Relevant bibliographies by topics / 3D molded interconnect devices

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic '3D molded interconnect devices'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "3D molded interconnect devices"

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Polzinger, Bernhard, Vladimir Matic, Laura Liedtke, et al. "Printing of Functional Structures on Molded 3D Devices." Advanced Materials Research 1038 (September 2014): 37–42. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.37.

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This paper summarizes the results on inkjet printing and characterization of functional structures on molded 2D and 3D devices. Different injection molded thermoplastics, a transfer molded thermoset and polyimide foil as substrate materials were used. Conductive structures were obtained by inkjet printing of a commercial available silver nanoparticle ink. The use of printable acrylic based ink enabled the fabrication of conductor crossovers or multilayers. Results on inkjet printed temperature sensitive structures and an inkjet printed intrusion sensor device as well as an inkjet printed elect
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Cui, Liangyu, Chengjuan Yang, Yanling Tian, and Dawei Zhang. "Development and Application of Molded Interconnect Devices." International Journal of Robotics Applications and Technologies 2, no. 1 (2014): 1–18. http://dx.doi.org/10.4018/ijrat.2014010101.

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With the improvements of electromechanical systems' automation and intelligence, contradiction between the high integration, high performance and miniaturization, low cost has become the principal reason restricting the development of electromechanical system. The emergence of molded interconnection device (MID) technology provides a new way to resolve this contradiction. Integration of the mechanical and electrical functions in electromechanical system onto the same polymer molded base structure, replacement of the tradition printed circuit board (PCB), design and processing of 3D circuit sys
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Zhuo, Yong. "Integration of 3D-Routing for the Design of Molded Interconnect Devices." Advanced Materials Research 139-141 (October 2010): 1109–12. http://dx.doi.org/10.4028/www.scientific.net/amr.139-141.1109.

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One of the fundamental innovations in the field of mechatronics is the direct material integration of mechanical and electronic functions using Molded Interconnect Devices (MID technology). Unlike conventional circuit boards, they are not limited to two dimensions but offer the possibility to arbitrarily lay printed circuit traces on the surfaces of the 3D carrier, traditional 2D routing function in EDA cannot be directly applied in MID design. In this paper, two new 3D automatic routing methods are introduced. One method is based on a grid graph and extends Hadlock’s minimum detour algorithm;
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Zhuo, Yong, Juan Peng, and Yan Jun Wu. "Design and Simulation of Molded Interconnect Devices with Two Shot Molding." Advanced Materials Research 295-297 (July 2011): 1651–55. http://dx.doi.org/10.4028/www.scientific.net/amr.295-297.1651.

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Three Dimensional Molded Interconnect Devices (3D-MID) has enormous potential for rationalization in both manufacturing process and the freedom to design of mechatronic products. Two shot molding is one of the most important and commonly used methods among the various MID manufacturing processes. Currently, there is a lack of effective design and simulation tools that can be used for MID with two shot molding. In this paper, an integrated product model using feature technology, some MID-specific design functions, and one special interface based on the API of Moldflow Plastics Insight (MPI) and
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Siengchin, Suchart, Supakit Chuaping, and Thomas Mann. "Glass Fiber/Polyphthalamide Composites for 3D-Molded Interconnect Devices Application: Structure and Properties." Polymer-Plastics Technology and Engineering 55, no. 15 (2016): 1613–22. http://dx.doi.org/10.1080/03602559.2016.1163599.

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Schmidt, Marc-Peter, Aleksandr Oseev, Christian Engel, Andreas Brose, Bertram Schmidt, and Sören Hirsch. "Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application." Journal of Sensors and Sensor Systems 5, no. 1 (2016): 55–61. http://dx.doi.org/10.5194/jsss-5-55-2016.

