Academic literature on the topic '3D integrated circuit'
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Journal articles on the topic "3D integrated circuit"
Koo, Jae-Mo, Sungjun Im, Linan Jiang, and Kenneth E. Goodson. "Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures." Journal of Heat Transfer 127, no. 1 (2005): 49–58. http://dx.doi.org/10.1115/1.1839582.
Full textWang, Shaoxi, Yue Yin, Chenxia Hu, and Pouya Rezai. "3D Integrated Circuit Cooling with Microfluidics." Micromachines 9, no. 6 (2018): 287. http://dx.doi.org/10.3390/mi9060287.
Full textKim, Bruce, Sukeshwar Kannan, Anurag Gupta, and Naga Sai Evana. "Modeling and Simulation of 3D MEMS Integrated RF Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 002006–27. http://dx.doi.org/10.4071/2012dpc-wp35.
Full textIndrusiak, Leandro Soares, and Ricardo Augusto da Luz Reis. "3D integrated circuit layout visualization using VRML." Future Generation Computer Systems 17, no. 5 (2001): 503–11. http://dx.doi.org/10.1016/s0167-739x(00)00036-4.
Full textAndras Moritz, Csaba. "Architecting 3D integrated circuit fabrics at nanoscale." Research Outreach, no. 108 (July 10, 2019): 122–25. http://dx.doi.org/10.32907/ro-108-122125.
Full textBehroozpour, Behnam, Phillip A. M. Sandborn, Niels Quack, et al. "Electronic-Photonic Integrated Circuit for 3D Microimaging." IEEE Journal of Solid-State Circuits 52, no. 1 (2017): 161–72. http://dx.doi.org/10.1109/jssc.2016.2621755.
Full textLi, Mingyu, Jiajun Shi, Mostafizur Rahman, Santosh Khasanvis, Sachin Bhat, and Csaba Andras Moritz. "Skybridge-3D-CMOS: A Fine-Grained 3D CMOS Integrated Circuit Technology." IEEE Transactions on Nanotechnology 16, no. 4 (2017): 639–52. http://dx.doi.org/10.1109/tnano.2017.2700626.
Full textPetrosyants, Konstantin O., and Nikita I. Ryabov. "Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages." Energies 13, no. 12 (2020): 3054. http://dx.doi.org/10.3390/en13123054.
Full textSabbavarapu, Srinivas, Amit Acharyya, P. Balasubramanian, and C. Ramesh Reddy. "Fast 3D Integrated Circuit Placement Methodology using Merging Technique." Defence Science Journal 69, no. 3 (2019): 217–22. http://dx.doi.org/10.14429/dsj.69.14410.
Full textHubbard, Joshua D., Ruben Acevedo, Kristen M. Edwards, et al. "Fully 3D-printed soft robots with integrated fluidic circuitry." Science Advances 7, no. 29 (2021): eabe5257. http://dx.doi.org/10.1126/sciadv.abe5257.
Full textDissertations / Theses on the topic "3D integrated circuit"
Sekar, Deepak Chandra. "Optimal signal, power, clock and thermal interconnect networks for high-performance 2d and 3d integrated circuits." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26562.
Full textAhmed, Mohammad Abrar. "Early Layout Design Exploration in TSV-based 3D Integrated Circuits." PDXScholar, 2017. https://pdxscholar.library.pdx.edu/open_access_etds/3617.
Full textContreras, Andres A. "Micronetworking: Reliable Communication on 3D Integrated Circuits." DigitalCommons@USU, 2010. https://digitalcommons.usu.edu/etd/728.
Full textZaveri, Jesal. "Electrical and fluidic interconnect design and technology for 3D ICS." Thesis, Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/39550.
Full textKim, Dae Hyun. "Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/43642.
Full textKnechtel, Johann. "Interconnect Planning for Physical Design of 3D Integrated Circuits." Doctoral thesis, Saechsische Landesbibliothek- Staats- und Universitaetsbibliothek Dresden, 2014. http://nbn-resolving.de/urn:nbn:de:bsz:14-qucosa-143635.
