Thematische Bibliographien / Output chips

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Auswahl der wissenschaftlichen Literatur zum Thema „Output chips“

Autor: Grafiati

Veröffentlicht am 4. Juni 2021

Zuletzt aktualisiert am 29. Juli 2025

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Zeitschriftenartikel zum Thema "Output chips"

Obradovic, Marko, Nikola Karlicic, Dusan Todorovic, Dejan Radic, and Aleksandar Jovovic. "Experimental studies of wood chips charactristics influence on boiler performance and pollutant emissions." Thermal Science 27, no. 1 Part A (2023): 121–32. http://dx.doi.org/10.2298/tsci2301121o.

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Wood chips are often used as solid fuel in modern biomass boilers. Experiments were conducted on 22 boilers located in Serbia burning wood chips as fuel. The influence of wood chips characteristics is analyzed in relation to the flue gas losses and the thermal efficiency of the boiler. Measured useful heat output of the tested boilers was 460-2585 kW. Moisture content of the wood chips was 19.21-38.23% with a net calorific value of 10177-14139 kJ/kg and ash content of 0.84-3.59%. Thermal efficiency of the boilers was 88.78-94.06%, flue gas losses 5.84-11.13% and flue gas temperature 121.83-188

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Evans, Arthur W., and Richard G. Parker. "Fuelwood Processing in New Hampshire Becomes a Mature Industry." Northern Journal of Applied Forestry 4, no. 2 (1987): 76–78. http://dx.doi.org/10.1093/njaf/4.2.76.

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Abstract In the past few years, New Hampshire's fuelwood processing industry has changed. The majority of output no longer comes from many small entrepreneurs, but from traditional multiproduct loggers. Ninety-four percent of the fuel-wood is marketed by producers whose annual output is over 100 cords. Most are integrated logging businesses; sawlogs are the major product, but fuelwood averages 30% of the output. Whole tree chips comprise 19% of the fuelwood output. Survey respondents reported that profit margins were satisfactory for cordwood and marginal for biomass chips. With more multi-pro

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Ruspani, Hikmah, and Yoga Nugroho. "The Analysis of Value Added Products of Jengkol into J Chips in Padang Village, Manggeng District, Aceh Barat Daya Regency." Economit Journal: Scientific Journal of Accountancy, Management and Finance 1, no. 4 (2022): 241–46. http://dx.doi.org/10.33258/economit.v1i4.590.

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Processing dogfruit into dogfruit chips is one of the potential products to be developed. This study aims to analyze the added value of dogfruit chips using the Hayami method. There are three variables used in this method, namely (1) Output input and price; (2) Revenue and profit and (3) Margin. From the results of the analysis of the production of dogfruit chips, using 10 kg of dogfruit as raw material which produces 7 kg of jengkol chips. The input price for raw material for dogfruit chips, namely dogfruit and edible oil, is Rp. 15,000 per production cycle. The added value obtained is Rp.14,

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Maulana, Ilham Taufik. "Perancangan Alat Bantu Pemanfaatan Gas Buang dari Proses Melting Recycle untuk Memanaskan Chips sebelum Masuk Melting Furnace." Jurnal Teknik Mesin ITI 4, no. 2 (2020): 63. http://dx.doi.org/10.31543/jtm.v4i2.416.

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Melting recycle merupakan proses pemisahan logam pengotor yang bersifat feromagnetik, dan proses peleburan aluminium chips menjadi logam aluminium cair. Aluminium Chips adalah aluminium padat berbentuk serpihan hasil proses permesinan CNC. Akan tetapi dalam proses pengeringan ini masih memiliki suatu kendala, yaitu temperatur aluminium chips yang masuk ke proses peleburan di melting furnace terlalu rendah, sehingga beberapa chips tidak bisa melt dan terbakar menjadi abu ketika chips dilebur di melting furnace. Hal tersebut disebabkan oleh performa burner yang tidak maksimal. Dirancanglah alat

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Sarno, Sarno, Dwi Putriana Nuramanah Kinding, and Muhamad Solekan. "ANALISIS PENDAPATAN DAN NILAI TAMBAH AGROINDUSTRI KERIPIK PISANG (STUDI KASUS PADA UKM SELERAKU BANJARNEGARA)." Jurnal Saintifik (Multi Science Journal) 22, no. 1 (2024): 25–32. http://dx.doi.org/10.58222/js.v22i1.216.

