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Journal articles on the topic 'Adhesives, Hot melt'

Author: Grafiati

Published: 4 June 2021

Last updated: 5 February 2022

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1

Paul, C. W. "Hot-Melt Adhesives." MRS Bulletin 28, no. 6 (June 2003): 440–44. http://dx.doi.org/10.1557/mrs2003.125.

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AbstractHot-melt adhesives facilitate fast production processes because the adhesives set simply by cooling. Formulations contain polymers to provide strength and hot tack (resistance to separation while adhesive is hot), and tackifiers and/or oils to dilute the polymer entanglement network, adjust the glass-transition temperature, lower the viscosity, and improve wet-out (molecular contact of the adhesive with the substrate over the entire bonding area). Some adhesives also contain waxes to speed setting, lower viscosity, and improve heat resistance. Obtaining adequate strength and heat resistance from nonreactive hot melts requires that some component of the hot melt separate out into a dispersed but interconnected hard-phase network upon cooling. The hard phases are commonly either glassy styrene domains (for adhesives based on styrenic block copolymers) or organic crystallites (for adhesives based on waxes, olefinic copolymers, or ethylene copolymers). This article will describe first the material properties relevant to the processing and performance of hot-melt adhesives, then the chemistry and function of the specific raw materials used in hot melts, and will conclude with illustrative application examples and corresponding formulations.

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2

Malysheva, G. V., and N. V. Bodrykh. "Hot-melt adhesives." Polymer Science Series D 4, no. 4 (October 2011): 301–3. http://dx.doi.org/10.1134/s1995421211040095.

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3

Kuo, Chung-Feng Jeffrey, Wei Lun Lan, Jui-Wen Wang, John-Ber Chen, and Pin-Hua Lin. "Hot-melt pressure-sensitive adhesive for seamless bonding of nylon fabric Part II: Process parameter optimization for seamless bonding of nylon fabric." Textile Research Journal 89, no. 12 (July 31, 2018): 2294–304. http://dx.doi.org/10.1177/0040517518790970.

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This study develops hot melt pressure sensitive adhesives (HMPSAs) for the seamless bonding of nylon fabric, using butyl acrylate as the main monomer material and mixing the functional monomer for polymerization. It is combined with 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide for the photoinitiator and ultraviolet irradiation is used to make a pre-polymer. The effects of butyl acrylate content, type of functional monomer, and 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide content on the molecular weight of acrylate pre-polymer are discussed, following the Taguchi method. The pre-polymer is then mixed with the reactive diluent glycidyl methacrylate blend and with 2-10phr diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, coated on a release film, irradiated by ultraviolet light, and cured into hot melt pressure sensitive adhesives. The adhesive properties of hot melt pressure sensitive adhesive bonding on nylon include the peel strength, the shear strength, adhesive warpage, adhesive color difference, and adhesive overflow, which are discussed following the Taguchi method and the elimination and choice translating reality method for multi-quality analysis. Hot melt pressure sensitive adhesives are implemented by optimization parameters for practical validation. The results show that the peel strength of hot melt pressure sensitive adhesives is 1.495 kg/cm, the shear strength of hot melt pressure sensitive adhesives is 14.326 kg/cm2, adhesive warpage is 0.93 mm, adhesive color difference is 1.66, and adhesive overflow is 0.97 mm. The performance of HMPSAs in this study is enhanced effective.

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4

Wang, Zongqian, Dengfeng Wang, Zun Zhu, Wei Li, and Yanxia Xie. "Enhanced antistatic properties of polyethylene film/polypropylene-coated non-woven fabrics by compound of hot-melt adhesive and polymer antistatic agent." Journal of Industrial Textiles 50, no. 6 (May 15, 2019): 921–38. http://dx.doi.org/10.1177/1528083719850834.

