Gotowe bibliografie tematyczne / Interfacial thermal conductance

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Gotowa bibliografia na temat „Interfacial thermal conductance”

Autor: Grafiati
Data publikacji: 2 listopada 2024
Data aktualizacji: 31 lipca 2025

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Artykuły w czasopismach na temat "Interfacial thermal conductance"

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Green, Andrew J., and Hugh H. Richardson. "Solute Effects on Interfacial Thermal Conductance." MRS Proceedings 1543 (2013): 151–57. http://dx.doi.org/10.1557/opl.2013.677.

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ABSTRACTThe thermal conductance of a gold/water interface has been found to change as a function of the surrounding’s adhesion energy. We measure the thermal conductance of a lithographically prepared gold nanowire with a thin film nanoscale thermal sensor composed of AlGaN:Er3+. The temperature of the nanowire is measured as a function of incident laser intensity. The slope of this plot is inversely proportional to the thermal conductance of the nanoparticle/surrounding’s interface. We show that the conductance of the nanoparticle/water interface increases with the molality of the solution. T
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Rajabpour, Ali, Saeed Bazrafshan, and Sebastian Volz. "Carbon-nitride 2D nanostructures: thermal conductivity and interfacial thermal conductance with the silica substrate." Physical Chemistry Chemical Physics 21, no. 5 (2019): 2507–12. http://dx.doi.org/10.1039/c8cp06992a.

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The rate of heat dissipation from a carbon-nitride 2D nanostructure depends on the interfacial thermal conductance with its substrate. It was found that a structure with higher thermal conductivity, has a lower value of interfacial thermal conductance with the silica substrate.
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Yang, Wu Lin, Kun Peng, Jia Jun Zhu, De Yi Li, and Ling Ping Zhou. "Numerical Modeling of Thermal Conductivity of Diamond Particle Reinforced Aluminum Composite." Advanced Materials Research 873 (December 2013): 344–49. http://dx.doi.org/10.4028/www.scientific.net/amr.873.344.

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In the present work, the finite element method is employed to predict the effective thermal conductivity of diamond particle reinforced aluminum composite. The common finite element commercial software ANSYS is used to for this numerical analysis. A body-centered cubic particle arrangement model are constructed to simulate the microstructure of the composite with 60 vol.% diamond. The effect of particle size and inhomogeneous interfacial conductance on the thermal conductivity of diamond particles reinforced aluminum composite is investigated. Cubo-octahedral particles are assumed and interfac
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Fan, Hang, Kun Zhang, Guansong He, Zhijian Yang, and Fude Nie. "Ab initio determination of interfacial thermal conductance for polymer-bonded explosive interfaces." AIP Advances 12, no. 6 (2022): 065005. http://dx.doi.org/10.1063/5.0094018.

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Understanding the thermal transport in polymer-bonded explosives (PBXs) is critical for enhancing the safety and reliability during PBX design, especially in the absence of effective experimental measurements. In this work, we rigorously investigated the phonon properties of 1,3,5-triamino-2,4,6-trinitrobenzene (TATB) and polyvinylidene fluoride (PVDF) and calculated the interfacial thermal conductance using an ab initio approach. The diffuse mismatch model and anharmonic inelastic model were adopted to examine the interfacial thermal conductance as a function of temperature for the TATB–PVDF
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Bai, Guang Zhao, Wan Jiang, G. Wang, Li Dong Chen, and X. Shi. "Effective Thermal Conductivity of MoSi2/SiC Composites." Materials Science Forum 492-493 (August 2005): 551–54. http://dx.doi.org/10.4028/www.scientific.net/msf.492-493.551.

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Thermal conductivity of as-prepared MoSi2/SiC composites has been determined by Laser Flash method. Interfacial thermal conductance for composites with 100nm SiC and with 0.5µm has been determined by using effective medium theory. The results of interfacial thermal conductance exhibit that both the inclusion size and the clustering of the inclusions play an important role in determining composite thermal conductivity.
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Wu, Shuang, Jifen Wang, Huaqing Xie, and Zhixiong Guo. "Interfacial Thermal Conductance across Graphene/MoS2 van der Waals Heterostructures." Energies 13, no. 21 (2020): 5851. http://dx.doi.org/10.3390/en13215851.

