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Artykuły w czasopismach na temat "Metallized film"

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Belko, V., Liu Cheng, Sofiya Kalmykova, Aleksey Pechnikov, and Andrey Plotnikov. "Influence of Electrodes Configuration on Metallized Film Capacitor Performance Metrics." Problems of the Regional Energetics, no. 1(65) (January 2025): 121–34. https://doi.org/10.52254/1857-0070.2025.1-65.9.

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The aim of the study is to reveal the influence of the electrode configuration of metallized film capacitors on their characteristics and performance under conditions typical of power electronics. Presently used electrodes configurations are summarized, their benefits and disadvantages are ana-lyzed. We showed that currently used metallized film capacitors electrodes configurations, ensuring reliable self-heling, have too high equivalent resistivity. Authors propose to introduce a hybrid type of electrode for metallized film capacitors. We showed the influence of the capacitor electrodes on it
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Bazhenov, S. L., I. N. Nasrullaev, I. V. Razumovskaya, S. K. Kudaikulova, B. A. Zhubanov, and Marc J. M. Abadie. "Multiple Cracking of Metallized Polyimide Kapton Films." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 41. http://dx.doi.org/10.18321/ectj332.

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Mechanical behaviour of metallized polyimide Kapton films was studied. The adhesion of metallized films to Kapton films is approximately hundred-folds higher than that of coatings made by usual sputter deposition of a metal on a polymer substrate. Multiple cracking of a metallized film was observed. Cracks<br />of two different scale levels are observed. The cracks of the first type (microcracks) are short with 1-2 μm length. The cracks of the second type are much longer and have length of several hundreds microns. The cracks of this type appear at higher strains as compared with the sho
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Donhowe, Mark, Jeff Lawler, Sean Souffie, and E. Lee Stein. "250°C Operating Temperature Dielectric Film Capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (2011): 000201–6. http://dx.doi.org/10.4071/hiten-paper2-mdonhowe.

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High operating temperature electronic components are needed for a variety of military, aerospace, down-hole, and electric vehicle applications. One of the limiting technologies is the availability of highly reliable capacitors that operate at temperatures greater than 150°C and up through 250°C. This paper introduces a high breakdown strength dielectric film Gore has developed for metallized film capacitors. In addition to exceptionally high breakdown voltages, the 6 μm PTFE film exhibits low dissipation factor and stable capacitance over a wide temperature range. Film properties were tested f
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Prikhodko, Oleg, Saule Kudaikulova, and Marc J. M. Abadie. "Electric and Optical Properties of Polyimide Surface Films Modified by Metals." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 31. http://dx.doi.org/10.18321/ectj330.

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<p>Electric and optical properties of polymer films, which were prepared on the basis of polyimides and metallized by binary aggregates Ag with Ni and Co, have been investigated. The metallized polyimide films with additional coating from Ni, Au and Rh have been studied too. It has been found that the temperature dependence of the specific surface resistance in the metallized films at the temperature from 25 up to 160 <sup>o</sup>C was in the well agreement with linear law. The specific surface resistance at 20 <sup>o</sup>C and temperature coefficient showed low
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Saidin, Syafiqah, Hendra Hermawan, Pascale Chevallier, and Diego Mantovani. "Surface Characterization of Biomimetic Hydroxyapatite-Silver Functionalized on Polydopamine Film." Advanced Materials Research 1125 (October 2015): 395–400. http://dx.doi.org/10.4028/www.scientific.net/amr.1125.395.

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Hydroxyapatite (HA) is a well known bioactive material in the application of coated orthopaedic and dental implants. Recently, biomimetic technique has been explored to deposit a stable carbonated HA on a metal surface, mimicking the properties of natural bone. The aim of this study is to surface characterize the biomimetic hydroxyapatite (HA) and metallized silver (Ag) functionalized on a polydopamine film grafted titanium alloy (Ti6Al4V). The Ti6Al4V disks were grafted with the polydopamine film to provide catechol/quinone groups for chemical binding process. The grafted surfaces were metall
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Casey, Frank, and Anthony Broomfield. "OPTICAL SENSORS MONITOR METALLIZED FILM PRODUCTION." Sensor Review 12, no. 4 (1992): 28–29. http://dx.doi.org/10.1108/eb007889.