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In this paper, the compound hot-melt adhesives were prepared by blending alkyl sulfonate polymer antistatic agent with modified rosin hot-melt adhesive and used for the preparation of polyethylene film/polypropylene-coated non-woven fabrics. The effects of the amount of antistatic agent on the melt viscosity, softening point, and thermal stability of the compounded hot-melt adhesives were studied. Then, the antistatic properties and its washing fastness of the coated non-woven fabrics were tested and analyzed. The results showed that the softening point and the melt viscosity of the hot-melt adhesives decreased after compounding, and the thermal stability of the compound hot-melt adhesives decreased in the high temperature range, which was not affected before 200℃. The surface inductive voltage, half-life, and specific resistance of the coated non-woven fabrics prepared from the compound adhesives decreased gradually with the increase of the amount of the antistatic agent, indicating that the antistatic property of the prepared fabrics was gradually improved. In addition, the fabrics still exhibited antistatic properties after soaping for several times. The influence of compound adhesive on the wettability of fabric surface was consistent with that of antistatic property. Finally, the mechanism of the hot-melt adhesive and antistatic agent compounding technology to improve the antistatic performance of the coated non-woven fabrics was elaborated, and the reason for its excellent soaping durability was also explained.

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5

Czech, Zbigniew, and Agnieszka Butwin. "UV-crosslinkable warm-melt pressure-sensitive adhesives based on acrylics." Polish Journal of Chemical Technology 12, no. 4 (January 1, 2010): 58–61. http://dx.doi.org/10.2478/v10026-010-0051-9.

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UV-crosslinkable warm-melt pressure-sensitive adhesives based on acrylics The target of this article is to show the preparation of new generation of UV-crosslinkable warm-melt acrylic pressure-sensitive adhesives (PSAs) and the experimental test of their adhesive properties in comparison with typical conventional hot-melts adhesives. New generation of UV-crosslinkable acrylic warm-melts PSAs containing unsaturated photoinitiator, incorporated during polymerization process into polymer chain, and photoreactive diluents added to PSA systems after polymerization allows producing of wide range of self-adhesive materials, such as labels, mounting tapes, masking and splicing tapes, and sign and marking films.

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6

Rossitto, Conrad. "Laminating with Hot Melt Adhesives." Journal of Coated Fabrics 16, no. 3 (January 1987): 190–98. http://dx.doi.org/10.1177/152808378701600305.

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7

Legocka, I., Z. Zimek, and A. Woźniak. "Adhesive properties of hot-melt adhesives modified by radiation." Radiation Physics and Chemistry 52, no. 1-6 (June 1998): 277–81. http://dx.doi.org/10.1016/s0969-806x(98)00201-1.

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8

Baurova, Natalia, Alexander Anoprienko, and Yulia Romanova. "The performance evaluation for rivet bonded joints in production and machine maintenance." MATEC Web of Conferences 224 (2018): 02003. http://dx.doi.org/10.1051/matecconf/201822402003.

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The paper deals with the studies on the serviceability and performance of rivet bonded joints produced with the use of thermoplastic hot-melt adhesives. Thermoplastic hot-melt adhesives are compared with conventional epoxy adhesives. The performance evaluation of different adhesive materials by dismantling of rivet bonded joints is fulfilled. The time necessary for each operation of the process is considered. The algorithms are provided for finding the design and engineering solution when replacing the conventional process of riveting by rivet bonding in production and machine maintenance.

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9

Waites, Paul. "Moisture‐curing reactive polyurethane hot‐melt adhesives." Pigment & Resin Technology 26, no. 5 (October 1997): 300–303. http://dx.doi.org/10.1108/03699429710177690.

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10

Brožek, Milan, Alexandra Nováková, and Helena Píšová. "Bonding of Plywood Using Hot Melt Adhesives." Manufacturing Technology 17, no. 4 (September 1, 2017): 423–27. http://dx.doi.org/10.21062/ujep/x.2017/a/1213-2489/mt/17/4/423.

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11

Gharde, Swaroop, Gaurav Sharma, and Balasubramanian Kandasubramanian. "Hot-Melt Adhesives: Fundamentals, Formulations, and Applications: A Critical Review." Reviews of Adhesion and Adhesives 8, no. 1 (March 1, 2020): 1–28. http://dx.doi.org/10.7569/raa.2020.097301.

