Relevant bibliographies by topics / Adhesives, Hot melt

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Adhesives, Hot melt'

Author: Grafiati
Published: 4 June 2021
Last updated: 5 February 2022

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Journal articles on the topic "Adhesives, Hot melt"

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Paul, C. W. "Hot-Melt Adhesives." MRS Bulletin 28, no. 6 (June 2003): 440–44. http://dx.doi.org/10.1557/mrs2003.125.

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AbstractHot-melt adhesives facilitate fast production processes because the adhesives set simply by cooling. Formulations contain polymers to provide strength and hot tack (resistance to separation while adhesive is hot), and tackifiers and/or oils to dilute the polymer entanglement network, adjust the glass-transition temperature, lower the viscosity, and improve wet-out (molecular contact of the adhesive with the substrate over the entire bonding area). Some adhesives also contain waxes to speed setting, lower viscosity, and improve heat resistance. Obtaining adequate strength and heat resistance from nonreactive hot melts requires that some component of the hot melt separate out into a dispersed but interconnected hard-phase network upon cooling. The hard phases are commonly either glassy styrene domains (for adhesives based on styrenic block copolymers) or organic crystallites (for adhesives based on waxes, olefinic copolymers, or ethylene copolymers). This article will describe first the material properties relevant to the processing and performance of hot-melt adhesives, then the chemistry and function of the specific raw materials used in hot melts, and will conclude with illustrative application examples and corresponding formulations.
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Malysheva, G. V., and N. V. Bodrykh. "Hot-melt adhesives." Polymer Science Series D 4, no. 4 (October 2011): 301–3. http://dx.doi.org/10.1134/s1995421211040095.

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Kuo, Chung-Feng Jeffrey, Wei Lun Lan, Jui-Wen Wang, John-Ber Chen, and Pin-Hua Lin. "Hot-melt pressure-sensitive adhesive for seamless bonding of nylon fabric Part II: Process parameter optimization for seamless bonding of nylon fabric." Textile Research Journal 89, no. 12 (July 31, 2018): 2294–304. http://dx.doi.org/10.1177/0040517518790970.

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This study develops hot melt pressure sensitive adhesives (HMPSAs) for the seamless bonding of nylon fabric, using butyl acrylate as the main monomer material and mixing the functional monomer for polymerization. It is combined with 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide for the photoinitiator and ultraviolet irradiation is used to make a pre-polymer. The effects of butyl acrylate content, type of functional monomer, and 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide content on the molecular weight of acrylate pre-polymer are discussed, following the Taguchi method. The pre-polymer is then mixed with the reactive diluent glycidyl methacrylate blend and with 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, coated on a release film, irradiated by ultraviolet light, and cured into hot melt pressure sensitive adhesives. The adhesive properties of hot melt pressure sensitive adhesive bonding on nylon include the peel strength, the shear strength, adhesive warpage, adhesive color difference, and adhesive overflow, which are discussed following the Taguchi method and the elimination and choice translating reality method for multi-quality analysis. Hot melt pressure sensitive adhesives are implemented by optimization parameters for practical validation. The results show that the peel strength of hot melt pressure sensitive adhesives is 1.495 kg/cm, the shear strength of hot melt pressure sensitive adhesives is 14.326 kg/cm2, adhesive warpage is 0.93 mm, adhesive color difference is 1.66, and adhesive overflow is 0.97 mm. The performance of HMPSAs in this study is enhanced effective.
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Wang, Zongqian, Dengfeng Wang, Zun Zhu, Wei Li, and Yanxia Xie. "Enhanced antistatic properties of polyethylene film/polypropylene-coated non-woven fabrics by compound of hot-melt adhesive and polymer antistatic agent." Journal of Industrial Textiles 50, no. 6 (May 15, 2019): 921–38. http://dx.doi.org/10.1177/1528083719850834.

