Увійти

Готові списки джерел за темами / Electrical wiring interconnection system / Статті в журналах

Щоб переглянути інші типи публікацій з цієї теми, перейдіть за посиланням: Electrical wiring interconnection system.

Статті в журналах з теми "Electrical wiring interconnection system"

Автор: Grafiati

Опубліковано: 30 травня 2022

Оновлено: 31 липня 2025

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся з топ-50 статей у журналах для дослідження на тему "Electrical wiring interconnection system".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Переглядайте статті в журналах для різних дисциплін та оформлюйте правильно вашу бібліографію.

1

Egitto, Frank, T. Antesberger, R. Das, et al. "Z-Axis Interconnection in Organic Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (2011): 001876–97. http://dx.doi.org/10.4071/2011dpc-wp35.

Повний текст джерела

Анотація:

Greater I/O density at the die level, more demanding performance requirements, and the continued desire to package more function into smaller devices is driving the need for improved wiring density and a concomitant reduction in feature sizes for electronic packages. Traditionally, greater wiring densities have been achieved by reducing the dimensions of vias, lines, and spaces, while also increasing the number of wiring layers. However, each of these methods possesses inherent limitations in today's most challenging multi-chip module (MCM) and system-in-package (SiP) applications that also de

Стилі APA, Harvard, Vancouver, ISO та ін.

2

WANG, Xiaohui, Li ZHU, Cheng CHE, Li LIANG, and Qinglin MA. "Study on safety design and analysis method for electrical wiring interconnection system." Xibei Gongye Daxue Xuebao/Journal of Northwestern Polytechnical University 40, no. 3 (2022): 690–98. http://dx.doi.org/10.1051/jnwpu/20224030690.

Повний текст джерела

Анотація:

A safety assessment for electrical wiring interconnection system (EWIS) was required, since the 4th revision of CCAR-25. At present, there is no systematic safety assessment method, which affects the airworthiness certification of military and civil aircraft. According to the safety assessment requirements, the requirements of new regulation 25.1709 were interpreted. Combining with the current situation of military and civil aircraft, the safety design and analysis method was established, and the safety verification technology was expanded, which can effectively identify the potential safety h

Стилі APA, Harvard, Vancouver, ISO та ін.

3

Sun, Wei, and Lihua Wang. "Optimization of Power System Wiring Process Based on Photoelectric Stabilized Technology." Journal of Nanoelectronics and Optoelectronics 15, no. 7 (2020): 875–83. http://dx.doi.org/10.1166/jno.2020.2812.

Повний текст джерела

Анотація:

Power equipment is a mechanical precision instrument that requires flexible wiring. In order to solve the problem of narrow cable wiring structure of the medium-voltage distribution network, a photoelectric stabilized device was adopted in the study. The device consists of multiple photoelectric sensors, electronic components, and structural components. Because the system supports different signal frequency bands, the interconnection technology in optoelectronic stabilization can resist electromagnetic interference so that it can further improve the accuracy of the wiring structure. The photoe

Стилі APA, Harvard, Vancouver, ISO та ін.

4

Zhu, Z., G. La Rocca, and M. J. L. van Tooren. "A methodology to enable automatic 3D routing of aircraft Electrical Wiring Interconnection System." CEAS Aeronautical Journal 8, no. 2 (2017): 287–302. http://dx.doi.org/10.1007/s13272-017-0238-3.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

5

Wang, Xinyan, Dongsheng Zhao, Hongrui Yan, Xiaojie Sun, Jianbo Liu, and Weizhao Wang. "Development of the remote automatic calibration system of the verification equipment for AC electrical energy meters." Journal of Physics: Conference Series 2591, no. 1 (2023): 012041. http://dx.doi.org/10.1088/1742-6596/2591/1/012041.

Повний текст джерела

Анотація:

Abstract The calibration of the verification equipment for AC electrical energy meters (hereinafter referred to as the DUT) was being performed manually till now. A new system for remote automatic calibration of the DUT, which applies cloud server, 4G cellular mobile interconnection technology and virtual serial communication technology, was firstly proposed in this paper. The technical problems of remote automatic calibration of large equipment, and safety problems in equipment transportation, wiring and installation were solved by developing automatic test and management software, remote com

Стилі APA, Harvard, Vancouver, ISO та ін.

