Готові списки джерел за темами / Grain boundary electron scattering

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Добірка наукової літератури з теми "Grain boundary electron scattering"

Автор: Grafiati

Опубліковано: 28 травня 2022

Оновлено: 31 липня 2025

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Статті в журналах з теми "Grain boundary electron scattering"

VANCEA, J. "UNCONVENTIONAL FEATURES OF FREE ELECTRONS IN POLYCRYSTALLINE METAL FILMS." International Journal of Modern Physics B 03, no. 10 (1989): 1455–501. http://dx.doi.org/10.1142/s0217979289000956.

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New experimental results concerning basic electronic properties of fine grained metallic films call for theoretical models differing from standard theories: 1) The d.c. conductivity depends on the number of electrons crossing the grain boundary potentials along their background scattering length. An intrinsic scattering length for the whole polycrystal cannot be defined. 2) The Hall coefficient depends on the grain size. Below a “cut-off grain size”, electrons with p-symmetry are virtually confined within the grains. Consequently a virtual free electron value is observed. 3) The work function

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Silcox, J. "Electron Scattering with an Atomic Sized Probe." Microscopy and Microanalysis 6, S2 (2000): 102–3. http://dx.doi.org/10.1017/s1431927600033006.

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It is the presence of local variations in atomic and electronic structure that often gives rise to intriguing properties of materials. Control of material properties then rests on detection of the local variations in the materials, determination of the origin of those variations and then understanding how such variations can be controlled to achieve a desired functionality. Recent examples using STEM with an atomic sized probe (∼2.2 Å) include studies of the bonding at grain boundaries in nickel rich Ni3Al doped with boron. EELS measurements revealed changes in the d-hole density-of-states tha

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Kumar, Sunil, and George C. Vradis. "Thermal Conductivity of Thin Metallic Films." Journal of Heat Transfer 116, no. 1 (1994): 28–34. http://dx.doi.org/10.1115/1.2910879.

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This study examines the effect of transverse thickness on the in-plane thermal conductivity of single crystal, defect-free, thin metallic films. The imposed temperature gradient is along the film and the transport of thermal energy is predominantly due to free electron motion. The small size necessitates an evaluation of the Boltzmann equation of electron transport along with appropriate electron scattering boundary conditions. Simple expressions for the reduction of conductivity due to increased dominance of boundary scattering are presented and the results are compared with other simplified

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Zhou, Tianji, Atharv Jog, and Daniel Gall. "First-principles prediction of electron grain boundary scattering in fcc metals." Applied Physics Letters 120, no. 24 (2022): 241603. http://dx.doi.org/10.1063/5.0098822.

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The electron reflection probability r at symmetric twin boundaries Σ3, Σ5, Σ9, and Σ11 is predicted from first principles for the eight most conductive face-centered cubic (fcc) metals. r increases with decreasing interplanar distance of atomic planes parallel to the boundary. This provides the basis for an extrapolation scheme to estimate the reflection probability rr at random grain boundaries, which is relatively small, rr = 0.28–0.39, for Cu, Ag, and Au due to their nearly spherical Fermi surfaces, but approximately two times higher for Al, Ca, Ni, Rh, and Ir with a predicted rr = 0.61–0.7

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Takata, Naoki, Kenichi Ikeda, Hideharu Nakashima, and Nobuhiro Tsuji. "In Situ EBSP Analysis of Grain Boundary Migration during Recrystallization in Pure Aluminum Foils." Materials Science Forum 558-559 (October 2007): 351–56. http://dx.doi.org/10.4028/www.scientific.net/msf.558-559.351.

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Grain boundary mobility in preferential growth of cube grains ({100}<001>) was evaluated by in-situ electron back scattering diffraction pattern (EBSP) analysis in order to clarify the fundamental mechanism of primary recrystallization in pure aluminum foils of 99.9% purity thermo-mechanically processed in the industrial production route for aluminum foils for electrolytic capacitors. We have carried out the continuous EBSP measurements during recrystallization of the aluminum foils heated to various temperatures in the chamber of scanning electron microscopy (SEM). We have succeeded in

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Alzobaie, Ammar Rahman, and May AbdulSattar Mohammed. "The Effect Scattering of Phonons, Surface and Grain Boundary on Electrical Properties for Magnesium and Palladium Nano Metallic." Journal of Physics: Conference Series 3028, no. 1 (2025): 012017. https://doi.org/10.1088/1742-6596/3028/1/012017.

