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Rozprawy doktorskie na temat „Interfacial Stress”

Autor: Grafiati

Data publikacji: 3 czerwca 2025

Data aktualizacji: 31 lipca 2025

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1

Chow, Wai Tuck. "Calculation of stress intensity factors for an interfacial crack." Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/21286.

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Yang, Jian. "Interfacial stress analysis and strengh prediction of plated RC beams." Thesis, University of Leeds, 2005. http://etheses.whiterose.ac.uk/413/.

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Strengthening of reinforced concrete (RC) beams by external plate bonding (EPB) technique has become very popular for the last two decades, especially in the past few years with the increasing applications of the advanced composites. Unlike the unstrengthenedb eams, the composite structure shows an undesirable failure of plate debonding. It has been well recognized that central to this failure mode is the stress concentration at the plate end. It is prerequisite to well understand the stress characteristics at this zone. This thesis reports a systematic investigation on the stress distribution

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3

Griffiths, Brigritte Mary. "Dentine permeability, adhesive penetration and interfacial stress : a confocal microscope study." Thesis, University College London (University of London), 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.286400.

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SILVA, ALBERTO MILONE. "EXPERIMENTAL RESULTS OF INTERFACIAL SHEAR STRESS IN STRATIFIED GAS-LIQUID FLOW." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 1991. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=19314@1.

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CONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO<br>O presente trabalho analisa experimentalmente o escoamento estratificado gás-líquido (ar-água) em um duto de seção retangular. Obteve-se uma correlação empírica para a tensão de cisalhamento na interface. Verifica-se que tal tensão, além de ser função dos números de Reynolds de ambos os escoamentos, depende também de características inerentes à fase líquida. Um perfil teórico de velocidade do gás foi comparado com os dados experimentais obtidos por anemometria para a região logarítmica. Foi realizada uma análise de incertezas, qu

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5

Krishnan, Srivatsava. "Modeling and Characterization of Interfacial Stress Transfer in Mechanoluminescent Smart Particulate Polymer Composites." The Ohio State University, 2020. http://rave.ohiolink.edu/etdc/view?acc_num=osu1577559227817298.

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Shady, Ebraheen Hassan E. H. Gowayed Yasser. "Stress mapping of textile composite materials and its application in interfacial shear behavior." Auburn, Ala., 2005. http://hdl.handle.net/10415/1272.

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Peterson, William Matthew. "Effect of fiber diameter on stress transfer and interfacial damage in fiber reinforced composites." Thesis, Montana State University, 2011. http://etd.lib.montana.edu/etd/2011/peterson/PetersonW0811.pdf.

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In this work, the effect of fiber diameter upon the strength, stiffness, and damage tolerance of a fiber-reinforced polymer composite laminate structure was investigated. Three cases were considered, in which the fiber diameters of 16, 8, and 4 microns were used. A fiber volume fraction of 32% was assumed in each model. Micromechanical, shear-lag, and progressive damage analyses were performed using finite element models of the structure, which was subjected to tensile loading in the fiber direction. Fiber-matrix load transfer efficiencies and the stress distributions near broken fibers within

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8

Park, Ji Eun. "Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill." Diss., Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/18228.

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9

Valença, Silvio Leonardo. "Avaliação da tensão interfacial entre petróleo parafínico e superfícies com resinas epóxi." Universidade Federal de Sergipe, 2010. https://ri.ufs.br/handle/riufs/3506.

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Oil is a very complex chemical system, as for instance, the paraffinic type which was considered as a fluid to be evaluated in this scientific paper, trough the static interfacial tension with the surfaces of the API 5L grade B conduction pipe and the EPOXY and EPOXY M resins. The paraffinic oil produced in the 7-PIR-244D-AL well, which is located in the producing field of Pilar in the state of Alagoas, presents special characteristics concerning its flow which are different from the other oils in the Sedimentary Basin of Sergipe and Alagoas. The resin used in the experiments were the EPOXY

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10

Hariwongsanupab, Nuttapong. "Development of green natural rubber composites : Effect of nitrile rubber, fiber surface treatment and carbon black on properties of pineapple leaf fiber reinforced natural rubber composites." Thesis, Mulhouse, 2017. http://www.theses.fr/2017MULH0399/document.