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Hot-Melt Adhesives (HMAs) are typically used in applications where instant sealing is critically required. HMAs are generally preferred for those applications where processing speed is critical. These materials are widely used in various engineering applications, mainly as sealants in leakages and crack filling of walls and roofs. The industrial use of HMAs is most common in glassware and automobiles for gluing glasses in buildings and bonding heavy motor parts. The formulation of HMAs contains a polymer of suitable nature that makes the base for a strong adhesive, and waxes are added to increase the settling time of adhesive. The tackifiers are used to dilute the polymer to adjust the Glass Transition Temperature (Tg) and to reduce the viscosity for proper flow of hot-melt. This review intends to comprehensively discuss the preparation and formulations of HMAs using various polymer matrices, along with their applications and mechanics. The designing of green HMAs has been discussed in the literature and have been promoted over conventional solvent-based HMAs due to their functionality without Volatile Organic Compounds (VOCs). Various measures, challenges, and resolutions for making hazard-free HMAs have been discussed in the present review.

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12

Cui, Yanjun, Donghua Chen, Xinling Wang, and Xiaozhen Tang. "Crystalline structure in isocyanate reactive hot melt adhesives." International Journal of Adhesion and Adhesives 22, no. 4 (January 2002): 317–22. http://dx.doi.org/10.1016/s0143-7496(02)00010-6.

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13

Petrie, Edward M. "Reactive hot-melt adhesives for better structural bonding." Metal Finishing 106, no. 5 (May 2008): 39–43. http://dx.doi.org/10.1016/s0026-0576(08)80125-0.

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14

Hopkins, Jeff. "Advances, Advantages, and Techniques of Hot Melt Adhesives." Journal of Coated Fabrics 23, no. 1 (July 1993): 5–13. http://dx.doi.org/10.1177/152808379302300102.

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15

Chung, Cheng-Hung, Wen-Chang Shih, and Wei-Ming Chiu. "Synthesis, characterization and properties of biomass and carbon dioxide derived polyurethane reactive hot-melt adhesives." e-Polymers 19, no. 1 (October 26, 2019): 535–44. http://dx.doi.org/10.1515/epoly-2019-0057.

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AbstractPolyurethane reactive hot-melt adhesives (PURHs) are frequently employed in industries; however, there is still a need to develop more sustainable and versatile methodologies to expand the functions and fabrication of these important materials. Renewable feedstock can give PURHs with new functions, and reduce environmental impact. This study focuses on synthesizing PURHs using polyols derived from biomass (plants) and greenhouse gas (CO2) resources. These PURHs were characterized by multiple techniques, including solid-state 13C nuclear magnetic resonance (NMR), a dynamic mechanical analysis (DMA), single-lap adhesive joints strength of stainless steel, and hydrolytic ageing. The PURH film based on biomass poly(tetramethylene ether) glycol (bio-PTMEG) exhibited better water vapor permeability, tensile strength, and adhesive joints properties than PURHs based on cashew nutshell liquid (CNSL) polyester diol and poly(propylene carbonate)-poly(propylene glycol) (PPC-PPG) copolymer diol. The polyols blend of bio-PTMEG with biomass and CO2 based polycarbonate diols respectively provided PURHs films excellent hydrolysis resistance and adhesive strength on single-lap adhesively bonded stainless steel specimens. The work herein demonstrates that various renewable polyols can be employed in a sustainable fashion to optimize the structures and properties of PURHs for important applications.

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16

MARULANDA AREVALO, JOSE LUDDEY, Miguel Angel Martinez Casanova, JUANA ABEJONAR BUENDIA, and ANTONIO PIQUERAS PEREZ. "Characterization a polyurethane-based reactive hot melt adhesive for applications in materials." DYNA 86, no. 210 (July 1, 2019): 247–53. http://dx.doi.org/10.15446/dyna.v86n210.78244.