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The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained the thermal conductivity (K) and interfacial thermal conductance (G) via MD simulations. The predicted Κ of monolayer graphene and monolayer MoS2 reached 1458.7 W/m K and 55.27 W/m K, respectively. The thermal conductance across the graphene/MoS2 interface was calculated to be 8.95 MW/
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Peterson, G. P., and L. S. Fletcher. "Measurement of the Thermal Contact Conductance and Thermal Conductivity of Anodized Aluminum Coatings." Journal of Heat Transfer 112, no. 3 (1990): 579–85. http://dx.doi.org/10.1115/1.2910426.

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An experimental investigation was conducted to determine the thermal contact conductance and effective thermal conductivity of anodized coatings. One chemically polished Aluminum 6061-T6 test specimen and seven specimens with anodized coatings varying in thickness from 60.9 μm to 163.8 μm were tested while in contact with a single unanodized aluminum surface. Measurements of the overall joint conductance, composed of the thermal contact conductance between the anodized coating and the bare aluminum surface and the bulk conductance of the coating material, indicated that the overall joint condu
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Liu, Yang, Wenhao Wu, Shixian Yang, and Ping Yang. "Interfacial thermal conductance of graphene/MoS2 heterointerface." Surfaces and Interfaces 28 (February 2022): 101640. http://dx.doi.org/10.1016/j.surfin.2021.101640.

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Yang, Wei, Kun Wang, Yongsheng Fu, Kun Zheng, Yun Chen, and Yongmei Ma. "Interfacial Thermal Conductance between Alumina and Epoxy." Journal of Physics: Conference Series 2109, no. 1 (2021): 012018. http://dx.doi.org/10.1088/1742-6596/2109/1/012018.

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Abstract Interfacial thermal conductance (ITC) of inorganic/epoxy interface is regarded as one of the most significant factors in determining thermal transport performance of epoxy composite. Here, ITC between alumina and epoxy was experimentally investigated by time-domain thermoreflectance (TDTR) method. The results show that the ITC is effectively increased from 9.0 MW m-2 K-1 for non-treated alumina/epoxy interfaces to 26.3 MW m-2 K-1 for plasma treated interfaces. This work sheds some light on design and application for thermally conductive composites.
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Xu, Ke, Jicheng Zhang, Xiaoli Hao, et al. "Interfacial thermal conductance of buckling carbon nanotubes." AIP Advances 8, no. 6 (2018): 065116. http://dx.doi.org/10.1063/1.5039499.

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Rozprawy doktorskie na temat "Interfacial thermal conductance"

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Bhatt, Hemanshu D. "Effect of interfacial thermal conductance and fiber orientation on the thermal diffusivity/conductivity of unidirectional fiber-reinforced ceramic matrix composites." Diss., This resource online, 1992. http://scholar.lib.vt.edu/theses/available/etd-07282008-135034/.

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Diarra, Cheick Oumar. "Modélisation par dynamique moléculaire ab initio du transport des excitons et du transport thermique dans les semiconducteurs organiques pour la collecte d'énergie." Electronic Thesis or Diss., Strasbourg, 2024. http://www.theses.fr/2024STRAD013.

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L'exciton joue un rôle clé dans le fonctionnement des cellules solaires organiques (OSCs). Comprendre sa dynamique dans les semiconducteurs organiques est essentiel, notamment pour améliorer la longueur de diffusion, une propriété déterminante pour la performance des hétérojonctions planaires, envisagées comme une alternative plus stable aux hétérojonctions en volume (BHJ). Dans la première partie de cette thèse, nous avons développé une approche méthodologique robuste et polyvalente pour évaluer la longueur de diffusion de l'exciton dans les semiconducteurs organiques. Cette approche, basée s
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Sears, Matthew. "Applications of Irreversible Thermodynamics: Bulk and Interfacial Electronic, Ionic, Magnetic, and Thermal Transport." Thesis, 2011. http://hdl.handle.net/1969.1/ETD-TAMU-2011-08-10096.

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Irreversible thermodynamics is a widely-applicable toolset that extends thermodynamics to describe systems undergoing irreversible processes. It is particularly useful for describing macroscopic flow of system components, whether conserved (e.g., particle number) or non-conserved (e.g., spin). We give a general introduction to this toolset and calculate the entropy production due to bulk and interfacial flow. We compare the entropy production and heating rate of bulk and interfacial transport, as well as interfacial charge and spin transport. We then demonstrate the power and applicability of
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(10225202), Jinhyun Noh. "STRUCTURAL AND MATERIAL INNOVATIONS FOR HIGH PERFORMANCE BETA-GALLIUM OXIDE NANO-MEMBRANE FETS." Thesis, 2021.