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Zirnheld, J. L., S. Olabisi, K. Burke, T. M. Disanto, H. L. Moore, and H. Singh. "Electric Explosion of Aluminum Metallized Film." IEEE Transactions on Plasma Science 37, no. 12 (2009): 2378–84. http://dx.doi.org/10.1109/tps.2009.2032547.

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Santos, Bielinski M., and James P. Gilreath. "DIFFERENTIAL PURPLE NUTSEDGE (Cyperus rotundus) PENETRATION THROUGH MULCH FILMS." HortScience 40, no. 3 (2005): 889c—889. http://dx.doi.org/10.21273/hortsci.40.3.889c.

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Purple nutsedge can easily penetrate polyethylene mulch films. However, there are no reports on possible differences among mulch films. Because of this situation, field trials were conducted in Ruskin and Bradenton, Fla., during 2002 and 2003. In Spring 2002, the treatments were a) no mulch, b) black Pliant High Barrier mulch, and c) green Klerk's Virtually Impermeable Film (VIF). In Spring 2002, the films were a) black Pliant High Barrier, b) black IPM Bromostop, c) metallized Pliant, and d) green Klerk's VIF. The number of nutsedge emerged through the films was determined. No fumigants or he
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Shen, Zhenzhen, Aleksey Reiderman, and Casey Anude. "Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications." International Symposium on Microelectronics 2015, no. 1 (2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.

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Silver nano-particle (AgNP) sintering has been a promising bonding material for high-temperature applications. There is an increasing demand for designs implemented as multi-chip module (MCM) in the high-temperature markets, like the oil and gas industry, primarily because of MCM's smaller size, higher-performance capability, and higher overall reliability when compared to traditional high Tg printed circuit boards. In this work, pressure-less AgNP sintering paste was used in the assembly of multi-chip modules. The assemblies included die-mounted on aluminum nitride and alumina substrates that
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Stachowiak, Tomasz, Przemysław Postawa, Marcin Chmielarz, and Dominik Grzesiczak. "Analysis of Mechanical and Thermal Properties of Polymer Materials Derived from Recycled Overprinted Metallized PP Films." Materials 17, no. 8 (2024): 1739. http://dx.doi.org/10.3390/ma17081739.

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Polymer materials and their composites are one of the most frequently used materials in the packaging and food industries. This applies to both disposable and reusable packaging, layered films with barrier properties, as well as densely overprinted polymer films and metallized food wrap films. According to statistical data from Plastics Europe, approximately 40% of processed thermoplastics are used to produce packaging, including single- and multi-layer film packaging. Growing requirements and new EU directives require the use of recycled materials in new products, which is not easy because th
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Rozprawy doktorskie na temat "Metallized film"

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Mello, Tiago Chaves. "Influência dos parâmetros do processo de serramento no corte de capacitores de filme metalizado ultrafino." reponame:Biblioteca Digital de Teses e Dissertações da UFRGS, 2015. http://hdl.handle.net/10183/127878.

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Visando determinar os valores ótimos para o processo de serramento de anéis bobinados de filme metalizado ultrafino de alumínio com dielétrico de poliéster a partir das condições atuais do processo de fabricação de capacitores pela empresa Epcos do Brasil, realizou-se a avaliação de diferentes tipos de serras circulares variando-se a velocidade de rotação (n) e o tempo de corte (tc). Desenvolvido projeto de experimento desses três fatores a fim de obter o resultado das interações entre eles quanto à resistência de isolamento (Riso) das peças cortadas. A serra de 160 dentes de metal-duro com re
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Lee, Yuen-Pen. "Electrically and thermally activated ageing mechanisms in metallised polymer film capacitors." Thesis, Loughborough University, 2001. https://dspace.lboro.ac.uk/2134/33870.

