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1

He, Baofeng. "Characterization and improvement of copper/glass adhesion." Thesis, Loughborough University, 2012. https://dspace.lboro.ac.uk/2134/10056.

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The development of glass substrates for use as an alternative to printed circuit boards (PCBs) attracts significant industrial attention, because of the potential for low cost but high performance interconnects and optical connection. Electroless plating is currently used to deposit conductive tracks on glass substrates and the quality of copper / glass adhesion is a key functional issue. Without adequate adhesive strength the copper plating will prematurely fail. Existing studies have covered the relationship between surface roughness and adhesion performance, but few of them have considered
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Moosa, Naina Mohamed Lebbai. "Improvement of interfacial adhesion in plastic packages--dimples, metallic coatings and black oxide /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?MECH%202002%20MOOSA.

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3

Vavilala, Suma. "Improvement of Homogeneity and Adhesion of Diamond-Like Carbon Films on Copper Substrates." Thesis, University of North Texas, 2004. https://digital.library.unt.edu/ark:/67531/metadc4565/.

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Electrodeposition method is used to deposit diamond-like carbon (DLC) films on copper substrates via anodic oxidation at low temperature. These films are characterized using Raman spectroscopy, Fourier transform infrared spectroscopy and scanning electron microscopy. Homogeneity of these films is studied using Raman spectroscopy and scanning electron microscopy. Scotch tape peel tests indicate adherent film on copper substrate. Carbon phase transformation is studied using thermal annealing experiments in conjunction with Raman spectroscopy and scanning electron microscopy. A cathodic electroch
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4

Ko, In Kap. "Improvement of cell adhesion to polymeric materials and their applications to regenerative medicine." 京都大学 (Kyoto University), 2003. http://hdl.handle.net/2433/148547.

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Jofre-Reche, José Antonio. "Optimization of the surface properties of polydimethylsiloxane by plasma treatment for adhesion improvement and durability to acrylic adhesive for medical applications." Doctoral thesis, Universidad de Alicante, 2014. http://hdl.handle.net/10045/86114.

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El polidimetilsiloxano (PDMS) es un polímero amorfo en base inorgánica con grupos pendientes que le imparten hidrofobicidad que es ampliamente utilidado en aplicaciones biomédicas. Debido a la baja energía superficial del PDMS, su adhesión es pobre. En algunas aplicaciones biomédicas (catéteres, prótesis) se requiere adhesión para lo cual se modifica superficialmente. Los plasmas generados en condiciones de no-equilibrio, también llamados plasmas fríos, han sido utilizados en el tratamiento superficial de PDMS para aumentar su energía superficial, pero las modificaciones producidas son poco es
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Neyman, Elizabeth. "Improvement in Adhesion for the Epoxy-SiC System via Plasma and Silane Surface Modification Techniques." Thesis, Virginia Tech, 2003. http://hdl.handle.net/10919/34490.

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<p>The adhesion durability of coatings and encapsulant materials utilized in electronic packaging is vital for device reliability in the microelectronics industry. Due to adverse operating conditions such as high moisture and high temperature environments, the adhesion between an adhesive and its substrate is typically compromised. This thesis addresses the advantages of employing plasma pretreatments and surface derivatization using silane coupling agents as surface modification techniques in an effort to enhance the adhesive bonding of epoxy to SiC coated Si wafers (SiC/Si). Durability wa
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Luo, Shijian. "SURFACE MODIFICATION OF TEXTILE FIBERS AND CORDS BY PLASMA POLYMERIZATION FOR IMPROVEMENT OF ADHESION TO POLYMERIC MATRICES." University of Cincinnati / OhioLINK, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1021299895.

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8

Lu, Kan P. "Surface modulation of fluoropolymers for the improvement of adhesion : O₂-CF₄-Ar radio frequency plasma modification of poly (tetrafluoroethylene) /." Online version of thesis, 1994. http://hdl.handle.net/1850/11696.

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9

Adsero, Matthew E. "Impact of Jet Grouting on the Lateral Strength of Soil Surrounding Driven Pile Foundations." BYU ScholarsArchive, 2008. https://scholarsarchive.byu.edu/etd/1378.