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Abstract. The current contribution reports about the fabrication technology for the development of novel microfluidic impedance spectroscopy sensors that are directly attachable on 3-D molded interconnect devices (3D-MID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications. Advantages of the MID technology in particular for an automotive industry application were recently discussed (Moser and Krause, 2006). An ability to integrate electrical and fluidic parts into the 3D-MID platform brings a sensor device to a new level of the miniaturization. The demonstr
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Wu, Yan Jun, Yong Zhuo, Juan Peng, Xuan Wu, and Xin Zhao. "Kinematic Analysis and Simulation of MID Laser Direct Structuring Equipment." Advanced Materials Research 590 (November 2012): 236–41. http://dx.doi.org/10.4028/www.scientific.net/amr.590.236.

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Molded Interconnect Devices (MID) is an innovative technology in the field of mechatronics which abandons the conventional circuit boards and integrates the mechanical and electronic functions directly on the 3D injection molded thermoplastics. The Laser Direct Structuring (LDS) is the most efficient and advanced technology for the manufacrure of MID. In this paper, LDS technology and equipment have been introduced. Then through kinematic modeling analysis of the LDS equipment, getting the forward and inverse solution of laser focus position in the 3D space. And the LDS equipment processing pa
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Bachnak, Nouhad. "MEMS Packaging with 3D-MID Technology." International Symposium on Microelectronics 2011, no. 1 (2011): 000484–90. http://dx.doi.org/10.4071/isom-2011-wa1-paper6.

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3D-MID (three dimensional molded interconnect devices) technology (which is already broadly used for 3D-MID mobile phone antennas) is also used for MEMS packaging and sensors applications. 3D-MID allows miniaturization by the integration of mechanical and electronic functions in one part. The 3D electronic circuit is integrated into a 3D plastic casing or carrier, making it possible to achieve much more compact construction and much greater function density. More and more applications involving electrical and electro-optical circuits are made using 3D-MID technology. Typical 3D-MID application
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Zhuo, Yong, Yan Jun Wu, and Juan Peng. "Design and Simulation of 3D Layout for MID Based on Open CASCADE." Advanced Materials Research 479-481 (February 2012): 1978–81. http://dx.doi.org/10.4028/www.scientific.net/amr.479-481.1978.

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Molded Interconnect Devices (MID) is an innovative technology which abandoned the conventional board and integrates the mechanical and electronic functions directly on materials. Due to the complex process, the existing MCAD and ECAD do not meet the requirements of MID, so an MID prototype system for design and simulation of 3D layout based on Open CASCADE has been developed in this paper. Through studying on the algorithm of 3D automatic routing, realized the functions of placement of 3D electronic components and 3D automatic routing. Also, simulation for 3D laser direct structuring and place
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Zeitler, Jochen, Bernhard Götze, Christian Fischer, and Jörg Franke. "Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools." Advanced Materials Research 1038 (September 2014): 11–17. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.11.

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Molded Interconnect Devices can be considered as attractive option for the integration of electronic functions into mechanical systems. While development methods and procedures reached high standards, CAD tools still drag behind. This paper focusses the necessary software structure for implementing of automated routing algorithms or other MID specific extensions into CAD tools. An innovative three-layer model will be introduced and explained in detail. This paper also describes a method for mapping electrical components on unfolded surfaces for the further implementation of the automated routi
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Dissertations / Theses on the topic "3D molded interconnect devices"

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Kamotesov, Sergkei. "Transmission d’énergie par induction électromagnétique en plastronique 3D." Thesis, Lyon, 2019. http://www.theses.fr/2019LYSE1353.

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L’objectif de la thèse est d’évaluer l’intérêt de la plastronique 3D dans le domaine de la transmission d’énergie à distance par induction électromagnétique (TEDIM). En effet, la TEDIM est actuellement basée sur des inductances planes, qui n’autorisent un transfert d’énergie entre émetteur et récepteur que sur une courte à moyenne distance, à condition de plus qu’elles soient alignées. Dans ce manuscrit est étudié le cas particulier de récepteurs de forme 3D disposés à l’intérieur d’une boite émettrice de 50 cm de côté comportant 4 inductances émettrices. Différents récepteurs avec des inducta
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Kaiser, Ingo [Verfasser]. "Systematik zur Entwicklung mechatronischer Systeme in der Technologie MID (Molded Interconnect Devices) / Ingo Kaiser." Paderborn : Universitätsbibliothek, 2009. http://d-nb.info/1033310107/34.

