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Bibliografias temáticas / Composite materials Cu

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Literatura científica selecionada sobre o tema "Composite materials Cu"

Autor: Grafiati

Publicado: 7 de setembro de 2024

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Artigos de revistas sobre o assunto "Composite materials Cu"

1

Ciupiński, Łukas, D. Siemiaszko, Marcin Rosiński, Andrzej Michalski, and Krzysztof Jan Kurzydlowski. "Heat Sink Materials Processing by Pulse Plasma Sintering." Advanced Materials Research 59 (December 2008): 120–24. http://dx.doi.org/10.4028/www.scientific.net/amr.59.120.

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A Pulse Plasma Sintering (PPS) process was employed to manufacture Cu-diamond composites with a 50% volume fraction of each constituent. Pure and Cr (0.8wt.%) alloyed copper matrices were used and commercial diamond powders. The composites were sintered at temperature of 900°C for 20 min and under pressure of 60 MPa. In these sintering conditions diamond becomes thermodynamically unstable. Cu0.8Cr-diamond and Cu-diamond composites with relative densities of 99,7% and 96% respectively were obtained. The thermal conductivity of Cu0.8Cr-diamond composite is equal to 640 W(mK)-1 whereas that of Cu

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2

Kim, Kyungju, Dasom Kim, Kwangjae Park, Myunghoon Cho, Seungchan Cho, and Hansang Kwon. "Effect of Intermetallic Compounds on the Thermal and Mechanical Properties of Al–Cu Composite Materials Fabricated by Spark Plasma Sintering." Materials 12, no. 9 (2019): 1546. http://dx.doi.org/10.3390/ma12091546.

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Aluminium–copper composite materials were successfully fabricated using spark plasma sintering with Al and Cu powders as the raw materials. Al–Cu composite powders were fabricated through a ball milling process, and the effect of the Cu content was investigated. Composite materials composed of Al–20Cu, Al–50Cu, and Al–80Cu (vol.%) were sintered by a spark plasma sintering process, which was carried out at 520 °C and 50 MPa for 5 min. The phase analysis of the composite materials by X-ray diffraction (XRD) and energy-dispersive spectroscopy (EDS) indicated that intermetallic compounds (IC) such

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3

Xu, Jian, Pei Xian Zhu, Hui Yu Ma, and Sheng Gang Zhou. "Characterisation of Ti-Al and Ti-Cu Laminated Composite Electrode Materials." Advanced Materials Research 194-196 (February 2011): 1667–71. http://dx.doi.org/10.4028/www.scientific.net/amr.194-196.1667.

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We proposed using Ti-Al and Ti-Cu laminated composites instead of single Ti electrode metals, as well as studied the difference in performance between laminated composite electrode materials and pure-Ti electrode. The analysis of the conductivity and electrochemical performance of electrode matrix material indicates the result that the improvement of matrix material by using Ti-Al and Ti-Cu laminated composites, better performance for conductivity of electrode, and be beneficial to homogenize the electrode surface potential and current distribution and promote electrocatalytic activity between

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Koltsova, Tatiana, Elizaveta Bobrynina, Aleksei Vozniakovskii, Tatiana Larionova, and Olga Klimova-Korsmik. "Thermal Conductivity of Composite Materials Copper-Fullerene Soot." Materials 15, no. 4 (2022): 1415. http://dx.doi.org/10.3390/ma15041415.

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Copper-based composites strengthened with fullerene soot nanoparticles of 20–30 nm size in concentration up to 23 vol.% were prepared via two methods: mechanical mixing and molecular level mixing. The dependence of thermal conductivity on the carbon concentration was studied. Maxwell’s model describes well the change in the thermal conductivity of the composite obtained by molecular level mixing. However, thermal conductivity of the composite produced by mechanical mixing is significantly lower than the calculated values, due to structural inhomogeneity and residual stresses. Comparison of the

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5

Sugianto, Sugianto, Ngurah Made Dharma Putra, Endah F. Rahayu, et al. "Synthesis, Characterization, and Electrochemical Performance of Reduced Graphene Oxide-Metal (Cu,Zn)-Oxide Materials." Indonesian Journal of Science and Technology 8, no. 2 (2023): 329–44. http://dx.doi.org/10.17509/ijost.v8i2.56065.

