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1

Belko, V., Liu Cheng, Sofiya Kalmykova, Aleksey Pechnikov, and Andrey Plotnikov. "Influence of Electrodes Configuration on Metallized Film Capacitor Performance Metrics." Problems of the Regional Energetics, no. 1(65) (January 2025): 121–34. https://doi.org/10.52254/1857-0070.2025.1-65.9.

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The aim of the study is to reveal the influence of the electrode configuration of metallized film capacitors on their characteristics and performance under conditions typical of power electronics. Presently used electrodes configurations are summarized, their benefits and disadvantages are ana-lyzed. We showed that currently used metallized film capacitors electrodes configurations, ensuring reliable self-heling, have too high equivalent resistivity. Authors propose to introduce a hybrid type of electrode for metallized film capacitors. We showed the influence of the capacitor electrodes on it
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2

Bazhenov, S. L., I. N. Nasrullaev, I. V. Razumovskaya, S. K. Kudaikulova, B. A. Zhubanov, and Marc J. M. Abadie. "Multiple Cracking of Metallized Polyimide Kapton Films." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 41. http://dx.doi.org/10.18321/ectj332.

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Mechanical behaviour of metallized polyimide Kapton films was studied. The adhesion of metallized films to Kapton films is approximately hundred-folds higher than that of coatings made by usual sputter deposition of a metal on a polymer substrate. Multiple cracking of a metallized film was observed. Cracks<br />of two different scale levels are observed. The cracks of the first type (microcracks) are short with 1-2 μm length. The cracks of the second type are much longer and have length of several hundreds microns. The cracks of this type appear at higher strains as compared with the sho
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3

Donhowe, Mark, Jeff Lawler, Sean Souffie, and E. Lee Stein. "250°C Operating Temperature Dielectric Film Capacitors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (2011): 000201–6. http://dx.doi.org/10.4071/hiten-paper2-mdonhowe.

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High operating temperature electronic components are needed for a variety of military, aerospace, down-hole, and electric vehicle applications. One of the limiting technologies is the availability of highly reliable capacitors that operate at temperatures greater than 150°C and up through 250°C. This paper introduces a high breakdown strength dielectric film Gore has developed for metallized film capacitors. In addition to exceptionally high breakdown voltages, the 6 μm PTFE film exhibits low dissipation factor and stable capacitance over a wide temperature range. Film properties were tested f
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4

Prikhodko, Oleg, Saule Kudaikulova, and Marc J. M. Abadie. "Electric and Optical Properties of Polyimide Surface Films Modified by Metals." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 31. http://dx.doi.org/10.18321/ectj330.

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<p>Electric and optical properties of polymer films, which were prepared on the basis of polyimides and metallized by binary aggregates Ag with Ni and Co, have been investigated. The metallized polyimide films with additional coating from Ni, Au and Rh have been studied too. It has been found that the temperature dependence of the specific surface resistance in the metallized films at the temperature from 25 up to 160 <sup>o</sup>C was in the well agreement with linear law. The specific surface resistance at 20 <sup>o</sup>C and temperature coefficient showed low
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5

Saidin, Syafiqah, Hendra Hermawan, Pascale Chevallier, and Diego Mantovani. "Surface Characterization of Biomimetic Hydroxyapatite-Silver Functionalized on Polydopamine Film." Advanced Materials Research 1125 (October 2015): 395–400. http://dx.doi.org/10.4028/www.scientific.net/amr.1125.395.

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Hydroxyapatite (HA) is a well known bioactive material in the application of coated orthopaedic and dental implants. Recently, biomimetic technique has been explored to deposit a stable carbonated HA on a metal surface, mimicking the properties of natural bone. The aim of this study is to surface characterize the biomimetic hydroxyapatite (HA) and metallized silver (Ag) functionalized on a polydopamine film grafted titanium alloy (Ti6Al4V). The Ti6Al4V disks were grafted with the polydopamine film to provide catechol/quinone groups for chemical binding process. The grafted surfaces were metall
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6

Casey, Frank, and Anthony Broomfield. "OPTICAL SENSORS MONITOR METALLIZED FILM PRODUCTION." Sensor Review 12, no. 4 (1992): 28–29. http://dx.doi.org/10.1108/eb007889.