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Abstract Nanometals, i.e., metals structured at the nanoscale, have gained increasing attention due to their excellent electronic applications. In the context of improving the electrical properties of nanometals, this study investigates the effect of phonon scattering, surface boundaries and grain boundaries on the electrical properties of magnesium (Mg) and palladium (Pd). An approximate equation is derived from the solution of the Boltzmann electron distribution equation by the Fuchs-Sondheimer and Mayadas-Shatzkes models, which takes into account the resistivity of the metal, as well as the

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Zhang, Zhi Guo. "Bridge Action of Double-Deck Films Interface Electrons." Applied Mechanics and Materials 217-219 (November 2012): 1038–42. http://dx.doi.org/10.4028/www.scientific.net/amm.217-219.1038.

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When both SnO2 film and a-Si film with infinite square resistance are deposited on an ITO film, the square resistance of the ITO film notably decreases. This phenomenon is more remarkable, when an ITO film has large square resistance. We believe that the films are composed of spaced crystalline grains. The film resistance is due to crystal boundary scattering carriers. Smaller crystalline grain and greater distance to the crystal boundary lead to fiercer scattering. The crystalline grains of the SnO2 film and a-Si film short-circuit the spaced ITO grains to form bridges so interface electrons

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Guo, Xitao, Yonghao Tan, Yupei Hu, et al. "Effect of microplate size on the semiconductor–metal transition in VO₂ thin films." New Journal of Chemistry 46, no. 16 (2022): 7497–502. http://dx.doi.org/10.1039/d2nj01324j.

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The degree of changes in resistivity (Δρ) becomes more prominent as the VO2 film microplate size grows, which is primarily attributed to a reduced probability of electron scattering with decreasing grain boundary density.

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fendle, Valerie, and Brian Ralph. "Clustering of coincident site lattice boundaries in polycrystals." Proceedings, annual meeting, Electron Microscopy Society of America 46 (1988): 630–31. http://dx.doi.org/10.1017/s0424820100105217.

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The distribution of coincident site lattice (CSL) and other geometrically special boundaries have been analysed in the form of “grain misorientation texture” (GMT) plots for several systems (pure nickel, a number of austenitic stainless steels and a complex superalloy, 1-5). Several heat treatment conditions have been investigated for each system. Principally, electron back scattering (EBS) in a scanning electron microscope has been used to collect the “microtexture” (i.e. grain specific) data which combines the considerable advantages of bulk specimen texture analysis, grain environment speci

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Qiu, T. Q., and C. L. Tien. "Size Effects on Nonequilibrium Laser Heating of Metal Films." Journal of Heat Transfer 115, no. 4 (1993): 842–47. http://dx.doi.org/10.1115/1.2911378.

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Picosecond and sub-picosecond lasers have become important tools in the fabrication and study of microstructures. When the laser pulse duration becomes comparable with or less than the characteristic time of energy exchange among microscopic energy carriers, the excited carriers are no longer in thermal equilibrium with the other carriers, creating a nonequilibrium heating situation. The presence of interfaces in metals provides additional scattering processes for electrons, which in turn affects the nonequilibrium heating process. This work studies size effects, due to both surface scattering

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Дисертації з теми "Grain boundary electron scattering"

Синашенко, Оксана Володимирівна, Оксана Владимировна Синашенко, Oksana Volodymyrivna Synashenko, et al. "The Influence of Electrons Scattering at Grain Boundary and at Surface on Resistivity and Thermal Coefficient of Resistance of Nanocrystalline Silver Films." Thesis, Sumy State University, 2012. http://essuir.sumdu.edu.ua/handle/123456789/34900.