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Jet grouting was used to strengthen the soft soil surrounding the piles and the pile cap of two full-scale driven pile foundations. Soilcrete columns, created by jet grouting, were placed underneath the pile cap and surrounding the piles of the first foundation. Two rows of soilcrete columns were placed around the perimeter of one-side of the second. All of the jet grouting took place after construction of the pile caps. Laboratory testing of the soilcrete slurry showed the columns as having a design unconfined compressive strength of 550-650 psi, compared with the native soil strength of only
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10

Veyrat, Alain. "Procédé électrochimique de traitement en continu de fibres de carbone par greffage d'amines ou de groupements aryls substitués." Vandoeuvre-les-Nancy, INPL, 1996. http://www.theses.fr/1996INPL055N.

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L’objectif de cette étude est la conception et la réalisation d'un dispositif pilote de traitement de surface de fibres de carbone. Le traitement consiste en une oxydation électrochimique dans un milieu acétonitrile qui aboutit au greffage de fonctions aminées à la surface des fibres. Cet apport d'azote améliore fortement l'adhésion entre les fibres et les résines époxydes dans les matériaux composites. Le phénomène, mis en évidence par voltamétrie, est caractérisé par des analyses de surface ESCA. La cinétique du greffage de l'éthylènediamine a été étudiée sur des électrodes de fibres fixes e
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LI, FENG CHUNG, and 李逢春. "Research of polymers-treatments by plasma for adhesion improvement." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/18298321643569064508.

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碩士<br>國防大學中正理工學院<br>應用化學研究所<br>93<br>ABSTRACT The bondability between polyvinylchloride (PVC) and polyurethane (PU) adhesive is low. An atmospheric pressure ejected plasma system is developed to pre-treat the PVC surface and increase its bondability to PU adhesive. The influences of gas type and operations parameters of plasma treatment on adhesion properties were analyzed. The surface modifications were characterized by means of different surface analysis techniques, such as contact angle measurement, ATR-IR spectroscopy, XPS, SEM, T-peel test and surface roughness measurement. Our results
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12

Bo-YuanLin and 林洦沅. "Quantification and Improvement of the Adhesion of Electrical Surgical Units." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/83693462433582129909.

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碩士<br>國立成功大學<br>生物醫學工程學系<br>101<br>Recently, electrical surgical unit (ESU) becomes more popular in regular surgery and minimally invasive surgery (MIS) to diathermy. Yet, during tissue removal, the formation of tissue adhesion on the tips and smoke remains a major problem during MIS. Only limited studies have investigated the influences of energy and material properties of electrode on adhesion surface and further quantify the adhesion phenomenon. This study tries to build an ex vivo tissue adhesion evaluation system of ESU based on the adhesion volume, adhesion strength and weight and histo
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Lin, Yi-Feng, and 林意豐. "The adhesion improvement of Cu films on the SiO2 substrate." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/61223017760915103990.

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碩士<br>正修科技大學<br>電機工程研究所<br>101<br>This paper is designed to use different layers of intermediary materials pass into the gas-evaporation of Cu films on high-temperature annealing, the and observe their characteristics after annealing. Deposition of complete evaporation of Cu films unfolds annealing phenomena, the film-grain will grow over time and cause the copper property not stable in the Cu films. High temperature annealing process thus becomes absolutely necessary process steps, because it can effectively control steam annealing of Cu films plating, the resistivity of Cu films stability, e
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Hsu, Hsien-Ta, and 徐先達. "Adhesion Strength Improvement of Copper Coating on Aluminum Nitride by Interlayer." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/xcbsyv.

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博士<br>逢甲大學<br>材料科學與工程學系<br>102<br>Recently metal-ceramic composite materials have been widely used in microelectronics, light-emitting diodes, and 3D IC. This study focused on the total-wet metallization of aluminum nitride by direct plated nickel alloys for further direct plated copper. Preparation of electroless nickel coating as interlayer can effectively increase adhesion strength between copper and aluminum nitride substrate. Pretreatment methods of AlN substrates including alkaline solution etching, atmospheric plasma etching, and hydrothermal etching were studied. The mechanical interlo
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Yang, Wei-Cih, and 楊濰慈. "Epitaxial Growth of GaN on Flexible Substrates and the Adhesion Improvement." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/jak843.