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7

Zirnheld, J. L., S. Olabisi, K. Burke, T. M. Disanto, H. L. Moore, and H. Singh. "Electric Explosion of Aluminum Metallized Film." IEEE Transactions on Plasma Science 37, no. 12 (2009): 2378–84. http://dx.doi.org/10.1109/tps.2009.2032547.

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8

Santos, Bielinski M., and James P. Gilreath. "DIFFERENTIAL PURPLE NUTSEDGE (Cyperus rotundus) PENETRATION THROUGH MULCH FILMS." HortScience 40, no. 3 (2005): 889c—889. http://dx.doi.org/10.21273/hortsci.40.3.889c.

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Purple nutsedge can easily penetrate polyethylene mulch films. However, there are no reports on possible differences among mulch films. Because of this situation, field trials were conducted in Ruskin and Bradenton, Fla., during 2002 and 2003. In Spring 2002, the treatments were a) no mulch, b) black Pliant High Barrier mulch, and c) green Klerk's Virtually Impermeable Film (VIF). In Spring 2002, the films were a) black Pliant High Barrier, b) black IPM Bromostop, c) metallized Pliant, and d) green Klerk's VIF. The number of nutsedge emerged through the films was determined. No fumigants or he
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9

Shen, Zhenzhen, Aleksey Reiderman, and Casey Anude. "Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications." International Symposium on Microelectronics 2015, no. 1 (2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.

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Silver nano-particle (AgNP) sintering has been a promising bonding material for high-temperature applications. There is an increasing demand for designs implemented as multi-chip module (MCM) in the high-temperature markets, like the oil and gas industry, primarily because of MCM's smaller size, higher-performance capability, and higher overall reliability when compared to traditional high Tg printed circuit boards. In this work, pressure-less AgNP sintering paste was used in the assembly of multi-chip modules. The assemblies included die-mounted on aluminum nitride and alumina substrates that
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10

Stachowiak, Tomasz, Przemysław Postawa, Marcin Chmielarz, and Dominik Grzesiczak. "Analysis of Mechanical and Thermal Properties of Polymer Materials Derived from Recycled Overprinted Metallized PP Films." Materials 17, no. 8 (2024): 1739. http://dx.doi.org/10.3390/ma17081739.

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Polymer materials and their composites are one of the most frequently used materials in the packaging and food industries. This applies to both disposable and reusable packaging, layered films with barrier properties, as well as densely overprinted polymer films and metallized food wrap films. According to statistical data from Plastics Europe, approximately 40% of processed thermoplastics are used to produce packaging, including single- and multi-layer film packaging. Growing requirements and new EU directives require the use of recycled materials in new products, which is not easy because th
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11

Girardi, M. A., K. A. Peterson, and P. T. Vianco. "Thick Film Process Characterization for Thin Film Metallized LTCC." Journal of Microelectronics and Electronic Packaging 13, no. 3 (2016): 136–42. http://dx.doi.org/10.4071/imaps.512.

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Low temperature cofired ceramic (LTCC) technology has proven to be invaluable in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high-frequency applications is appealing due to its low losses, design flexibility, and packaging and integration capability. The LTCC thick film process is summarized, including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields
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12

Sung, Taehyun, Sue A. Bidstrup Allen, and Paul A. Kohl. "Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing." Journal of Microelectronics and Electronic Packaging 2, no. 2 (2005): 142–54. http://dx.doi.org/10.4071/1551-4897-2.2.142.

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The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards we
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13

Zhang, Hui Chong, Zhan Chang Pan, Guang Hui Hu, et al. "Surface Modification of PET Films by Vapor-Phase Photografting Acrylic Acid and its Application to Electroless Copper Plating." Advanced Materials Research 311-313 (August 2011): 1802–5. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1802.