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Les effets du caoutchouc nitrile (NBR), du traitement de la surface des fibres et du noir de carbone sur les propriétés des composites à base de caoutchouc naturel renforcé par des fibres d'ananas (NR / PALF) ont été étudiés. L'incorporation de NBR et le traitement de surface de la fibre ont été utilisés pour améliorer les propriétés mécaniques des composites à faible déformation, alors que le noir de carbone a été utilisé pour améliorer ces propriétés à forte déformation. La teneur en fibres a été fixée à 10 phr. Les matériaux composites ont été préparés à l'aide d'un mélangeur à cylindres et

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11

Carpenter, John Stuart. "Estimates of Interfacial Properties in Cu/Ni Multilayer Thin Films using Hardness and Internal Stress Data." The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1285006915.

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Kachlířová, Helena. "Mezifázová reologie jakožto účinný nástroj k popisu mezifázového chování biofilmů." Master's thesis, Vysoké učení technické v Brně. Fakulta chemická, 2019. http://www.nusl.cz/ntk/nusl-402123.

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The aim of this diploma thesis is to optimize a method of interfacial rheology for testing the interfacial behaviour of biofilms on the liquid-air interface and after that use the method for studying the biofilm formation under optimal and stress conditions. For studying the biofilm formation, Kombucha was used. It is a microbial culture forming a cellulose biofilm on the interface. As the stress conditions, reduction of sucrose concentration, change of pH and change of ionic strength was used. Next, the ability of regeneration of biofilm formed on the interface was studied. The biofilm format

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13

Balijepalli, Ram Gopal Verfasser], and Eduard [Akademischer Betreuer] [Arzt. "Numerical analysis of interfacial stress distributions and adhesion behaviour of fibrillar surfaces / Ram Gopal Balijepalli. Betreuer: Eduard Arzt." Saarbrücken : Saarländische Universitäts- und Landesbibliothek, 2016. http://d-nb.info/1112131469/34.

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14

Iwamoto, Sohei. "Analysis of multiple cracking and interfacial debonding of the galvannealed coating layer under applied tensile strain." 京都大学 (Kyoto University), 2009. http://hdl.handle.net/2433/77968.

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Kyoto University (京都大学)<br>0048<br>新制・課程博士<br>博士(工学)<br>甲第14575号<br>工博第3043号<br>新制||工||1453(附属図書館)<br>26927<br>UT51-2009-D287<br>京都大学大学院工学研究科材料工学専攻<br>(主査)教授落合庄治郎, 教授粟倉泰弘, 准教授奥田浩司<br>学位規則第4条第1項該当

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15

RUTHERFORD, ROBERT WESLEY. "MODELING AND TESTING OF THE INTERFACIAL STRESS STATE OF A 316L STAINLESS STEEL CLAD TUNGSTEN COMPOSITE USING PUSH-OUT TESTING." University of Cincinnati / OhioLINK, 2001. http://rave.ohiolink.edu/etdc/view?acc_num=ucin996070635.

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16

Chen, Zhiwen. "Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds." Thesis, Loughborough University, 2015. https://dspace.lboro.ac.uk/2134/18431.

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Sn-based solder alloys are extensively used in electronic devices to form interconnects between different components to provide mechanical support and electrical path. The formation of a reliable solder interconnects fundamentally relies on the metallurgic reaction between the molten solder and solid pad metallization in reflowing. The resultant IMC layer at the solder/pad metallization interface can grow continuously during service or aging at an elevated temperature, uplifting the proportion of IMCs in the entire solder joint. However, the essential mechanical properties of interfacial IMC (

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17

PASQUALETTE, MARCELO DE ALENCASTRO. "OPTIMIZATION OF THE INTERFACIAL SHEAR STRESS AND ASSESSMENT OF CLOSURE RELATIONS FOR HORIZONTAL VISCOUS OIL-GAS FLOWS IN THE STRATIFIED AND SLUG REGIMES." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2017. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=32458@1.