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UKM Seleraku is one of the businesses engaged in the agro-industry of banana chips in Banjarnegara Regency. The fundamental issue faced by UKM Seleraku is the lack of knowledge regarding the overall production costs and added value of the banana chips agro-industry they are involved in. The research aims to analyze the income and added value of the banana chips agro-industry. The basic research methods applied include case study and descriptive methods, as well as participatory action research. Data collection methods involve interviews, direct observation, and record-keeping. The data used in

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Zhang, Wei Qiang, Li Su, Jun Wang, Bin Bin Liu, and Jian Ping Hu. "Design and Manufacture of Energy-Recycling Pads for Low-Power Chips." Key Engineering Materials 460-461 (January 2011): 467–72. http://dx.doi.org/10.4028/www.scientific.net/kem.460-461.467.

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Energy-recycling output pad cells for driving adiabatic chips are designed, which have been fabricated with Chartered 0.35um process and tested. The proposed energy-recycling output pad cells include mainly bonding pads, electrostatic discharge (ESD) protection circuits, and two stage energy-recycling buffers that are used to drive the large load capacitances on chip pads. The two stage energy-recycling buffers are realized using CPAL (Complementary Pass-transistor Adiabatic Logic) and PAL-2N (pass-transistor adiabatic logic with NMOS pull-down configuration), respectively. For comparison, a c

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Wati, Ratna Kartika, Eqwar Saputra, and Alfalisyado. "Pengembangan Usaha Kelompok IRT Ceriping Singkong di Desa Suro melalui Intervensi TTG Berbasis Digital Economy di Desa Suro, Kecamatan Kalibagor, Banyumas." Jurnal Loyalitas Sosial: Journal of Community Service in Humanities and Social Sciences 6, no. 2 (2024): 54–70. https://doi.org/10.32493/jls.v6i2.p54-70.

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Mitra is a group of IRT Cassava Chips. According to the results of observations and interviews with the head of the IRT Cassava Chips group, Mrs. Fajar Apriana, said that the cassava chips made by this home business are still not good in appearance or taste, especially since the packaging is still simple. The shape of the cassava chips is not yet homogeneous, they are still big, small and thick and thin because they still use a manual slicing tool. Initially in Suro Village there were around 18 home industries that made cassava chips, but because the products were not selling well on the marke

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Nurwati, Niken, Rini Nizar, and Amalia Amalia. "ANALISIS AGROINDUSTRI KRIPIK UBI KAYU DI KELURAHAN KULIM KECAMATAN TENAYAN RAYA KOTA PEKANBARU." Jurnal Ilmiah Pertanian 14, no. 1 (2018): 1–11. http://dx.doi.org/10.31849/jip.v14i1.949.

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The agricultural sector is the main pillar of economic development in Indonesia because Indonesia almost all economic activities centered on the sector. Processing of agricultural or agro-industry is the agricultural product processing business for the purpose of increasing the value of the product. Pekanbaru city produces one of the agricultural products that manioc. The highest production of cassava in Sub Tenayan Raya in Pekanbaru, namely 11 210 tonnes (Pekanbaru in number 2015). In connection with this condition, this study aims to analyze costs and revenues, Break Even Point (BEP), profit

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Liu, Kan, and Yi Fang. "Development of Valve Controlled Microfluidics Based on STM32 Dual-Core ARM." Applied Mechanics and Materials 727-728 (January 2015): 725–28. http://dx.doi.org/10.4028/www.scientific.net/amm.727-728.725.

