Добірка наукової літератури з теми "Micro-Electronics industry"

Оформте джерело за APA, MLA, Chicago, Harvard та іншими стилями

Оберіть тип джерела:

Ознайомтеся зі списками актуальних статей, книг, дисертацій, тез та інших наукових джерел на тему "Micro-Electronics industry".

Біля кожної праці в переліку літератури доступна кнопка «Додати до бібліографії». Скористайтеся нею – і ми автоматично оформимо бібліографічне посилання на обрану працю в потрібному вам стилі цитування: APA, MLA, «Гарвард», «Чикаго», «Ванкувер» тощо.

Також ви можете завантажити повний текст наукової публікації у форматі «.pdf» та прочитати онлайн анотацію до роботи, якщо відповідні параметри наявні в метаданих.

Статті в журналах з теми "Micro-Electronics industry":

1

Hayward, Keith. "Micro-electronics: an industry in transition." International Affairs 65, no. 2 (1989): 338. http://dx.doi.org/10.2307/2622111.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Velinova, R. "Statistical modelling of wastewater quality: The case of micro-electronics industry." Water Research 29, no. 11 (November 1995): 2541–47. http://dx.doi.org/10.1016/0043-1354(95)00080-5.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Xu, Shu Bo, and Wen Cai Xu. "Printed Electronics Based on Precision Coating." Applied Mechanics and Materials 312 (February 2013): 550–53. http://dx.doi.org/10.4028/www.scientific.net/amm.312.550.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
The situation and development of the current main coating technology is analyzed at the view of the application of printed electronics at home and abroad. Spin coating, micro-gravure coating and slot die coating are the main coating technologies in the field of printed electronics.Along with the application of digital controlling technology and the progress of coating technology, precision coating technology will be more widely applied in printed electronics field and it also can promote the development of the printed electronics industry.
4

Oxley, C. H., R. H. Hopper, G. Hill, and G. A. Evans. "Improved infrared (IR) microscope measurements and theory for the micro-electronics industry." Solid-State Electronics 54, no. 1 (January 2010): 63–66. http://dx.doi.org/10.1016/j.sse.2009.09.022.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Lin, Y. P., L. L. Yen, L. Y. Pan, P. J. Chang, and T. J. Cheng. "Emerging epidemic in a growing industry: cigarette smoking among female micro-electronics workers in Taiwan." Public Health 119, no. 3 (March 2005): 184–88. http://dx.doi.org/10.1016/j.puhe.2004.03.005.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Acero Cacho, Raquel, Jorge Santolaria Mazo, and Marcos Pueo Arteta. "Double Flank Roll Testing as Verification Technique for Micro Gears." Key Engineering Materials 615 (June 2014): 45–50. http://dx.doi.org/10.4028/www.scientific.net/kem.615.45.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
In recent years there has been a considerable interest in microsystems, named as MEMS (Micro Electromechanical Systems). Its continuing expansion is expected, derived from the trend towards miniaturization of components and the increasing applications for these micro devices. To overcome this, the technology to produce these products known as microsystem technology (MST), has been improving in order to allow the manufacturing of this type of parts becoming of growing importance over the past years. Micro gears are commonly used in electronics industry where the miniaturization process follows a constant evolution with multiple use advantages despite their small size. In this work the study and analysis of the existing verification techniques for micro gears together with the definition of a double flank rolling test focused on these gears is presented.
7

Akhtar, Mohd Majid, Mohammad Zubair Khan, Mohd Abdul Ahad, Abdulfattah Noorwali, Danish Raza Rizvi, and Chinmay Chakraborty. "Distributed ledger technology based robust access control and real-time synchronization for consumer electronics." PeerJ Computer Science 7 (June 1, 2021): e566. http://dx.doi.org/10.7717/peerj-cs.566.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Background Consumer electronics or daily use home appliances are the basic necessity of every household. With the adoption of IoT in consumer electronics, this industry is set to rise exponentially. In recent times, the demand for consumer electronics rises amidst the pandemic due to a paradigm shift from in-office culture to work from home. Despite intelligent IoT devices, smart home configuration, and appliances at our disposal, the rudimentary client-server architecture fails to provide facilities like full access control of data and devices, transparency, secured communication, and synchronization between multiple devices, etc. to the users. Methods To overcome these limitations, Blockchain technology has been adopted in recent years, however, it has its own set of limitations in its widespread implementation. Hence, we propose a methodology using the IOTA platform, a distributed ledger technology (DLT) for secured communication between consumer electronics devices and appliances. Results The implementation provides access control, interoperability, data storage, and management with an exploratory insight towards a decentralized micro-payment use-case between Electric cars and charging stations.
8