6

Tomasella, Francesca, Marco Fioriti, Luca Boggero, and Sabrina Corpino. "Method for Estimation of Electrical Wiring Interconnection Systems in Preliminary Aircraft Design." Journal of Aircraft 56, no. 3 (2019): 1259–63. http://dx.doi.org/10.2514/1.c034943.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

7

S, Chitra, Jayakumar J, Venkateshkumar P, Shanty Chacko, and Sivabalan. "Identification of Power Leakage and Protection of Over Voltage in Residential Buildings." International Journal of Electrical and Electronics Research 10, no. 1 (2022): 51–56. http://dx.doi.org/10.37391/ijeer.100107.

Повний текст джерела

Анотація:

In many residential buildings the electrical wires of individual houses are laid in the same conduit pipe and some mistakes could be made in identifying similar coloured wires when they are laid in same conduit pipe. Most of the faults are caused by the neutral interconnection in the wiring system. Usually neutral wires are connected to neutral bus within the panel board or switchboard, and are "bonded" to earth ground. In our secondary distribution, tree system of supply is mostly utilized. The voltage of each phase to neutral will be maintained at rated value even during the unbalanced load

Стилі APA, Harvard, Vancouver, ISO та ін.

8

Furse, Cynthia, Moussa Kafal, Reza Razzaghi, and Yong-June Shin. "Special Issue on Embedded Sensors for Fault Diagnosis in Electrical Wiring Interconnection Systems, Power Grids, Structural Cables, Pipelines, and Electrical Machines." IEEE Sensors Journal 21, no. 2 (2021): 886–87. http://dx.doi.org/10.1109/jsen.2020.3035852.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

9

Kropp, Andrea. "Wireless communication for medical applications: the HEARTS experience." Journal of Telecommunications and Information Technology, no. 4 (December 30, 2005): 40–41. http://dx.doi.org/10.26636/jtit.2005.4.347.

Повний текст джерела

Анотація:

Wireless networks provide all the functionality of wire-line networks without the physical constraints of the wire itself giving an interesting alternative to phone-line and powerline wiring systems. With a wireless network, physicians can actively monitor a patient’s vital signs from anywhere in a hospital. HEARTS (health early alarm recognition and telemonitoring system) is a research project having the major aim to provide support for prevention and monitoring heart disease, based on advanced technology. The HEARTS idea is to gather biometric and environmental data coming from patients duri

Стилі APA, Harvard, Vancouver, ISO та ін.

10

Wu, Chenyang, Junqiang Wang, Xiaofei Liu, Mengwei Li, Zehua Zhu, and Yue Qi. "Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment." Micromachines 13, no. 10 (2022): 1603. http://dx.doi.org/10.3390/mi13101603.

Повний текст джерела

Анотація:

The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to stud

Стилі APA, Harvard, Vancouver, ISO та ін.

11

Das, Rabindra, Frank D. Egitto, Steven G. Rosser, Erich Kopp, and Barry Bonitz. "3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 000618–34. http://dx.doi.org/10.4071/2013dpc-tp12.

Повний текст джерела

Анотація:

The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Add

Стилі APA, Harvard, Vancouver, ISO та ін.

12

Das, Rabindra N., Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz, and Raj Rai. "3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics." International Symposium on Microelectronics 2013, no. 1 (2013): 000531–37. http://dx.doi.org/10.4071/isom-2013-wa43.

Повний текст джерела

Анотація:

The demand for high-performance, lightweight, portable computing power is driving the industry toward 3D integration to meet the demands of higher functionality in ever smaller packages. To accomplish this, new packaging needs to be able to integrate multiple substrates, multiple dies with greater function, higher I/O counts, smaller pitches, and greater heat densities, while being pushed into smaller and smaller footprints. The approaches explored in this paper include eliminating active chip packages by directly attaching the chip to the System-in-Package (SiP) with flip chip technology. Add

Стилі APA, Harvard, Vancouver, ISO та ін.

13

Zhong, Chaorong, Ruijuan Qi, Yonghui Zheng, Yan Cheng, Wenxiong Song, and Rong Huang. "The Relationships of Microscopic Evolution to Resistivity Variation of a FIB-Deposited Platinum Interconnector." Micromachines 11, no. 6 (2020): 588. http://dx.doi.org/10.3390/mi11060588.