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In this paper, the compound hot-melt adhesives were prepared by blending alkyl sulfonate polymer antistatic agent with modified rosin hot-melt adhesive and used for the preparation of polyethylene film/polypropylene-coated non-woven fabrics. The effects of the amount of antistatic agent on the melt viscosity, softening point, and thermal stability of the compounded hot-melt adhesives were studied. Then, the antistatic properties and its washing fastness of the coated non-woven fabrics were tested and analyzed. The results showed that the softening point and the melt viscosity of the hot-melt adhesives decreased after compounding, and the thermal stability of the compound hot-melt adhesives decreased in the high temperature range, which was not affected before 200℃. The surface inductive voltage, half-life, and specific resistance of the coated non-woven fabrics prepared from the compound adhesives decreased gradually with the increase of the amount of the antistatic agent, indicating that the antistatic property of the prepared fabrics was gradually improved. In addition, the fabrics still exhibited antistatic properties after soaping for several times. The influence of compound adhesive on the wettability of fabric surface was consistent with that of antistatic property. Finally, the mechanism of the hot-melt adhesive and antistatic agent compounding technology to improve the antistatic performance of the coated non-woven fabrics was elaborated, and the reason for its excellent soaping durability was also explained.
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Czech, Zbigniew, and Agnieszka Butwin. "UV-crosslinkable warm-melt pressure-sensitive adhesives based on acrylics." Polish Journal of Chemical Technology 12, no. 4 (January 1, 2010): 58–61. http://dx.doi.org/10.2478/v10026-010-0051-9.

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UV-crosslinkable warm-melt pressure-sensitive adhesives based on acrylics The target of this article is to show the preparation of new generation of UV-crosslinkable warm-melt acrylic pressure-sensitive adhesives (PSAs) and the experimental test of their adhesive properties in comparison with typical conventional hot-melts adhesives. New generation of UV-crosslinkable acrylic warm-melts PSAs containing unsaturated photoinitiator, incorporated during polymerization process into polymer chain, and photoreactive diluents added to PSA systems after polymerization allows producing of wide range of self-adhesive materials, such as labels, mounting tapes, masking and splicing tapes, and sign and marking films.
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Rossitto, Conrad. "Laminating with Hot Melt Adhesives." Journal of Coated Fabrics 16, no. 3 (January 1987): 190–98. http://dx.doi.org/10.1177/152808378701600305.

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Legocka, I., Z. Zimek, and A. Woźniak. "Adhesive properties of hot-melt adhesives modified by radiation." Radiation Physics and Chemistry 52, no. 1-6 (June 1998): 277–81. http://dx.doi.org/10.1016/s0969-806x(98)00201-1.

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Baurova, Natalia, Alexander Anoprienko, and Yulia Romanova. "The performance evaluation for rivet bonded joints in production and machine maintenance." MATEC Web of Conferences 224 (2018): 02003. http://dx.doi.org/10.1051/matecconf/201822402003.

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The paper deals with the studies on the serviceability and performance of rivet bonded joints produced with the use of thermoplastic hot-melt adhesives. Thermoplastic hot-melt adhesives are compared with conventional epoxy adhesives. The performance evaluation of different adhesive materials by dismantling of rivet bonded joints is fulfilled. The time necessary for each operation of the process is considered. The algorithms are provided for finding the design and engineering solution when replacing the conventional process of riveting by rivet bonding in production and machine maintenance.
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Waites, Paul. "Moisture‐curing reactive polyurethane hot‐melt adhesives." Pigment & Resin Technology 26, no. 5 (October 1997): 300–303. http://dx.doi.org/10.1108/03699429710177690.

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Brožek, Milan, Alexandra Nováková, and Helena Píšová. "Bonding of Plywood Using Hot Melt Adhesives." Manufacturing Technology 17, no. 4 (September 1, 2017): 423–27. http://dx.doi.org/10.21062/ujep/x.2017/a/1213-2489/mt/17/4/423.

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Dissertations / Theses on the topic "Adhesives, Hot melt"

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Doody, Paul David. "The rheology and strength of hot melt adhesives." Thesis, Coventry University, 1997. http://curve.coventry.ac.uk/open/items/aee7101d-7aef-41a0-a6a1-32d9877f92d1/1.