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This dissertation describes a combined computational and experimental study to understand the fundamental electrostatic, thermal, electromagnetic, and discharge related processes during the ageing of metallised polymer film capacitors. In the event of internal breakdowns, these capacitors are capable of "self-healing" through a controlled isolation of defects on the electrode surfaces by mosaic patterning the electrode. The objective of this project is to develop viable computer models to unravel electrothermally activated ageing processes in capacitors. To provide the necessary validation to
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Rochefort, Claire. "Analyse du vieillissement, estimation de la durée de vie et méthode de surveillance de l’état de santé des condensateurs à film métallisé." Electronic Thesis or Diss., Lyon 1, 2024. http://www.theses.fr/2024LYO10183.

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Très largement utilisés, les condensateurs à films métallisés sont une cause commune de panne des systèmes d’électronique de puissance. Leur défaillance peut engendrer des risques d’explosion et d’incendie. Outre l’enjeu de sécurité, l’étude des défaillances est justifiée par les enjeux économiques relatifs à la maintenance des systèmes. L’objectif est de prédire l’évolution du vieillissement pour estimer la durée de vie utile restante et d’anticiper les pannes soudaines. A ce jour, les lois de vieillissement les plus utilisées nécessitent d’effectuer préalablement des essais de vieillissement
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Brown, Robert Winston, and rwb@rmit edu au. "Electrical and Thermal Modelling of Low Power Metallised Polypropylene Capacitors." RMIT University. Electrical and Computer Engineering, 2007. http://adt.lib.rmit.edu.au/adt/public/adt-VIT20080130.155318.

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Metallised polypropylene (MPP) capacitors, the dominant capacitor type used in a wide range of power and electronic circuit applications, offer high volumetric capacitor density, low cost, excellent frequency characteristics and a unique ability to recover from point failures in the dielectric film. However MPP capacitors have a generic weakness that is not well understood, failure of the self-healing process leading to ongoing catastrophic failure. The work described in this thesis includes the derivation of an improved electrical model of a capacitor and the uncovering of a mechanism fo
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Barker, Campbell Preston. "Physical and chemical aspects of A10x/PET gas barrier composites." Thesis, Durham University, 1994. http://etheses.dur.ac.uk/5818/.

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BONNEL, DE LONGCHAMP NATHALIE. "Etude de phenomenes transitoires dans les films minces. Premiere partie : auto-regeneration dans les condensateurs a film metallise. seconde partie: commutation supra-normal dans ybacuo epitaxie." Paris 7, 1992. http://www.theses.fr/1992PA077025.

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Cette these porte sur des mesures de phenomenes transitoires rapides sur des films minces. En premiere partie, on etudie l'influence de l'environnement et de la nature des electrodes sur le phenomene d'auto-regeneration dans les condensateurs a films polymere metallise, par des mesures electriques ou l'auto-regeneration se manifeste par un transitoire de courant. Un circuit de tres faible inductance a ete specialement concu pour l'acquisition en monocoup de ce transitoire rapide et non-reproductible. On analyse ainsi: la decharge du condensateur, l'energie dissipee, le courant crete, sa duree,
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Makdessi, Maawad. "Modélisation, vieillissement et surveillance de l'état de santé des condensateurs films utilisés dans des applications avioniques." Phd thesis, Université Claude Bernard - Lyon I, 2014. http://tel.archives-ouvertes.fr/tel-01058227.

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Le domaine aéronautique connait de nos jours un engouement sans précédent autour de l'avion plus électrique. L'importance du nombre d'équipements électriques est à un tel point que l'amélioration de leur fiabilité devient incontournable. Actuellement, les composants passifs occupent 75 % des éléments électroniques utilisés en avionique dont la moitié correspond à des condensateurs. Ces derniers doivent donc répondre aux exigences environnementales avioniques assez contraignantes. C'est dans ce contexte que nous nous sommes intéressés particulièrement à l'étude des condensateurs à technologie f
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Tsai, Chir-Jang, and 蔡奇璋. "Adhesion Behaviors of Thick Film Metallized AlN Substrate." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/28391973378611150919.