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The reduced graphene oxide (rGO) and metal (Cu,Zn)-oxide composites were prepared using a one-step hydrothermal technique. The role of (Cu,Zn)-oxide on the physical and electrochemical properties of the composite was investigated. The composite consists of various shapes of ZnO nanoflowers and micro-spheres, as well as Cu-oxide nanoflakes and octahedron-like shapes. The (Cu,Zn)-oxides were formed in between the rGO layers and observed in the rGO-ZnO, rGO-CuO, and rGO-CuO-ZnO composites. The presence of ZnO, CuO, and rGO within the composite structure is also confirmed by the analyses of crysta

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Han, Ying, Sida Li, Yundong Cao, et al. "Mechanical Properties of Cu-W Interpenetrating-Phase Composites with Different W-Skeleton." Metals 12, no. 6 (2022): 903. http://dx.doi.org/10.3390/met12060903.

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In this work, copper–tungsten (Cu-W) composites with a cubic and rhombic dodecahedron W-skeleton were fabricated by the infiltration of Cu melt into a three-dimensionally printed W scaffold. The effects of the skeleton structure on the mechanical properties and energy-absorbing characteristics of the Cu-W interpenetrating-phase composite were investigated and compared with those of commercial Cu-W composite fabricated by powder metallurgy. The results indicated that the mechanical properties of the studied Cu-W interpenetrating-phase composites were mainly related to the properties of their or

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Kim, Song-Mi, Woo-Rim Park, and Oh-Heon Kwon. "The Strength and Delamination of Graphene/Cu Composites with Different Cu Thicknesses." Materials 14, no. 11 (2021): 2983. http://dx.doi.org/10.3390/ma14112983.

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This study analyzed the mechanical and fracture behavior of graphene/copper (Cu) composites with different Cu thicknesses by using molecular dynamics (MD) and representative volume element (RVE) analysis. Three graphene/Cu composite analytical models were classified as 4.8, 9.8, and 14.3 nm according to Cu thicknesses. Using MD analysis, zigzag-, armchair-, and z (thickness)-direction tensile analyses were performed for each model to analyze the effect of Cu thickness variation on graphene/Cu composite strength and delamination fracture. In the RVE analysis, the mechanical characteristics of t

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Silvain, Jean François, Valérie Denis-Lutard, Pierre Marie Geffroy, and Jean Marc Heintz. "Adaptive Composite Materials with Novel Architectures." Materials Science Forum 631-632 (October 2009): 149–54. http://dx.doi.org/10.4028/www.scientific.net/msf.631-632.149.

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Today, there is a strong push to improve the thermal management of electronic components in order to increase the performance and the reliability of electronic devices. Up to now, most of the heat sinks are mainly made of Copper that presents a good thermal conductivity (TC) but a coefficient of thermal expansion (CTE) much higher than the ceramic of the DBC (direct bonding Copper). It induces interfacial thermal stresses and indeed it decreases the reliability of the global electronic system. Therefore, there is a strong need for the development of novel heat dissipation material having low C

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Wang, Qing Yun, Wei Ping Shen, and Ming Liang Ma. "Mean and Instantaneous Thermal Expansion of Uncoated and Ti Coated Diamond/Copper Composite Materials." Advanced Materials Research 702 (May 2013): 202–6. http://dx.doi.org/10.4028/www.scientific.net/amr.702.202.

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Heat sink materials not only should have higher thermal conductivity, but also have smaller difference of thermal expansion with cooled material. diamond/copper composites were made by the powder metallurgy method. Vacuum slowly vapor deposition technique was employed to deposit a titanium film on diamond particles before mixing with Cu powder in order to improve the bonding strength between Cu and diamond particles during sintering. The thermal expansion of diamond/Cu d composite was measured in the temperature range from 50 to 600 °C. The results show that the titanium film on diamond improv

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Niu, Bing, Dongdong Xie, Yanxin Zhang, et al. "Morphology Control and Mechanism of Different Bath Systems in Cu/SiCw Composite Electroplating." Nanomaterials 14, no. 12 (2024): 1043. http://dx.doi.org/10.3390/nano14121043.

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With the rapid development of electronic technology and large-scale integrated circuit devices, it is very important to develop thermal management materials with high thermal conductivity. Silicon carbide whisker-reinforced copper matrix (Cu/SiCw) composites are considered to be one of the best candidates for future electronic device radiators. However, at present, most of these materials are produced by high-temperature and high-pressure processes, which are expensive and prone to interfacial reactions. To explore the plating solution system suitable for SiCw and Cu composite electroplating,

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Teses / dissertações sobre o assunto "Composite materials Cu"

1

Guazzone, Federico. "Engineering of substrate surface for the synthesis of ultra-thin composite Pd and Pd-Cu membranes for H₂ separation." Link to electronic thesis, 2005. http://www.wpi.edu/Pubs/ETD/Available/etd-011006-123013/.