Повний текст джерела

Анотація:

Depositing platinum (Pt) interconnectors during the sample preparation process via a focused ion beam (FIB) system is an inescapable procedure for in situ transmission electron microscopy (TEM) investigations. To achieve good electrical contact and avoid irreversible damage in practical samples, the microscopic evolution mechanism of FIB-deposited Pt interconnectors need a more comprehensive understanding, though it is known that its resistivity could be affected by thermal annealing. In this work, an electron-beam FIB-deposited Pt interconnector was studied by advanced spherical aberration (C

Стилі APA, Harvard, Vancouver, ISO та ін.

14

Tasneem, Saba. "WIRELESS CHARGING FOR ELECTRICAL VEHICLES." INTERANTIONAL JOURNAL OF SCIENTIFIC RESEARCH IN ENGINEERING AND MANAGEMENT 08, no. 05 (2024): 1–5. http://dx.doi.org/10.55041/ijsrem34757.

Повний текст джерела

Анотація:

Nowadays Wireless power transmission (WPT) is popular and gaining technology finding its application in various fields. The power is transferred from a source to an electrical load without the need of interconnections. Wireless power Transmission (WPT) is useful to power electrical devices where physical wiring is not possible or inconvenient. The technology uses the principle of mutual inductance. One of the best future applications finds in automotive sector especially in Electrical Vehicles. This project deals with research and development of wireless charging systems for Electric Vehicles

Стилі APA, Harvard, Vancouver, ISO та ін.

15

Hwang, Yoojin, Jeong Ho Lee, and Myung Jun Kim. "Controlling Surface Morphology of Electrodeposited Sn-Bi through Additives." ECS Meeting Abstracts MA2024-02, no. 23 (2024): 1969. https://doi.org/10.1149/ma2024-02231969mtgabs.

Повний текст джерела

Анотація:

Establishing robust electrical connections between chips is crucial in semiconductor packaging structures to manufacture high-performance electronics. Microbumps and low-temperature solders have become preferred alternatives to conventional metal wiring processes, aiming to enhance electronics integration. Microbumps, typically made of Cu for its low electrical resistivity, play a vital role in facilitating efficient electrical connections. Meanwhile, a commonly used solder material is Sn-Ag. However, traditional thermo-compression (TC) bonding utilizing Cu pillars and Sn-Ag solder typically r

Стилі APA, Harvard, Vancouver, ISO та ін.

16

Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, et al. "Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications." Journal of Microelectronics and Electronic Packaging 16, no. 3 (2019): 124–35. http://dx.doi.org/10.4071/imaps.930748.

Повний текст джерела

Анотація:

Abstract This article demonstrates a next-generation high-performance 3D packaging technology with smaller form factor, excellent electrical performance, and reliability for heterogeneous integration. High-density logic-memory integration, today, is built predominantly using interposers which are fundamentally limited in assembly pitch and interconnect lengths, and they also are expensive as the package sizes increase. On the other hand, high-frequency applications continue to use laminates which are also limited by package size and ability to integrate many components. Wafer-level fan-out (WL

Стилі APA, Harvard, Vancouver, ISO та ін.

17

Lin, Yu, Jian Jun Yi, Shao Li Chen, and Chun Hua Gu. "A System for Interconnection of Telecommunication Cables Based on RFID." Advanced Materials Research 452-453 (January 2012): 299–304. http://dx.doi.org/10.4028/www.scientific.net/amr.452-453.299.

Повний текст джерела

Анотація:

In large-scale telecommunication cables, it is not desirable for engineers to set manual tracing telecommunication cables or insert specific telecommunication cables into the corresponding wiring panel. The reason is that they are either time-consuming or unstable in accuracy. This paper introduces a cable interconnected system which is based on the RFID technology. This system enables operators to read cables connecting information with a portable RFID reader, hence obtaining relevant wiring information of the cables and connecting cables in a precise and fast way.

Стилі APA, Harvard, Vancouver, ISO та ін.

18

Takeuchi, Kai, Takeki Ninomiya, Michitaka Kubota, et al. "Hydrophilic Bonding of SiO₂/SiO₂ and Cu/Cu using Sequential Plasma Activation." ECS Meeting Abstracts MA2023-02, no. 33 (2023): 1595. http://dx.doi.org/10.1149/ma2023-02331595mtgabs.

Повний текст джерела

Анотація:

To meet the increasing market demand for next-generation electronic devices, 3D system integration is getting greater and greater attention. However, traditional methods such as soldering or bump bonding cannot handle high density interconnection. Therefore, hybrid bonding technology, which simultaneously bonds Cu wiring layer and SiO2 dielectric layer, is indispensable. In the hybrid bonding process, hydrophilic bonding is commonly used to bond SiO2 to SiO2. This technique involves bonding of hydrophilic bonding surfaces, followed by post-bonding annealing to achieve a reliable bonding interf

Стилі APA, Harvard, Vancouver, ISO та ін.