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The paper describes the method of separation of the share of both surface and grain boundary electron scattering on resistance and thermal coefficient of resistance (TCR). The calculation of ρd, βd and gb, βgb values, which correspond to the surface and grain boundary electron scattering respectively, and their comparative analysis were done based on experimental data of thermal and size dependence of specific resistance (ρ) and TCR (β) for nanocrystalline silver films. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/34900

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Hansen, Landon Thomas. "Characterization of Dislocation - Grain Boundary Interactions Through Electron Backscatter Diffraction." BYU ScholarsArchive, 2019. https://scholarsarchive.byu.edu/etd/7536.

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Further understanding of dislocation-GB interactions is critical to increasing the performance of polycrystalline metals. The research contained within this dissertation aims to further dislocation-GB interaction understanding through three research studies. First, the effect of noise in EBSPs on GND calculations was evaluated in order to improve dislocation characterization via HR-EBSD. Second, the evolution of GNDs and their effects on back stress was studied through experimental and computational methods applied to tantalum oligo specimens. Third, statistical analysis was used to evaluate g

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Amalaraj, Akash Savio. "5D Grain Boundary Characterization from EBSD Microscopy." BYU ScholarsArchive, 2018. https://scholarsarchive.byu.edu/etd/8816.

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Knowledge of the full 5-degree Grain Boundary Character Distribution (GBCD) is vital to understanding properties, such as gas diffusivity, that are dominated by grain boundary character. Surface characterization techniques, such as Electron Backscattered diffraction (EBSD), can provide only 4 of the 5 GB characteristics (the rotation between the neighboring grains, and the trace of the GB on the surface). The inclination of the GB in the direction normal to the surface is not known. A previous study indicated that the GB inclination could be recovered by correlating the Electron Backscattered

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Dudeck, K. J. "High resolution electron microscopy investigation of the strontium titanate 3(112) [110] grain boundary." Thesis, University of Oxford, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.510948.

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Sun, Tik. "Classical Size Effect in Copper Thin Films: Impact of Surface and Grain Boundary Scattering on Resistivity." Doctoral diss., Orlando, Fla. : University of Central Florida, 2009. http://purl.fcla.edu/fcla/etd/CFE0002959.

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Wade, C. Austin. "Investigation of Grain Boundary Segregation and Embrittlement Mechanisms of the Cu-Bi System by Analytical Electron Microscopy." Thesis, Lehigh University, 2015. http://pqdtopen.proquest.com/#viewpdf?dispub=3723911.

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<p> Grain boundary (GB) segregation and embrittlement of copper (Cu) by small amounts of bismuth (Bi) has been investigated on 6°, 13°, and 33° Cu twist bicrystals. The results from micro-mechanical double edge notched testing showed no embrittlement effects in the 6° GB. The 33° GB has been shown to be significantly embrittled by the introduction of Bi. Single edge notch testing of the 13° GB also showed a reduction in fracture toughness. These mechanical results have been interpreted through the use of analytical electron microscopy (AEM) studying the GB geometry, the

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Basinger, John A. "Detail Extraction from Electron Backscatter Diffraction Patterns." BYU ScholarsArchive, 2011. https://scholarsarchive.byu.edu/etd/2689.

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Cross-correlation based analysis of electron backscatter diffraction (EBSD) patterns and the use of simulated reference patterns has opened up entirely new avenues of insight into local lattice properties within EBSD scans. The benefits of accessing new levels of orientation resolution and multiple types of previously inaccessible data measures are accompanied with new challenges in characterizing microscope geometry and other error previously ignored in EBSD systems. The foremost of these challenges, when using simulated patterns in high resolution EBSD (HR-EBSD), is the determination of patt

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Pourmatin, Hossein. "Computational Multiscale Methods for Defects: 1. Line Defects in Liquid Crystals; 2. Electron Scattering in Defected Crystals." Research Showcase @ CMU, 2014. http://repository.cmu.edu/dissertations/458.