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碩士<br>國立交通大學<br>電子物理系所<br>108<br>Nowadays, roll-to-roll fabricated devices are benefit to thin, light and unbreakable products. GaN is known for the applications in the field of high-frequency and power electronic devices such as high electron mobility transistors, RF components, and light-emitting diodes for its high saturated current and wide band gap [1]. Additionally, the fluorophlogopite mica as a flexible substrate is resistant to corrosion, high temperature and collision. Thus, we propose the use of fluorophlogopite mica substrate for GaN growth to form flexible GaN devices. However, th
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Wang, Lu-Yu, and 王律祐. "Application of composite silane compounds in adhesion improvement on silicon wafer." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/9drc6t.

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17

Han, Wu Shu, and 吳澍涵. "Improvement of Bacterium Adhesion on Au Thin Film Using Surface Plasmon Resonance Biosensor." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/79711369371028759332.

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碩士<br>國立陽明大學<br>生醫光電工程研究所<br>96<br>Biosensor using surface plasmon resonance (SPR) has been recognized as a potentially powerful tool for fast diagnose due to its advantage characteristics, namely high sensitivity to minimum samples, single-step direct sensing, label-free detection, real-time observation, and chemical sensitivity. However, all the researches using SPR in this field are still limited on the molecule dynamics level; no whole cells are used due to complexity of cell activities. Our research use the bacteria (prokaryote) which has simple cell behavior be the sample. The cell immob
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Lin, Cheng-Yu, and 林正裕. "The improvement of Au film and SiOx/Si substrate adhesion using H2 plasma treatment." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/75296600905466873001.

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Lu, Kuan-Wei, and 盧冠為. "Improvement of Adhesion between Optical Film and Plastic Substrate by Using Plasma Polymerization Film." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/wrrk64.

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碩士<br>國立中央大學<br>能源工程研究所<br>106<br>Optical components are used in many electronic products in daily life. The demand for lightweight and portable electronic products is increasing, therefore, the use of plastic substrates becomes important. However, the insufficient adhesion on plastic substrates has been a serious problem of the production of optical components. In this experiment, a material with high surface free energy is introduced to deposit a polymer film by using plasma polymerization technique. The optical thin film material silicon dioxide (SiO2) was coated to investigate the improvem
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CHEN, WAN-YUN, and 陳宛筠. "Improvement of Adhesion for Anti-fogging Film Coating on Polycarbonate by Plasma Surface Modification." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/04112029197536120180.

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21

Ling, Chang hsiao, and 張筱靈. "Studies Improvement Preparation of Glass Fiber Clothes of the adhesion Polytetrafluoroethylene film Laminar Composite." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/89762828424965224733.

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碩士<br>國立雲林科技大學<br>化學工程與材料工程研究所<br>99<br>PTFE (polyterafluoroethylene) film is an extremely hydrophobic material. In order to improve and enhance its hydrophilic and adhesion, this study used atmos- phere plasma to modify the surface of PTFE with the application of different plas- ma powers and rolling rates. Moreover, the study used the contact angle test in Ar gas under the power of 1.3kw and rolling rate 2L/min as the optimal condition. Afterwards this study spread two UV glue Aliphatic Urethane Diacrylate N6113, N Series, and Aliphatic Urethane Diacrylate diluted in 25% IBOA, 6148J-75, J Se
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游舜名. "Adhesion Improvement between SU8-2035 Resist and Glass Substrate by Self-Assembly Monolayers (SAMs)." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/57590543838994141139.

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23

Lin, Ping-Yu, and 林秉宥. "Study on the Adhesion Improvement of UV Curing Polyurethane Alignment and Substrate for Flexible Display." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/00785265828486361936.

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碩士<br>大同大學<br>材料工程學系(所)<br>101<br>In this study, the nano-imprinting and UV curing technology were used to produce the spacer of flexible display, and to improve the methods of spacer production. The main that purpose was improving the plastics substrate manufacture and impact its stress resistance in order to maintain the value of spacer gap, which can keep original optical property and durability, and improving the mechanical property. The focus of this study was on the re-planning the process of the flexible display, so that the process would much more match the roll-to-roll(R2R) process. I
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Chen, Shuh-Heng, and 陳述亨. "A Study on The Improvement of Interfacial Adhesion Strength of Glass Fiber / Thermal Plastic Composites." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/61037654354600728203.