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碩士<br>義守大學<br>材料科學與工程學系<br>88<br>The interfacial pore distribution, microstructure, and adhesive properties of an aluminum nitride (AlN) substrate screen-printed with resistor pastes have been investigated over a wide temperature range (600 ~ 850 oC). Some of the resistors have been doped with varying concentrations (5 ~ 20%) of submicronmeter Al2O3 particles. Some of the AlN substrates have also been thermally pre-oxidized at elevated temperatures before the printing process. Sintering temperature for fully densification of the resistor film has been found to increase with the Al2
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Reid, Behanzin Hassu Bowelle. "An investigation of low pressure, low energy surface flashover across metallized polypropylene film (MPF) as an intense pulsed light source." 2006. http://proquest.umi.com/pqdweb?did=1075712821&sid=2&Fmt=2&clientId=39334&RQT=309&VName=PQD.

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Thesis (M.S.)--State University of New York at Buffalo, 2006.<br>Title from PDF title page (viewed on July. 19, 2006) Available through UMI ProQuest Digital Dissertations. Thesis adviser: Sarjeant, Walter J., Etemadi, Kasra. Includes bibliographical references.
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"METALLIZED POLYMERS: EXPLORATION AND DEVELOPMENT OF A LASER ENGINEERED METAL INTERLAYER IN NOBLE METAL-DOPED BTDA/ODA POLYIMIDE FILMS." Tulane University, 2017.

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Książki na temat "Metallized film"

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Energy-saving and Climate Control in Greenhouses with Concertina-shaped Screen, Made of Metallized Complex Film. European Communities / Union (EUR-OP/OOPEC/OPOCE), 1993.

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Stress-induced Phenomena in Metallization: Proceedings of the Second International Workshop held in Austin, Texas, March 1993 (AIP Conference Proceedings ... Phenomena Metallizat.). American Institute of Physics, 1994.

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(Editor), Shefford P. Baker, Matti A. Korhonen (Editor), Eduard Arzt (Editor), and Paul S. Ho (Editor), eds. Stress Induced Phenomena in Metallization: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001 ... Phenomena Metallizat.). American Institute of Physics, 2002.

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(Editor), Paul S. Ho, Shefford P. Baker (Editor), Tomoji Nakamura (Editor), and Cynthia A. Volkert (Editor), eds. Stress-Induced Phenomena in Metallization: Seventh International Workshop on Stress-Induced Phenomena in Metallization (AIP Conference Proceedings / AIP ... Phenomena Metallizat.). American Institute of Physics, 2004.

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Części książek na temat "Metallized film"

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Lee, W. C., V. W. Lindberg, P. H. Wojciechowski, and F. J. Duarte. "Thin Film Adhesion Measurement Using Excimer Laser Ablation and Tensile Extension Tests." In Metallized Plastics 2. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-0735-6_35.

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Datta, Saswati, Yoon-Gi Kim, P. A. Dowben, et al. "Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates From Organometallic Complexes." In Metallized Plastics 3. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3416-7_7.

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Xiao, Meng, Boxue Du, Ranran Xu, et al. "Improvement of Dielectric Properties of Polypropylene Film for HVDC Metallized Film Capacitors." In Polymer Insulation Applied for HVDC Transmission. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-9731-2_25.

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Yan, Fei, and Xiang Huang. "Study on Factors Influencing Self-healing Energy of Metallized Film Capacitors." In Lecture Notes in Electrical Engineering. Springer Nature Singapore, 2024. http://dx.doi.org/10.1007/978-981-99-7401-6_11.

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Cui, Yanjie, Yong Sun, Wenhao Lu, Cheng Yao, and Chunhong Zhou. "Research on the Influence of Safety Film on the Thermal Field Distribution of Metallized Film Capacitors." In Lecture Notes in Electrical Engineering. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-7413-9_42.

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Yu, Hongyu, Li Ran, Hao Feng, and Jinxiao Wei. "Design of Increasing Dielectric Constant of Metallized Film Capacitor to Reduce Its Volume in MMC." In The Proceedings of 2022 International Conference on Wireless Power Transfer (ICWPT2022). Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-0631-4_97.

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Cui, Huize, Zhaoliang Xing, and Chong Zhang. "Influence Mechanism of Hot-Press Setting Time and Winding Tension on the Performance of Metallized Film Capacitors." In Lecture Notes in Electrical Engineering. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-7413-9_68.