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Various properties of the components and adhesives were modelled. The compatibility of the components were successfully incorporated into an extended Fox equation to predict the glass transition temperature. The peel strength of the adhesive was modelled in terms of the rheological properties of elastic moduli and loss tangent values at different temperatures. A second model based upon the value of the loss tangent at room temperature was also broadly successful but deviations from predicted behaviour were observed which were attributable to failure of the adhesive joints by a mode not included in the model. The modulus of the adhesive was modelled on the basis of an extended mixture rule in which the extent of compatibility was identified by a parameter n. The value of n varied as a function of adhesive composition and temperature, indicating that the behaviour of the adhesives changed subtly as the compatibility of the phases changed. The value of the parameter could not be directly related to the morphology of the adhesive phases. Fourteen commercially available poly(ethylene-co-vinyl acetate) (EVA) copolymer samples were selected in which there was a systematic change in the melt index, amount of vinyl acetate, and degree of crystallinity. Various hot melt adhesives were made using these copolymers and a standard amount of wax and resin. The materials were examined using differential scanning calorimetry (DSC), oscillatory rheometry (both controlled strain and controlled stress), and transient (creep) rheometry. The adhesives were also investigated using a variety of industrial tests which included peel adhesion and tensile testing at four different rates, open and setting time, shear and peel stress resistance at elevated temperatures, and viscosity determination over a wide range of temperatures. Detailed thermal analysis and characterisation have provided a range of accurate and systematic data on all of the materials and in particular showed that the components of the adhesive did not merely act as a mechanical mixture but had a distinct compatibility. The controlled stress technique was found to more discriminatory than the controlled strain, due to the more precisely controlled heating and cooling of the sample during loading and evaluation. Other key differences between the techniques are attributable to the different thermal histories imposed upon the semi-crystalline adhesive components. Detailed analysis of the complex rheological curves showed several key factors. One of the most important was the modulus crossover temperature Tx which was shown to correlate well with the softening point of the adhesive, its open time, and the heat resistance under shear as determined by the shear adhesion failure temperature (SAFT). It was possible to construct a linear relationship between Tx and SAFT which allowed prediction of this key adhesive parameter. There was no significant relationship established between the softening point of an adhesive and its heat resistance, open time, or critical thermal characteristics, and the use of the softening point as a useful indicator of adhesive performance is contested. The open time was shown to be clearly influenced by the properties of the copolymer. The relationship between open time and melt index is complex and two competing mechanisms are thought responsible. These are the inability to fully wet the substrate for high molecular weights and resistance to complete substrate penetration by capillary effects for adhesives formulated with low molecular weight polymers. Both of these effects cause a reduction in open time. The cloud points of the adhesives were independent of the molecular weight but strongly affected by composition. Degree of crystallinity was also an influence at higher molecular weights. Cloud point correlated slightly with the onset of crystallisation as determined by DSC however differences are extremely small and the method was not deemed robust enough for widespread industrial application. Various properties of the components and adhesives were modelled. The compatibility of the components were successfully incorporated into an extended Fox equation to predict the glass transition temperature. The peel strength of the adhesive was modelled in terms of the rheological properties of elastic moduli and loss tangent values at different temperatures. A second model based upon the value of the loss tangent at room temperature was also broadly successful but deviations from predicted behaviour were observed which were attributable to failure of the adhesive joints by a mode not included in the model. The modulus of the adhesive was modelled on the basis of an extended mixture rule in which the extent of compatibility was identified by a parameter n. The value of n varied as a function of adhesive composition and temperature, indicating that the behaviour of the adhesives changed subtly as the compatibility of the phases changed. The value of the parameter could not be directly related to the morphology of the adhesive phases.
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Dixit, Ninad Yogesh. "Microphase Separation Studies in Styrene-Diene Block Copolymer-based Hot-Melt Pressure- Sensitive Adhesives." Diss., Virginia Tech, 2015. http://hdl.handle.net/10919/51205.

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This dissertation is aimed at understanding the microstructure evolution in styrene — diene block copolymer — based pressure-sensitive adhesive compositions in melt. The work also focuses on determining the microphase separation mechanism in adhesive melts containing various amounts of low molecular weight resin (tackifiers) blended with styrene — diene block copolymers. To understand the correlation between adhesive morphology and their dynamic mechanical behavior, small angle X-ray scattering (SAXS) and rheological analysis were performed on blends with different compositions. A modified Percus — Yevick model combined with Gaussian functions was used fit the liquid like disordered and bcc — ordered peaks of the SAXS intensity profiles. The morphological parameters derived from SAXS analysis corresponded to features such as the size and extent of ordering of the microphase separated polystyrene domains. The variation in these parameters with respect to temperature and adhesive composition correlated reasonably well with the trends observed in the shear modulus measured using rheological analysis. It was found that the ordering of polystyrene domains was influenced by the tackifier content in the adhesive blends. Polymer chain mobility was determined to be the dominant factor governing ordering kinetics, which depended on both the quench temperature and tackifier content in the blends. The addition of increasing amounts of tackifier eventually leads to a shift from a nucleation and growth type mechanism to a spinodal decomposition mechanism for phase separation and ordering. The compatibility of the tackifier with the polystyrene chains had a significant impact on the morphological transitions and microphase separation in adhesive blends. The blends containing a styrene — incompatible tackifier showed ordering over a broader range of temperatures compared to the blends containing a polystyrene — compatible tackifier.
Ph. D.
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Lin, Yung-Sen. "Enhanced adhesion performance of primer to thermoplastic olefins by low temperature cascade arc discharge plasmas /." free to MU campus, to others for purchase, 1996. http://wwwlib.umi.com/cr/mo/fullcit?p9823318.