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Kaforey, Monica L. "Solid state thermal gradient processing of Y₁Ba₂Cu₃O₇âx/Ag superconducting composite ribbons." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/28038.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994.<br>Vita. Title as it appears in the Feb. 1994 MIT Graduate List: Solid state temperature gradient processing of Y₁Ba₂Cu₃O₇âx/Ag superconducting composite ribbons.<br>Includes bibliographical references (leaves 197-202).<br>by Monical L. Kaforey.<br>Ph.D.

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3

Kraiem, Nada. "Impression 3D de matériaux composites à base de diamant pour des applications de gestion thermique." Electronic Thesis or Diss., Bordeaux, 2024. http://www.theses.fr/2024BORD0129.

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Avec la tendance à la miniaturisation croissante des équipements électriques et à l'augmentation constante de la densité de puissance dans les dispositifs à base de semiconducteurs, la gestion efficace de la chaleur est devenue un enjeu majeur pour les chercheurs. En effet, cette évolution technologique impose des contraintes de plus en plus strictes en termes de dissipation thermique, nécessitant des solutions innovantes pour garantir une meilleure durabilité et fiabilité des composants. Dans ce contexte, l'utilisation de matériaux composites offrant une conductivité thermique élevée et un co

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4

Tilliander, Ulrika. "Synthesis of nano sized Cu and Cu-W alloy by hydrogen reduction." Licentiate thesis, KTH, Materials Science and Engineering, 2005. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-353.

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<p>The major part of the present work, deals with the reduction kinetics of Cu<sub>2</sub>O powder and a Cu<sub>2</sub>O-WO<sub>3</sub> powder mixture by hydrogen gas, studied by ThermoGravimetric Analysis (TGA). The reduction experiments were carried out both isothermally and non-isothermally on thin powder beds over different temperature intervals. During the experiments, the reductant gas flow rate was kept just above the starvation rate for the reaction to ensure that chemical reaction was the rate-controlling step. The activation energy for the reactions was evaluated from isothermal as w

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Guazzone, Federico. "Engineering of Substrate Surface for the synthesis of Ultra-Thin Composite Pd and Pd-Cu Membranes for H2 Separation." Digital WPI, 2006. https://digitalcommons.wpi.edu/etd-dissertations/442.

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This work describes a novel technique to prepare ultra-thin composite Pd-porous metal membranes for H2 separation. This novel technique consists of the gradual smoothing of the Porous Metal (PM) support's surface with several layers of pre-activated alumina particles of different sizes. The deposition of coarse, fine and ultra-fine alumina particles resulted in the narrowing of the PM' surface pore size distribution. The excellent surface smoothness achieved after the grading of the PM 's surface support allowed for the preparation of gas tight Pd layers as thin as 5.6?m. The Pd layers were ex

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6

Quelennec, Xavier. "Nanostructuration d'un composite Cu-Fe par déformation intense : vers un mélange forcé à l'échelle atomique." Phd thesis, Université de Rouen, 2008. http://tel.archives-ouvertes.fr/tel-00648688.

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Les techniques d'élaboration par déformation plastique intense permettent d'obtenir des matériaux nanostructurés à l'état massif. La grande quantité de défauts (dislocations, lacunes,...) peut donner lieur à des transformations de phases hors équilibre. L'objectif de ce travail à été de produire par HPT (high pressure torsion) une solution solide hors équilibre à partir du système modèle Cu-Fe et de comprendre les mécanismes physiques à l'origine de sa formation. Le matériau initial est un nanocomposite filamentaire Cu-cfc/Fe-α. Des tranches de ce composite ont été déformées par HPT pour une l

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7

Shi, Hailong. "Recrystallization of 2D dimensioned Copper (Cu) foils and graphene nanosheets (GNSs) reinforced Cu matrix laminated composites." Electronic Thesis or Diss., Université de Lorraine, 2021. http://www.theses.fr/2021LORR0096.

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La recristallisation est le processus des métaux déformés à froid qui se produit lors du traitement thermique. La texture de recristallisation contribue à l'anisotropie des propriétés mécaniques et physiques. Motivés par la minimisation des produits, les matériaux 2D et les composites stratifiés sont de plus en plus demandés pour des applications. Ainsi, à des fins scientifiques et techniques, des recherches sur la recristallisation de tels matériaux sont nécessaires pour comprendre les mécanismes sous-jacents. Dans ce travail, des feuilles de Cu et des composites stratifiés à matrice de Cu re

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8

H, Lavrenyuk O. Mykhalichko V. Olijnyk B. Mykhalichko. "Stereochemical aspect of influence of [Cu(diethylenetriamine)(H2O)] SO4 H2O chelate compound onto combustibility decrease of epoxy-amine composite materials." Thesis, Book of abstr. Third EuCheMS Inorganic Chemistry Conference “Chemistry over the horizon” , Wroclaw, 2015. http://hdl.handle.net/123456789/1645.