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PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO<br>COORDENAÇÃO DE APERFEIÇOAMENTO DO PESSOAL DE ENSINO SUPERIOR<br>PROGRAMA DE EXCELENCIA ACADEMICA<br>O atual esgotamento de campos de petróleo tradicionais tem aumentado a demanda pela produção e transporte óleos não convencionais, que podem possuir uma alta viscosidade dinâmica. Neste contexto, o estudo do escoamento simultâneo de gás e óleos viscosos em tubulações é de grande importância para a indústria de Óleo e Gás. Simulações numéricas uni-dimensionais desempenham um papel essencial nestes estudos, especialmente aquelas baseadas no Mod

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18

Saillard, Audric. "Modeling and simulation of stress-induced non-uniform oxide scale growth during high-temperature oxidation of metallic alloys." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/33898.

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The metallic alloys employed in oxidizing environment at high temperature rely on the development of a protective oxide scale to sustain the long-term aggressive exposition. However, the oxide scale growth is most of the time coupled with stress and morphological developments limiting its lifetime and then jeopardizing the metallic component reliability. In this study, a mechanism of local stress effect on the oxidation kinetics at the metal/oxide interface is investigated. The objective is to improve the understanding on the possible interactions between stress generation and non-uniform oxid

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19

Wood, Joseph D. "Brittle mixed-mode cracks between linear elastic layers." Thesis, Loughborough University, 2017. https://dspace.lboro.ac.uk/2134/24177.

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Original analytical theories are developed for partitioning mixed-mode fractures on rigid interfaces in laminated orthotropic double cantilever beams (DCBs) based on 2D elasticity by using some novel methods. Note that although the DCB represents a simplified case, it provides a deep understanding and predictive capability for real applications and does not restrict the analysis to a simple class of fracture problems. The developed theories are generally applicable to so-called 1D fracture consisting of opening (mode I) and shearing (mode II) action only with no tearing (mode III) action, for

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20

Khallahle, Jack Buckhill. "Numerical Simulation of Flow Parameters in Stratified Gas-Liquid Flow in a Horizontal Pipe." Thesis, The University of Sydney, 2022. https://hdl.handle.net/2123/29931.

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The transportation of gas-liquid mixtures in horizontal pipes as two-phase stratified flow is examined using computational fluid dynamics (CFD) method. The design of these pipelines requires accurate prediction of flow parameters such as pressure drop and liquid holdup. Many empirical correlations have been developed in the last 70 years and are well documented in the literature to obtain these parameters using experimental, analytical and numerical methods. In this investigation, the numerical method based on CFD code-FLUENT is used as an alternative to the experimental method to obtained

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21

Jain, Jayesh R. "Homogenization Based Damage Models for Monotonic and Cyclic Loading in 3D Composite Materials." The Ohio State University, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=osu1230431496.

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22

Zhang, Bochun. "Failure Mechanism Analysis and Life Prediction Based on Atmospheric Plasma-Sprayed and Electron Beam-Physical Vapor Deposition Thermal Barrier Coatings." Thesis, Université d'Ottawa / University of Ottawa, 2017. http://hdl.handle.net/10393/35709.

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Using experimentally measured temperature-process-dependent model parameters, the failure analysis and life prediction were conducted for Atmospheric Plasma Sprayed Thermal Barrier Coatings (APS-TBCs) and electron beam physical vapor deposition thermal barrier coatings (EB-PVD TBCs) with Pt-modified -NiAl bond coats deposited on Ni-base single crystal superalloys. For APS-TBC system, a residual stress model for the top coat of APS-TBC was proposed and then applied to life prediction. The capability of the life model was demonstrated using temperature-dependent model parameters. Using existing

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23

Chen, Buo. "Crack Path Selection in Adhesively Bonded Joints." Diss., Virginia Tech, 1999. http://hdl.handle.net/10919/29709.

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This dissertation is to obtain an overall understanding of the crack path selection in adhesively bonded joints. Using Dow Chemical epoxy resin DER 331Â® with various levels of rubber concentration as an adhesive, and aluminum 6061-T6 alloy with different surface pretreatments as the adherends, both symmetric and asymmetric double cantilever beam (DCB) specimens are prepared and tested under mixed mode fracture conditions in this study. Post-failure analyses conducted on the failure surfaces indicate that the failure tends to be more interfacial as the mode II component in the fracture incre

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Guo, Shu. "Experimental and Numerical Investigations on the Durability and Fracture Mechanics of the Bonded Systems for Microelectronics Application." Diss., Virginia Tech, 2003. http://hdl.handle.net/10919/28743.