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Holbery, James D. "Recycle polymer characterization and adhesion modeling /." Thesis, Connect to this title online; UW restricted, 2000. http://hdl.handle.net/1773/10586.

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Korin, Christer. "Mechanical Behaviour of Adhesive Joints in Cartonboard for Packaging." Doctoral thesis, Karlstads universitet, Avdelningen för kemiteknik, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:kau:diva-4731.

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A cartonboard package is often sealed and closed with an adhesive – either a hot-melt adhesive (adhesives that are applied in a molten state on the cartonboard) or a dispersion adhesive (adhesives that are applied as water-based dispersions). This thesis focuses on the process of hot-melt gluing, and how material properties and process conditions affect the performance of the adhesive joint. Requirements vary depending on how the package is to be used. A package that is only supposed to protect the product during transport differs from one that is supposed to attract consumers and facilitate their use of the product. If a package has been opened, due to external or internal forces that cause a fracture in the adhesive joint, the consumer may choose another package instead. A fracture of the adhesive joint may occur in several different ways; for example, a cohesive fracture in the adhesive, an interfacial fracture between the adhesive and one of the cartonboard surfaces, and a cohesive fracture in the cartonboard. The traditional way of testing the adhesive joint is to subjectively evaluate the fibre tear after manually tearing the joint apart. The primary interest of this study has been to find an objective method that can characterise the adhesive joint – that is, its strength and joint characteristics. The work has principally concentrated on physical experiments where the Y-peel method has been evaluated and further developed, including the construction of a laboratory adhesive applicator. Adhesive joint failure is analysed and correlated to the force-elongation curve during Y-peel testing in order to explore various mechanisms of the failure. The force versus elongation curves are transformed into a force versus inelastic deformation curve for the adhesive joint. The inelastic deformation of the adhesive joint is defined as the inelastic opening of the adhesive joint perpendicular to the cartonboard surface. The dissipative descending energy has been used to characterise the adhesive joint. High descending dissipative energy showed high resistance against final failure of the joint. This correlates very well with the manual fibre-tear test. Characteristic force-elongation curves in Y-peel testing – that is, the shape of the curve – have been analysed, and four main failure modes have been identified. The finite element method has been used to predict mechanical behaviour in the ascending part of the force-elongation curve. When it comes to local behaviour, a high stiffness adhesive results in bending behaviour while a low results in shearing, but on a global scale, no big difference was detected on the ascending part of the force-elongation curve. The new laboratory adhesive applicator and finite element method can be used to objectively design the interaction between the adhesive and the cartonboard for a specific application. This can be achieved by modifying the cartonboard, the adhesive or the process parameters.
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Abboud, Tâmara [Verfasser], Hans-Joachim Gutachter] Radusch, Thomas [Gutachter] [Groth, and Udo [Gutachter] Wagenknecht. "Influence of tackifying resins on properties of polymer blends employed as hot melt pressure sensitive adhesives / Tâmara Abboud ; Gutachter: Hans-Joachim Radusch, Thomas Groth, Udo Wagenknecht." Halle (Saale) : Universitäts- und Landesbibliothek Sachsen-Anhalt, 2020. http://d-nb.info/1215098952/34.

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Nasr, M., H. Karandikar, R. T. A. Abdel-Aziz, N. Moftah, and Anant R. Paradkar. "Novel nicotinamide skin-adhesive hot melt extrudates for treatment of acne." Taylor and Francis, 2018. http://hdl.handle.net/10454/16734.