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This article describes a precisely microfluidic control system based on a dual-core STM32F10x microcontroller. The system consists of 32 independent microfluidic valve controlled output, human-computer interaction display, ethernet module, WIFI module, CAN module, USB module and graphical control interface. Using this microfluidic control system, the biological and medical workers precisely and conveniently control liquid in microfluidic chips. The microfluidic control system would be widely used for microfluidic chips.

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Ramella, Chiara, Motahhareh Estebsari, Abbas Nasri, and Marco Pirola. "GaAs-Based Serial-Input-Parallel-Output Interfaces for Microwave Core-Chips." Electronics 10, no. 23 (2021): 3029. http://dx.doi.org/10.3390/electronics10233029.

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Microwave core-chips are highly integrated MMICs that are in charge of all the beam-shaping functions of a transmit-receive module within a phased array system. Such chips include switches, amplifiers and attenuators, phase shifters, and possibly other elements, each to be controlled by external digital signals. Given the large number of control lines to be integrated in a core-chip, the embedding of a serial to parallel interface is indispensable. Digital design in compound semiconductor technology is still rather challenging due to the absence of complementary devices and the availability of

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Dissertationen zum Thema "Output chips"

Burrow, Ryan David. "Enhancing Input/Output Correctness, Protection, Performance, and Scalability for Process Control Platforms." Thesis, Virginia Tech, 2019. http://hdl.handle.net/10919/89903.

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Most modern control systems use digital controllers to ensure safe operation. We modify the traditional digital control system architecture to integrate a new component known as a trusted input/output processor (TIOP). TIOP interface to the inputs (sensors) and outputs (actuators) of the system through existing communication protocols. The TIOP also interface to the application processor (AP) through a simple message passing protocol. This removes any direct input/output (I/O) interaction from taking place in the AP. By isolating this interaction from the AP, system resilience against malware

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Wang, Mingzhen. "High-speed Low-voltage CMOS Flash Analog-to-Digital Converter for Wideband Communication System-on-a-Chip." Wright State University / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=wright1189815482.

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Gupta, Vishal. "An accurate, trimless, high PSRR, low-voltage, CMOS bandgap reference IC." Diss., Available online, Georgia Institute of Technology, 2007, 2007. http://etd.gatech.edu/theses/available/etd-07052007-073154/.

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Thesis (Ph. D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008. Ayazi, Farrokh, Committee Member ; Rincon-Mora, Gabriel, Committee Chair ; Bhatti, Pamela, Committee Member ; Leach, W. Marshall, Committee Member ; Morley, Thomas, Committee Member.

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Chiu, Yan-Lian, and 邱彥璉. "On-Chip ESD Protection Design for Output Driver Applications." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/71703819228828214352.

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碩士 國立臺灣師範大學 電機工程學系 104 With the continuous evolution of semiconductor integrated circuits (ICs) process, electrostatic discharge (ESD) events are likely to cause internal electronic components of the wafer suffered irreversible damage. All microelectronic products must meet the reliability specifications. Therefore, ESD must be taken into consideration. In the application of integrated circuit, several novel ESD protection devices are designed in this work. By designing the structure, this work has been fabricated in 0.18-μm 1.8V/3.3V CMOS process. In the experimental results, t

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Fang, Chein-Wei, and 方建偉. "Output Reduction and Data Compression for System-on-a-Chip." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/43898895869830469288.

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碩士 國立成功大學 電機工程學系碩博士班 92 With the popularization in SOC designs, it is highly demanded to increase the SOC reliability. The conventional scan architecture is one of the most popular methods for this purpose. However, One of the bottlenecks of testing a system-on-a-chip (SoC) is the long test times arisen from the limited test data bandwidth between the tester and the SOC. Hence, the data compression techniques that reduce the test data volume have received much attention recently. 　　In this thesis, we present a test response compression approach which can greatly reduce the volum

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Shen, Wei-Chieh, and 沈瑋傑. "Chip Design of Low Latency Parallel Turbo Decoder with Synchronous Output." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/5y8xbk.