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As a simple and useful approach, vapor-phase photografting acrylic acid was used to modify the surface of PET films. Catalyst of silver nanoparticles was distributed on the photografting PET films equably after reducing by ascorbic acid. Topography of the pristine, grafting and metallized PET films was characterized by scanning electron microscope (SEM). XRD and FTIR-ATR were also used to analyze the electroless plating copper layer and the grafting PET film respectively.
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14

Kudaikulova, Saule, Assima Syzdykova, Rinat Iskakov, et al. "Effect of Modification on Electrochemical Chelation of Polyimide Films." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 23. http://dx.doi.org/10.18321/ectj329.

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Novel procedure of electrochemical chelation of polyimide films was developed. The kinetics of silver cation sorptions into the films during the chelation was found out. The effect of modification treatment of film surfaces on kinetics of electrochemical process was studied. The stabilization of ion-sorbed layer of films occurs in water-isopropanol solvents. Sorption of silver during electrochemical deposition is 0.75-1.5 mg per 100 μm of polyimide depending on modification solution. Thus, the most appropriate morphological modification with about 1.5 mg/100 μm take places in heterocyclic solv
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15

Li Hua, 李化, 陈耀红 Chen Yaohong, 林福昌 Lin Fuchang, and 彭波 Peng Bo. "Lifetime characteristics of metallized film pulsed capacitors." High Power Laser and Particle Beams 22, no. 4 (2010): 773–76. http://dx.doi.org/10.3788/hplpb20102204.0773.

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16

Jia Zhanqiang, 贾占强, 蔡金燕 Cai Jinyan, 梁玉英 Liang Yuying, and 韩春辉 Han Chunhui. "Reliability assessment of metallized film pulse capacitor." High Power Laser and Particle Beams 23, no. 1 (2011): 272–76. http://dx.doi.org/10.3788/hplpb20112301.0272.

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17

Cox, James W. "Industrial Applications for Substrates of Metallized Film." Journal of Plastic Film & Sheeting 4, no. 1 (1988): 43–49. http://dx.doi.org/10.1177/875608798800400106.

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18

Joubert, Ch, A. Béroual, and G. Rojat. "Asymmetrical current distribution in metallized film capacitors." Journal of Applied Physics 95, no. 11 (2004): 6420–25. http://dx.doi.org/10.1063/1.1712009.

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19

Ostrowski, Jörg, Ralf Hiptmair, and Henning Fuhrmann. "Electric 3D‐simulation of metallized film capacitors." COMPEL - The international journal for computation and mathematics in electrical and electronic engineering 26, no. 2 (2007): 524–43. http://dx.doi.org/10.1108/03321640710727836.

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20

Vassiliadi, E., and P. A. Tarantili. "Characterization of metallized biaxially oriented polypropylene film." Journal of Applied Polymer Science 105, no. 4 (2007): 1713–22. http://dx.doi.org/10.1002/app.26396.

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21

Southward, Robin E., Carey K. Bagdassarian, Christopher J. Sudol, et al. "Synthesis of surface-metallized polymeric films by in situ reduction of (4,4,4-trifluoro-1-(2-thienyl)-1,3-butanedionato) silver(I) in a polyimide matrix." Journal of Materials Research 14, no. 7 (1999): 2897–904. http://dx.doi.org/10.1557/jmr.1999.0387.

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Thermal curing of the (4,4,4-trifluoro-1-(2-thienyl)-1,3-butanedionato)silver(I)-containing poly(amic acid) formed from 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide gives both polyimide films via cyclodehydration and reduction of silver(I) to the native metal. Silver(0) migrates to the surface resulting in surface metallized composite films, which can have excellent reflectivity, but do not exhibit surface electrical conductivity. The films retain mechanical and thermal properties similar to those of the parent polyimide.
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22

Rytöluoto, Ilkka, Minna Niittymäki, Paolo Seri, et al. "Biaxially oriented silica–polypropylene nanocomposites for HVDC film capacitors: morphology-dielectric property relationships, and critical evaluation of the current progress and limitations." Journal of Materials Chemistry A 10, no. 6 (2022): 3025–43. http://dx.doi.org/10.1039/d1ta10336a.