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Hot melt extrusion is a continuous process with wide industrial applicability. Till current date, there have been no reports on the formulation of extrudates for topical treatment of dermatological diseases. The aim of the present work was to prepare and characterize medicated hot melt extrudates based on Soluplus polymer and nicotinamide, and to explore their applicability in acne treatment. The extrudates were characterized using DSC, FTIR, XRD, and DVS. The extrudates were also tested for their skin adhesion potential, ability to deposit nicotinamide in different skin layers, and their clinical efficacy in acne patients. The 10% nicotinamide extrudates exhibited amorphous nature which was reserved during storage, with no chemical interaction between nicotinamide and Soluplus. Upon contrasting the skin adhesion and drug deposition of extrudates and nicotinamide gel, it was evident that the extrudates displayed significantly higher adhesion and drug deposition reaching 4.8 folds, 5.3 folds, and 4.3 folds more in the stratum corneum, epidermis and dermis, respectively. Furthermore, the extrudates significantly reduced the total number of acne lesions in patients by 61.3% compared to 42.14% with the nicotinamide gel. Soluplus extrudates are promising topical drug delivery means for the treatment of dermatological diseases.
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Van, Heerden Vaughn Tyronne. "A marketing strategy for SASOLWAKS in the USA hot melt adhesive industry / Vaughn Tyronne van Heerden." Thesis, North-West University, 2006. http://hdl.handle.net/10394/2513.

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Sewell, Neil Thomas. "Algorithms for multi-axis additive rapid prototyping : rapid prototyping using hot-melt adhesive deposition and computer numerical controlled machining centres." Thesis, University of Exeter, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.410823.

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Kallel, Achraf. "Étude d'un procédé innovant de contre-collage d'emballages flexibles par des colles thermofusibles." Thesis, Paris, ENMP, 2015. http://www.theses.fr/2015ENMP0016/document.