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Water-assisted crack growth at an epoxy/glass interface was measured as a function of applied strain energy release rate, G, and temperature using a wedge test geometry. The specimens consist of two glass plates bonded with a thin layer of proprietary epoxy adhesive. The crack fronts along the epoxy/glass interfaces were measured using an optical stereomicroscope. The relationship between G and the debonding rate, v, can be measured using this method, and the threshold value of strain energy release rate, Gth, can be determined from the measured data. Two types of testing procedures were co

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25

Fadel, Ophélie. "Étude des propriétés interfaciales de polyphénols modèles : compréhension des mécanismes d'action au niveau membranaire." Compiègne, 2012. http://www.theses.fr/2012COMP2012.

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Le stress oxydant dans les systèmes biologiques est contrôlé par un équilibre entre les espèces pro- et antioxydantes. L'activité des molécules antioxydantes est cruciale pour préserver les fonctions des biomolécules qui peuvent être dégradées par le stress oxydant. L'ADN, les protéines et les lipides en sont les cibles privilégiées. L'efficacité des antioxydants peut dépendre du substrat oxydable et de la localisation cellulaire : sur le lieu de production d'EROs ou à proximité des cibles moléculaires de l'attaque oxydante. Les polyphénols sont des antioxydants naturels très abondants dans le

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26

Guinard, Caroline. "Influence des propriétés morphologiques et mécaniques des barrières thermiques sur la fissuration interfaciale induite par perçage laser impulsionnel." Thesis, Paris Sciences et Lettres (ComUE), 2016. http://www.theses.fr/2016PSLEM068/document.

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De nombreuses pièces aéronautiques telles que les chambres de combustion sont percées d'une multitudes de trous de refroidissement. Ce perçage, généralement effectué par un laser de puissance peut induire des endommagements dans la matière percée. Sur les systèmes barrières thermiques, une fissuration pouvant conduire à l'écaillage de la barrière thermique se produit à l'interface céramique/sous-couche lors du perçage laser. Cette thèse présente des éléments de compréhension des phénomènes de formation et de propagation de la fissure interfaciale. Pour cela, un protocole spécifique a été utili

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Furgeaud, Clarisse. "Effets cinétique et chimique lors des premiers stades de croissance de films minces métalliques : compréhension multi-échelle par une approche expérimentale et modélisation numérique." Thesis, Poitiers, 2019. http://www.theses.fr/2019POIT2298.

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Cette thèse est consacrée au suivi de la dynamique de croissance de films minces métalliques par pulvérisation magnétron et sa corrélation avec les propriétés des films, telles que les contraintes résiduelles, la microstructure et la morphologie de surface. Différents outils de diagnostic in situ et en temps réel (courbure du substrat-MOSS, spectroscopie de réflectivité optique de surface-SDRS, diffraction (DRX) et réflectivité (XRR) des rayons X et résistivité électrique) couplés à des caractérisations ex situ (HRTEM, STEM, DRX, XRR, EBSD) ont permis d’appréhender l’influence des effets cinét

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28

Wang, Yan. "Exploring Biopolymer-Clay Nanocomposite Materials by Molecular Modelling." Doctoral thesis, KTH, Teoretisk kemi och biologi, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-166299.

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In this thesis, bio-nanocomposites made from two alternative biopolymers and montmorillonite (Mnt) clay have been investigated by molecular modelling. These biopolymers are xyloglucan (XG) and chitosan (CHS), both of which are abundant, renewable, and cost-effective. After being reinforced by Mnt clay nanoparticles, the polymer nanocomposites gains in multifunctionality and in the possibility to register unique combinations of properties, like mechanical, biodegradable, electrical, thermal and gas barrier properties. I apply molecular dynamics (MD) simulations to study the interfacial mechanis

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Lin, C. H., and 林俊賢. "Interfacial stress distributions in fiber reinforced cementitiouscomposites." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/00122304493461993187.

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Chang, Keng-Hua, and 張耕華. "Nonlinear finite element interfacial stress analysis between FPD and abutments." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/67789771180003022406.