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Investigation of the processing–morphology–dielectric performance relationships of BOPP nanocomposites provides critical perspectives on the future prospects and challenges of polymer nanocomposites for high voltage metallized film capacitors.
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23

Orlenson, VulfBorisovich, Sergey Aleksandrovich Zuev, and Vladimir Victorovich Starostenko. "The nanometer conductive film diffraction properties." ITM Web of Conferences 30 (2019): 08011. http://dx.doi.org/10.1051/itmconf/20193008011.

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In this article the numerical simulations and experimental studies of microwave electromagnetic wave interaction with micro- and nanoparticles of different sizes with their arbitrary location on the substrate are carried. The optical coefficients (reflection, transmission and absorption) and their dependence on the metallized nanocoating fill factor and thickness were obtained.
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24

Paajanen, Mika, Mikko Karttunen, Satu Kortet, Outi Härkki, and Inka Orko. "Thermally More Durable Electromechanical Films by POSS Nanomodification." Key Engineering Materials 538 (January 2013): 65–68. http://dx.doi.org/10.4028/www.scientific.net/kem.538.65.

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The thermal stability of polypropylene (PP) based cellular electromechanical films was improved by compounding PP with thermally more durable cyclo olefin copolymer (COC) and polyhedral oligomeric silsesquioxane (POSS) nanochemical. The cast films were biaxially oriented in laboratory scale and then expanded by a gas diffusion expansion method, which increased the pore size inside the cellular film structure and the thickness of the film. The cellular films were then electrostatically charged by a contact charging method and metallized by gold sputtering. The samples were aged at 85°C showing
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25

Muhina, L. L., I. V. Razumovskaja, S. K. Kudaikulova, B. A. Zhubanov, and M. J. M. Abadie. "The Microhardness as an Express Method for Estimation the Depth of Metal Particle Distribution." Eurasian Chemico-Technological Journal 6, no. 1 (2016): 37. http://dx.doi.org/10.18321/ectj331.

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By measurement of microhardness of silver layer on polyimide films and its reduction after removing the stress, the depth of silver distribution in the polyimide films was calculated. A significant hardening of Kapton 100 HN films was observed especially for cobalt-impregnated materials, which was about 10 μm. The distribution of silver in the film layers was obviously deeper that manifested as entirely lower hardening at microhardness measurement. Because of the initial microhardness of Upilex it was observed strong hardening of the effort, which was led to shallow distribution of metals in t
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26

Yang, Lan, Yun Ye, Tai Liang Guo, and Xiao Jin Huang. "Surfacial Metallization of Carbon Fibers by Copper Coating and Field Emission Properties." Materials Science Forum 663-665 (November 2010): 183–86. http://dx.doi.org/10.4028/www.scientific.net/msf.663-665.183.

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Carbon fibers (CNFs) were surfacial metallized by electroless deposited with copper, and their field emission properties were investigated by diode test. The results indicated that the field emission properties of CNFs were affected by the thicknesses of copper. After CNFs were surfacial metallized, the volume resistivity of CNFs was decreased and field emission property was increased, respectively; increase the thin-film thickness, there appeared an optimal film thickness value for properties of field electron emission. It was found that CNFs owned the best field emission properties after ele
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27

Marra, J. V. "Metallized Opp Film, Surface Characteristics and Physical Properties." Journal of Plastic Film & Sheeting 4, no. 1 (1988): 27–34. http://dx.doi.org/10.1177/875608798800400104.

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28

Vuillermet, Y., O. Chadebec, J. M. Lupin, A. Saker, G. Meunier, and J. L. Coulomb. "Optimization of Low-Voltage Metallized Film Capacitor Geometry." IEEE Transactions on Magnetics 43, no. 4 (2007): 1569–72. http://dx.doi.org/10.1109/tmag.2007.892473.

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29

Kong, M. G., and Y. P. Lee. "Electrically induced heat dissipation in metallized film capacitors." IEEE Transactions on Dielectrics and Electrical Insulation 11, no. 6 (2004): 1007–13. http://dx.doi.org/10.1109/tdei.2004.1387824.