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<p>Beta-gallium oxide (<i>β</i>-Ga<sub>2</sub>O<sub>3</sub>) is an emerging wide bandgap semiconductor for next generation power devices which offers the potential to replace GaN and SiC. It has an ultra-wide bandgap (UWBG) of 4.8 eV and a corresponding <i>E</i><sub>br </sub>of 8 MV/cm. <i>β</i>-Ga<sub>2</sub>O<sub>3 </sub>also possesses a decent intrinsic electron mobility limit of 250 cm<sup>2</sup>/V<i>·</i>s, yielding high Baliga’s figure of merit of 3444. In addition, the large bandgap of <i>β</i>-Ga<sub>2</sub>O<sub>3 </sub>gives stability in harsh environment operation at high temperatu
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Części książek na temat "Interfacial thermal conductance"

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Choudhary, Rajesh, Aman Singh, Aditya Kumar, and Sudhakar Subudhi. "Experimental Investigations on the Thermal Contact Conductance Using Al2O3 Nanoparticles in the Interfacial Material." In Lecture Notes in Mechanical Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-99-7827-4_57.

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Talapatra, Animesh, and Debasis Datta. "Molecular Dynamics Simulation-Based Study on Enhancing Thermal Properties of Graphene-Reinforced Thermoplastic Polyurethane Nanocomposite for Heat Exchanger Materials." In Inverse Heat Conduction and Heat Exchangers. IntechOpen, 2020. http://dx.doi.org/10.5772/intechopen.86527.

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Molecular dynamics (MD) simulation-based development of heat resistance nanocomposite materials for nanoheat transfer devices (like nanoheat exchanger) and applications have been studied. In this study, MD software (Materials Studio) has been used to know the heat transport behaviors of the graphene-reinforced thermoplastic polyurethane (Gr/TPU) nanocomposite. The effect of graphene weight percentage (wt%) on thermal properties (e.g., glass transition temperature, coefficient of thermal expansion, heat capacity, thermal conductivity, and interface thermal conductance) of Gr/TPU nanocomposites
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Streszczenia konferencji na temat "Interfacial thermal conductance"

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Wang, Yingtao, Yuan Gao, Elham Easy, Eui-Hyeok Yang, Baoxing Xu, and Xian Zhang. "Thermal Conductivities and Interfacial Thermal Conductance of 2D WSe2." In 2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS). IEEE, 2020. http://dx.doi.org/10.1109/nems50311.2020.9265628.

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Yuksel, Anil, Edward T. Yu, Michael Cullinan, and Jayathi Murthy. "Effect of Interfacial Thermal Conductance Between the Nanoparticles." In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/ipack2018-8212.

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Heat transport across nanostructured interfaces, such as between nanoparticles, has been of great interest for advanced thermal management. Interfacial thermal conductance, G, is central to understanding thermal heat transport between nanoparticles that have a contact point between each other as well as the surrounded medium. In this study, we show that G dominates the heat transport compared to the conduction and radiation heat transfer modes between the nanoparticles for values higher than ∼20 (MW/m2K). We also investigate the effect of radius of contact between the nanoparticles on the over
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Choi, Woon Ih, Kwiseon Kim, and Sreekant Narumanchi. "Molecular Dynamics Modeling of Thermal Conductance at Atomically Clean and Disordered Silicon/Aluminum Interfaces." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-65409.

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Thermal resistance between layers impedes effective heat dissipation in electronics packaging applications. Thermal conductance for clean and disordered interfaces between silicon (Si) and aluminum (Al) was computed using realistic Si/Al interfaces and classical molecular dynamics with the modified embedded atom method potential. These realistic interfaces, which include atomically clean as well as disordered interfaces, were obtained using density functional theory. At 300 K, the magnitude of interfacial conductance due to phonon-phonon scattering obtained from the classical molecular dynamic
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Lv, Wei, and Asegun Henry. "Thermal Interface Conductance Between Aligned Polyethylene and Graphite." In ASME 2015 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/imece2015-50492.

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Molecular dynamics simulations are used to provide fundamental insights into the thermal interface resistance between aligned polyethylene chains and graphite layers using the Reactive Force Field (ReaxFF) potential[1] to describe the atomic interactions. We find that the interfacial conductance could alter more than two orders of magnitude when changing orientation of polymer fibers to graphite. This finding suggests that, by using highly stretched polymer fibers, one could then maximize the interfacial conductance to engineer high thermal conductivity polymer composites.
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Liu, Chenhan, Jian Wang, Weiyu Chen, Zhiyong Wei, Juekuan Yang, and Yunfei Chen. "Interfacial Thermal Conductance Between Carbon Nanotubes From Nonequilibrium Green’s Function Method." In ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/mnhmt2013-22094.