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碩士<br>國立成功大學<br>醫學工程研究所<br>88<br>The interface condition between tooth structure and metal prosthesis is an important factor for traditional FPD (fixed partial denture) and Maryland bridge treatments. A frequent cause of FPD failure is the separation of the retainers from its abutment tooth. Other than the biological concern (e.g., acid erosion), the state of the stress level might be a significant issue which speed up the terminal interface to separate when inappropriate occlusal forces were applied on the structure. This study employed the non-linear finite element approaches (including two

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Cheng, Lien-Huang, and 鄭蓮晃. "On the microstructure and interfacial shear stress of TiN-coated." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/20058188303387558603.

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碩士<br>國立中興大學<br>材料工程學研究所<br>84<br>The microstructure and chemistry of the ion-plated TiN on AISI 304 stainless steel was studied by Zeiss 902A energy filter transmission electron microscope(EFTEM) to understand the structure-process relationship of the kollow cathod discharge ion plating (HCD-IP) technique. Compared to conventional TEM, EFTEM with in-column prism energy filter offers several advantages including muchbetter image and diffraction sharpness. The detection of the light elements

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Wu, Jia-rong, and 吳佳融. "Effect of applied stress on copper/tin thin film interfacial reaction." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/01014820293746296698.

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碩士<br>中興大學<br>化學工程學系所<br>95<br>With the electronic products becoming small, thin and light, the flip-chip technology is the trend of the package because of its small package size and excellent performance. The interfacial reaction between solder bump and under bump metallization is one of the important subjects in the flip chip reliability concerns. But at the process of microelectronic packaging, the electronic products that could be affected by the environment of the packaging and the property of products’s material could be strain. In this study, effect of applied stresses on the copper/tin

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Vinu, P. "Stress Intensity Factors For Bimaterial Interfacial Cracks : A Weight Function Approach." Thesis, 1999. https://etd.iisc.ac.in/handle/2005/1604.

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Vinu, P. "Stress Intensity Factors For Bimaterial Interfacial Cracks : A Weight Function Approach." Thesis, 1999. http://etd.iisc.ernet.in/handle/2005/1604.

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Tsai, Chih-Ya, and 蔡智雅. "Magnetoelectric coupling in epitaxial self-assembled multiferroic nansotructures driven by interfacial stress." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/sp3ths.

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博士<br>國立交通大學<br>光電工程研究所<br>102<br>In this thesis, we investigate the interfacial stress-driven magnetoelectric (ME) coupling in self-assembled multiferroic nanostructures deposited by pulsed laser deposition. It includes four subjects: the growth of conductive SrRuO3 thin film, the basic properties of CoFe2O4-PbTiO3 nanostructure, the magnetic field generated ME effect in CoFe2O4-PbTiO3 nanostructure, and anomalous spin and phonon dynamics in CoFe2O4-BaTiO3 nanostructure. First, we investigate the influence of growth oxygen ambience on the structure andconductivity of SrRuO3 thin films depos

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chang, shih-ping, and 張石平. "Analysis of Composite Laminates Using Interlaminar Stress Continuity Theory with Interfacial Slip." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/19857643309397885623.

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碩士<br>大葉大學<br>機械工程研究所碩士班<br>93<br>The composites laminates suffer mostly on the low strength in the thickness direction upon loading. The delamination failure inside the laminate usually occurs on these weak interfaces. Therefore, the interlaminar stresses deserve more attentions in the analysis of composite laminates. This research focuses on developing an interlaminar stress continuity theory to simulate the effect of interfacial slippage on the resonance frequency and modal stress distribution of the composite laminate. In addition, the influences of the slip constant, location and area of

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Xu, Jia-Ying, and 許嘉穎. "An Assessment of Interfacial Stress Evolution in Flip-Chip Packages During Thermal Cycling." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/76984191113900617516.

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碩士<br>國立海洋大學<br>機械與輪機工程學系<br>90<br>Abstract Under the stringent specification for the microeletronic packages, higher product’s reliability was quested by the prevention from fatigue/fracture failure of the new generation of Flip-Chip assembly due to the existence of defects. The delamination on the assembly’s interfaces is owing to the effects of stress concentration and/or stress singularity; and solder bumps, underfill, chip may therefore induce cracks as the precursor of a final stage failure. Flip-Chip Packages under thermal cyclic loading had been simulated by the f

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Huang, Shih-An, and 黃仕安. "A Study of Automatic Optical Inspection for Interfacial Stress of Flexible Multi-Layer Substrate." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/ub3jpp.