19

Li, Wei, Donghao Fan, Xi Zhu, Huaqiang Sun, and Zhennan Xiao. "Research on strength checking of EWIS bracket for civil aircraft." Journal of Physics: Conference Series 3026, no. 1 (2025): 012017. https://doi.org/10.1088/1742-6596/3026/1/012017.

Повний текст джерела

Анотація:

Abstract To improve the efficiency of strength verification of EWIS (Electrical Wiring Interconnection Systems) brackets, this thesis simplified the model of the EWIS bracket fixing harness, screened the extreme points of load of various brackets in the designated area of the aircraft, and determined the strength compliance of EWIS bracket at the extreme points of load. Therefore, it could quickly determine whether the strength of other similar brackets in the same area meets the requirements.

Стилі APA, Harvard, Vancouver, ISO та ін.

20

Topilkin, Pavel. "STUDY OF VEHICLE ELECTRICAL SYSTEM FIRE HAZARD." Problems of risk management in the technosphere 2024, no. 1 (2024): 174–81. http://dx.doi.org/10.61260/1998-8990-2024-1-174-181.

Повний текст джерела

Анотація:

The article examines the change of the probability of an emergency mode (failure) of the vehicle's electrical wiring depending on the time of its operation. We revealed necessity of establishing the wear and operation time of electrical wiring in a vehicle. Emergency modes in the vehicle electrical network have been identified and analyzed. The behavior of some contact connections of a vehicle was studied for an increase in contact resistance. It is concluded that it is necessary to develop deterministic and stochastic mathematical models that describe the state of the vehicle’s electrical net

Стилі APA, Harvard, Vancouver, ISO та ін.

21

Buck, T. J. "Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection." Circuit World 14, no. 2 (1988): 4–10. http://dx.doi.org/10.1108/eb043946.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

22

Mitsukura, Kazuyuki, Masaya Toba, Kousuke Urashima, et al. "Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer." Journal of Microelectronics and Electronic Packaging 14, no. 1 (2017): 26–31. http://dx.doi.org/10.4071/imaps.348184.

Повний текст джерела

Анотація:

An organic interposer technology with ultrafine line and space is required to achieve high-density interconnection between chips. In this article, we propose a high reliability, ultrafine trench wiring process. Currently, trench wiring is made by laser ablation of dielectric, sputtering, copper plating, and then chemical mechanical polishing (CMP). However, it is challenging to achieve fine trench with smooth side wall using laser ablation, and CMP is also not suitable because of its high assembly cost. Reliability is another challenge because of the narrower and thinner insulator. We have dev

Стилі APA, Harvard, Vancouver, ISO та ін.

23

Haluza, Miroslav, Petr Toman, and Jan Macháček. "Utilization of knowledge systems and bases for selection and evaluation of domestic electrical installations." International Journal for Innovation Education and Research 5, no. 9 (2017): 88–110. http://dx.doi.org/10.31686/ijier.vol5.iss9.800.

Повний текст джерела

Анотація:

This article deals with the use of the sophisticated methods for the selection of technical and economic solution of electrical wiring. This solution is based not only on a price but also on many other criteria such as a comfort, service, durability etc. The focus of the work is a treatise on wiring systems from a global perspective, where it is impossible to use a conventional approach for objective evaluation and selection of the appropriate electrical wiring system (because of the complexity of such systems and their interdependencies). In the article are given information of an energy cons

Стилі APA, Harvard, Vancouver, ISO та ін.

24

Wu, Bin, Xiaojie Liu, Tai Zeng, Zhengliang Su, and Fei Xie. "Experimental study on fireproof properties of aviation cables." Journal of Physics: Conference Series 2955, no. 1 (2025): 012050. https://doi.org/10.1088/1742-6596/2955/1/012050.

Повний текст джерела

Анотація:

Abstract This study investigates the fire protection capability of Engine Wiring Interconnection System (EWIS) components, focusing on the performance of typical aviation cables under fire conditions. Using an oil burner to simulate fire environments, key parameters such as flame resistance, insulation resistance, and leakage current were monitored. The results show that shielded cables exhibit up to 35% higher leakage currents compared to unshielded cables under identical conditions, indicating a higher propensity for insulation breakdown and short circuits. These findings provide theoretical

Стилі APA, Harvard, Vancouver, ISO та ін.

