Gotowa bibliografia na temat „Dry etch”
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Artykuły w czasopismach na temat "Dry etch"
Lee, Jong Seok, Geun Min Choi, Ji Nok Jung, et al. "Development of a Integrated Dry/Wet Hybrid Cleaning System." Solid State Phenomena 195 (December 2012): 21–24. http://dx.doi.org/10.4028/www.scientific.net/ssp.195.21.
Pełny tekst źródłaCastro, Marcelo S. B., Sebastien Barnola, and Barbara Glück. "Selective and Anisotropic Dry Etching of Ge over Si." Journal of Integrated Circuits and Systems 8, no. 2 (2013): 104–9. http://dx.doi.org/10.29292/jics.v8i2.380.
Pełny tekst źródłaPARK, JONG CHEON, JIN KON KIM, TAE GYU KIM, et al. "DRY ETCHING OF SnO2 AND ZnO FILMS IN HALOGEN-BASED INDUCTIVELY COUPLED PLASMAS." International Journal of Modern Physics B 25, no. 31 (2011): 4237–40. http://dx.doi.org/10.1142/s0217979211066660.
Pełny tekst źródłaKwon, Jiyoung, Jungwon Kim, Dongseok Choi, and Duck-Su Kim. "The Influence of Drying Time, Application Mode, and Agitation on the Dentin Bond Strength of a Novel Mesoporous Bioactive Glass-Containing Universal Dentin Adhesive." Journal of Functional Biomaterials 16, no. 7 (2025): 247. https://doi.org/10.3390/jfb16070247.
Pełny tekst źródłaLenzi, Tathiane Larissa, Fabio Zovico Maxnuck Soares, and Rachel de Oliveira Rocha. "Does Bonding Approach Influence the Bond Strength of Universal Adhesive to Dentin of Primary Teeth?" Journal of Clinical Pediatric Dentistry 41, no. 3 (2017): 214–18. http://dx.doi.org/10.17796/1053-4628-41.3.214.
Pełny tekst źródłaChiang, Chao-Ching, Xinyi Xia, Jian-Sian Li, Fan Ren та Stephen J. Pearton. "Selective Wet and Dry Etching of NiO over β-Ga2O3". ECS Transactions 111, № 2 (2023): 73–83. http://dx.doi.org/10.1149/11102.0073ecst.
Pełny tekst źródłaSzweda, Roy. "Dry etch processes for optoelectronic devices." III-Vs Review 14, no. 1 (2001): 42–47. http://dx.doi.org/10.1016/s0961-1290(01)89007-4.
Pełny tekst źródłaHeidenblut, Maria, D. Sturm, Alfred Lechner, and Franz Faupel. "Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch." Solid State Phenomena 145-146 (January 2009): 349–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.145-146.349.
Pełny tekst źródłaKang, In Ho, Wook Bahng, Sung Jae Joo, Sang Cheol Kim, and Nam Kyun Kim. "Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode." Materials Science Forum 615-617 (March 2009): 663–66. http://dx.doi.org/10.4028/www.scientific.net/msf.615-617.663.
Pełny tekst źródłaSung, Da In, Hyun Woo Tak, Dong Woo Kim, and Geun Young Yeom. "A comparative study of Cx(x = 4, 5, 7)F8 plasmas for dry etch processing." Materials Express 10, no. 6 (2020): 903–8. http://dx.doi.org/10.1166/mex.2020.1776.
Pełny tekst źródłaRozprawy doktorskie na temat "Dry etch"
Nilgianskul, Tan. "Control of a semiconductor dry etch process using variation and correlation analyses." Thesis, Massachusetts Institute of Technology, 2016. http://hdl.handle.net/1721.1/107025.
Pełny tekst źródłaMuthukrishnan, N. Moorthy. "Characterization and modeling of dry etch processes for titanium nitride and titanium films in Cl₂/N₂ and BCl₃ plasmas." Diss., This resource online, 1996. http://scholar.lib.vt.edu/theses/available/etd-06062008-151045/.
Pełny tekst źródłaCatala, Antoine. "Gravure Plasma du Nitrure de Gallium pour la réalisation de micro LEDs à hautes performances." Electronic Thesis or Diss., Université Grenoble Alpes, 2024. http://www.theses.fr/2024GRALT041.
Pełny tekst źródłaVilla, Katherine. "The use of wet-to-dry dressings for mechanical debridement." Honors in the Major Thesis, University of Central Florida, 2013. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/928.
Pełny tekst źródłaHamlett, Anna. "Human trafficking : a modern day slavery." Honors in the Major Thesis, University of Central Florida, 2009. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/1270.