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碩士<br>國立臺灣海洋大學<br>機械與機電工程學系<br>106<br>The purpose of this study is to use the relationship between stress and optical interference to detect the interfacial stress and residual interfacial stress of flexible conductive substrates. Polyethylene terephthalate (PET) / indium tin oxide (ITO) composite material (composite material) is used as a double-layer flexible conductive substrate in this study. Polarized light passes through the substrates and a tensile stress is applied to the sample simultaneously. The light is divided into two types of light, which are faster and slower, when the polarize

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Maya, Kini K. "Interfacial Processes in Densification of Cubic Zirconia." Thesis, 2016. https://etd.iisc.ac.in/handle/2005/3158.

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Sintering, a process of forming dense solid bodies from powder compacts remains the most important route for processing of ceramics. The process of sintering involves formation and growth of necks during initial stage, coarsening, relative particle rotation, filling of connected pores in intermediate stage, filling of isolated pores during final stage sintering and rapid grain growth towards the end of densification. The processes involve a combi-nation of grain boundary diffusion, surface diffusion, grain boundary migration and grain boundary sliding. Studies of interfacial processes during s

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Maya, Kini K. "Interfacial Processes in Densification of Cubic Zirconia." Thesis, 2016. http://hdl.handle.net/2005/3158.

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Sintering, a process of forming dense solid bodies from powder compacts remains the most important route for processing of ceramics. The process of sintering involves formation and growth of necks during initial stage, coarsening, relative particle rotation, filling of connected pores in intermediate stage, filling of isolated pores during final stage sintering and rapid grain growth towards the end of densification. The processes involve a combi-nation of grain boundary diffusion, surface diffusion, grain boundary migration and grain boundary sliding. Studies of interfacial processes during s

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Hu, Tien-Chen, and 胡天鎮. "Influence of Stress on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/92565690528913304264.

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博士<br>國立中興大學<br>精密工程學系所<br>101<br>This thesis presents the results from four point bending tests conducted to investigate the strained substrates effect on interfacial Cu-Sn inter-metallic compound (IMC) formation layer growth. The test specimens were cut into strips 27 mm in length and 5 mm in width from 4 inch double polished silicon wafers or 400 μm Cu substrate. A very thin adhesion layer was deposited onto the substrate using sputtering. A 10 μm thick copper layer was deposited on top of the adhesion layer using the electroplating method. Two types of tin samples (Matte and Bright) were t

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Chen, Yu-Jen, and 陳郁仁. "Effects of mechanically applied stress on tin whisker growth and interfacial reactions at solder joints." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/88822259818316561047.

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碩士<br>國立中興大學<br>化學工程學系所<br>97<br>In this study, for simplicity, externally applied tensile stress was exerted on a Sn thin film electrodeposited on a Cu substrate using three-point bending to simulate the condition of a Sn thin film subjecting to a tensile stress due to CTE (coefficient of thermal expansion) effect. To perform the bending experiments, a specifically designed three-point bending module made of brass was used to bend the samples. Filamentary Sn whiskers were formed on an electrodeposited Sn thin film aged at room temperature. Sn whisker growth was significantly mitigated on the

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Ye, Tang-hung, and 葉唐宏. "Study of resin characteristics, interfacial strengths and structural stress simulation for Chip-in-Film packaging." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/32754893961604900273.

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碩士<br>國立屏東科技大學<br>材料工程所<br>95<br>The chip-in-film package (CiFP) is to embed the thin chip into the flexible substrate. For this advanced assembly technology study, the properties of PI and DAF resins and the interfacial shear strength between the different materials are investigated. The curing conductions of the PI and DAF resins are carried out by DSC, the CTE, moduli and Tg are measured using TMA. The 2D model of the package is establised for the structural stress simulation during the temperature cycling testing by the ABAQUS software. In comparison with the interfacial shear strength

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Ryu, Suk-Kyu. "Thermo-mechanical stress analysis and interfacial reliabiity for through-silicon vias in three-dimensional interconnect structures." Thesis, 2011. http://hdl.handle.net/2152/ETD-UT-2011-12-4580.