25

Cui, Yinhua, Jeong Yeul Jeong, Yuan Gao, and Sung Gyu Pyo. "Process Optimization of Via Plug Multilevel Interconnections in CMOS Logic Devices." Micromachines 11, no. 1 (2019): 32. http://dx.doi.org/10.3390/mi11010032.

Повний текст джерела

Анотація:

This paper reports on the optimization of the device and wiring in a via structure applied to multilevel metallization (MLM) used in CMOS logic devices. A MLM via can be applied to the Tungsten (W) plug process of the logic device by following the most optimized barrier deposition scheme of RF etching 200 Å IMP Ti (ion metal plasma titanium) 200 Å CVD TiN (titanium nitride deposited by chemical vapor deposition) 2 × 50 Å. The resistivities of the glue layer and barrier, i.e., IMP Ti and CVD TiN, were 73 and 280 μΩ·cm, respectively, and the bottom coverages were 57% and 80%, respectively, at a

Стилі APA, Harvard, Vancouver, ISO та ін.

26

Subert, József, László Rónai, and József Lénárt. "Electrical design of a press system." Multidiszciplináris tudományok 12, no. 4 (2022): 216–23. http://dx.doi.org/10.35925/j.multi.2022.4.23.

Повний текст джерела

Анотація:

The paper deals with an electrical design of an electrohydraulic system, which is capable to use for rock pressing. The system has three stations, which controlled by programmable logic controller. The electrical design contains the wiring, and the development of a valve controller card, which provides adequate current to a pressure relief valve.

Стилі APA, Harvard, Vancouver, ISO та ін.

27

Md., Maidul Hasan, Fuad Al Hassan Md., Al-Noman Siddique Md., and Al Amin Md. "Industrial Wiring Fault Detection System." International Journal of Innovative Science and Research Technology (IJISRT) 10, no. 2 (2025): 2047–52. https://doi.org/10.5281/zenodo.14987857.

Повний текст джерела

Анотація:

In our daily lives, we tend to use a variety of electronic devices using a variety of complex electronic components. All modern appliances have their electrical wires covered with a PVC jacket to protect both the wires and the user from electric shocks. However, sometimes this protection also causes problems for users. Whenever an internal wire breaks, the device is rendered inactive and the user cannot easily find out why. Video cameras, halogen floodlights, hand drill bits, grinders and cutters are powered by connecting a two or three-core cable to a main power supply. Due to long-term use,

Стилі APA, Harvard, Vancouver, ISO та ін.

28

Torres, J. "European Copper Interconnection Project." MRS Bulletin 19, no. 8 (1994): 75. http://dx.doi.org/10.1557/s0883769400047783.

Повний текст джерела

Анотація:

Multilevel metallization is becoming an increasingly interesting area of research as circuit fabrication technologies are scaled down to deep submicron dimensions. The mainstream of today's interconnection technology is AlSiCu metallization. Al-based solutions, however, seem to be limited in resistivity as well as in electromigration performance. Because of its low electrical resistivity and its resistance to electromigration, copper is considered to be a promising new solution for on-chip interconnections. The performance of copper would allow its use in wiring with very small linewidths, as

Стилі APA, Harvard, Vancouver, ISO та ін.

29

Bulumulla, Selaka, and Koushik Ramachandran. "Evaluation of die to organic laminate to PCB interconnects up to 50GHz." International Symposium on Microelectronics 2019, no. 1 (2019): 000223–27. http://dx.doi.org/10.4071/2380-4505-2019.1.000223.

Повний текст джерела

Анотація:

Abstract Ceramic substrates have traditionally been used in RF and microwave packaging applications because of the electrical properties at high frequencies. However, there is significant interest in using organic laminates due to its tighter wiring ground rules for high density packaging and lower cost of fabrication. The high frequency performance of interconnection from die to PCB using an organic packaging substrate has not yet been studied in detail. In this work, the interconnect performance of die to organic laminate to PCB up to 50 GHz was modeled and characterized using a test vehicle

Стилі APA, Harvard, Vancouver, ISO та ін.