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In the first part of this thesis, we demonstrate theory and computations for finite-energy line defect solutions in an improvement of Ericksen-Leslie liquid crystal theory. Planar director fields are considered in two and three space dimensions, and we demonstrate straight as well as loop disclination solutions. The possibility of static balance of forces in the presence of a disclination and in the absence of ow and body forces is discussed. The work exploits an implicit conceptual connection between the Weingarten-Volterra characterization of possible jumps in certain potential fields and th

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Dohr, Judith. "Micromechanical testing of oxidized grain boundaries." Thesis, University of Oxford, 2016. https://ora.ox.ac.uk/objects/uuid:fb8a08ef-87d8-47ab-9ac8-89bf300203ea.

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Primary water stress corrosion cracking (SCC) of metals in pressurized water reactors (PWRs) is known to be one of the most challenging and cost intensive modes of failure in the nuclear industry. Even though it is known that cracking in Ni-base alloys proceeds mainly intergranular (IG), the initiation and propagation of cracks in ductile metals are not yet understood and a much-desired accurate prediction of SCC related failure seems unobtainable. In this thesis, a combination of microcantilever fracture experiments, scanning electron- (SEM) and transmission electron microscopy (TEM) techniqu

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Crane, Samantha. "High resolution transmission electron microscopy analysis of the influence of grain boundary and triple grain junction crystallinity and chemistry on silicon carbide-based armor with small additions of aluminum, boron, and carbon." [Gainesville, Fla.] : University of Florida, 2005. http://purl.fcla.edu/fcla/etd/UFE0010845.

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Книги з теми "Grain boundary electron scattering"

Randle, V. Measurement of Grain Boundary Geometry. Taylor & Francis Group, 2019.

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Randle, Valerie. Measurement of Grain Boundary Geometry. Taylor & Francis Group, 2017.

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Randle, Valerie. Measurement of Grain Boundary Geometry. Taylor & Francis Group, 2017.

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Randle, Valerie. Measurement of Grain Boundary Geometry. Taylor & Francis Group, 2017.

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Measurement of Grain Boundary Geometry. Taylor & Francis Group, 2017.

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Частини книг з теми "Grain boundary electron scattering"

Reed, Bryan W., and Christopher A. Schuh. "Grain Boundary Networks." In Electron Backscatter Diffraction in Materials Science. Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-88136-2_15.

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Roukes, M. L., T. J. Thornton, A. Scherer, and B. P. Van der Gaag. "Electron-Boundary Scattering in Quantum Wires." In Electronic Properties of Multilayers and Low-Dimensional Semiconductor Structures. Springer US, 1990. http://dx.doi.org/10.1007/978-1-4684-7412-1_6.

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Woonbumroong, A., P. D. Brown, and C. B. Boothroyd. "Grain-boundary segregation of Ho in BaTiO3." In Electron Microscopy and Analysis 1997. CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-131.

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Brown, R. A. "Phonon Scattering by a Grain Boundary in Silicon." In Phonon Scattering in Condensed Matter V. Springer Berlin Heidelberg, 1986. http://dx.doi.org/10.1007/978-3-642-82912-3_77.

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Keast, V. J., and D. B. Williams. "Investigations of grain boundary embrittlement in the STEM." In Electron Microscopy and Analysis 1997. CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-77.

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Wang, S., and M. Aindow. "High Angle Grain Boundary Structure in Widmanstätten Alpha Ti Microstructures." In Electron Microscopy and Analysis 1997. CRC Press, 2022. http://dx.doi.org/10.1201/9781003063056-171.

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Goyal, Amit. "Grain Boundary Character Based Design of Polycrystalline High Temperature Superconducting Wires." In Electron Backscatter Diffraction in Materials Science. Springer US, 2000. http://dx.doi.org/10.1007/978-1-4757-3205-4_25.

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Rohrer, Gregory S., and Valerie Randle. "Measurement of the Five-Parameter Grain Boundary Distribution from Planar Sections." In Electron Backscatter Diffraction in Materials Science. Springer US, 2009. http://dx.doi.org/10.1007/978-0-387-88136-2_16.