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COSTA, FRANCINE A. da. "Sintese e sinterizacao de pos compositos do sistema W-Cu." reponame:Repositório Institucional do IPEN, 2004. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11176.

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Made available in DSpace on 2014-10-09T12:49:13Z (GMT). No. of bitstreams: 0<br>Made available in DSpace on 2014-10-09T13:57:43Z (GMT). No. of bitstreams: 1 09808.pdf: 15249724 bytes, checksum: 28b6b5cf9f351da89e42817bc182390d (MD5)<br>Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)<br>Tese (Doutoramento)<br>IPEN/T<br>Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP<br>FAPESP:00/00255-9

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Tang, Fei. "The Microstructure-Processing-Property Relationships in an Al Matrix Composite System Reinforced by Al-Cu-Fe Alloy Particles." Washington, D.C. : Oak Ridge, Tenn. : United States. Dept. of Energy. Office of Science ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2004. http://www.osti.gov/servlets/purl/835313-syGDu9/webviewable/.

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Livros sobre o assunto "Composite materials Cu"

1

Moore, Thomas J. Tensile strength of simulated and welded butt joints in W-Cu-composite sheet. Lewis Research Center, 1994.

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Capítulos de livros sobre o assunto "Composite materials Cu"

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Shohji, Ikuo, Susumu Arai, Naoki Kano, Noboru Otomo, and Masahisa Uenishi. "Development of Cu Brazing Sheet with Cu-P Composite Plating." In Key Engineering Materials. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-456-1.2025.

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2

Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials. Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_7.

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3

Lin, Hong Ming, Giin Shan Chen, and Pee Yew Lee. "Microstructure and Properties of Vacuum Hot-Pressing SiC/ Ti-Cu-Ni-Sn Bulk Metallic Glass Composites." In Composite Materials V. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-451-0.26.

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4

Fan, Zhi Kang, and Peng Xiao. "Morphology of Chromium in Cu- 2.0%~4.2%Cr Alloys." In Advances in Composite Materials and Structures. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-427-8.277.

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5

Wang, Xin Hong, Zeng Da Zou, Min Zhang, Si Li Song, and Shi Yao Qu. "Bonding Strength and Microstructure of Cermet/Cu-Based Alloy Composite Brazed Coatings." In Key Engineering Materials. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.154.

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6

Xiao, Peng, and Zhi Kang Fan. "Effects of Chromium Particle on Elevated Temperature Tensile Strength of Cu-Cr Alloy." In Advances in Composite Materials and Structures. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-427-8.273.

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7

Han, Guihong, Pengfei Tang, Hongyang Wu, Jun Ma, Xiaomeng Yang, and Yongsheng Zhang. "Adsorption Behavior of Cu(II) to Silica-Humics Composite Aerogels." In The Minerals, Metals & Materials Series. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05749-7_10.

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Joo, K. H., K. I. Chang, Hyoung Seop Kim, and Sun Ig Hong. "Processing of Ultrafine-Grained Cu-Fe-Cr Composite by Equal Channel Angular Pressing." In Materials Science Forum. Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-985-7.71.

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Qi, Yu Hong, Z. P. Zhang, D. L. Liu, and Z. K. Hei. "Microstructure and Mechanical Properties of Al-Cu-Cr Quasicrystals/Al Matrix Composites Synthesized by Hot-Pressing Technique." In Advances in Composite Materials and Structures. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-427-8.1061.

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Xu, Qiang, Xing Hong Zhang, Jie Cai Han, and Xiao Dong He. "Preparation of TiB₂ Nanoparticles Reinforced Cu-Matrix Composite by Direct Combustion Synthesis." In Key Engineering Materials. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.1339.

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Trabalhos de conferências sobre o assunto "Composite materials Cu"

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Sundaram, Rajyashree, Guohai Chen, Takeo Yamada, et al. "Lightweight Cu/Carbon Nanotube Composite Electric Conductors." In 2020 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2020. http://dx.doi.org/10.7567/ssdm.2020.k-9-03.

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2

Yungang Li, Limin Liu, and Jie Li. "The progress of W-Cu composite materials preparation technique." In Environment (ICMREE). IEEE, 2011. http://dx.doi.org/10.1109/icmree.2011.5930584.

