Libros sobre el tema "Semiconductor wafers Electronic packaging"
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Reliability of electronic packages and semiconductor devices. McGraw-Hill, 1997.
Buscar texto completoIEEE/UCS/SEMI, International Symposium on Semiconductor Manufacturing (4th 1995 Austin Tex ). Fourth IEEE/UCS/SEMI International Symposium on Semiconductor Manufacturing: [proceedings]. Institute of Electrical and Electronics Engineers, 1995.
Buscar texto completoRanda, J. Noise temperature measurements on wafer. U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology, 1997.
Buscar texto completoN, Buckley D., Ringel S. A, Ren F, Electrochemical Society Electronics Division, and State-of-the-Art Program on Compound Semiconductors (20th : 1994 : San Francisco, Calif.), eds. Proceedings of the Symposium on Large Area Wafer Growth and Processing for Electronic and Photonic Devices and the Twentieth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XX). The Electrochemical Society, 1995.
Buscar texto completoYong, Liu, and Shichun Qu. Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications. Springer, 2014.
Buscar texto completoYong, Liu, and Shichun Qu. Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications. Springer, 2016.
Buscar texto completoJ, Kowalski G., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.), and Symposium on Mechanics of SMT and Photonic Structures (12th : 2000 : Orlando, Fla.), eds. Packaging of electronic and photonic devices: Presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. American Society of Mechanical Engineers, 2000.
Buscar texto completoMicroelectronics Packaging Handbook, Part II: Semiconductor Packaging (Microelectronics Packaging Handbook). Springer, 1997.
Buscar texto completoZhao, Wei, Hui Liu, Xingsheng Liu, and Lingling Xiong. Packaging of High Power Semiconductor Lasers. Springer, 2014.
Buscar texto completoZhao, Wei, Hui Liu, Xingsheng Liu, and Lingling Xiong. Packaging of High Power Semiconductor Lasers. Springer, 2016.
Buscar texto completoA, Neugebauer C., ed. The Packaging of power semiconductor devices. Gordon and Breach Science Publishers, 1986.
Buscar texto completoMicroelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging. 2nd ed. Springer, 1997.
Buscar texto completoJames, Moyne, Del Castillo Enrique, and Hurwitz Arnon Max, eds. Run-to-run control in semiconductor manufacturing. CRC Press, 2001.
Buscar texto completo(Editor), James Moyne, Enrique Del Castillo (Editor), and Arnon M. Hurwitz (Editor), eds. Run-to-Run Control in Semiconductor Manufacturing. CRC, 2000.
Buscar texto completoProceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials. Electrochemical Society, 1993.
Buscar texto completoFourth IEEE/UCS/SEMI International Symposium on Semiconductor Manufacturing: [proceedings]. Additional copies may be purchased from IEEE Service Center, 1995.
Buscar texto completoBuckley, D. N., S. A. Ringel, J. P. Vilcot, C. Kusano, and G. J. Valco. Large Area Wafer Growth & Processing for Electronic & Photonic Devices State of the Art Program on Compound Semiconductors XX (Process Engineering Handbook Series). Electrochemical Society, 1995.
Buscar texto completoH, Temkin, and Society of Photo-optical Instrumentation Engineers., eds. Processing and packaging of semiconductor lasers and optoelectronic devices: 20-21 January 1993, Los Angeles, California. SPIE, 1993.
Buscar texto completoKwok-Kit, Wong Alfred, Singh Vivek K, Society of Photo-optical Instrumentation Engineers., and International SEMATECH, eds. Design for manufacturability through design-process integration: 28 February-2 March 2007, San Jose, California, USA. SPIE, 2007.
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