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Dixit, Hemant, Aniruddha Konar, Rajan Pandey, Jin Cho, and Francis Benistant. "Analyzing the Impact of Grain Boundary Scattering on the Metal Resistivity: First-Principles Study of Symmetric Tilt Grain Boundaries in Copper." In Springer Proceedings in Physics. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-319-97604-4_107.

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Schoop, Urs, Stephan Kleefisch, Stefanie Meyer, et al. "Transport properties of grain boundary junctions fabricated from hole and electron doped high-Tc superconductors." In Advances in Superconductivity XI. Springer Japan, 1999. http://dx.doi.org/10.1007/978-4-431-66874-9_23.

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Тези доповідей конференцій з теми "Grain boundary electron scattering"

Hefferan, Christopher M., Michael J. Deible, Matthew J. Perricone, and Keith E. Wagner. "Grain Boundary Corrosion of UNS N10276 Using Orientation Imaging via Electron Backscatter Diffraction Microscopy (EBSD)." In CORROSION 2019. NACE International, 2019. https://doi.org/10.5006/c2019-13418.

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Abstract Due to its reliable performance in many corrosive environments, UNS N10276 is widely used in diverse industrial sectors ranging from chemical processing to marine and aerospace. Understanding the physical properties associated with different processing histories can assist in informed selection of UNS N10276 microstructures for specific applications. Here, grain boundary corrosion susceptibility in the context of grain boundary types is the focus. With the aid of electron backscatter diffraction microscopy (EBSD), grain maps containing spatial orientation information have been collect

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Bruemmer, S. M. "Grain Boundary Composition Effects on Environmentally Induced Cracking of Engineering Materials." In CORROSION 1987. NACE International, 1987. https://doi.org/10.5006/c1987-87185.

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Abstract There is now clear evidence that intergranular stress corrosion cracking (SCC) and hydrogen embrittlement (HE) of engineering materials depend on grain boundary composition. Two examples are used to illustrate this interrelationship: 1) SCC of austenitic stainless steel in high- temperature water and 2) HE of NiCrMoV rotor steels in acidic solutions. Grain boundary compositions are characterized by analytical electron microscopy and scanning Auger electron spectroscopy. Environmental cracking susceptibility is indicated by slow- strain-rate tests in appropriate aqueous environments. D

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Wang, J. Q., A. Atrens, and D. R. G. Mitchell. "Grain Boundary Characterization of X42 Pipeline Steel in Relation to IGSCC." In CORROSION 2001. NACE International, 2001. https://doi.org/10.5006/c2001-01210.

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Abstract Grain boundaries of pipeline steel X42 were characterised by electron energy loss spectroscopy (EELS) and with energy dispersive X-ray spectroscopy using a high-resolution analytical electron microscope in order to elucidate its intergranular stress corrosion cracking mechanism. In these experiments, EELS was not a good method contrary to expectation. Carbon contamination on the specimen surface continues to be a issue. Argon plasma cleaning and Precision Ion Polishing System cleaning did not remove the carbon contamination from the sample surface. There were carbide precipitates alon

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Jacobs, A. J. "Grain Boundary Segregation and IGSCC in Cold Worked Type 304SS." In CORROSION 1989. NACE International, 1989. https://doi.org/10.5006/c1989-89495.

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Abstract Applied potential CERT tests were conducted on unirradiated, mill-annealed Type 304SS, in an attempt to reproduce irradiation-assisted IGSCC in the laboratory. To simulate highly irradiated material, the test material was cold worked and given a low temperature anneal. Significant (10%) IGSCC was obtained in samples that had been cold rolled 30%, aged at 500°C for 700 hours, and CERT tested under an anodic potential of 0 volts (SHE). The results of Auger Electron Spectroscopy showed that the amount of intergranular phosphorus segregation could be correlated with the degree of IGSCC an

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Bruemmer, S. M., L. A. Chariot, and E. P. Simonen. "Grain Boundary Chemistry Effects on Irradiation-Assisted Stress Corrosion Cracking." In CORROSION 1990. NACE International, 1990. https://doi.org/10.5006/c1990-90506.