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博士<br>國立臺灣科技大學<br>纖維及高分子工程研究所<br>88<br>Through the plasma polymerization, monomers; styrene (ST)、acrylonitrile (AN)、tetramethylsilane (TMS)、hexamethyldisiloxane (HMDSO) 、2,2,4,4,6,6,-hexamrthylcyclotrisilazane (HMCTSN)、1,1,1,3,3,3,-hexamethyldisilazane (HMDSN)were polymerized onto the surface of glass fiber. The surface chemistry deposition were measurement by XPS, the surface free energy by static & dynamic contact angle, and surface morphology after plasma treated by SEM. Through the formation of a transcrystalline layer on the surface of glass fibre, the interfacial adhesion strength betw
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洪東光. "The Study on Improvement of Epoxy Molding Efficiency Through Minimizing Adhesion Effects IC Epoxy Molding Process." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/53387614100306914796.

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碩士<br>明新科技大學<br>系統晶片與嵌入式系統產業研發研究所<br>98<br>Abstract Adhesion Effects, which relates to adhesion between EMC (Epoxy Molding Compound) and IC mold surface in curing, occur in IC package. The effects not only lead to mold adhesion in ejection, but also influence quality of products, damage products, fail to molding, and cause the reduction of the yield rate. And how to minimize the influence of adhesion effects through adequate surface treatments and coating without mold design change is an urgent issue for the industry and researchers. Based on adhesion as parameters, this study applies adhe
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Huang, Chin-Hua, and 黃勁華. "Design and Improvement of a Testing Machine for Shear and Normal Adhesion Force between EMC and Metal." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/3md524.

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碩士<br>國立成功大學<br>工程科學系碩博士班<br>92<br>In IC packaging, when epoxy molding compound(EMC)is filling the mold cavity and cured in the mold, adhesive effects occur in the interface between mold surface, substrate, leadframe and EMC. Adhesive effects are good for leadframe and substrate, because the larger adhesion causes the better reliability. But, the adhesion between mold and EMC will affect the products quality. Normal and shear adhesion force exist in the IC packaging. So we want to understand the exact value and avoid the problems.   This study is focus on adhesion effects. We improve the mold
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Huang, Shao-Nung, and 黃少農. "High Tg, transparent BAPP-ODPA polyimide for flexible device applications: Its synthesis, properties, and ITO/PI adhesion improvement." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/06047100540454553845.

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碩士<br>國立交通大學<br>工學院半導體材料與製程產業專班<br>97<br>ility, and versatility has energized a sleuth of new IC products mounted onto flexible substrates, such as e-paper, flexible solar cell in satellite, or key components using plastic substrate sin cell phones and digital cameras. While these materials offer many attractive features, they also impose limitations and challenges such as high CTE, lower Tg, low processing temperatures, problematic adhesion strength in the multiple film stacking (with barrier, hard coat, or conductive transparent oxides), high O2 and water permeation, and device degradation.
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Chen, Zi-Ren, and 陳姿任. "To study the surface modification of titanium on the improvement of osteoblast adhesion using non-thermal atmospheric plasma." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/fu93mk.

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碩士<br>中原大學<br>生物醫學工程研究所<br>107<br>Owing to new technological advances, dental implantation has gained popularity to restore edentulous area. However, the failure rate of implantation is nearly to 10 %. According to the reason of dental implantation failure, it is found that shortening the osteointegration time may help to improve the success rate of dental implantation efficiently. From literature review, the hydrophilic functional group of the material surface can be activated by the atmospheric plasma and still not to damage the properties of the material. Therefore, the purpose of this stud
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Chen, Jian-Zhi, and 陳建智. "A Study of the Adhesion Improvement on a Thin Film Deposited on the PMMA Substrate Using Buffer-Layered Structure." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/y7g57r.

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碩士<br>國立虎尾科技大學<br>光電工程系光電與材料科技碩士班<br>104<br>This study will be used polymethyl methacrylate (acrylic) as the substrate, by plasma enhanced chemical vapor deposition system (PECVD), thermal evaporation system, RF magnetron co-sputtering system, and spray painting, testing and adhesion improvement on a functional thin film that include hard coatings thin film, reflection thin film, anti-Glare Coating and transparent conductive thin film. The results showed that when the functional thin film adhered to the acrylic substrate only 0B degree level, in order to improve the adhesion of the functional
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Chang, Chun Chi, and 張峻齊. "Exploration of Anti-Wear CrAlSiN Nanocomposite Coating under Extreme Environment and Adhesion Improvement of Coating on Stainless Steel 304 Substrate via Low Pressure Plasma Nitridation." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/62998286149549011059.