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Padiyath, R., Jayshree Seth, S. V. Babu, and L. J. Matienzo. "Plasma-Induced Deposition of Copper Films." In Metallized Plastics 3. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3416-7_3.

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Eisfeller, Richard, and John S. Judge. "Metallized Indium Island Films for Flexible Automotive Trim." In Metallized Plastics 2. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-0735-6_5.

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Padiyath, R., M. David, and S. V. Babu. "Plasma Induced Deposition of Copper Films on Polymer Surfaces." In Metallized Plastics 2. Springer US, 1991. http://dx.doi.org/10.1007/978-1-4899-0735-6_8.

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Streszczenia konferencji na temat "Metallized film"

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Xiao, Meng, Liangtian Zhang, Xiaodan Du, Xiangyu Dong, and Boxue Du. "Study on Partial Discharge Characteristics of Dielectric Films for Metallized Film Capacitors." In 2024 IEEE 5th International Conference on Dielectrics (ICD). IEEE, 2024. http://dx.doi.org/10.1109/icd59037.2024.10613102.

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Zhang, Jie, Feipeng Wang, Jian Zhou, Yushuang He, and Guoqiang Du. "Dependence of Self-Healing Arc on Metal Vaporization Contributions for Metallized Film Capacitor." In 2024 IEEE 5th International Conference on Dielectrics (ICD). IEEE, 2024. http://dx.doi.org/10.1109/icd59037.2024.10613128.

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Xiao, Meng, Liangtian Zhang, Zhiyuan Zhang, Yuyan Cheng, Zening Lu, and Boxue Du. "Research on Partial Discharge and Self-Healing Characteristics for Metallized Film of Capacitors." In 2024 IEEE 5th International Conference on Dielectrics (ICD). IEEE, 2024. http://dx.doi.org/10.1109/icd59037.2024.10613348.

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Yi, Chengqian, Bo Zhang, Chaoran Li, and Yufan Yao. "Charge-discharge current distribution among elements in metallized film capacitors used for MMC." In 2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE). IEEE, 2024. http://dx.doi.org/10.1109/ichve61955.2024.10676226.

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Zhang, Ting, Lu Cheng, Di Hu, et al. "The Simultaneous Improvement of Energy Storage Density and Self-Healing Property of Metallized Film." In 2024 IEEE 14th International Conference on the Properties and Applications of Dielectric Materials (ICPADM). IEEE, 2024. http://dx.doi.org/10.1109/icpadm61663.2024.10750615.

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Zuo, Qianglin, Yanjun Zhao, and Xu Han. "Research on Application of Self-Healing Metallized Film Capacitors of DC Filter for HVDC System." In 2024 International Conference on HVDC (HVDC). IEEE, 2024. http://dx.doi.org/10.1109/hvdc62448.2024.10723079.

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Li, Zhili, Yizheng Tang, Qiming Sun, et al. "Intelligent Monitoring Approach of Metallized Film Capacitor Degradation Status Using Ultrasonic Signal of Self-healing Discharge." In 2024 CPSS & IEEE International Symposium on Energy Storage and Conversion (ISESC). IEEE, 2024. https://doi.org/10.1109/isesc63657.2024.10785409.

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Zhang, Liangtian, Meng Xiao, Boxue Du, and Zhaoliang Xing. "Partial Discharge Characteristics of Metallized Film for Metallized Film Capacitors." In 2023 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD). IEEE, 2023. http://dx.doi.org/10.1109/asemd59061.2023.10369688.

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Nielsen, Dennis A., Vladimir N. Popok, and Kjeld Pedersen. "Electric field mapping inside metallized film capacitors." In 2015 Annual Reliability and Maintainability Symposium (RAMS). IEEE, 2015. http://dx.doi.org/10.1109/rams.2015.7105153.

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Belko, Victor, Oleg Emelyanov, and Ivan Ivanov. "Critical Parameters of Metallized Film Capacitor’s Failure." In 2018 IEEE 2nd International Conference on Dielectrics (ICD). IEEE, 2018. http://dx.doi.org/10.1109/icd.2018.8468437.

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