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Abstract Radiation-induced segregation (RIS) to grain boundaries and interfacial microchemistry effects on intergranular stress corrosion cracking (IGSCC) have been investigated in 304 and 316 stainless steels (SS). Irradiation dose effects on RIS to grain boundaries were studied using nickel ion bombardment of fine-grained, sputter-deposited SS. Damage levels from 1 to 20 dpa were produced in near-surface regions encompassing several grain diameters in depth. The resultant "bulk" damage promoted RIS of silicon and nickel, as well as depletion of chromium at grain interfaces. Maximum enrichmen

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Cheng, Zhuolin, Jiale Wang, Rou Li, Ao Gao, Jianying Li, and Kangning Wu. "Evolution of Electron Trapping at the Grain Boundary During Long-Term Stability Transition of Stable ZnO Varistor Ceramics." In 2024 IEEE 14th International Conference on the Properties and Applications of Dielectric Materials (ICPADM). IEEE, 2024. http://dx.doi.org/10.1109/icpadm61663.2024.10750713.

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Angeliu, T. M. "Microstructural Characterization of L-Grade Stainless Steels Relative to the IGSCC Behavior in BWR Environments." In CORROSION 2001. NACE International, 2001. https://doi.org/10.5006/c2001-01121.

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Abstract Analytical electron microscopy techniques were used to provide insight to the IGSCC behavior of L-grade stainless steels in boiling water nuclear reactor (BWR) environments. Grain boundary Cr-depletion and cold work are well known as important material parameters affecting IGSCC. Characterization of cracked L-grade BWR core components revealed significant surface cold work and W-shaped grain boundary Cr-depletion profiles. Grain boundary composition measurements of other actual and simulated BWR core components revealed differences in the Cr and Mo profiles as a function of the bulk c

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Jacobs, A. J., G. P. Wozadlo, K. Nakata, T. Okada, and S. Suzuki. "The Correlation of Grain Boundary Composition in Irradiated Type 348 Stainless Steel with IASCC Resistance." In CORROSION 1994. NACE International, 1994. https://doi.org/10.5006/c1994-94124.

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Abstract Scanning transmission electron microscopy (STEM) analyses, in-reactor swelling mandrel tests, and laboratory constant extension rate tensile (CERT) tests were conducted on nine custom Type 348SS alloys, in an attempt to correlate grain boundary composition with IASCC resistance. Phosphorus enrichment showed the best correlation with in-reactor test results, and Cr depletion the best correlation with laboratory results. Silicon and P enrichment were found to be quantitatively dependent on the bulk concentrations of these elements, while the amount of Cr depletion seemed to be at least

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Tsuchiyama, Tomohiro, Osamu Matsumoto, and Takenori Nakayama. "Stress Corrosion Cracking Behavior of 3.5Nicrmov Steel in Carbonated Pure Water." In CORROSION 1998. NACE International, 1998. https://doi.org/10.5006/c1998-98247.

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Abstract SCC susceptibility of 3.5NiCrMoV steel in a carbonated pure water at 157°C decreased with the decrease of P content in steel. SCC susceptibility also decreased by the addition of Nb. It was also confirmed that the SCC cracks were primarily intergranular. An Auger electron spectroscopy (AES) analysis revealed that P segregation to grain boundary might play an essential role in accelerating SCC susceptibility, and Nb could suppress the P segregation to grain boundary. The role of Nb in raising resistance to SCC is thought to be attributed to the decreasing P segregation to grain boundar

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Звіти організацій з теми "Grain boundary electron scattering"

Plitzko, Jurgen M., Geoffrey H. Campbell, Wayne E. King, Stephen M. Foiles, Christian Kisielowski, and Gerd Duscher. Study by atomistic theory and high-resolution electron microscopies of Cu atoms at an Al grain boundary. Office of Scientific and Technical Information (OSTI), 2003. http://dx.doi.org/10.2172/841694.

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Campbell, G. H., W. E. King, W. L. Wien, and S. M. Foiles. A high resolution electron microscopy study of the {Sigma}11 (113)/[110] symmetric tilt grain boundary in pure Al and Al-1.5 wt% Cu. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/231591.

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