Full textXu, Yuanzhe, and 徐远哲. "Variational analysis for 3D integrated circuit on-chip structures based on process-variation-aware electromagnetic-semiconductor coupledsimulation." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2011. http://hub.hku.hk/bib/B47047616.
Full textNeveu, Florian. "Design and implementation of high frequency 3D DC-DC converter." Thesis, Lyon, INSA, 2015. http://www.theses.fr/2015ISAL0133/document.
Full textDoan, Nguyen Anh Vu. "Multi-Objective Optimization and Multi-Criteria Decision Aid Applied to the Design of 3D-Stacked Integrated Circuits." Doctoral thesis, Universite Libre de Bruxelles, 2015. https://dipot.ulb.ac.be/dspace/bitstream/2013/216785/4/thesis.pdf.
Full textFkih, Yassine. "Conception en vue du Test des Circuits Intégrés 3D à base de TSVs." Thesis, Montpellier 2, 2014. http://www.theses.fr/2014MON20063/document.
Full textBooks on the topic "3D integrated circuit"
Integrated interconnect technologies for 3D nanoelectronic systems. Artech House, 2009.
Find full textThree-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Hanser Publishers, 2014.
Find full textKhan, Nauman, and Soha Hassoun. Designing TSVs for 3D Integrated Circuits. Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-5508-0.
Full textSalah, Khaled, Yehea Ismail, and Alaa El-Rouby. Arbitrary Modeling of TSVs for 3D Integrated Circuits. Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-07611-9.
Full textElectrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC. Wiley-IEEE Press, 2011.
Find full textLim, Sung Kyu. Design for High Performance, Low Power, and Reliable 3D Integrated Circuits. Springer New York, 2013.
Find full textLim, Sung Kyu. Design for High Performance, Low Power, and Reliable 3D Integrated Circuits. Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9542-1.
Full textJapan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto. Stress Induced Phenomena and Reliability in 3D Microelectronics: Kyoto, Japan, 28-30 May 2012. Edited by Ho P. S. editor. AIP Publishing, 2014.
Find full textBook chapters on the topic "3D integrated circuit"
Checka, Nisha. "Circuit Architectures for 3D Integration." In Integrated Circuits and Systems. Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76534-1_13.
Full textBurns, James, Brian Aull, Robert Berger, et al. "An SOI-Based 3D Circuit Integration Technology." In Integrated Circuits and Systems. Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76534-1_8.
Full textTakahashi, Hiroshi, Senling Wang, Shuichi Kameyama, et al. "Trends in 3D Integrated Circuit (3D-IC) Testing Technology." In Three-Dimensional Integration of Semiconductors. Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-18675-7_8.
Full textLi, Li. "Three-Dimensional System-in-Package for Application-Specific Integrated Circuit and Three-Dimensional Dynamic Random-Access Memory Integration." In 3D Integration in VLSI Circuits. CRC Press, 2018. http://dx.doi.org/10.1201/9781315200699-2.
Full textBelleville, Marc. "3D Integration for Digital and Imagers Circuits: Opportunities and Challenges." In Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-17752-1_31.
Full textArnaldo, Ignacio, José L. Risco-Martín, José L. Ayala, and J. Ignacio Hidalgo. "Power Profiling-Guided Floorplanner for Thermal Optimization in 3D Multiprocessor Architectures." In Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-24154-3_2.
Full textZanini, Francesco, David Atienza, and Giovanni De Micheli. "Convex-Based Thermal Management for 3D MPSoCs Using DVFS and Variable-Flow Liquid Cooling." In Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-24154-3_34.
Full textEbi, Thomas, Holm Rauchfuss, Andreas Herkersdorf, and Jörg Henkel. "Agent-Based Thermal Management Using Real-Time I/O Communication Relocation for 3D Many-Cores." In Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-24154-3_12.
