Articoli di riviste sul tema "Microelectronic devices"
Cita una fonte nei formati APA, MLA, Chicago, Harvard e in molti altri stili
Vedi i top-50 articoli di riviste per l'attività di ricerca sul tema "Microelectronic devices".
Accanto a ogni fonte nell'elenco di riferimenti c'è un pulsante "Aggiungi alla bibliografia". Premilo e genereremo automaticamente la citazione bibliografica dell'opera scelta nello stile citazionale di cui hai bisogno: APA, MLA, Harvard, Chicago, Vancouver ecc.
Puoi anche scaricare il testo completo della pubblicazione scientifica nel formato .pdf e leggere online l'abstract (il sommario) dell'opera se è presente nei metadati.
Vedi gli articoli di riviste di molte aree scientifiche e compila una bibliografia corretta.
Brodie, I., and P. R. Schwoebel. "Vacuum microelectronic devices." Proceedings of the IEEE 82, no. 7 (July 1994): 1006–34. http://dx.doi.org/10.1109/5.293159.
Testo completovon Windheim, Tasso, Kristin H. Gilchrist, Charles B. Parker, Stephen Hall, James B. Carlson, David Stokes, Nicholas G. Baldasaro, et al. "Proof-of-Concept Vacuum Microelectronic NOR Gate Fabricated Using Microelectromechanical Systems and Carbon Nanotube Field Emitters." Micromachines 14, no. 5 (April 29, 2023): 973. http://dx.doi.org/10.3390/mi14050973.
Testo completoSrivastava, V. "THz vacuum microelectronic devices." Journal of Physics: Conference Series 114 (May 1, 2008): 012015. http://dx.doi.org/10.1088/1742-6596/114/1/012015.
Testo completoRen, Yanru, Min Zhu, Dongyu Xu, Minghui Liu, Xuehui Dai, Shengao Wang, and Longxian Li. "Overview on Radiation Damage Effects and Protection Techniques in Microelectronic Devices." Science and Technology of Nuclear Installations 2024 (March 30, 2024): 1–17. http://dx.doi.org/10.1155/2024/3616902.
Testo completoMANUSHIN, Dmitrii V., Guzel' R. TAISHEVA, and Shamil' I. ENIKEEV. "Russian microelectronics: Current state-of-the-art, logistics, management issues, crisis response measures." National Interests: Priorities and Security 19, no. 5 (May 16, 2023): 808–42. http://dx.doi.org/10.24891/ni.19.5.808.
Testo completoChen, Yuan, and Xiao Wen Zhang. "Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices." Applied Mechanics and Materials 58-60 (June 2011): 2171–76. http://dx.doi.org/10.4028/www.scientific.net/amm.58-60.2171.
Testo completoMin, K. H., and J. Mardinly. "Electron Tomography of Microelectronic Devices." Microscopy and Microanalysis 9, S02 (July 22, 2003): 502–3. http://dx.doi.org/10.1017/s1431927603442517.
Testo completoEkpu, M., R. Bhatti, M. I. Okereke, and K. C. Otiaba. "Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000473–77. http://dx.doi.org/10.4071/isom-2013-wa23.
Testo completoOSADCHUK, Iaroslav. "MICROELECTRONIC AUTOGENERATOR TEMPERATURE SENSORS." Herald of Khmelnytskyi National University. Technical sciences 317, no. 1 (February 23, 2023): 237–47. http://dx.doi.org/10.31891/2307-5732-2023-317-1-237-247.
Testo completoКриштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес та Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, № 3s (15 червня 2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.
Testo completoAzizov, А. R. "Microelectronic device for determining telecontrol signal pulse quality." E3S Web of Conferences 458 (2023): 09020. http://dx.doi.org/10.1051/e3sconf/202345809020.
Testo completoSluckuvienė, Zita, and Lidija Božė. "Technologies and materials that have enabled the miniaturization of electronic elements." Applied Scientific Research 2, no. 2 (October 3, 2023): 151–59. http://dx.doi.org/10.56131/tmt.2023.2.2.178.
Testo completoAzizov, Asadulla, Elnora Ametova, and Feruza Shakirova. "Integrated microelectronic pulse shaper for automation and telemechanic systems in railway transport." E3S Web of Conferences 402 (2023): 03005. http://dx.doi.org/10.1051/e3sconf/202340203005.
Testo completoFowler, Michelle, Dongshun Bai, Curt Planje, and Xie Shao. "High-Aspect Ratio Planarization using Self-Leveling Materials." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002567–86. http://dx.doi.org/10.4071/2012dpc-tha35.
Testo completoNorthrop, D. C. "Book Review: Introduction to Microelectronic Devices." International Journal of Electrical Engineering & Education 27, no. 1 (January 1990): 93. http://dx.doi.org/10.1177/002072099002700139.
Testo completoBaikerikar, K. K., and A. B. Scranton. "Photopolymerizable liquid encapsulants for microelectronic devices." Polymer 42, no. 2 (January 2001): 431–41. http://dx.doi.org/10.1016/s0032-3861(00)00388-8.