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30

Tortai, J. H., A. Denat, and N. Bonifaci. "Self-healing of capacitors with metallized film technology:." Journal of Electrostatics 53, no. 2 (2001): 159–69. http://dx.doi.org/10.1016/s0304-3886(01)00138-3.

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31

Godec, M., Dj Mandrino, and M. Gaberšček. "Investigation of performance degradation in metallized film capacitors." Applied Surface Science 273 (May 2013): 465–71. http://dx.doi.org/10.1016/j.apsusc.2013.02.063.

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32

Buzko, Vladimir, Maxim Babushkin, Sergey Ivanin, Alexander Goryachko, and Iliya Petriev. "Study of Electromagnetic Shielding Properties of Composites Based on Glass Fiber Metallized with Metal Films." Coatings 12, no. 8 (2022): 1173. http://dx.doi.org/10.3390/coatings12081173.

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The article presents the results of an investigation of composites based on manufactured samples of fiberglass metalized with a submicron film made of brass, neusilber and non-magnetic SS304 stainless steel. It was found that, due to their characteristics, the samples of metallized fiberglass are an effective electromagnetic wave-absorbing filler for various building and construction materials; The developed metallized fiberglass samples are also useful for the creation of EMI-shielding building materials for protection from microwave radiation. With an increase in the proportion of metalized
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33

Suchaneck, Gunnar, O. Volkonskiy, Gerald Gerlach, et al. "Piezoelectric PZT Thin Films on Flexible Copper-Coated Polymer Films." Materials Science Forum 636-637 (January 2010): 392–97. http://dx.doi.org/10.4028/www.scientific.net/msf.636-637.392.

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This work analyzes the processing of Pb(Zr,Ti)O3 (PZT) thin films directly on copper-coated polymer films. PZT thin film deposition was performed onto the metallized Kapton® films using a single RF plasma jet. In order to reduce the interaction of PZT and Cu during the initial growth stage, an ultrathin amorphous TiO2-x seeding layer was sputter-deposited prior to PZT deposition. The film texture was a mixture of (111)-oriented perovskite nanocrystals, rutile and pyrochlore. Topography and piezoelectric in-plane and out-of-plane response of the films were evaluated using a commercial AFM adapt
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34

Schmidt, Richard, Kathrin Reinhardt, Thomas Seuthe, Olga Schwab, Claudia Feller, and Markus Eberstein. "Shrinkage controlled pastes for bulky silver and copper thick films in power electronics." International Symposium on Microelectronics 2015, no. 1 (2015): 000267–72. http://dx.doi.org/10.4071/isom-2015-wa43.

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Harvesting green energy and sustainable, effective use of it is based on efficient, cost-effective power electronics. To build robust, multi-functional and highly integrated electronic modules, metallizations with low resistances and the capability to carry high current loads for inner and top layer thick-films are needed. Additionally, these layers have to be interconnectable by metallized vias, soldering and bonding. A major challenge in realization of bulky silver and copper thick-films is to allow sufficient evaporation of the gaseous products during the interface reaction. Various ways to
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35

Starostenko, Vladimir V., Evgeniy V. Grigoriev, Alim S. Mazinov, et al. "Heating dynamics of metal-dielectric structures with nanometer-thin conductive films under the influence of microwave fields." Radioelectronics. Nanosystems. Information Technologies. 14, no. 3 (2022): 243–48. http://dx.doi.org/10.17725/rensit.2022.14.243.

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The paper presents the results of experimental studies of the heating dynamics of metal-dielectric structures (MDS) with aluminum conductive nanoscale films deposited by magnetron sputtering on low-cost substrates (glass, sitall, PET and PTFE) under exposure to monochromatic ultrahigh frequency (UHF) fields in a waveguide. At film thicknesses less than 2 nm, the experimental samples had mostly dielectric properties. Noticeable interaction of the films with microwave, causing thermal phenomena, was observed at thicknesses greater than 2 nm and reached a maximum at 5 nm. Thermal degradation proc
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36

Islam, Aminul, and Hans Nørgaard Hansen. "Effects of Miniaturization on the Quality of Metallized Plastic Parts." Micromachines 13, no. 4 (2022): 515. http://dx.doi.org/10.3390/mi13040515.