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碩士 國立臺北科技大學 電腦與通訊研究所 100 Turbo code has excellent decoding performance which is one of close to the Shannon-limit error correction codes. In order to achieve requirement of the modern communication, turbo codes employ multiple SISO decoders by intuition. However, parallel decoders will degrade the correcting performance dramatically as a result of shortening the interleaver length. Thus in this thesis, we proposed a low latency parallel decoding with synchronous output turbo decoder. It can improve both latency and error correction ability in comparison with general parallel turbo

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Wang, Tzu-Hao, and 王子豪. "An Integrated Humidity and Temperature Sensor Readout Chip with Digital Output." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/26986627523151876879.

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碩士 國立暨南國際大學 電機工程學系 98 This work presents a sensor chip which consists of a humidity sensor and a temperature sensor, and a readout circuit with digital output. We use the polyimide as a sensing material. The readout circuit is designed to detect the capacitance and current changes for sensing the humidity and temperature changes, respectively. The chip is implemented using 0.35μm CMOS-MEMS process provided by CIC. The simulation result of digital output for humidity sensor is 685-863 when the capacitance changes from 2.928pF to 3.697pF, and temperature sensor is 50-393 when the tem

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Chao, Wen-Chang. "Performance-Driven Block and Input/Output Buffer Placement in Flip-Chip Design." 2004. http://www.cetd.com.tw/ec/thesisdetail.aspx?etdun=U0001-2907200414064000.

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Chao, Wen-Chang, and 趙文璋. "Performance-Driven Block and Input/Output Buffer Placement in Flip-Chip Design." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/6565c8.

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碩士 國立臺灣大學 電子工程學研究所 92 The flip-chip package gives the highest chip density of any packaging methods to support the pad-limited ASIC design. One of the most important characteristics of flip chip designs is that the input/output buffers could be placed anywhere inside a chip. For most practical designs, we have to control the timing of the input/output signals. This can be achieved through controlling the positions of bump balls, input/output buffers, and first-stage/last-stage cells in a flip chip. Specifically, we intend to minimize the path length between blocks and bump balls as

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Lin, Cheng Chen, and 林正晨. "Enhancement of Heat Dissipation and Output Efficiency for Power Flip-Chip LEDs." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/44659073715026467929.

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碩士 長庚大學 電子工程學系 98 Light emitting diode (LED) has the most potential to be mainstream device in the next solid-state lighting illustration. Nowadays, all the LED related researches focus on the topic of high power 1×1 mm2 LED. However, how to dissipate heat generated from LED’s junction is a very important issue for high power LED. In this thesis, goal stub bump which has high thermal conductivity (291 W/m-K) and silicon substrate as sub-mount had been used to achieve Flip-Chip LED fabrication by thermosonic bonding method. Since Flip-Chip LED can quick dissipate heat through goal s

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Bücher zum Thema "Output chips"

Nicopoulos, Chrysostomos. Network-on-Chip Architectures: A Holistic Design Exploration. Springer Netherlands, 2009.

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Chen, Sao-Jie. Hardware Software Co-Design of a Multimedia SOC Platform. Springer Netherlands, 2009.

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Rez, Peter. Agriculture—Things That Are Grown. Oxford University Press, 2017. http://dx.doi.org/10.1093/oso/9780198802297.003.0014.

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Timber has the lowest embodied energy of any of the construction materials. Paper production from trees requires much more energy. There is some energy saving in recycling, as recycled paper substitutes for pulp derived from wood chips. Growing crops for food also requires energy. The energy required for plants to grow comes from the sun, but there are additional energy inputs from fertiliser and farm machinery to speed up the growth process and vastly improve crop yields. If grains are used as animal feed, then the energy inputs are much larger than the dietary energy output—the larger the an

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Foster, Eric Michael. The electrical output of single-chip CMOs packages. 1987.

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Hischak, Thomas S. 1939. The Rowman & Littlefield Publishing Group, Inc., 2017. https://doi.org/10.5040/9798881832520.