Testo completoOsenbach, John W. "Corrosion-induced degradation of microelectronic devices." Semiconductor Science and Technology 11, no. 2 (February 1, 1996): 155–62. http://dx.doi.org/10.1088/0268-1242/11/2/002.
Testo completoGorham, D. A. "Analysis of microelectronic materials and devices." Microelectronics Journal 24, no. 5 (August 1993): 594. http://dx.doi.org/10.1016/0026-2692(93)90143-3.
Testo completoBlackmore, G. W. "Analysis of Microelectronic Materials and Devices." Journal of Electroanalytical Chemistry 326, no. 1-2 (May 1992): 363–64. http://dx.doi.org/10.1016/0022-0728(92)80525-9.
Testo completoTyler, Talmage, Olga A. Shenderova, and Gary E. McGuire. "Vacuum microelectronic devices and vacuum requirements." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 23, no. 4 (July 2005): 1260–66. http://dx.doi.org/10.1116/1.1885019.
Testo completoGray, H. F. "The physics of vacuum microelectronic devices." IEEE Transactions on Electron Devices 36, no. 11 (November 1989): 2599. http://dx.doi.org/10.1109/16.43690.
Testo completoSchreutelkamp, R. J. "Analysis of microelectronic materials and devices." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 72, no. 1 (October 1992): 143. http://dx.doi.org/10.1016/0168-583x(92)95294-2.
Testo completoAdams, F. "Analysis of Microelectronic Materials and Devices." Analytica Chimica Acta 268, no. 1 (October 1992): 189. http://dx.doi.org/10.1016/0003-2670(92)85264-7.
Testo completoLin, Yadi, and Wendi Lin. "The Impact of Predictability and Fault Tolerance on Reliability in Microelectronic Device Design and Manufacturing." International Journal of Engineering and Technology 16, no. 1 (2024): 57–60. http://dx.doi.org/10.7763/ijet.2024.v16.1255.
Testo completoLiu, Shiqian, Keith Sweatman, Stuart McDonald, and Kazuhiro Nogita. "Ga-Based Alloys in Microelectronic Interconnects: A Review." Materials 11, no. 8 (August 8, 2018): 1384. http://dx.doi.org/10.3390/ma11081384.
Testo completoHawker, Craig J., James L. Hedrick, Robert D. Miller, and Willi Volksen. "Supramolecular Approaches to Nanoscale Dielectric Foams for Advanced Microelectronic Devices." MRS Bulletin 25, no. 4 (April 2000): 54–58. http://dx.doi.org/10.1557/mrs2000.30.
Testo completoLi, Shiyi, Yuecen Zhao, Wenzhong Lou, Hengzhen Feng, Sining Lv, Ziying Zhang, and Wenxing Kan. "Electromagnetic pulse impact characterization of MEMS devices." Journal of Physics: Conference Series 2982, no. 1 (April 1, 2025): 012003. https://doi.org/10.1088/1742-6596/2982/1/012003.
Testo completoArduino, Daniele, Stefano Stassi, Chiara Spano, Luciano Scaltrito, Sergio Ferrero, and Valentina Bertana. "Silicon and Silicon Carbide Recrystallization by Laser Annealing: A Review." Materials 16, no. 24 (December 16, 2023): 7674. http://dx.doi.org/10.3390/ma16247674.
Testo completoKarnaushenko, Daniil, Tong Kang, Vineeth K. Bandari, Feng Zhu, and Oliver G. Schmidt. "3D Microelectronics: 3D Self‐Assembled Microelectronic Devices: Concepts, Materials, Applications (Adv. Mater. 15/2020)." Advanced Materials 32, no. 15 (April 2020): 2070120. http://dx.doi.org/10.1002/adma.202070120.
Testo completoAhmed, Wase U. "Metallography of Microelectronic Devices / Metallographie mikroelektronischer Bauteile." Practical Metallography 39, no. 8 (August 1, 2002): 437–48. http://dx.doi.org/10.1515/pm-2002-390807.
Testo completoRuhl, Guenther, Sebastian Wittmann, Matthias Koenig, and Daniel Neumaier. "The integration of graphene into microelectronic devices." Beilstein Journal of Nanotechnology 8 (May 15, 2017): 1056–64. http://dx.doi.org/10.3762/bjnano.8.107.
Testo completoLarson, D. J., D. Lawrence, W. Lefebvre, D. Olson, T. J. Prosa, D. A. Reinhard, R. M. Ulfig, et al. "Toward atom probe tomography of microelectronic devices." Journal of Physics: Conference Series 326 (November 9, 2011): 012030. http://dx.doi.org/10.1088/1742-6596/326/1/012030.
Testo completoMecklenburg, Matthew, William A. Hubbard, E. R. White, Rohan Dhall, Stephen B. Cronin, Shaul Aloni, and B. C. Regan. "Nanoscale temperature mapping in operating microelectronic devices." Science 347, no. 6222 (February 5, 2015): 629–32. http://dx.doi.org/10.1126/science.aaa2433.