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In this paper, the interfacial thermal conductance between two single-wall carbon nanotubes (SWCNTs) is evaluated using the nonequilibrium Green’s function (NEGF) method. The calculation results show that, for offset parallel contact type, interfacial thermal conductance increases almost linearly with the overlap length. This is because the coupling atom number in overlap region is the main contributor to heat flow through interface. With the same overlap length, interfacial thermal conductance of the nested contact type is much higher than that of the offset parallel contact type. By comparin
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Hopkins, Patrick E., John C. Duda, and Pamela M. Norris. "Contributions of Anharmonic Phonon Interactions to Thermal Boundary Conductance." In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44135.

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Continued reduction of characteristic dimensions in nanosystems has given rise to increasing importance of material interfaces on the overall system performance. With regard to thermal transport, this increases the need for a better fundamental understanding of the processes affecting interfacial thermal transport, as characterized by the thermal boundary conductance. When thermal boundary conductance is driven by phononic scattering events, accurate predictions of interfacial transport must account for anharmonic phononic coupling as this affects the thermal transmission. In this paper, a new
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Wang, Mingkang, Diego J. Perez-Morelo, Georg Ramer, et al. "Nanophotonic Scanning Probes for Nanoscale Imaging of Thermal Conductivity and Interfacial Thermal Conductance." In CLEO: Applications and Technology. Optica Publishing Group, 2022. http://dx.doi.org/10.1364/cleo_at.2022.atu4m.4.

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Nanophotonic resonator integration and miniaturization decrease detection noise of nanomechanical scanning probe microscopy and increase its throughput. Using pulsed laser excitation, we demonstrate fast imaging (≈500,000× faster than a commercial probe) of thermal properties with 35nm spatial resolution.
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Babaei, Hasan, Pawel Keblinski, and J. M. Khodadadi. "Molecular Dynamics Study of the Interfacial Thermal Conductance at the Graphene/Paraffin Interface in Solid and Liquid Phases." In ASME 2013 Heat Transfer Summer Conference collocated with the ASME 2013 7th International Conference on Energy Sustainability and the ASME 2013 11th International Conference on Fuel Cell Science, Engineering and Technology. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ht2013-17478.

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By utilizing molecular dynamics (MD) simulations, we study the interfacial thermal conductance at the interface of graphene and paraffin. In doing so, we conduct non-equilibrium heat source and sink simulations on systems of parallel and perpendicular configurations in which the heat flow is parallel and perpendicular to the surface of graphene, respectively. For the perpendicular configuration, graphene with different number of layers are considered. The results show that the interfacial thermal conductance decreases with the number of layers and converges to a value which is equal to the obt
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Jayadeep, U. B., R. Krishna Sabareesh, R. Nirmal, K. V. Rijin, and C. B. Sobhan. "Molecular Dynamics Modeling of the Effect of Thermal Interface Material on Thermal Contact Conductance." In ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASMEDC, 2008. http://dx.doi.org/10.1115/mnht2008-52204.

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Thermal contact conductance is used to indicate the resistance offered by a contact interface to the flow of heat. When an interface material is applied as nano-layered coatings on super-finished contacting surfaces, the possibility of size effects necessitates the use of a discrete computation method for its analysis. Hence, a methodology is proposed which utilizes Molecular Dynamics (MD) simulations to obtain the size affected thermal conductivity of the interfacial layer, which in turn characterizes the thermal contact conductance behavior. Molecular Dynamics codes have been developed, maki
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Hopkins, Patrick E., Richard N. Salaway, Robert J. Stevens, and Pamela M. Norris. "Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-15288.

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The thermal conductance at solid-solid interfaces is becoming increasingly important in thermal considerations dealing with devices on nanometer length scales. Specifically, interdiffusion or mixing around the interface, which is generally ignored, must be taken into account when the characteristic lengths of the devices are on the order of the thickness of this mixing region. To study the effect of this interfacial mixing on thermal conductance, a series of Cr films are grown on Si substrates subject to various deposition conditions to control the growth around the Cr/Si boundary. The Cr/Si i
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Raporty organizacyjne na temat "Interfacial thermal conductance"

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Norris, Pamela M. Modeling Interfacial Thermal Boundary Conductance of Engineered Interfaces. Defense Technical Information Center, 2014. http://dx.doi.org/10.21236/ada609810.

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