Pełny tekst źródłaTorres, Gabriella. "An exploratory study : romanticism in modern day men and women." Honors in the Major Thesis, University of Central Florida, 2010. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/1509.
Pełny tekst źródłaMiniello, Jonathan. "Missing the consequences misperceptions of the 1967 six-day israeli-arab war." Honors in the Major Thesis, University of Central Florida, 2011. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/478.
Pełny tekst źródłaAhmed, Shameem. "Day in and day out : women's experience in the family and the reconstruction of their secondary status." Thesis, McGill University, 1991. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=59959.
Pełny tekst źródłaGuijarro, de Ortiz Myriam. "Literacy Activities that Parents of Preschool Children Attending Day Care Promote at Home and Community Settings." Honors in the Major Thesis, University of Central Florida, 2005. http://digital.library.ucf.edu/cdm/ref/collection/ETH/id/760.
Pełny tekst źródłaAlabed, Hadhom Mohamed. "The effects of fasting for a single day, and during Ramadan, upon performance." Thesis, Liverpool John Moores University, 2010. http://researchonline.ljmu.ac.uk/5958/.
Pełny tekst źródłaKsiążki na temat "Dry etch"
Deepak, Ranadive, and Society of Photo-optical Instrumentation Engineers., eds. Dry etch technology: 9-10-September 1991, San Jose, California. SPIE, 1992.
Znajdź pełny tekst źródłaRoss, Kathy. Every day is Earth Day: A craft book. Millbrook Press, 1994.
Znajdź pełny tekst źródłaRoss, Kathy. Every day is Earth Day: A craft book. Millbrook Press, 1995.
Znajdź pełny tekst źródłaCzęści książek na temat "Dry etch"
van Roosmalen, A. J., J. A. G. Baggerman, and S. J. H. Brader. "Etch Processes." In Dry Etching for VLSI. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-2566-4_6.
Pełny tekst źródłaPearton, S. J., and R. J. Shul. "Dry Etch Damage in Widegap Semiconductor Materials." In Defects in Optoelectronic Materials. CRC Press, 2022. http://dx.doi.org/10.1201/9780367811297-5.
Pełny tekst źródłaMansfield, William M. "Enhancement of Dry-Etch Resistance of Poly(butene-1 sulfone)." In Polymers for High Technology. American Chemical Society, 1987. http://dx.doi.org/10.1021/bk-1987-0346.ch027.
Pełny tekst źródłaClaes, Martine, Quoc Toan Le, J. Keldermans, et al. "Photoresist Characterization and Wet Strip after Low-k Dry Etch." In Solid State Phenomena. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/3-908451-46-9.325.
Pełny tekst źródłaSchaedeli, U., M. Hofmann, E. Tinguely, and N. Münzel. "A Top-Surface Imaging Approach Based on the Light-Induced Formation of Dry-Etch Barriers." In ACS Symposium Series. American Chemical Society, 1995. http://dx.doi.org/10.1021/bk-1995-0614.ch020.
Pełny tekst źródłaIto, Hiroshi, Mitsuru Ueda, and Mayumi Ebina. "Copolymer Approach to Design of Sensitive Deep-UV Resist Systems with High Thermal Stability and Dry Etch Resistance." In ACS Symposium Series. American Chemical Society, 1989. http://dx.doi.org/10.1021/bk-1989-0412.ch004.
Pełny tekst źródłaClaes, M., Vasile Paraschiv, S. Beckx, et al. "Selective Wet Removal of Hf-Based Layers and Post-Dry Etch Residues in High-k and Metal Gate Stacks." In Solid State Phenomena. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/3-908451-06-x.93.
Pełny tekst źródłaBreuker, Remco E. "North Korean Slavery and Forced Labor in Present-Day Europe." In The Palgrave Handbook of Global Slavery throughout History. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-13260-5_36.
Pełny tekst źródłaMohammed, S. G., M. Halliru, J. M. Jibrin, I. Kapran, and H. A. Ajeigbe. "Impact Assessment of Developing Sustainable and Impact-Oriented Groundnut Seed System Under the Tropical Legumes (III) Project in Northern Nigeria." In Enhancing Smallholder Farmers' Access to Seed of Improved Legume Varieties Through Multi-stakeholder Platforms. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-15-8014-7_6.
Pełny tekst źródłaLeape, Lucian L. "A Community of Concern: The Massachusetts Coalition for the Prevention of Medical Errors." In Making Healthcare Safe. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-71123-8_8.