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Continual scaling of devices and on-chip wiring has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, three-dimensional (3-D) integration with through-silicon vias (TSVs) has emerged as an effective solution to meet the future interconnect requirements. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. In this dissertation, thermal stresses and interfacial reliability of TSV structures are analyzed by combining analytical and numer

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ChiYang and 楊麒. "Numerical analysis of pullout behavior and interfacial stress between steel fiber and ultra-high performance concrete." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/pa37an.

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碩士<br>國立成功大學<br>土木工程學系<br>104<br>Ultra-high performance concrete (UHPC) is widely used in structures subjected to impact and blast loading, due to its high compressive strength, superior ductility and extraordinary durability than ordinary concrete. It can effectively improve the workability of ultra-high performance concrete by adding steel fibers in to UHPC. However, the propagation of crack would cause the interface of concrete and steel to debond. In order to improve the interfacial bond strength, it is important to make a further investigation over the characteristics of the interface of

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Xi-Hong, Chen. "Theoretical Transient Analyses of Stress Wave Propagation and Dynamic Fracture for Interfacial Crack in Elastic-Piezoelectric Bi-materials." 2006. http://www.cetd.com.tw/ec/thesisdetail.aspx?etdun=U0001-1308200612442000.

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Chen, Xi-Hong, and 陳熙洪. "Theoretical Transient Analyses of Stress Wave Propagation and Dynamic Fracture for Interfacial Crack in Elastic-Piezoelectric Bi-materials." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/97486724804187589218.

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博士<br>國立臺灣大學<br>機械工程學研究所<br>94<br>In transversely isotropic elastic solids, there is no surface wave for anti-plane deformation. However, for certain orientations of piezoelectric materials, a surface wave propagating along the free surface (interface) will occur and is called the Bleustein-Gulyaev (Maerfeld-Tournois) surface wave. The existence of the surface wave strongly influences the crack propagation event. Hence the existence condition and velocity of the interfacial surface wave between two piezoelectric materials are analyzed. The nature of anti-plane dynamic fracture in piezoelectric

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Li, Dongxu, G. Fei, H. Xia, Paul E. Spencer, and Philip D. Coates. "Micro-contact reconstruction of adjacent carbon nanotubes in polymer matrix through annealing-Induced relaxation of interfacial residual stress and strain." 2015. http://hdl.handle.net/10454/8024.

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Yes<br>Thermoplastic polyurethane (TPU)/multi-walled carbon nanotubes (CNT) nanocomposites were prepared by twin-screw extrusion and micro injection molding. The electrical conductivity of micro injection molded polymer nanocomposites exhibits a low value and uneven distribution in the micromolded samples. Real-time tracing of electrical conductivity was conducted to investigate the post thermal treatment on the electrical conductivity of microinjection molded composites. The results show that postmolding thermal treatment leads to a significant increase in the electrical conductivity by over

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Suen, Wei-Luen, and 孫唯倫. "Interfacial strength measurements of the chip/molding compound interfaces and structural stress simulation for temperaturing cycling test of the Multi-Chip Module." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/72128186653006225195.

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碩士<br>國立屏東科技大學<br>材料工程所<br>98<br>The material properties of the molding compound GE applied on the three-chip module were measured by TGA, DSC and TMA equipments. The interfacial shear strengths were measured for the interfaces of molding compound with the chip passivation layers of PI and Si3N4. The shear strain energy densities were also calculated from the interfacial shear test results. The three-chip module passed the temperature cycling (TC), temperature and humidity (TH) and high temperature storage (HTS) reliability tests. Three-dimensional finite element modeling analysis wa

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Zhang, Hong-Zen, and 張洪仁. "Study on the characteristics of underfill materials, interfacial strengths and structural stress for the high I/Os flip chip on the coreless build-up substrate with the stacked-via." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/07163649550774496763.

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碩士<br>國立屏東科技大學<br>材料工程所<br>95<br>The flip chip technology is presently focused on the chip assembly on the rigid substrate, which consists of glass-reinforcement core layer. For the flexible electronic, the advantages are mainly the package volume shrinkage, shorter interconnects and flexibility. In this study, more than 4000 I/Os chip is chosen for the PI-base coreless substrate assembly. Before the assembly, the underfill material properties were studied by DSC, TGA, TMA and Viscometer instruments. The interfacial strengths of chip/underfill and substrate/underfill were also carried out by t

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