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« Revoluflex » est un procédé de contre-collage de films plastiques par l'intermédiaire d'une fine couche d'adhésif thermofusible. Dans ce procédé, l'adhésif fondu est extrudé à travers une filière plate (entrefer ~ 1 mm) puis étiré dans l'air sur une très courte distance (~ 1 mm) à des taux d'étirage très importants (Dr>100) et enfin déposé sur le film plastique primaire. Une pompe à vide, placée au-dessous du film extrudé, permet de stabiliser le procédé et d'empêcher l'admission de bulles d'air entre le film primaire et l'adhésif. Un film plastique secondaire est ensuite déposé sur le film primaire pour former le film complexe. En fonction des paramètres du procédé, plusieurs défauts sont observés. Par exemple, on observe dans certaines conditions des surépaisseurs périodiques dans la couche d'adhésif qui s'apparentent à une instabilité d'étirage appelée Draw Resonance. D'autres défauts qui correspondent plutôt à des déchirures dans le film adhésif sont également observés. Ces défauts représentent un obstacle pour le développement de ce procédé innovant et donc l'enjeu de cette étude consiste à comprendre l'origine de ces défauts afin de pouvoir les supprimer ou, au moins, en différer l'apparition.Pour ce faire, ces défauts ont tout d'abord été caractérisés et leur apparition a été quantifiée en fonction des paramètres du procédé et de la rhéologie de différentes formulations d'adhésif.Des modèles de complexité croissante, tant au niveau de la description cinématique de l'écoulement que de la loi de comportement du polymère, ont été développés. Des modèles membrane Newtonien et viscoélastique à largeur constante où un différentiel de pression est appliqué entre les deux faces du film extrudé constituent une première approche théorique qui rend compte de l'effet de la pompe à vide. La méthode de stabilité linéaire a été utilisée pour prédire le phénomène d'instabilité périodique en fonction du comportement rhéologique et des paramètres du procédé. Notre étude a montré que les résultats de ces modèles membrane sont très influencés par les conditions initiales de l'écoulement. Comme l'hypothèse membrane n'est plus valide à de très courtes distances d'étirage, nous avons développé deux modèles 2D Newtonien qui rendent compte à la fois de l'écoulement dans la filière et au cours de l'étirage. Le premier modèle symétrique ne prend pas en compte l'effet de la pompe à vide mais et a été résolu avec deux approches différentes : une méthode de suivi d'interface couplée à la méthode de stabilité linéaire et une méthode de simulation directe par capture d'interface (méthode Level-Set). Nous avons montré que ces deux méthodes permettent d'obtenir la même solution stationnaire et les mêmes résultats de stabilité. Le deuxième modèle prend en compte le différentiel de pression et a été résolu uniquement par la technique de suivi d'interface couplée à la méthode de stabilité linéaire. Ce modèle 2D permet également de trancher entre les différentes conditions initiales testées avec le modèle membrane.Ces modèles permettent d'expliquer plusieurs phénomènes observés expérimentalement comme l'effet stabilisant du différentiel de pression et de la courte distance d'étirage. De plus, ils mettent en évidence un résultat paradoxal qui est l'effet stabilisant du taux d'étirage dans certaines conditions opératoires. Ils montrent enfin que le différentiel de pression provoque une contrainte très élevée au niveau de la lèvre inférieure de la filière, ce qui peut être une explication des déchirures observés dans la couche de colle
“Revoluflex” is an innovative laminating process consisting in bonding two plastic films with a thin layer of hot melt adhesive. The molten adhesive is extruded through a flat die (gap ~ 1 mm). Then, it is stretched into the air at very high draw ratio (Dr> 100) over a very short distance (~ 1 mm) and set down on the primary plastic film. A vacuum pump, located beneath the extruded film, stabilizes the process and prevents air bubble intake between the primary and the adhesive film. A secondary plastic film is then laid on the coated primary film to give a laminate. Many defects can be observed as a function of the process parameters such as wavelike instabilities characterized by periodical sustained oscillations in the hot melt adhesive layer. This instability is similar to the “Draw Resonance” instability encountered with classical processes involving the stretching of a molten polymer. Other defects looking like small bubbles, cracks or rips in the adhesive layer are also observed. These defects hinder commercial deployment of the process. The aim of this study is there to understand their origins in order to remove them or at least delay their onset.These defects have first been characterized and their appearance was quantified according to process parameters and adhesive rheology. Several theoretical models of increasing complexity, in terms of flow kinematics and polymer rheology, have been developed. Newtonian and Viscoelastic constant width membrane models involving a pressure differential between the two sides of the extruded film represent a first theoretical approach that accounts for the vacuum pump effect. The linear stability method was used to investigate the influence of adhesive rheological behavior and process parameters on the onset of periodic instabilities. It was shown that the results were highly dependent on the initial flow conditions at die exit. Since the membrane assumption is not valid for very short stretching distances, we developed two Newtonian 2D models accounting for both extrusion and drawing steps. The first one is a symmetric model that does not account for the vacuum pump effect. It was solved using two different approaches: a front-tracking method coupled with linear stability analysis and a direct numerical simulation with interface capturing method (Level set method). It was shown that both methods lead to the same stationary solution and the same stability results. The second model accounts for the pressure differential and it was solved using only the front-tracking method. This latter 2D model enables to check the validity of the initial flow conditions of the membrane model.These models allow us to explain several experimental phenomena such as the stabilizing effect of the pressure differential and the short stretching distance. In addition, they help explaining experimental features which contradict the classical literature on drawing instabilities such as the stabilizing effect of increasing the draw ratio under certain operating conditions. Finally, they show that the pressure differential induces a high stress at the bottom lip of the extrusion die, which may clarify the cracks and rips observed in the adhesive layer
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Books on the topic "Adhesives, Hot melt"

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Hot Melt Symposium (2001 Hilton Head Island, S.C.). 2001 Hot Melt Symposium. Atlanta, Ga: TAPPI, 2001.

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Hot Melt Symposium. (1986 Hilton Head, S.C.). 1986 Hot Melt Symposium, Marriott Hilton Head Hotel, Hilton Head, SC, June 1-4. Atlanta, GA, USA: TAPPI Press, 1986.

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Hot Melt Symposium (2000 Bal Harbour, Fla.). 2000 Hot Melt Symposium: June 25-28, 2000, Sheraton Bal Harbour, Bal Harbour, FL. Atlanta, Ga: TAPPI Press, 2000.

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Hot, Melt Symposium (1999 Durango Colorado). TAPPI Hot Melt Symposium: June 13-16, 1999, Durango, Colorado, Sheraton Tamarron Resort. Atlanta, Georgia: TAPPI Press, 1999.