Burling, Steven, Gary Nicholls, Stewart Hemsley, Sadayuki Nagatomo, and Kazuhiko Shiokawa. "Current Developments in Precious Metal Plating for the Semi - Conductor/Micro - Electronics Markets." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000112–20. http://dx.doi.org/10.4071/isom-2015-tp44.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
How the metal finishing (plating) industry is meeting the technical demands of the Microelectronic market as the demand of smaller, lighter, faster, cheaper moves on relentlessly. This paper will focus in particular on Pure Gold Plating, Silver Plating and Palladium Plating for this market. Electrolytic, electroless and immersion processes will be covered outlining the operating parameters and defining applications in particular to the rapidly changing electronic packaging market within microelectronics. In this market the effects of contamination on the deposit compositions, e.g. comparing a Modern Pure Gold Plating bath with traditional Pure Gold Plating processes, can be significant and will be discussed in detail. Details on silver plating for LED applications will also be covered in this paper. How these products are moving towards more Environmentally Friendly low and non-cyanide systems will also be shown.
9

Nodin, Muhamad Nor, and Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview." Advanced Materials Research 844 (November 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Polydimethylsiloxane (PDMS) commonly used for microcontact printing is essential towards the successful introduction of high speed printing of reel-to-reel or reel-to-plate manufacturing processes. Here, it is proposed that extending flexography printing method into the multiple micro-scale printing solid line onto subtract by using PDMS stamp as a plate. Flexography is a high-speed technique commonly used for printing onto substrates in a lot of paper printing industry. It was introduces a decade ago where it is very useful for large production. In this area of printing, the expanding demand on printing electronics leads to a lot of study needed for high speed and large production of electronic industries. This work elaborates the feasibility of PDMS stamp (12in x 4in) use in flexography printing for multiple micro solid lines. It will undergo by using simple and inexpensive fabrication PDMS mold process. This paper illustrates the use of PDMS in microcontact printing fusing with flexography printing to produce multiple micro-solid line printing capability by using conductive ink as application of printing electronic industry applications.
10

Bočková, Nina, and Tomáš Meluzín. "R&D investments as Possible Factors of Company’s Competitiveness." Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis 64, no. 6 (2016): 1857–67. http://dx.doi.org/10.11118/actaun201664061857.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
This article describes the impact of R&D investment to on the economic stability in the Czech electronics industry in the period 2007–2014. Increasing the competitiveness of companies is conditional on the systematic investments, development and stability of companies. Searching for competitive advantage through innovation may be one of the ways of how to obtaining a stab. market position in the industry. The aim of this article was is to determine whether there are relations between changes of economic indicators and the reporting process of research activities for innovative companies in the electronics industry. The research was conducted among 103 companies based in the Czech Republic, which invested in R&D in 2007 – 2013. The comparison was made between companies which invested in the 2007 – 2013 in the annual or occasional R&D. Two subgroups were established and companies in each subgroup were monitored companies according to their size. Spearman’s rank correlation was used to assess if relationships among R&D Expenditure and Operating Revenue were preserved across periods. Two hypotheses were formulated and verified on the basis of statistical data processing of innovative companies. The results showed that innovative companies had the ability to better capitalize on their asset base, and they are better able to cover their needs from their own resources better than other companies of in the electronics industry. Their ability to provide a return on equity varies by according to company size. Innovative companies showed an ability to reach a positive outcome from operating activities. The coefficient of self-financing for SMEs is for SMEs constantly above the industry mean and increases with the length of period of time. This trend was not confirmed for micro-companies and large companies this trend was not confirmed.