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The metallization of plastics is an important industrial process. Plastics are metallized for both aesthetic and functional purposes. The unceasing pursuit towards the miniaturization and reduction in the part’s size challenges the already complicated process of metallization. A rigorous research study uncovering the effects of miniaturization on the quality of metallized parts is missing at the state-of-the-art level. This study focuses on the quality of the deposited metal film based on geometrical dimensions and systematically characterizes the effects of miniaturization on the metallized m
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37

Kong, Zhong Hua, Li Gang Wu, Chun Ya Tong, and Zai Fei Luo. "Calculation of Self-Healing Contract Resistance of Metallized Film." Applied Mechanics and Materials 615 (August 2014): 236–39. http://dx.doi.org/10.4028/www.scientific.net/amm.615.236.

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Abstract. Self-healing is an interesting property of metallized capacitors. contract resistance is importance to self healing. In the paper contract resistance is calculated with different diameters of hole and different thickness of metal layer. The larger is radius of hole, the less is contract resistance. The thicker is metal layer, the less is contract resistance.
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38

Picci, G., and M. Rabuffi. "Pulse handling capability of energy storage metallized film capacitors." IEEE Transactions on Plasma Science 28, no. 5 (2000): 1603–6. http://dx.doi.org/10.1109/27.901241.

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39

Belko, Victor, Dmitry Glivenko, Oleg Emelyanov, Ivan Ivanov, and Andrey Plotnikov. "Current Pulse Polarity Effect on Metallized Film Capacitors Failure." IEEE Transactions on Plasma Science 45, no. 6 (2017): 1020–25. http://dx.doi.org/10.1109/tps.2017.2703947.

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40

Li, Zhiwei, Hua Li, Fuchang Lin, et al. "Lifetime investigation and prediction of metallized polypropylene film capacitors." Microelectronics Reliability 53, no. 12 (2013): 1962–67. http://dx.doi.org/10.1016/j.microrel.2013.06.005.

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41

Baëtens,, Tiffany, Emiliano Pallecchi, Vincent Thomy, and Steve Arscott. "Metallized SU-8 thin film patterns on stretchable PDMS." Journal of Micromechanics and Microengineering 29, no. 9 (2019): 095009. http://dx.doi.org/10.1088/1361-6439/ab307f.

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Du, Guoqiang, and Jie Zhang. "Capacitance Evaluation of Metallized Polypropylene Film Capacitors Considering Cumulative Self-Healing Damage." Electronics 13, no. 14 (2024): 2886. http://dx.doi.org/10.3390/electronics13142886.

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Self-healing (SH) in metallized polypropylene film capacitors (MPPFCs) can lead to irreversible damage to electrode and dielectric structures, resulting in capacitance loss and significant stability degradation, especially under cumulative SH conditions. To enhance the reliability assessment of MPPFCs post-SH, this study conducted SH experiments on MPPFCs, examined the damage patterns of the electrodes and dielectric films, and proposed a novel capacitance evaluation method for MPPFCs under cumulative SH conditions. The results reveal that with increasing SH voltage, the number of dielectric l
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43

Prystay, M. C., and J. F. Power. "Thermophysical Measurements and Interfacial Adhesion Studies in Ultrathin Polymer Films Using Homodyne Photothermal Spectrometry." Applied Spectroscopy 47, no. 4 (1993): 501–14. http://dx.doi.org/10.1366/0003702934334886.

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Homodyne laser photopyroelectric spectrometry (PPES) is a new photothermal detection scheme which uses electronic mixing to downshift a high-frequency swept wave photothermal response into a bandwidth of approximately one kilohertz. A rapid photopyroelectric impulse response is recovered from the downshifted component at high time resolution and is used, here, in two different geometries, to probe the thermal and interfacial properties of assemblies composed of submicron-thick-ness polymer films deposited on the metallized surface of a pyroelectric thin-film detector. In the thermal transmissi
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44

Olorounto, Olaïtan Germaine, Guy Deniau, Elisabeth Zekri, Denis Doizi, Johan Bertrand, and Vincent Corbas. "Development of Optical Sensors Based on Neutral Red Absorbance for Real-Time pH Measurements." Sensors 24, no. 17 (2024): 5610. http://dx.doi.org/10.3390/s24175610.