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Hot, Melt Symposium (1994 Hilton Head S. C. ). 1994 Hot Melt Symposium, Hyatt Regency, Hilton Head, South Carolina, June 19-22: Proceedings. Atlanta, GA: TAPPI Press, 1994.

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Abbott, Stephen. Waterbased and hot melt adhesives: Best practice guide. [Kettering]: SATRA Footwear Technology Centre, 1997.

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Saqa, Hanna. Waste reduction activities and options for a manufacturer of fire retardant plastic pellets and hot melt adhesives. Cincinnati, OH: U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, 1992.

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Tappi Hot Melt Symposium, 1999 Proceedings. Tappi Pr, 1999.

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Zavala, David Zavala. Analysis of processes operative within plywood during hot pressing. 1986.

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Frost & Sullivan., ed. U.S. hot melt markets: Technology is geared for fast packaging applications. Mountain View, Calif: Frost & Sullivan, 1994.

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Book chapters on the topic "Adhesives, Hot melt"

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Hussey, Bob, and Jo Wilson. "Thermoplastic Hot-Melt Adhesives." In Structural Adhesives, 322–54. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4613-1203-1_24.

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Utekar, P., H. Gabale, A. Khandelwal, and S. T. Mhaske. "Hot-Melt Adhesives from Renewable Resources." In Progress in Adhesion and Adhesives, 101–14. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2017. http://dx.doi.org/10.1002/9781119407485.ch4.

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Eastman, Ernest F., and Lawrence Fullhart. "Polyolefin and Ethylene Copolymer-based Hot Melt Adhesives." In Handbook of Adhesives, 408–22. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4613-0671-9_23.

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Rossitto, Conrad. "Polyester and Polyamide High Performance Hot Melt Adhesives." In Handbook of Adhesives, 478–98. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4613-0671-9_28.

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Chu, Sung Gun. "Hot Melt Sealants Based on Thermoplastic Elastomers." In Adhesives, Sealants, and Coatings for Space and Harsh Environments, 301–19. Boston, MA: Springer US, 1988. http://dx.doi.org/10.1007/978-1-4613-1047-1_28.

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Hemken, G., S. Böhm, and K. Dilger. "Use of Hot Melt Adhesives for the Assembly of Microsystems." In Design and Manufacturing of Active Microsystems, 327–43. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-12903-2_18.

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Rathmann, S., J. Ellwood, A. Raatz, and J. Hesselbach. "Design of a Microassembly Process Based on Hot Melt Adhesives." In Design and Manufacturing of Active Microsystems, 345–64. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-12903-2_19.

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Gooch, Jan W. "Hot-Melt Adhesive." In Encyclopedic Dictionary of Polymers, 371. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_6045.

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Gooch, Jan W. "Adhesive, Hot Melt." In Encyclopedic Dictionary of Polymers, 20. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_267.

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Agger, R. T. "The Current Situation for Holt-Melt Adhesives." In Adhesion 13, 98–104. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-010-9082-7_7.

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Conference papers on the topic "Adhesives, Hot melt"

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Hemken, G., and S. Böhm. "Laser-based microbonding using hot melt adhesives." In SPIE LASE: Lasers and Applications in Science and Engineering, edited by Wilhelm Pfleging, Yongfeng Lu, Kunihiko Washio, Willem Hoving, and Jun Amako. SPIE, 2009. http://dx.doi.org/10.1117/12.808671.

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Brodbeck, Luzius, Liyu Wang, and Fumiya Iida. "Robotic body extension based on Hot Melt Adhesives." In 2012 IEEE International Conference on Robotics and Automation (ICRA). IEEE, 2012. http://dx.doi.org/10.1109/icra.2012.6225258.

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Ciardiello, Raffaele, Andrea Tridello, Luca Goglio, and Giovanni Belingardi. "Experimental Assessment of the Dynamic Behavior of Polyolefin Thermoplastic Hot Melt Adhesive." In ASME 2018 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/pvp2018-84725.