30

Hang, Xu, Sun Hao, Zhang Tianyao, Lu Yi, Duan Huijie, and Zhao Nian. "Research on Digital Prototype Model Design of Missile Electrical System." Journal of Physics: Conference Series 2891, no. 12 (2024): 122025. https://doi.org/10.1088/1742-6596/2891/12/122025.

Повний текст джерела

Анотація:

Abstract The design of missile electrical systems involves various aspects such as electrical network, wiring harness connection relationships, wiring harness layout, and electromagnetic compatibility design. Traditional design methods cannot meet the design requirements of missile electrical systems due to many drawbacks. In this paper, a method to design digital prototype model is proposed. The digital prototype model consists of two parts: the design of cable electrical model is based on Capital and the design of cable structure model is based on NX. And the Digital Prototype model is archi

Стилі APA, Harvard, Vancouver, ISO та ін.

31

Guo, Chun. "Electrical Interconnection of Microarray Acceleration Sensor System." Sensor Letters 13, no. 12 (2015): 1039–43. http://dx.doi.org/10.1166/sl.2015.3623.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

32

YAMANAKA, Naoaki. "Optical Interconnection. Optical Interconnection Technologies for Advanced ATM Switching System." Journal of Japan Institute of Electronics Packaging 1, no. 3 (1998): 186–91. http://dx.doi.org/10.5104/jiep.1.186.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

33

Rao Musala, Venkateswara, and T. V Rama Krishna. "Low latency Path Aware XY-X Routing Algorithm for NoC Architectures." International Journal of Engineering & Technology 7, no. 2.7 (2018): 763. http://dx.doi.org/10.14419/ijet.v7i2.7.10941.

Повний текст джерела

Анотація:

Route specific information with the SoC needs a great deal of wiring, which increases the Resistance & Capacitance (RC) component of the system. Network on Chip (NoC) is utilized as the interface to address the problems in SoC, On-chip interconnection network in NoC has gained more consideration over steadfast wiring and buses, like lower latency, scalability and high performance. Present routing algorithms in NoC is suffered from load balancing at incarnation networks under non-uniform traffic conditions, causes increase the NoC trade-offs (latency and throughput). Adaptive routing is a t

Стилі APA, Harvard, Vancouver, ISO та ін.

34

Rohit, Choubey, Pakhare Aakash, Raj Atul, et al. "Wireless Charging System for Electric Vehicle." Advancement of Signal Processing and its Applications 4, no. 2 (2021): 1–5. https://doi.org/10.5281/zenodo.5031263.

Повний текст джерела

Анотація:

<em>Wireless power transfer is popular and most recent technology which is gaining its importance for various application in various field. In wireless power transfer power is transferred from source to electrical load without any physical wiring. WPT is useful where physical wiring is inconvenient. The basic principle of WPT is mutual induction. This paper deals with wireless transmission techniques for charging the electric vehicle. Further wireless charging in E-Bike system. In this paper we have used inductive power transfer technique for charging electric vehicle. The system deals with so

Стилі APA, Harvard, Vancouver, ISO та ін.

35

Du, Lingxia. "Integrated Wiring System of Intelligent Building Based on Internet of Things." Wireless Communications and Mobile Computing 2022 (July 19, 2022): 1–8. http://dx.doi.org/10.1155/2022/1086210.

Повний текст джерела

Анотація:

In order to explore how the intelligent building can realize the integrated wiring system, the author proposes an integrated wiring system for the intelligent building based on the Internet of Things. This method recommends key technical problems and solutions based on the information represented by the Internet of Things and explores the research on the realization of integrated wiring systems in intelligent buildings. Research has shown that the integrated wiring system of intelligent buildings based on the Internet of Things can solve the shortcomings of traditional buildings, and the happi

Стилі APA, Harvard, Vancouver, ISO та ін.

36

Han, Changwoon, Seungil Park, and Hyeonseok Lee. "Intermittent failure in electrical interconnection of avionics system." Reliability Engineering & System Safety 185 (May 2019): 61–71. http://dx.doi.org/10.1016/j.ress.2018.12.016.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

37

Rahman, M. M. Hafizur, Mohammed Al-Naeem, Mohammed N. M. Ali, and Abu Sufian. "TFBN: A Cost Effective High Performance Hierarchical Interconnection Network." Applied Sciences 10, no. 22 (2020): 8252. http://dx.doi.org/10.3390/app10228252.