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In the present study, we used tensile shear tests, Shore hardness tests, differential scanning calorimetry (DSC), and thermogravimetry (TGA) to characterize a reactive polyurethane-based hot melt adhesive. We also measured contact angles at various temperatures to evaluate the wettability of the adhesive and to determine the optimum temperature range for applications. The adhesive was tested following curing for various times, and the bonding of the adhesive with several materials was investigated to determine whether it has the potential for greater versatility of application. Therefore, we explored new uses of the adhesive, such as in the matrix of a composite with fiberglass. Reactive hot melt adhesives are useful because they provide a certain degree of flexibility to joints, and have high processing speeds, high initial rigidity, and high working temperatures.

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17

Soares, Andreia, and Miguel Pestana. "Polyterpene Resisns: Part I – A Brief Historical Review." Silva Lusitana 28, no. 2 (2020): 181–95. http://dx.doi.org/10.1051/silu/20202802165.

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The terpenic resins are polymers of low molecular weight hydrocarbons, obtained by cationic polymerization of terpenes. These products are used in the adhesives, sealants and wax coating industries. Commercial adhesive resins are prepared from monoterpenes -the main ones are α-pinene, β-pinene and dipentene. The softening point and molecular weight of polyterpene resins are critical for their main use (adherence). Its adhesive behavior results from the relationship of the softening point with the molecular weight. At the commercial level, polyterpene resins are produced by polymerization of terpene monomers. Batch and continuous systems are used. The composition of an adhesive requires a wide knowledge of the materials available and the specific requirements of its application. The most common types of adhesives are Pressure Sensitive Adhesives, Hot-melt Adhesives and Structural Adhesives.

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18

MATYAŠOVSKÝ, JÁN, JÁN SEDLIAČIK, IGOR NOVÁK, PETER DUCHOVIČ, and PETER JURKOVIČ. "Influence of collagen modifications on qualitative parameters of thermoplastic adhesive mixtures and its microbiological stability." Annals of WULS, Forestry and Wood Technology 105 (June 6, 2019): 54–61. http://dx.doi.org/10.5604/01.3001.0013.7716.

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Influence of collagen modifications on qualitative parameters of thermoplastic adhesive mixtures and its microbiological stability.This work presents the possibility to use the modified biopolymer collagen for preparation of ecologic, biologically degradable thermoplastic adhesives. Collagen prepared from secondary raw materials of the leather and food industry was applied as a starting material for the preparation of thermoplastic, formaldehyde-free adhesives intended for use in woodworking, furniture and paper industries. Glued joint obtained high strength and flexibility after application of modification plasticisation agents based on collagen. Modifications of collagen glue with keratin biopolymer increased its resistance to water and the strength of the glued joint. Prepared samples of hot-melt adhesive had higher bonding strengths than standard commercial adhesives. The highest tensile strengths were achieved by applying of undiluted adhesive with the application of 2.5% keratin hydrolysate into hot-melt adhesive. As collagen is a natural polymer easy biodegradable in the aquatic environment, the research has focused on the possibility of its microbiological stabilization with aqueous solutions of ionic and colloidal silver. The highest microbiological activity was observed in a sample of ionic silver sulphate solution with a concentration of 2000 ppm Ag+. Its 1% concentration was applied for antibacterial thermoplastic stabilization of formaldehyde-free collagen glue.

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19

Utekar, P., H. Gabale, A. Khandelwal, and S. T. Mhaske. "Hot-Melt Adhesives from Renewable Resources: A Critical Review." Reviews of Adhesion and Adhesives 4, no. 1 (March 1, 2016): 104–18. http://dx.doi.org/10.7569/raa.2016.097303.

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20

Gu, Cheng, Matthew R. Dubay, Steven J. Severtson, and Larry E. Gwin. "Hot-Melt Pressure-Sensitive Adhesives Containing High Biomass Contents." Industrial & Engineering Chemistry Research 53, no. 27 (June 27, 2014): 11000–11006. http://dx.doi.org/10.1021/ie501441w.

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21

Frost and Sullivan Ltd. "Market for hot-melt adhesives in western Europe studied." International Journal of Adhesion and Adhesives 9, no. 2 (April 1989): 60. http://dx.doi.org/10.1016/0143-7496(89)90004-3.

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22

Brodbeck, Luzius, and Fumiya Iida. "An extendible reconfigurable robot based on hot melt adhesives." Autonomous Robots 39, no. 1 (April 3, 2015): 87–100. http://dx.doi.org/10.1007/s10514-015-9428-1.

