conference and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1991. http://dx.doi.org/10.4271/912288.

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Horton, A. M. "Zinc Metallizing for External Corrosion Control of Ductile Iron Pipe." In Pipelines 2014. Reston, VA: American Society of Civil Engineers, 2014. http://dx.doi.org/10.1061/9780784413692.118.

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Zhang, T., E. Padayodi, R. N. Raoelison, and J. C. Sagot. "Development of Compatibilizing Sublayer for Metallizing CFRP Structures by Cold Spray." In ITSC2022. DVS Media GmbH, 2022. http://dx.doi.org/10.31399/asm.cp.itsc2022p0893.

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Abstract (sommario):
Abstract This study aims to develop a metal-based compatibilizing sublayer on a Carbon Fiber-Reinforced Polymer (CFRP) composite to overcome the erosion issue of polymer substrate using the cold spray deposition technique. The objective is to contribute to the in-situ repair of aircraft structures. Two cases of sublayers, i.e., Al-based sublayer (1126 μm thick) and Cu-based sublayer (547 μm thick), have been prepared and co-cured with the CFRP substrates by pressure assisted molding process. Gas-atomized copper powders were deposited on a reference sample of aluminum panel (A-0) and on two fun
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Sabard, A., A. Albassam, S. Chadha, and T. Hussain. "Cold Spraying of Metallic Powders Onto Polymeric Substrates: Influence of Gas Preheating Temperature on the Coating Deposition." In ITSC2018, edited by F. Azarmi, K. Balani, H. Li, T. Eden, K. Shinoda, T. Hussain, F. L. Toma, Y. C. Lau, and J. Veilleux. ASM International, 2018. http://dx.doi.org/10.31399/asm.cp.itsc2018p0159.

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Abstract (sommario):
Abstract Common issues such as ice formation on wind turbine blades and lightning strikes on airplanes can be mitigated by metallizing polymers and composites used on the outer surface of the component. Cold gas dynamic spray is a novel process that has the potential to be used for metallization of polymer and composite surfaces to produce electrically and/or thermally conductive components. In this study, mixed Cu-Zn and Al-Zn feedstock powders were deposited onto polypropylene and nylon-6 substrates to investigate the viability of metallizing nonmetallic surfaces using a commercially availab
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Cowan, James J., and W. Dennis Slafer. "Advances in Holographic Embossing: The Polaform Process." In Holography. Washington, D.C.: Optica Publishing Group, 1986. http://dx.doi.org/10.1364/holography.1986.tub1.

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Abstract (sommario):
The Polaform process is a relatively new technique for the mass replication of holographic recordings by means of embossing. The process consists of the following major steps: Recording of a holographic interference pattern in photoresist; formation of a master metal replica of the photoresist pattern by electroplating; and use of the metal master or a metal replica to repeatedly emboss this pattern into long sheets of plastic. In certain cases, there is a fourth step involving metallizing and die cutting of the plastic sheet.
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Petrescu, Emil, Paul Penciou, Camelia Petrescu, and Marinela Catrinciuc. "Execution of chemical metallizing of the inlet opening of a puncture in material." In SIOEL: Sixth Symposium of Optoelectronics, edited by Teodor Necsoiu, Maria Robu, and Dan C. Dumitras. SPIE, 2000. http://dx.doi.org/10.1117/12.378673.

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Rubinstein, Mary, John Lembo, and Fred Swartling. "Two Special Cost-Effective Applications for Electrochemical Metallizing for Improved Brazing and Bonding." In Annual Aerospace/Airline Plating and Metal Finishing Forum and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1989. http://dx.doi.org/10.4271/890927.

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