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Jürgenhake, Christoph [Verfasser]. "Systematik für eine prototypenbasierte Entwicklung mechatronischer Systeme in der Technologie MID (Molded Interconnect Devices) / Christoph Jürgenhake." Paderborn : Universitätsbibliothek, 2017. http://d-nb.info/1144342945/34.

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Schierbaum, Thomas [Verfasser]. "Systematik zur Kostenbewertung im Systementwurf mechatronischer Systeme in der Technologie Molded Interconnect Devices (MID) / Thomas Schierbaum." Paderborn : Universitätsbibliothek, 2017. http://d-nb.info/1127628151/34.

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Jürgenhake, Christoph [Verfasser]. "Systematik für eine prototypenbasierte Entwicklung mechatronischer Systeme in der Technologie MID (Molded Interconnect Devices) / Christoph Jürgenhake." Paderborn : Universitätsbibliothek, 2018. http://d-nb.info/1153057166/34.

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Bachy, Bassim [Verfasser], and Jörg [Gutachter] Franke. "Experimental Investigation, Modeling, Simulation and Optimization of Molded Interconnect Devices (MID) Based on Laser Direct Structuring (LDS) / Bassim Bachy ; Gutachter: Jörg Franke." Erlangen : Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 2017. http://d-nb.info/1151399507/34.

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Jyun-yiChen and 陳駿逸. "Two-component injection molding of molded interconnect devices." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/43412954579878389594.

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Chao-ChunShen and 沈昭均. "The structural strength analysis with plastic injection molding of molded interconnect devices." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/82432562966828079677.

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碩士<br>國立成功大學<br>航空太空工程學系碩博士班<br>100<br>The MID (Molded interconnect device, MID) technology is different from the traditional printed circuit boards. The advantage is combing with mechanical and electrical functions in a single plastic parts, also provides the advantages of three-dimensional mesh circuit, making enhancement of the product , the appearance of pluralism and miniaturization, also effectively saves space and assembly time. Two-component injection molding of MID has the advantages of simple process, fast, low cost, easy processing, but the bonding strength between the two materials
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Ren-HaoLiu and 劉人豪. "Application of In-mold Decoration of Injection Molding in Three-Dimensional Molded Interconnect Devices." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/23403394113877342313.

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博士<br>國立成功大學<br>航空太空工程學系<br>103<br>Three Dimensional Molded Interconnect Devices, also known as 3D-MID, integrate both mechanical and electrical functions on plastic substrates. The products are characterized with mechanical structures and electric circuits. This research is based on In-Mold Decoration, also known as IMD, process for 3D-MID. IMD process prints electric circuits on plastic films which are subsequently thermoformed to 3D surface for final products. The thermoformed 3D plastic film is then trimmed and inserted into mold cavity for injection molding to make the final 3D-MID produc
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Dreßler, Marc [Verfasser]. "Reliability study of stud bump bonding flip chip assemblies on molded interconnect devices / vorgelegt von Marc Dreßler." 2010. http://d-nb.info/1002991226/34.

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Books on the topic "3D molded interconnect devices"

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Franke, Jörg, ed. Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.

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Three-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Hanser Publishers, 2014.

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Kawasaki, Tōru, Takeo Nakagawa, and Tetsuo Yumoto. MID (shashutsu seikei kairo buhin). Shīemushī, 1997.

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11th International Congress Molded Interconnect Devices - Scientific Proceedings: Selected, Peer Reviewed Papers from the 11th International Congress ... Fuerth, Germany. Trans Tech Pubn, 2014.