Pełny tekst źródłaStreszczenia konferencji na temat "Dry etch"
Avram, Andrei, Henk-Willem Veltkamp, Marek Eliáš, et al. "A Method for Comparing Dry Etch Equipment." In 2024 International Symposium on Electronics and Telecommunications (ISETC). IEEE, 2024. https://doi.org/10.1109/isetc63109.2024.10797425.
Pełny tekst źródłaWise, Rich S. "HVM readiness of dry resist patterning solutions." In Advanced Etch Technology and Process Integration for Nanopatterning XIV, edited by Efrain Altamirano-Sánchez and Nihar Mohanty. SPIE, 2025. https://doi.org/10.1117/12.3055139.
Pełny tekst źródłaKim, Heeju, Min Cheol Kim, and Geun Young Yeom. "Dry development characteristics and surface analysis of spin-coated tin oxo cluster using Cl2 radical plasma." In Advanced Etch Technology and Process Integration for Nanopatterning XIV, edited by Efrain Altamirano-Sánchez and Nihar Mohanty. SPIE, 2025. https://doi.org/10.1117/12.3051628.
Pełny tekst źródłaSarkar, Tanushree, Anne Vandooren, Karen Stiers, et al. "Dry etch challenges for patterning middle-of-line (MOL) dual damascene contact trench and via in monolithic CFET (complementary FET)." In Advanced Etch Technology and Process Integration for Nanopatterning XIV, edited by Efrain Altamirano-Sánchez and Nihar Mohanty. SPIE, 2025. https://doi.org/10.1117/12.3052052.
Pełny tekst źródłaCho, Kyoung Y., and Dong W. Im. "ECR plasma and etch characterization of photoresist dry etch processes." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56918.
Pełny tekst źródłaTurner, Terry R. "Correlation of real-time-monitored process module parameters and wafer results." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56921.
Pełny tekst źródłaNulty, James E., and Joseph A. Maher. "Application-specific integrated processing for ULSI." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56920.
Pełny tekst źródłaYoneda, Masahiro, K. Kawai, Hiroshi Miyatake, Nobuo Fujiwara, K. Nishioka, and Haruhiko Abe. "Evaluation of silicon surface damage induced by plasma radiation." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56910.
Pełny tekst źródłaNamura, Takashi, Hirofumi Uchida, Hiroyuki Okada, et al. "Wafer charging in different types of plasma etchers." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56911.
Pełny tekst źródłaHasan, Zia, Joseph A. Maher, James E. Nulty, and Larry Krynski. "In-situ auto ash: a key to reducing process-generated particles." In Dry Etch Technology, edited by Deepak Ranadive. SPIE, 1992. http://dx.doi.org/10.1117/12.56912.
Pełny tekst źródłaRaporty organizacyjne na temat "Dry etch"
Ohta, Taisuke. LaB6 nanostructures - wet vs dry etch. Office of Scientific and Technical Information (OSTI), 2019. http://dx.doi.org/10.2172/1491599.
Pełny tekst źródłaZhang, Linlin, Xiaoming Xi, Xihua Liu, et al. Should aerobic and resistance training interventions for Multiple sclerosis be performed on the same day: A protocol for systematic review and network meta-analysis. INPLASY - International Platform of Registered Systematic Review and Meta-analysis Protocols, 2021. http://dx.doi.org/10.37766/inplasy2021.12.0126.
Pełny tekst źródłaMarlow, Thomas. PR-000-18COMP-R03 Damage Prevention Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011548.
Pełny tekst źródłaGreaney, Carrie. PR-000-18COMP-R04 Geohazards Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011549.
Pełny tekst źródłaMarlow, Thomas, Laurie Perry (Archived), and Carrie Greaney. PR-000-18COMP-R05 Horizontal Directional Drilling Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011550.
Pełny tekst źródłaMarlow, Thomas. PR-000-18COMP-R06 Pipeline Repair Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011551.
Pełny tekst źródłaMarlow, Thomas. PR-000-18COMP-R02 Composite Repairs Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011547.
Pełny tekst źródłaChoquette, Gary. PR-000-18COMP-R01 Gas Engine Emissions Compendium. Pipeline Research Council International, Inc. (PRCI), 2019. http://dx.doi.org/10.55274/r0011546.
Pełny tekst źródłaChoquette, Gary. PR-000-21COMP-R04 Valve Spacing and Automation Compendium. Pipeline Research Council International, Inc. (PRCI), 2021. http://dx.doi.org/10.55274/r0012149.
Pełny tekst źródłaRipey, Mariya. NUMBERS IN THE NEWS TEXT (BASED ON MATERIAL OF ONE ISSUE OF NATIONWIDE NEWSPAPER “DAY”). Ivan Franko National University of Lviv, 2021. http://dx.doi.org/10.30970/vjo.2021.50.11106.
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