Дисертації з теми "Micro-Electronics industry":

1

Blair, Daniel P. "SolarBridge Technologies: Entrepreneurship in the Solar Inverter Industry." Case Western Reserve University School of Graduate Studies / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=case1301506263.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Al-Kharaz, Mohammed. "Analyse multivariée des alarmes de diagnostic en vue de la prédiction de la qualité des produits." Thesis, Aix-Marseille, 2021. http://theses.univ-amu.fr.lama.univ-amu.fr/211207_ALKHARAZ_559anw633vgnlp70s324svilo_TH.pdf.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Cette thèse s’intéresse à la prédiction de la qualité de produits et à l’amélioration de la performance des alarmes de diagnostics au sein d’une usine de semi-conducteurs. Pour cela, nous exploitons l’historique des alarmes collecté durant la production. Premièrement, nous proposons une approche de modélisation et d’estimation du risque de dégradation du produit final associé à chaque alarme déclenchée en fonction du comportement d’activation de celle-ci sur l’ensemble des produits durant la production. Deuxièmement, en utilisant les valeurs de risque estimées pour toute alarme, nous proposons une approche de prédiction de la qualité finale d’un lot de produits. Grâce à l’utilisation des techniques d’apprentissage automatique, cette approche modélise le lien entre les événements d’alarmes des processus et la qualité finale du lot. Dans la même veine, nous proposons une autre approche basée sur le traitement du texte d’évènement d’alarmes dans le but de prédire la qualité finale du produit. Cette approche présente une amélioration en termes de performances et en termes d’exploitation de plus d’information disponible dans le texte d’alarme. Enfin, nous proposons un cadre d’analyse des activations d’alarmes en présentant un ensemble d’outils d’évaluation de performances et plusieurs techniques de visualisation interactive plus adaptées pour la surveillance et l’évaluation des processus de fabrication de semi-conducteurs. Pour chacune des approches susmentionnées, l’efficacité est démontrée à l’aide d’un ensemble de données réelles obtenues à partir d’une usine de fabrication de semi-conducteurs
This thesis addresses the prediction of product quality and improving the performance of diagnostic alarms in a semiconductor facility. For this purpose, we exploit the alarm history collected during production. First, we propose an approach to model and estimate the degradation risk of the final product associated with each alarm triggered according to its activation behavior on all products during production. Second, using the estimated risk values for any alarm, we propose an approach to predict the final quality of the product's lot. This approach models the link between process alarm events and the final quality of product lot through machine learning techniques. We also propose a new approach based on alarm event text processing to predict the final product quality. This approach improves performance and exploits more information available in the alarm text. Finally, we propose a framework for analyzing alarm activations through performance evaluation tools and several interactive visualization techniques that are more suitable for semiconductor manufacturing. These allow us to closely monitor alarms, evaluate performance, and improve the quality of products and event data collected in history. The effectiveness of each of the above approaches is demonstrated using a real data set obtained from a semiconductor manufacturing facility

Книги з теми "Micro-Electronics industry":

1

Kaplinsky, Raphael. Micro-electronics and employment revisited: A review. Geneva: International Labour Office, 1987.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Kaplinsky, Raphael. Micro-electronics and employment revisited: A review. Geneva: International Labour Office, 1987.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Hoffman, Kurt. Micro-electronics and clothing: The impact of technical change on a global industry. New York: Praeger, 1988.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Hoffman, Kurt. Micro-electronics and clothing: The impact of technical change on a global industry. New York: Praeger, 1988.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Pugel, Thomas, Richard R. Nelson, Richard Langlois, Carmela S. Haklisch, and William Egelhoff. Micro-Electronics: An Industry in Transition. Taylor & Francis Group, 2018.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Pugel, Thomas, Richard R. Nelson, Richard Langlois, Carmela S. Haklisch, and William Egelhoff. Micro-Electronics: An Industry in Transition. Taylor & Francis Group, 2020.

Знайти повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.