Повний текст джерела

Анотація:

In order to fulfill the increasing demand for computation power to process a boundless data concurrently within a very short time or real-time in many areas such as IoT, AI, machine learning, smart grid, and big data analytics, we need exa-scale or zetta-scale computation in the near future. Thus, to have this level of computation, we need a massively parallel computer (MPC) system that shall consist of millions of nodes; and, for the interconnection of these massive numbers of nodes, conventional topologies are infeasible. Thus, a hierarchical interconnection network (HIN) is a rational way t

Стилі APA, Harvard, Vancouver, ISO та ін.

38

Lee, Wei Chen, and Hill Wu. "Computer-Aided Analysis and Measurement of an Interconnection System." Advanced Materials Research 308-310 (August 2011): 2279–85. http://dx.doi.org/10.4028/www.scientific.net/amr.308-310.2279.

Повний текст джерела

Анотація:

The electrical characteristics of an interconnection system, which include impedance, insertion loss, and return loss, can greatly affect its performance as the signal speed increases. The objective of this research was to understand the discrepancy between the computer-aided analysis and measurement results of an interconnection system, so that a more accurate prediction of the electrical characteristics of this system can be made during the design phase. It was discovered that in both the time and frequency domain the computer-aided analysis results were consistent with the measurement resul

Стилі APA, Harvard, Vancouver, ISO та ін.

39

Chen, Ying, Xiang Ning Wang, and Dong Jie Bao. "Discussion about Several Questions of High-Rise Building Fire Control Electrical Design and Installation." Applied Mechanics and Materials 347-350 (August 2013): 970–74. http://dx.doi.org/10.4028/www.scientific.net/amm.347-350.970.

Повний текст джерела

Анотація:

This paper mainly discusses the fire control electrical systems set in high-rise building. When designing and installing the fire control electrical system, we should pay close attention to following some aspects to ensure the reliability of the fire protection system: the probe system settings, laying electrical wiring, and electrical fire alarm system settings, fire protection telephone, broadcast system.

Стилі APA, Harvard, Vancouver, ISO та ін.

40

Rodríguez-Fdez, Sonia, L. Francisco Lorenzo-Martín, Salvatore Fabbiano, et al. "New Functions of Vav Family Proteins in Cardiovascular Biology, Skeletal Muscle, and the Nervous System." Biology 10, no. 9 (2021): 857. http://dx.doi.org/10.3390/biology10090857.

Повний текст джерела

Анотація:

Vav proteins act as tyrosine phosphorylation-regulated guanosine nucleotide exchange factors for Rho GTPases and as molecular scaffolds. In mammals, this family of signaling proteins is composed of three members (Vav1, Vav2, Vav3) that work downstream of protein tyrosine kinases in a wide variety of cellular processes. Recent work with genetically modified mouse models has revealed that these proteins play key signaling roles in vascular smooth and skeletal muscle cells, specific neuronal subtypes, and glia cells. These functions, in turn, ensure the proper regulation of blood pressure levels,

Стилі APA, Harvard, Vancouver, ISO та ін.

41

Liu, Yan Li, Tao Jia, and Ze Cheng. "The Research of the Affection of Wiring on the Induction Motor Direct Torque Control." Applied Mechanics and Materials 325-326 (June 2013): 1089–92. http://dx.doi.org/10.4028/www.scientific.net/amm.325-326.1089.

Повний текст джерела

Анотація:

The logical choice of stator voltage vector is the key for induction motor direct torque control. This paper proposes a stator voltage vector selection rule based on wiring, according to analyzing the affection caused by the electrical wiring on motor stator voltage amplitude and phase. The rules are tested in direct torque control system. Experimental results show the correctness of the theoretical analysis.

Стилі APA, Harvard, Vancouver, ISO та ін.

42

Braun, Lars, Minh Le, Jürgen Motz, and Kai Peter Birke. "Novel Approach to Diagnose Safe Electrical Power Distribution." Energies 17, no. 22 (2024): 5685. http://dx.doi.org/10.3390/en17225685.

Повний текст джерела

Анотація:

The integrity of the 12Vdc power distribution system on a vehicle is essential to guarantee continuous power supply to safety-relevant consumers. Safety-relevant consumers are critical loads, for example, electric power steering, braking systems with functionalities like Anti-Lock Braking or Electronic Stability Control, and autonomous drive systems. To prevent insufficient power supply for safety-relevant consumers due to an increased wiring harness resistance, a novel diagnostic approach is developed to determine the condition of the power distribution, especially the electrical resistance.

Стилі APA, Harvard, Vancouver, ISO та ін.