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What do Babes in Arms, Beau Geste, Gunga Din, The Hunchback of Notre Dame, Only Angels Have Wings, and Young Mr. Lincoln all have in common? They are all classic films released in the same year, but none of them received Academy Award nominations for best picture. Why? In that same year, Hollywood produced Dark Victory, Goodbye Mr. Chips, Mr. Smith Goes to Washington, and Ninotchka, as well as two of the most beloved films of all time, Gone with the Wind and The Wizard of Oz. In 1939 Hollywood created an unprecedented number of great films, a year that has yet to be surpassed in cinematic achi

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Das, Chita R., Springer, Chrysostomos Nicopoulos, and Vijaykrishnan Narayanan. Network-on-Chip Architectures: A Holistic Design Exploration. Springer Netherlands, 2012.

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Reis, Ricardo, Ian O'Connor, Sergei Kostin, Thomas Hollstein, Jaan Raik, and Anton Tšertov. VLSI-SoC : System-on-Chip in the Nanoscale Era – Design, Verification and Reliability: 24th IFIP WG 10.5/IEEE International Conference on Very Large ... and Communication Technology ). Springer, 2017.

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Chen, Sao-Jie, Pao-Ann Hsiung, and Guang-Huei Lin. Hardware Software Co-Design of a Multimedia SOC Platform. Springer, 2010.

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Chen, Sao-Jie, Pao-Ann Hsiung, Guang-Huei Lin, and Yu-Hen Hu. Hardware Software Co-Design of a Multimedia SOC Platform. Springer Netherlands, 2010.

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Buchteile zum Thema "Output chips"

Deng, Ke, Qinye Yin, Yiwen Zhang, and Ming Luo. "Chip-by-Chip Iterative Multiuser Detection for VBLAST Coded Multiple-Input Multiple-Output Systems." In Networking - ICN 2005. Springer Berlin Heidelberg, 2005. http://dx.doi.org/10.1007/978-3-540-31957-3_4.

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Xiong, Guoqiang, Yue Cao, Jun Chen, and Beixi Kong. "Screening Method of Chip-Dependent Industries Based on Input-Output Theory." In Proceedings of the Fifteenth International Conference on Management Science and Engineering Management. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-79203-9_21.

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Seyd-Darwish, I., P. Chavel, J. Taboury, F. Devos, T. Maurin, and R. Reynaud. "Optical Input and Output Functions for a Cellular Automaton on a Silicon Chip." In Optical Information Technology. Springer Berlin Heidelberg, 1993. http://dx.doi.org/10.1007/978-3-642-78140-7_17.

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Cruz, J. M., and L. O. Chua. "A 16 x 16 Cellular Neural Network Universal Chip: The First Complete Single-Chip Dynamic Computer Array with Distributed Memory and with Gray-Scale Input-Output." In Cellular Neural Networks and Analog VLSI. Springer US, 1998. http://dx.doi.org/10.1007/978-1-4757-4730-0_1.

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Salem, Amr, Hussien Hegab, and Hossam A. Kishawy. "Environmental Assessment and Optimization When Machining with Micro-textured Cutting Tools." In Lecture Notes in Mechanical Engineering. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-28839-5_41.

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AbstractThe dry machining strategy has recently received high attention in the field of metal cutting as it can eliminate the environmental impacts associated with the usage of cutting fluids. However, high-generated heat and severe tool wear are usually observed for the dry machining operations. One of the suggested techniques to improve the dry machining performance is to utilize the textured cutting tools, reducing the friction at the chip-tool interface. In this study, three different micro-textured tool designs were used during the machining AISI 1045 at different cutting conditions. A li

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Rajaei, Ali, Marco Becker, Yuanbin Deng, et al. "Materials in the Drive Chain – Modeling Materials for the Internet of Production." In Internet of Production. Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-030-98062-7_23-1.