Частини книг з теми "Micro-Electronics industry":

1

Schwarz, Bernd, Hans Jürgen Albrecht, Gunnar Petzold, Jörg Deliga, and Christian Wegener. "Simulation in the Industry." In Benefiting from Thermal and Mechanical Simulation in Micro-Electronics, 1–16. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/978-1-4757-3159-0_1.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Halder, Kumaresh, Dibyendu Mandal, Karabi Ganguly, Swati Sikdar, and Sandip Bag. "The Effects of Metal Ion Doped Ceramic Fillers into Poly (Vinylidene Fluoride) Matrix: A Comparative Investigation and Its Application in Micro-Electronics Industry." In Studies in Autonomic, Data-driven and Industrial Computing, 309–24. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-7305-4_31.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Islam, Nazrul, and Ndubuisi Ekekwe. "Disruptive Technologies, Innovation and Global Redesign." In Disruptive Technologies, Innovation and Global Redesign, 1–11. IGI Global, 2012. http://dx.doi.org/10.4018/978-1-4666-0134-5.ch001.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Innovations from disruptive technologies drive new opportunities through provision of higher-valued products and services. They create new markets and reshape established ones, enabling changes across industries, and consequently impact the competitive landscape through formation of new business models. Disruptive innovations have recently been applied to a wide variety of sectors such as consumer electronics, micro-lending, mobile banking, portable water filters, and cell phones, which continue to capture market share in the global telecommunication industry. Data shows that innovation correlates with better quality of life when it diffuses into societies and economies. The rich nations see it as a way to stave off poverty while the poor ones are depending on it to accelerate economic growth. Indeed, it is the gun-powder of the knowledge world, at firm, nation, and regional levels. This chapter explains how it grasps the demand of a non-mainstream market, survey the unknown market, and over time, lead the whole market, resulting in cultural, social, and economic changes. A closer examination of the five habits, usually associated with the purveyors of innovation, using the gaming industry, the fastest-growing mass media and entertainment industry, is provided.
4

Harcourt, Alison, George Christou, and Seamus Simpson. "The Internet of Things." In Global Standard Setting in Internet Governance, 189–209. Oxford University Press, 2020. http://dx.doi.org/10.1093/oso/9780198841524.003.0011.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Apple iPhones do not use the standardized micro-Universal Serial Bus (USB) port but specialized ports for their proprietary Lightning connectors. However, in October 2018, Apple’s vice-president of hardware engineering John Ternus announced the switch to USB-C for the new generation of iPads from 2019. Apple iPhone is expected to follow suit. This marks the end to a long battle over port standardization for personal computers within the Institute of Electrical and Electronics Engineers (IEEE). The change came about due to a push from the European Commission for industry to agree on a universally proprietary free standard. This chapter documents how states have been increasingly involved in steering intellectual property rights (IPR) policies within standards-developing organization (SDO) fora. Civil society too has had a role to play from the stance of open source solutions to interoperability, albeit with less and varying degrees of success across the fora. The chapter focuses on how state pressure has counterbalanced historic corporate pressure for preserving patent protection.
5

Kwon, Hyeong-ki. "Transition II." In Changes by Competition, 108–27. Oxford University Press, 2021. http://dx.doi.org/10.1093/oso/9780198866060.003.0006.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
The reforms initiated in the late 1970s took time to materialize the detailed form of new developmentalism. Conflicts between state policymakers and large corporations slowly produced adjustments through tedious attrition in the Roh Tae-woo (1988–92) and Kim Young-sam (1993–7) administrations. Large corporations wanted input-oriented volume expansionism, while economic bureaucrats pressed to change private corporations’ strategy toward specialization in core business. This chapter examines how industrial politics between the state and the private firms, as well as within the state, evolved in the Roh and Kim administrations, and why Korea continued state-led developmentalism by contentious adjustments. First this chapter examines the industrial politics between state and business, as well as among the ministries within the state during the Roh and Kim administrations. And before exploring the transformation following the Asian financial crisis, this chapter examines the electronics industry for a micro-level analysis of Korea’s new developmentalism.
6

Wang, Chia-Hui, Ray-I. Chang, and Jan-Ming Ho. "Collaborative Video Surveillance for Distributed Visual Data Mining of Potential Risk and Crime Detection." In Surveillance Technologies and Early Warning Systems, 194–204. IGI Global, 2011. http://dx.doi.org/10.4018/978-1-61692-865-0.ch010.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Thanks to fast technology advancement of micro-electronics, wired/wireless networks and computer computations in past few years, the development of intelligent, versatile and complicated video-based surveillance systems has been very active in both research and industry to effectively enhance safety and security. In this chapter, the authors first introduce the generations of video surveillance systems and their applications in potential risk and crime detection. For effectively supporting early warning system of potential risk and crime (which is load-heavy and time-critical), both collaborative video surveillance and distributed visual data mining are necessary. Moreover, as the surveillance video and data for safety and security are very important for all kinds of risk and crime detection, the system is required not only to data protection of the message transmission over Internet, but also to further provide reliable transmission to preserve the visual quality-of-service (QoS). As cloud computing, users do not need to own the physical infrastructure, platform, or software. They consume resources as a service, where Infrastructure-as-a-Service (IaaS), Platform-as-a-Service (PaaS), Software-as-a-Service (SaaS), and pay only for resources that they use. Therefore, the design and implementation of an effective communication model is very important to this application system.
7