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In the last decades, the use of adhesives has rapidly increased in many industrial fields. Adhesive joints are often preferred to traditional fasteners due to the many advantages that they offer. For instance, adhesive joints show a better stress distribution compared to the traditional fasteners and high mechanical properties under different loading conditions. Furthermore, they are usually preferred for joining components made of different materials. A wide variety of adhesives is currently available: thermoset adhesives are generally employed for structural joints but recently there has been a significant increment in the use of thermoplastic adhesives, in particular of the hot-melt adhesives (HMAs). HMAs permit to bond a large number of materials, including metal and plastics (e.g., polypropylene, PP), which can be hardly bonded with traditional adhesives. Furthermore, HMAs are characterized by a short open time and, therefore, permit for a quick and easy assembly process since they can be easily spread on the adherend surfaces by means of a hot-melt gun and they offer the opportunity of an ease disassembling process for repair and recycle. For all these reasons, HMAs are employed in many industrial applications and are currently used also for bonding polypropylene and polyolefin piping systems. In the present paper, the dynamic response of single lap joints (SLJ) obtained by bonding together with a polyolefin HMA two polypropylene substrates was experimentally assessed. Quasi-static tests and dynamic tests were carried out to investigate the strain rate effect: dynamic tests were carried out with a modified instrumented impact pendulum. Relevant changes in the joint performance have been put in evidence. Failure modes were finally analysed and compared. A change in the failure mode is experimentally found: in quasi-static tests SLJ failed due to a cohesive failure of the adhesive, whereas in dynamic tests the SLJ failed due to an interfacial failure, with a low energy absorption.
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Landy, Edward. "Thermoplastic Hot Melt Web Adhesives in Automotive Soft Trim." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1985. http://dx.doi.org/10.4271/850528.

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Goel, Anil B., and D. Kip Hillshafer. "Crosslinkable Hot Melt Adhesives for Flexible and Structural Bonding." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1993. http://dx.doi.org/10.4271/930837.

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La Rosa, Angela Daniela, George-Andrei Ursan, Mihaela Aradoaei, Maria Ursan, and Cristina Schreiner. "Life Cycle Assessment of Microwave Activated Hot-Melt Adhesives." In 2018 International Conference and Exposition on Electrical And Power Engineering (EPE). IEEE, 2018. http://dx.doi.org/10.1109/icepe.2018.8559740.

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Brunella, Valentina, Giulia Spezzati, Ermias Gebrekidan Koricho, Giovanni Belingardi, Brunetto Martorana, Fabrice Bondji Ngabang, and Marco Simioli. "Novel Use of Electromagnetic-Sensitive Nano-Additives to Develop Reversible Hot-Melt Adhesives." In ASME 2018 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/pvp2018-84913.

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The paper describes the use of electromagnetic-sensitive nano-particle additive for developing a reversible hot-melt adhesive for structural applications. A prototype of a lower tail gate has been manufactured by means of this innovative technology to demonstrate the potential for joining plastic components in automotive and aerospace applications. Monitoring of nanoparticles release during preparation of modified adhesives shows very low environmental impact if the mixing process is performed under a fume hood. The innovative electromagnetic bonding process can provide to the manufacturing industry new opportunities in terms of simplification of productive lay-out, more flexible design and process rapidity, in addition to significant economic benefit. The reversibility of the process would also increase the chances for part reuse and/or recycling that would otherwise be discarded.
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Ursan, George-Andrei, Maria Ursan, Angela Daniela La Rosa, and Iulian Cosmin Contofan. "Correlations Between Simulation and Electromagnetic Properties Testing of Hot Melt Nanostructured Adhesives." In 2018 International Conference and Exposition on Electrical And Power Engineering (EPE). IEEE, 2018. http://dx.doi.org/10.1109/icepe.2018.8559821.

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Liyu Wang, Fabian Neuschaefer, Remo Bernet, and Fumiya Iida. "Design considerations for attachment and detachment in robot climbing with hot melt adhesives." In 2012 IEEE International Conference on Robotics and Automation (ICRA). IEEE, 2012. http://dx.doi.org/10.1109/icra.2012.6224955.

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Jin Su Jung, Jae Hoon Kim, Min Seok Kim, Han Mo Jeong, Youn Bok Cho, Yong Sung Kim, Tae Kyoon Kim, Jeong Mi Hwang, Sang Yun Lee, and Yang Lae Cho. "The properties of reactive hot melt polyurethane adhesives with acrylic polymer or macromonomer modifications." In 2008 Third International Forum on Strategic Technologies (IFOST). IEEE, 2008. http://dx.doi.org/10.1109/ifost.2008.4603008.

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