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AbstractIn this chapter, the focus lies on a predictive description of the material response to the thermomechanical loads within different process steps by means of physical and data-driven models. The modeling approaches are demonstrated in examples of innovative production technologies for components of a drive chain: Fine blanking of parts; powder metallurgical (PM) production of gears; open-die forging and machining of drive shafts. In fine blanking, material, process, and quality data are acquired to model interactions between process and material with data-driven methods. Interpretable

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Akeh, Ugbah Paul, Steve Woolnough, and Olumide A. Olaniyan. "ECMWF Subseasonal to Seasonal Precipitation Forecast for Use as a Climate Adaptation Tool Over Nigeria." In African Handbook of Climate Change Adaptation. Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-45106-6_97.

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AbstractFarmers in most parts of Africa and Asia still practice subsistence farming which relies minly on seasonal rainfall for Agricultural production. A timely and accurate prediction of the rainfall onset, cessation, expected rainfall amount, and its intra-seasonal variability is very likely to reduce losses and risk of extreme weather as well as maximize agricultural output to ensure food security.Based on this, a study was carried out to evaluate the performance of the European Centre for Medium-range Weather Forecast (ECMWF) numerical Weather Prediction Model and its Subseasonal to Seaso

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"Input/Output." In Now the Chips Are Down. The MIT Press, 2016. http://dx.doi.org/10.7551/mitpress/10039.003.0006.

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A. Ukaegbu, Ikechi, and Arjuna Marzuki. "Perspective Chapter: Chip I/O Design Fundamentals, Methodologies and Challenges." In Embedded Systems - The Future of Industry-Based Applications [Working Title]. IntechOpen, 2024. http://dx.doi.org/10.5772/intechopen.1004105.

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The dramatic increase in processing power due to the combined effects of integrated circuit scaling and shifts in computer architectures from single core to multi-core systems has led to the highly scaled on-chip aggregate bandwidths to the Tb/s range. Consequently, this has resulted to the increase in the amount of data transfer between chips to increase overall system performance. However, due to the limited I/O pin count in chip packages and PCBs, designing efficient high-speed and low power chip I/O is important. This chapter proposes a configurable I/O driver that can be configured betwee

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Konferenzberichte zum Thema "Output chips"

Korček, Radovan, William Fraser, Sarra Salhi, et al. "Scalable surface gratings for efficient fiber-chip and free-space optical coupling." In Integrated Photonics Research, Silicon and Nanophotonics. Optica Publishing Group, 2024. http://dx.doi.org/10.1364/iprsn.2024.im4g.1.

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Efficient optical input/output interfaces between photonic chips and fibers or free-space ports are indispensable building blocks for a wide range of applications. Here, we present our progress in the development of silicon nitride grating couplers and compact silicon antennas.

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Li, Fuyi, Yu Xia, Shuai Xiao, et al. "Accurate Charge-Domain Bootstrapped Computing-in-Memory SRAM Design with Wide Programmable Output Voltage Range." In 2024 IEEE 37th International System-on-Chip Conference (SOCC). IEEE, 2024. http://dx.doi.org/10.1109/socc62300.2024.10737831.

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He, Yang, Long Cheng, Heming Wang, et al. "Chip-scale high-performance photonic microwave oscillator." In Frontiers in Optics. Optica Publishing Group, 2024. https://doi.org/10.1364/fio.2024.fm5e.6.

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We report a chip-scale high performance photonic micrwave oscillator based on integrated electro-optical frequency division, which achieves a phase noise level of −141 dBc/Hz at 10 kHz offset for scaled 10 GHz carrier output.

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Babaghorbani, Behnoosh, and Iman Esmaeil Zadeh. "Implementation of Cryogenic Amplifier by Using Superconducting Nanowire Single Photon Detector." In Quantum 2.0. Optica Publishing Group, 2024. http://dx.doi.org/10.1364/quantum.2024.qw3a.13.

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Measuring superconducting materials near absolute zero Kelvin poses challenges due to low output voltage. This study presents a cryogenic amplifier for ultra-low temperatures, fabricable on the same chip as the material, replacing noisy room temperature setups.