Full textRahmani, Amir-Mohammad, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, and Hannu Tenhunen. "Power and Area Optimization of 3D Networks-on-Chip Using Smart and Efficient Vertical Channels." In Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-24154-3_28.
Full textPatti, Robert S. "3D Memory." In Integrated Circuits and Systems. Springer US, 2008. http://dx.doi.org/10.1007/978-0-387-76534-1_12.
Full textConference papers on the topic "3D integrated circuit"
Ehsan, Md Amimul, Zhen Zhou, and Yang Yi. "Neuromorphic 3D Integrated Circuit." In GLSVLSI '17: Great Lakes Symposium on VLSI 2017. ACM, 2017. http://dx.doi.org/10.1145/3060403.3060470.
Full textPathak, Divya, and Ioannis Savidis. "Power supply voltage detection and clamping circuit for 3-D integrated circuits." In 2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S). IEEE, 2014. http://dx.doi.org/10.1109/s3s.2014.7028202.
Full textJieliang Lu, Qin Wang, Jing Xie, and Zhigang Mao. "TSVs-aware floorplanning for 3D integrated circuit." In 2013 IEEE 10th International Conference on ASIC (ASICON 2013). IEEE, 2013. http://dx.doi.org/10.1109/asicon.2013.6812068.
Full textDai, Yong-sheng, Xiang-zhi Chen, Mao-ya Yang, and Jian-hua Zhu. "Researches of UWB MMIC control circuits and LTCC 3D integrated circuit technology." In 2016 International Conference on Integrated Circuits and Microsystems (ICICM). IEEE, 2016. http://dx.doi.org/10.1109/icam.2016.7813566.
Full textRahman, Mostafizur, Santosh Khasanvis, Jiajun Shi, Mingyu Li, and Csaba Andras Moritz. "Fine-grained 3-D integrated circuit fabric using vertical nanowires." In 2015 International 3D Systems Integration Conference (3DIC). IEEE, 2015. http://dx.doi.org/10.1109/3dic.2015.7334563.
Full textChen, Yung-Tin, and Steve Radigan. "Pushing KrF photolithography limit for 3D integrated circuit." In Microlithography 2004, edited by Bruce W. Smith. SPIE, 2004. http://dx.doi.org/10.1117/12.544386.
Full textLevine, Zachary H., and Steven Grantham. "X-Ray Tomography of Integrated Circuit Interconnects: Past and Future." In ISTFA 2001. ASM International, 2001. http://dx.doi.org/10.31399/asm.cp.istfa2001p0011.
Full textYuan Xie and Yuchun Ma. "Design space exploration for 3D integrated circuits." In 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT). IEEE, 2008. http://dx.doi.org/10.1109/icsict.2008.4735042.
Full textLau, John H., Ying Ying Lim, Teck Guan Lim, et al. "Design and analysis of 3D stacked optoelectronics on optical printed circuit boards." In Integrated Optoelectronic Devices 2008, edited by Alexei L. Glebov and Ray T. Chen. SPIE, 2008. http://dx.doi.org/10.1117/12.764032.
Full textLi, Jing, and Hiroshi Miyashita. "Post-placement Thermal Via Planning for 3D Integrated Circuit." In APCCAS 2006 - 2006 IEEE Asia Pacific Conference on Circuits and Systems. IEEE, 2006. http://dx.doi.org/10.1109/apccas.2006.342144.
Full textReports on the topic "3D integrated circuit"
Chu, D., and D. W. Palmer. 3D packaging for integrated circuit systems. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/420397.
Full textShakouri, Ali, Bin Liu, Patrick Abraham, and John E. Bowers. 3D Photonic Integrated Circuits for WDM Applications. Defense Technical Information Center, 1998. http://dx.doi.org/10.21236/ada461796.
Full textAhmed, Mohammad. Early Layout Design Exploration in TSV-based 3D Integrated Circuits. Portland State University Library, 2000. http://dx.doi.org/10.15760/etd.5509.
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