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Chien-Chun, Chen. "An Improvement of Adhesive Coating in LCM Assembly." 2006. http://www.cetd.com.tw/ec/thesisdetail.aspx?etdun=U0017-1901200710280225.

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Su, Hsuan-Ho, and 蘇宣合. "Study of Adhesive Behavior Improvement of FCCL in Stack." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/69268826605063404949.

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碩士<br>南台科技大學<br>化學工程與材枓工程系<br>98<br>The purpose of this study was to improve the domestic production of the two-layer single-side FCCL in stack, PI surface adhesion to another PI when pressed them together. The improving method is, adding filler into the PI films, to increase the PI film surface roughness, in order to reduce the PI-PI interface adhesion. The use of fillers include silica compounds (30M, 30MHE), calcium phosphate compounds (T-3983, T-3984) and calcium carbonate compounds. Experiment was proceeding by in-situ polymerization and direct mixing, filler amount 1~3wt%, to compare the
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Liu, Kent-Ting, and 劉耿廷. "The study of the improvement of polyimide adhesive residue on QFN Package." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/56960132122253163563.

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碩士<br>國立高雄應用科技大學<br>化學工程與材料工程系<br>98<br>This research has studied an advanced package type of QFN, the package can work in a small space and light weight. During assembly process, the “plasma clean” could remove most organic contaminants not only to enhance the ability of wire bonding but also increase the yield strength of wire. By the experiment, we have known that in the period less than 600 seconds is optimal for wire bonding in “plasma clean” process; the period of “plasma clean” also influence the thermo-plastic lead to the residue on the surface of tape. The residue is much less in five
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Chen, Ting-I., and 陳庭益. "Improvement on Lamination Process of Liquid Optical Clear Adhesive in Projected Capacitive Touch Panel." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/33387450446880909201.

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碩士<br>大同大學<br>機械工程學系(所)<br>100<br>Capacitive Touch Panel, replaced Resistive Touch panel, becomes the main stream application in medium size handheld equipment and Tablet PC after iPhone started the fashion of multi-touch. However, due to the highly requirement in customize design to accommodate various ID design, there are many different process developed, and there are also pros and cons out from those different structure process. And for the lamination process on glass to glass, using optical liquid gel, is the newest technology developed during these years. Nevertheless, this new technolog
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Coene, Ryan Patrick. "Comparison of pain relief and functional improvement in landmark vs. ultrasound-guided corticosteroid injections for adhesive capsulitis: a prospective study." Thesis, 2017. https://hdl.handle.net/2144/23753.

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BACKGROUND: Adhesive capsulitis is an idiopathic disorder of the shoulder that is characterized by pain in combination with the gradual loss of passive and active range of motion. It is typically self-limiting, although the disease still remains poorly understood. However, there are several treatment modalities, both conservative and surgical, that provide significant clinical benefit for patients with adhesive capsulitis. Corticosteroid injections are an established conservative treatment method for adhesive capsulitis. Several studies have demonstrated that injections provide short-term bene
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HUANG, HUI-KAI, and 黃暉凱. "Improvement both in Package Manufacturing Process Speed and in Optical-Thermal Performance of InGaN Blue High-Power LEDs by Using UV Die Attach Adhesive." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/s6e688.

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"Improvement of adhesive strength between polymer and indium-tin oxide with self-assembly monolayers =: 利用自身組織單層分子薄膜改善聚合物和氧化銦錫導電膜之間的黏著力". 2002. http://library.cuhk.edu.hk/record=b5895977.

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by Sin Lai Yi, Mandy.<br>Thesis (M.Phil.)--Chinese University of Hong Kong, 2002.<br>Includes bibliographical references (leaves 120-121).<br>Text in English; abstracts in English and Chinese.<br>by Sin Lai Yi, Mandy.<br>Abstract --- p.ii<br>論文摘要 --- p.iii<br>Acknowledgements --- p.iv<br>Table of Contents --- p.v<br>List of Figures --- p.ix<br>List of Tables --- p.xiii<br>Chapter Chapter 1 --- Introduction<br>Chapter 1.1 --- Adhesion --- p.1<br>Chapter 1.2 --- Adhesion issues in PLEDs --- p.1<br>Chapter 1.3 --- Literature review of the adhesion measurement techniques --- p.4<br>Chapte
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