43

Tsay, Tain-Sou. "Small Loop Antenna System Design for Radio Direction Finding." WSEAS TRANSACTIONS ON COMMUNICATIONS 20 (December 16, 2021): 172–76. http://dx.doi.org/10.37394/23204.2021.20.22.

Повний текст джерела

Анотація:

In this literature, a low-cost small loop antenna is developed for radio direction finding. It consists of two coupled rectangular counter-wiring loop antennas. A signal-processing circuit is developed also for demodulated outputs. A single rectangular loop antenna is discussed first for illustrating the receiving characteristics and then the proposed two coupled rectangular counter-wiring loop antennas are designed for radio direction finding. Measurements give a large linear detecting range. It is ready for Omni-directional application using another two coupled loop antennas and can be used

Стилі APA, Harvard, Vancouver, ISO та ін.

44

Liu, Y., J. J. Brown, D. C. W. Lo, and S. R. Forrest. "Optically powered optical interconnection system." IEEE Photonics Technology Letters 1, no. 1 (1989): 21–23. http://dx.doi.org/10.1109/68.87883.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

45

Al – Hamad, Mawlood M. "Modernization of Electrical Installation by using Wireless Remote Control." Tikrit Journal of Engineering Sciences 17, no. 4 (2010): 32–35. http://dx.doi.org/10.25130/tjes.17.4.04.

Повний текст джерела

Анотація:

Great benefits can be achieved by using wireless remote control in electrical wiring systems of buildings. Probably the main advantage of this application is the drastic saving in wiring installations, which in turn will give higher reliability, safety and economy. The idea of this application can be summarized in the following explanation. ” Instead off connecting each point of electrical system to individual switch by wires, a remote receiver can be situated in a place near to the point. The transmitter is used to operate the point remotely. The mains are connected to the receiver which will

Стилі APA, Harvard, Vancouver, ISO та ін.

46

Guo, Qiang. "Novel Approach to Risk Assessment of Aircraft Electrical Wiring Interconnet System." Journal of Aircraft 48, no. 6 (2011): 1888–93. http://dx.doi.org/10.2514/1.c031288.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

47

D. Baflor, Romel, Alden Q. Gabuya, Jr., and Gregorion P. Pajaron Jr. "Reengineering the Electrical Wiring System of Cebu Technological University,Tuburan Campus." Journal of Electrical & Electronic Systems Research 24, Apr2024 (2024): 57–63. http://dx.doi.org/10.24191/jeesr.v24i1.009.

Повний текст джерела

Стилі APA, Harvard, Vancouver, ISO та ін.

48

G. Mansal, Rondolph. "DESIGN AND DEVELOPMENT OF A COMPETENCY-BASED TRAINER FOR ELECTRICAL WIRING SYSTEM." International Journal of Applied Science and Engineering Review 06, no. 03 (2025): 120–42. https://doi.org/10.52267/ijaser.2025.6309.

Повний текст джерела

Анотація:

This study presents the development, design and evaluation of the Competency-Based Training Electrical Wiring System (CBTEWS) trainer at Agusan Del Sur State College of Agriculture and Technology. Following the Analysis, Design, Development, Implementation, and Evaluation (ADDIE), model framework the research addressed the critical need for realistic electrical training environments that bridge the gap between classroom instruction and professional practice.

Стилі APA, Harvard, Vancouver, ISO та ін.

49

Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. "Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer." Journal of Microelectronics and Electronic Packaging 9, no. 4 (2012): 160–65. http://dx.doi.org/10.4071/imaps.359.

Повний текст джерела

Анотація:

Electrical and mechanical performance of quilt packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dice along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 100 pH, and the self-capacitance can be less than 34 fF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that cau

Стилі APA, Harvard, Vancouver, ISO та ін.

50

Zheng, Quanling, M. Ashraf Khan, Alfred M. Kriman, and Gary H. Bernstein. "Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer." International Symposium on Microelectronics 2012, no. 1 (2012): 000441–46. http://dx.doi.org/10.4071/isom-2012-tp55.

Повний текст джерела

Анотація:

Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 0.01 nH, and the self-capacitance can be less than 0.034 pF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that

Стилі APA, Harvard, Vancouver, ISO та ін.

Ми пропонуємо знижки на всі преміум-плани для авторів, чиї праці увійшли до тематичних добірок літератури. Зв'яжіться з нами, щоб отримати унікальний промокод!