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Measuring pH with an optical sensor requires the immobilization of a chemical recognition phase on a solid surface. Neutral red (NR), an acid base indicator was used to develop two different optical probe configurations. The chemistry of aryl diazonium salts was chosen for the elaboration of this chemical phase, as it enables strong covalent bonds to be established on the surface of metallized glass or metallic surfaces. It also allows the formation of a thick film required to obtain an exploitable spectral response. The surfaces of interest (metallized optical fiber and 316 L stainless-steel
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Belko, Victor, Ivan Ivanov, Andrey Plotnikov, and Valery Belanov. "Energy characteristics of self-healing process in metallized film capacitors." E3S Web of Conferences 140 (2019): 02006. http://dx.doi.org/10.1051/e3sconf/201914002006.

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Metallized film capacitors widely used in energy applications were studied. The experimental method for investigation of energy and dynamic characteristics of self-healing processes in real metal-film capacitors was developed. The commercial PET and PP MFCs of 0.22 – 1 μF capacitance and 63–250 V voltage were tested. Depending on applied voltage, 3 types of SH processes in MFC were discovered: single, repetitive, and multiple SH. Dependencies of self-healing energy on breakdown voltage were obtained. These dependencies are described by power law with the exponent n = 2.2–2.4 that significantly
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46

Baumann, F. H., D. L. Chopp, T. Díaz de la Rubia, et al. "Multiscale Modeling of Thin-Film Deposition: Applications to Si Device Processing." MRS Bulletin 26, no. 3 (2001): 182–89. http://dx.doi.org/10.1557/mrs2001.40.

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Metallization is the back end of the integrated-circuit (IC) fabrication process where the transistor interconnections are formed. Figure 1 shows the metallized part of a static random-access memory chip. Metal lines for electrical connections (Al and Cu) in Si devices are deposited as blanket films and then etched or polished away to define the conducting lines.
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Goral, J. P., M. M. Al-Jassim, D. Albin, J. R. Tuttle, and R. Noufi. "TEM identification of secondary phases in non-stoichiometric polycrystalline CuInSe2 thin films." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 4 (1990): 604–5. http://dx.doi.org/10.1017/s0424820100176150.

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Polycrystalline thin films of CuInSe2 and CuGaSe2 are currently being developed as low-cost photovoltaic devices. These films are vacuum-deposited onto molybdenum metallized alumina substrates. The film composition may be varied by manipulation of the deposition parameters. For photovoltaic applications, the desired phase has a stoichiometry close to CuInSe2. This compound is a zincblende variant, the cations and anions occupying separate fcc sublattices. Under certain growth conditions, the Cu and In atoms adopt an ordered configuration within the cationic sublattice resulting in the tetragon
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Wang Wenjuan, 王文娟, 李化 Li Hua, 李智威 Li Zhiwei, 童勇 Tong Yong, and 林福昌 Lin Fuchang. "Lifetime improvement of metallized film capacitors by inner pressure strengthening." High Power Laser and Particle Beams 26, no. 4 (2014): 45015. http://dx.doi.org/10.3788/hplpb20142604.45015.

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Belko, Victor O., Oleg A. Emelyanov, Ivan O. Ivanov, Andrey P. Plotnikov, and Efrem G. Feklistov. "Application of Numerical Simulation for Metallized Film Capacitors Electrodes Design." IEEE Access 9 (2021): 80945–52. http://dx.doi.org/10.1109/access.2021.3085695.

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Pippin, H. Gary, Eugene Normand, Suzanne L. B. Wolf, and Rachel Kamenetzky. "Analysis of Metallized TeflonTM Thin-Film Materials Performance on Satellites." Journal of Spacecraft and Rockets 41, no. 3 (2004): 322–25. http://dx.doi.org/10.2514/1.10725.

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