Testo completoGórski, Bartosz, Jonas Rein, Samantha Norris, Yanxin Ji, Paul L. McEuen, and Song Lin. "Light-harvesting microelectronic devices for wireless electrosynthesis." Nature 637, no. 8045 (January 8, 2025): 354–61. https://doi.org/10.1038/s41586-024-08373-1.
Testo completoChin, K. Ken, and R. B. Marcus. "Field emitter tips for vacuum microelectronic devices." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8, no. 4 (July 1990): 3586–90. http://dx.doi.org/10.1116/1.576511.
Testo completoWürfl, Joachim, Vera Abrosimova, Jochen Hilsenbeck, Erich Nebauer, Walter Rieger, and Günther Tränkle. "Reliability considerations of III-nitride microelectronic devices." Microelectronics Reliability 39, no. 12 (December 1999): 1737–57. http://dx.doi.org/10.1016/s0026-2714(99)00181-x.
Testo completoBerbezier, I., and A. Ronda. "Si/SiGe heterostructures for advanced microelectronic devices." Phase Transitions 81, no. 7-8 (July 2008): 751–72. http://dx.doi.org/10.1080/01411590802130576.
Testo completoLiechti, K. M. "Residual stresses in plastically encapsulated microelectronic devices." Experimental Mechanics 25, no. 3 (September 1985): 226–31. http://dx.doi.org/10.1007/bf02325091.
Testo completoHersee, S. D., L. Yang, M. Kao, P. Martin, J. Mazurowski, A. Chin, and J. Ballingall. "MOMBE GaAs and AlGaAs for microelectronic devices." Journal of Crystal Growth 120, no. 1-4 (May 1992): 218–27. http://dx.doi.org/10.1016/0022-0248(92)90394-x.
Testo completoMizoguchi, Katsuhiro, and Etsuo Hasegawa. "Photoactive Polymers Applied to Advanced Microelectronic Devices." Polymers for Advanced Technologies 7, no. 5-6 (May 1996): 471–77. http://dx.doi.org/10.1002/(sici)1099-1581(199605)7:5/6<471::aid-pat534>3.0.co;2-r.
Testo completoWietrzak, A., and D. Poulikakos. "Turbulent forced convective cooling of microelectronic devices." International Journal of Heat and Fluid Flow 11, no. 2 (June 1990): 105–13. http://dx.doi.org/10.1016/0142-727x(90)90003-t.
Testo completoMammadova, A. M., A. N. Mammadova, and R. N. Valiyev. "Application of injection transistors in microelectronic devices." Proceedings Natural and Technical sciences, no. 01 (2024): 85. http://dx.doi.org/10.59849/3006-1318.2024.1.85.
Testo completoYang, Qing, John Mardinly, Christian Kübel, Chris Nelson, and Christian Kisielowski. "Electron tomography of microelectronic device interconnects." International Journal of Materials Research 97, no. 7 (July 1, 2006): 880–84. http://dx.doi.org/10.1515/ijmr-2006-0142.
Testo completoWong Mian Sheng, Abdulhafid M Elfaghi, and Lukmon Owolabi Afolabi. "Numerical Study on Heat Propagation in Laptop Cooling System." Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 99, no. 1 (October 17, 2022): 58–65. http://dx.doi.org/10.37934/arfmts.99.1.5865.
Testo completoWang, Guang Yin. "Investigation Progress on Microelectronic Materials: Carbon Nanotube and Graphene." Advanced Materials Research 531 (June 2012): 165–67. http://dx.doi.org/10.4028/www.scientific.net/amr.531.165.
Testo completoBaranov, M. A., E. K. Karseeva, and O. Yu Tsybin. "Prototypes of devices for heterogeneous hybrid semiconductor electronics with an embedded biomolecular domain." Микроэлектроника 52, no. 6 (November 1, 2023): 497–507. http://dx.doi.org/10.31857/s0544126923600185.
Testo completoMoon, F. C. "Mechanics of Electronic and Electromechanical Devices." Applied Mechanics Reviews 38, no. 10 (October 1, 1985): 1294–96. http://dx.doi.org/10.1115/1.3143696.
Testo completoLauer, Scott, Whitten Little, Pier Benci, Tim Schmitt, and John Mazurowski. "Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Carriers and Microelectronic Systems." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000946–48. http://dx.doi.org/10.4071/isom-2012-wp53.
Testo completoLauer, Scott, Whitten Little, Thomas Ambrose, Jeff Conrad, and Tim Cowen. "Precision Patterned Thin Films without Photolithography: Additive Manufacturing of Printed Electronics." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000927–31. http://dx.doi.org/10.4071/isom-2013-thp55.
Testo completoAzizov, Asadulla. "Development and research of a model of a microprocessor device of a set-up control unit for paired points." E3S Web of Conferences 402 (2023): 03019. http://dx.doi.org/10.1051/e3sconf/202340203019.
Testo completo