Wang, Chia-Hui, Ray-I. Chang, and Jan-Ming Ho. "Collaborative Video Surveillance for Distributed Visual Data Mining of Potential Risk and Crime Detection." In Wireless Technologies, 713–24. IGI Global, 2012. http://dx.doi.org/10.4018/978-1-61350-101-6.ch313.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Thanks to fast technology advancement of micro-electronics, wired/wireless networks and computer computations in past few years, the development of intelligent, versatile and complicated video-based surveillance systems has been very active in both research and industry to effectively enhance safety and security. In this chapter, the authors first introduce the generations of video surveillance systems and their applications in potential risk and crime detection. For effectively supporting early warning system of potential risk and crime (which is load-heavy and time-critical), both collaborative video surveillance and distributed visual data mining are necessary. Moreover, as the surveillance video and data for safety and security are very important for all kinds of risk and crime detection, the system is required not only to data protection of the message transmission over Internet, but also to further provide reliable transmission to preserve the visual quality-of-service (QoS). As cloud computing, users do not need to own the physical infrastructure, platform, or software. They consume resources as a service, where Infrastructure-as-a-Service (IaaS), Platform-as-a-Service (PaaS), Software-as-a-Service (SaaS), and pay only for resources that they use. Therefore, the design and implementation of an effective communication model is very important to this application system.

Тези доповідей конференцій з теми "Micro-Electronics industry":

1

Oxley, C. H., R. H. Hopper, and G. A. Evans. "Improved infrared (IR) microscope measurements for the micro-electronics industry." In 2008 2nd Electronics Systemintegration Technology Conference. IEEE, 2008. http://dx.doi.org/10.1109/estc.2008.4684352.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
2

Brijs, B. "Advanced RBS analysis of thin films in micro-electronics." In The CAARI 2000: Sixteenth international conference on the application of accelerators in research and industry. AIP, 2001. http://dx.doi.org/10.1063/1.1395351.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
3

Zhang, Fei, Jun Duan, XiaoYan Zeng, and XiangYou Li. "355nm DPSS UV laser micro-processing for the semiconductor and electronics industry." In SPIE LASE, edited by Hiroyuki Niino, Michel Meunier, Bo Gu, and Guido Hennig. SPIE, 2010. http://dx.doi.org/10.1117/12.845689.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
4

Chang, Jen-Shih, H. Tsubone, G. D. Harvel, and K. Urashima. "Capillary/Narrow Flow Channel Driven EHD Gas Pump for an Advanced Thermal Management of Micro-Electronics." In 2008 IEEE Industry Applications Society Annual Meeting (IAS). IEEE, 2008. http://dx.doi.org/10.1109/08ias.2008.91.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
5

Lei, Weisheng, Wentao Hu, and Qiang Fu. "Micro-machining applications of green (second harmonic) solid state lasers in the electronics manufacturing industry." In ICALEO® 2001: Proceedings of the Laser Materials Processing Conference and Laser Microfabrication Conference. Laser Institute of America, 2001. http://dx.doi.org/10.2351/1.5059846.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
6

Wang, Li, Kuo-Hua Liu, Ching-Chuan Tseng, Anton V. Prokhorov, Hazlie Mokhlis, Chua Kein Huat, and Manoj Tripathy. "Evaluation of Summation Results of Injected Third-Order Harmonic Currents Produced by Micro Hydro Generators with Power-Electronics Converters Using a Probabilistic Approach." In 2021 IEEE Industry Applications Society Annual Meeting (IAS). IEEE, 2021. http://dx.doi.org/10.1109/ias48185.2021.9677190.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
7