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Book chapters on the topic "3D molded interconnect devices"

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Fuchs, M. "Materials for 3D-MID." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.002.

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Pfeffer, M. "Assembly Technology for 3D-MID." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.004.

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Goth, C., and T. Kuhn. "MID Technology and Mechatronic Integration Potential." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.001.

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Schramm, R. "Structuring and Metallization." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.003.

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Goth, C. "Interconnection Technology." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.005.

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Hörber, J., and P. Daneschwar. "Quality and Reliability." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.006.

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Eberhardt, W., P. Buckmüller, and H. Kück. "MID Prototyping." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.007.

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Jürgenhake, C., T. Schierbaum, C. Fischer, and R. Dumitrescu. "Integrative Development of MID." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.008.

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Goth, C. "Case Studies." In Three-Dimensional Molded Interconnect Devices (3D-MID). Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.009.

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Fischer, Christian, Jörg Franke, and Klaus Feldmann. "Two Approaches for the Design of Molded Interconnect Devices (3D-MID)." In Advances in Intelligent and Soft Computing. Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-10430-5_6.

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Conference papers on the topic "3D molded interconnect devices"

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Ermantraut, Eugen, Andre Zimmermann, Hagen Muller, et al. "Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices." In 2018 13th International Congress Molded Interconnect Devices (MID). IEEE, 2018. http://dx.doi.org/10.1109/icmid.2018.8526993.

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Olsen, Ejvind, and Ludger Overmeyer. "Printing of laser-generated conductive copper tracks on 3D components." In 2021 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. http://dx.doi.org/10.1109/mid50463.2021.9361618.

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Sergkei, Kamotesov, Philippe Lombard, Vincent Semet, Bruno Allard, Mael Moguedet, and Michel Cabrera. "The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer." In 2018 13th International Congress Molded Interconnect Devices (MID). IEEE, 2018. http://dx.doi.org/10.1109/icmid.2018.8526962.

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Wimmer, Annette, Herbert Reichel, and Klaus Schmidt. "New standards for 3D-userinterfaces-manufactured by a Film Insert Molding process." In 2018 13th International Congress Molded Interconnect Devices (MID). IEEE, 2018. http://dx.doi.org/10.1109/icmid.2018.8526978.

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Ankenbrand, Markus, Matthias Scheetz, Joerg Franke, et al. "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies." In 2018 13th International Congress Molded Interconnect Devices (MID). IEEE, 2018. http://dx.doi.org/10.1109/icmid.2018.8527052.

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Gotze, Elisa, Kevin Postler, Stefan Buschulte, Frederik Zanger, and Volker Schulze. "Limits of ceramics in the 3D-MID with additively produced aluminum substrate." In 2018 13th International Congress Molded Interconnect Devices (MID). IEEE, 2018. http://dx.doi.org/10.1109/icmid.2018.8527061.

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Kamotesov, Sergkei, Philippe Lombard, Christian Vollaire, et al. "Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing." In 2016 12th International Congress Molded Interconnect Devices (MID). IEEE, 2016. http://dx.doi.org/10.1109/icmid.2016.7738936.

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Hamjah, Mohd-Khairulamzari, Jochen Zeitler, Yannic Eiche, et al. "Manufacturing of Polymer Optical Waveguides for 3D-Opto-MID: Review of the OPTAVER Process." In 2021 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. http://dx.doi.org/10.1109/mid50463.2021.9361620.

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Mager, Thomas, Christoph Jurgenhake, and Roman Dumitrescu. "Approach for a modular design methodology for an efficient development of 3D MID components." In 2021 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. http://dx.doi.org/10.1109/mid50463.2021.9361622.

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Tenchine, Lionel, and Olivier Dassonville. "Randomly shaped 3D electronics using innovative combination of standard surface mount technologies and polymer processing." In 2016 12th International Congress Molded Interconnect Devices (MID). IEEE, 2016. http://dx.doi.org/10.1109/icmid.2016.7738937.

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