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Goossen, K. W., J. E. Cunningham, W. Y. Jan, and D. A. B. Miller. "Interleaved-contact electroabsorption modulator using doping-selective electrodes with 25 °C to 95 °C operating range." In Quantum Optoelectronics. Optica Publishing Group, 1993. http://dx.doi.org/10.1364/qo.1993.qwb.1.

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As the number and bandwidth requirements of connections to integrated circuit chips approach thousands and hundreds of megahertz, respectively (which is occurring now), the capability of standard electrical chip input/output becomes strained. For this reason optical input/output to chips is being explored by a number of groups.1 In modulator systems, an off-chip laser would be split into an array of beams that illuminates an array of surface-normal modulators. The modulators would be switched by the on-chip electronics to imprint information on the reflected beams. Multiple quantum well (MQW)

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Stellari, Franco, Peilin Song, Moyra K. McManus, et al. "Study of Critical Factors Determining Latchup Sensitivity of ICs Using Emission Microscopy." In ISTFA 2003. ASM International, 2003. http://dx.doi.org/10.31399/asm.cp.istfa2003p0019.

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Abstract In this paper we discuss the use of Emission Microscopy (EMMI) to examine the events leading to latchup for various Input/Output (I/O) pins of a test chip in order to study the factors that impact latchup sensitivity of VLSI chips. The goal of our study is to identify and characterize the structures that are most prone to latchup in test chips, thus providing countermeasures to be used to improve the overall latchup resistance of commercial chips. As it has been shown in literature [1-3], EMMI can be used to localize areas that are latching up. Here we focus our attention on electrost

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Malba, Vincent, Leland B. Evans, Christopher D. Harvey, and Anthony F. Bernhardt. "V-PAC: Vertical Packaging for Assembly-Compatible Chip Stacks." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35194.

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A new process for making high-density memory stacks which are completely compatible with typical electronic assembly techniques is presented. The process uses PECVD-SiO2 passivation, laser direct-writing, electrodeposited photoresist, and metal electroplating to form a reroute pattern extending from the input/output (I/O) pads on top of the chip directly onto the chip sidewalls. With the I/O available for interconnection on the side of the chip, four memory chips are stacked together with one silicon reroute chip. A high-temperature compatible anisotropically conductive adhesive is used to con

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Nakazono, Toru, and Yuta Watanabe. "A Study of Stoichiometric Bio-Mass Gas Engine." In JSAE/SAE 2015 Small Engine Technologies Conference & Exhibition. Society of Automotive Engineers of Japan, 2015. http://dx.doi.org/10.4271/2015-32-0831.

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<div class="section abstract"><div class="htmlview paragraph">Bio-mass fuel gas is very important because bio-mass gas is renewable and carbon free. Especially, woody chips are very popular and are not used efficiently. Gasifier makes the producer gas from woody chips. Conventionally, dual fuel engines are used to generate electricity by producer gas and light oil. As the dual fuel engine can run under the low heating value gas, dual fuel engine is very useful. As light oil is fossil oil, it is not carbon free. If bio-mass gas engine can run only by producer gas, this power unit is

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Das, Sunil R., Sujoy Mukherjee, Emil M. Petriu, Mansour H. Assaf, and Altaf Hossain. "Space Compaction for Embedded Cores-Based System-on-Chips (SOCs) Using Fault Graded Output Merger." In 2007 IEEE Instrumentation & Measurement Technology Conference IMTC 2007. IEEE, 2007. http://dx.doi.org/10.1109/imtc.2007.379374.

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Hsu, Jung Tsung, C. S. Huang, W. Y. Yeh, et al. "Bevelled-sidewalls formation and its effect on the light output of GaInN MQW LED chips." In Optical Science and Technology, the SPIE 49th Annual Meeting, edited by Ian T. Ferguson, Nadarajah Narendran, Steven P. DenBaars, and John C. Carrano. SPIE, 2004. http://dx.doi.org/10.1117/12.565339.

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