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3

Hu, Wang, Zhang Zhaohui, Hu Zhengyang, Li Shenglin, Yin Shipan, and Song Qi. "CNTs/Cu composites fabricated by ball mixing and spark plasma sintering." In 2ND INTERNATIONAL CONFERENCE ON COMPOSITE MATERIALS AND MATERIAL ENGINEERING (ICCMME 2017). Author(s), 2017. http://dx.doi.org/10.1063/1.4983592.

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4

Zhang, Yinghui, Linghui He, Haixia Tian, and Kai Peng. "Influences of Carbon Nanotubes on Performance of W-Cu Composite Materials." In 2015 International Conference on Advanced Material Engineering. WORLD SCIENTIFIC, 2015. http://dx.doi.org/10.1142/9789814696029_0051.

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Moskvichev, E. N. "Fabrication of NiAl strengthened Cu-Al based composite." In PROCEEDINGS OF THE II INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS, SYSTEMS AND TECHNOLOGIES: (CAMSTech-II 2021). AIP Publishing, 2022. http://dx.doi.org/10.1063/5.0092748.

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Masuda, Chitoshi, and Yoshihisa Tanaka. "Fatigue Properties of Cu-Cr In-Situ Composite." In ASME 2000 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2000. http://dx.doi.org/10.1115/imece2000-2458.

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Abstract The new electrical conductive material, Cu-15wt%Cr in-situ composite, was developed for the application of lead frame, high field magnet and trolley wire. The Cu-Cr composite was fabricated by casting method in vacuum and forged, solution-treated, and cold drawn (η = 4.66 and 6.94). In this paper the cold drawn Cu-Cr composite was tested under cyclic loading at room temperature in comparison to the data for pure copper. The fatigue stresses decreased with increasing the number of cycles to failure and the double -knees were not seen on the S-N curves for both alloys as in other face c

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Ramli, M. I. I., M. A. A. Mohd Salleh, M. M. Al Bakri Abdullah, R. M. Said, A. V. Sandu, and N. Saud. "Microstructural and phase analysis of Sn-Cu-Ni-XSiC composite solder." In ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY V: International Conference on Advanced Material Engineering and Technology 2016. Author(s), 2017. http://dx.doi.org/10.1063/1.4981848.

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Ramli, M. I. I., M. A. A. Mohd Salleh, R. M. Said, and N. Saud. "Thermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder." In ADVANCED MATERIALS ENGINEERING AND TECHNOLOGY V: International Conference on Advanced Material Engineering and Technology 2016. Author(s), 2017. http://dx.doi.org/10.1063/1.4981849.

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Shu, Kuen Ming, Hung Rung Shih, Wen Feng Lin, and G. C. Tu. "Hybrid EDM and Grinding Hard Materials Using a Metal Matrix Composite Electrode." In ASME 7th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2004. http://dx.doi.org/10.1115/esda2004-58098.

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Electrical discharge machining (EDM) has been shown to be a versatile method for machining difficult-to-work materials including heated-treated steels, tungsten carbides and various conductive ceramics. However, low machining efficiency is one of the main EDM disadvantages. The topic of how to reduce machining time and maintains reasonable accuracy has always been of research interest. The main object of the present work was to develop an electrical discharge machining and grinding (EDMG) methodology to remove the re-solidified layer through the grinding induced by a metal matrix composite ele

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Bharathi, K. Divya, M. R. Rahman, Sunita Choudhary, and S. B. Arya. "Development and characterization of Cu/MWCNT composite prepared by electrodeposition technique." In ADVANCES IN MECHANICAL DESIGN, MATERIALS AND MANUFACTURE: Proceeding of the Second International Conference on Design, Materials and Manufacture (ICDEM 2019). AIP Publishing, 2020. http://dx.doi.org/10.1063/5.0010560.

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Relatórios de organizações sobre o assunto "Composite materials Cu"

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Chefetz, Benny, Baoshan Xing, Leor Eshed-Williams, Tamara Polubesova, and Jason Unrine. DOM affected behavior of manufactured nanoparticles in soil-plant system. United States Department of Agriculture, 2016. http://dx.doi.org/10.32747/2016.7604286.bard.

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The overall goal of this project was to elucidate the role of dissolved organic matter (DOM) in soil retention, bioavailability and plant uptake of silver and cerium oxide NPs. The environmental risks of manufactured nanoparticles (NPs) are attracting increasing attention from both industrial and scientific communities. These NPs have shown to be taken-up, translocated and bio- accumulated in plant edible parts. However, very little is known about the behavior of NPs in soil-plant system as affected by dissolved organic matter (DOM). Thus DOM effect on NPs behavior is critical to assessing the

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