Gajapath, Satya S., Sushanta K. Mitra, and Patricio F. Mendez. "Modeling of Micro Electron Beam Welding With Melting and Evaporation." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-88427.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Integrating the components at micro and nano levels is becoming a challenge as the demand to scale the devices further down grows, especially in the micro-electronics and medical industry. The current use of microwelding technology using laser and electron beams suffers from a major set back of excessive surface ablation. The present paper proposes using electron beam as a volume heating source to avoid surface ablation and arrives at the conditions to micro-weld successfully through numerical analysis.
8

Korotash, I. V., and E. M. Rudenko. "Optical test method of HTSC structures for creating miniature elements and devices for the optical-instrument-building industry." In International Conference on Optical Diagnostics of Materials and Devices for Opto-, Micro-, and Quantum Electronics, edited by Sergey V. Svechnikov and Mikhail Y. Valakh. SPIE, 1995. http://dx.doi.org/10.1117/12.226164.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
9

Zhao, Zheng, Beibei Feng, Xingtuan Yang, and Yanfei Sun. "Prospect of MAO Technology Application in Nuclear Power Industry." In 2013 21st International Conference on Nuclear Engineering. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/icone21-15435.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Micro arc oxidation (MAO) technology known as a newly surface treatment technology has got a widely application in the field of aviation, aerospace, automotive, electronics, and medical industry. Strength, toughness, hardness and corrosion of valve metal such as aluminum, magnesium, copper, zinc, zirconium and their alloys can be greatly improved by MAO technology. This paper tries to probe into the feasibility of using MAO technology in nuclear power industry. Aluminum and its alloys are used as structural materials such as the cladding of reactor fuel and all kinds of pipes in the low nuclear reactor. Zirconium alloys are widely used for the fuel cladding, cannula, catheter and other components of the fuel assemblies. Titanium and its alloys offer a unique combination of desirable mechanical properties which makes them to be the candidate materials for structural application in the field of nuclear energy. The surface of all these materials may be destroyed which increasing the risk of the nuclear accident due to the severe serving conditions. As a result, it is necessary to improve the corrosion and wear resistance behavior. With the urgent requirements of safety and durability of nuclear reactor, MAO technology must have a broad prospect in nuclear industry.
10

Wilson, Merrill A., Kurt Recknagle, and Kriston Brooks. "Design and Development of a Low-Cost, High Temperature Silicon Carbide Micro-Channel Recuperator." In ASME Turbo Expo 2005: Power for Land, Sea, and Air. ASMEDC, 2005. http://dx.doi.org/10.1115/gt2005-69143.

Повний текст джерела
Стилі APA, Harvard, Vancouver, ISO та ін.
Анотація:
Typically, ceramic micro-channel devices are used for high temperature heat exchangers, catalytic reactors, electronics cooling, and processing of corrosive streams where the thermomechanical benefits of ceramic materials are desired. These benefits include: high temperature mechanical and corrosion properties and tailorable material properties such as thermal expansion, electrical conductivity and thermal conductivity. In addition, by utilizing Laminated Object Manufacturing (LOM) methods, inexpensive ceramic materials can be layered, featured and laminated in the green state and co-sintered to form monolithic structures amenable to mass production. In cooperation with the DOE and Pacific Northwest National Labs, silicon carbide (SiC) based micro-channel recuperator concepts are being developed and tested. The performance benefits of a high temperature, micro-channel heat exchanger are realized from the improved thermal efficiency of the high temperature cycles and the improved effectiveness of micro-channels for heat transfer. In designing these structures, the heat and mass transfer within the micro-channels are being analyzed with heat transfer models, computational fluid dynamics models and validated with experimental results. As an example, a typical micro-turbine cycle was modified and modeled to incorporate this ceramic recuperator and it was found that the overall thermal efficiency of the micro-turbine could be improved from about 27% to over 40%. Process improvements require technical advantages and cost advantages. These LOM methodologies have been based on well-proven industry standard processes where labor, throughput and capital estimates have been tested. Following these cost models and validation at the prototype scale, cost estimates were obtained. For the micro-turbine example, cost estimates indicate that the high-temperature SiC recuperator would cost about $200 per kWe. The development of these heat exchangers is multi-faceted and this paper focuses on the design optimization of a layered micro-channel heat exchanger, its performance testing, and fabrication development through LOM methodologies.

До бібліографії