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23

Takemoto, Mototsugu, Mikio Kajiyama, Hiroshi Mizumachi, Akio Takemura, and Hirokuni Ono. "Miscibility and adhesive properties of EVA-based hot-melt adhesives. II. Peel strength." Journal of Applied Polymer Science 83, no. 4 (November 29, 2001): 726–35. http://dx.doi.org/10.1002/app.2267.

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24

Ciardiello, R., B. Martorana, VG Lambertini, and V. Brunella. "Iron-based reversible adhesives: Effect of particles size on mechanical properties." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 232, no. 8 (October 17, 2017): 1446–55. http://dx.doi.org/10.1177/0954406217736552.

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A hot melt adhesive – mainly used for bonding plastic component in automotive field – was modified with different iron-based particles to give it a reversible behaviour. Mechanical and physical properties of these reversible adhesives were experimentally assessed in the work. The modified adhesives, coupled with electromagnetic induction, are able to guarantee separation of the joints without any damage to the substrates for recycling, reuse or repairing of components. Single lap joint specimens were prepared using epoxy/glass fibres substrates and tests were carried out on neat and modified adhesive with 5% weight of iron and iron oxide. Three different Fe particles size were tested: 450 µm, 60 µm and 1–6 µm. The particles size of iron oxide was 50 nm. Separation was studied using single lap joint specimens under electro-magnetic induction. Experimental results showed that the maximum peak load decreases when the average particles sizes increase. The peak loads of the smallest particles were equal to the ones of the pristine adhesive. The elongation of the adhesives increases when the adhesive is modified with both iron and iron oxide particles. Finally, experimental tests on single lap joints coupled with electro-magnetic induction showed that separation of the substrates is possible using iron oxide particles. Electro-magnetic tests conducted on particles alone, helped to understand that bigger particles are able to overcome the melting temperature of the adhesive but hot-melt adhesives modified with these particles are not able to reach the melting. These tests showed that the number of particles into the adhesive matrix is very important for this kind of tests.

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25

Latko-Durałek, Paulina, Rafał Kozera, Jan Macutkevič, Kamil Dydek, and Anna Boczkowska. "Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes." Materials 13, no. 20 (October 9, 2020): 4469. http://dx.doi.org/10.3390/ma13204469.

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The polymeric adhesive used for the bonding of thermoplastic and thermoset composites forms an insulating layer which causes a real problem for lightning strike protection. In order to make that interlayer electrically conductive, we studied a new group of electrically conductive adhesives based on hot melt copolyamides and multi-walled carbon nanotubes fabricated by the extrusion method. The purpose of this work was to test four types of hot melts to determine the effect of their viscosity on the dispersion of 7 wt % multi-walled carbon nanotubes and electrical conductivity. It was found that the dispersion of multi-walled carbon nanotubes, understood as the amount of the agglomerates in the copolyamide matrix, is not dependent on the level of the viscosity of the polymer. However, the electrical conductivity, analyzed by four-probe method and dielectric spectroscopy, increases when the number of carbon nanotube agglomerates decreases, with the highest value achieved being 0.67 S/m. The inclusion of 7 wt % multi-walled carbon nanotubes into each copolyamide improved their thermal stability and changed their melting points by only a few degrees. The addition of carbon nanotubes makes the adhesive’s surface more hydrophilic or hydrophobic depending on the type of copolyamide used.

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26

Qu, Dezhi, Shuai Sun, Hongwei Gao, Yongping Bai, and Ying Tang. "Biodegradable copolyester poly(butylene-co-isosorbide succinate) as hot-melt adhesives." RSC Advances 9, no. 20 (2019): 11476–83. http://dx.doi.org/10.1039/c9ra01780a.

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27

Pomposo, J. A., J. Rodrı́guez, and H. Grande. "Polypyrrole-based conducting hot melt adhesives for EMI shielding applications." Synthetic Metals 104, no. 2 (July 1999): 107–11. http://dx.doi.org/10.1016/s0379-6779(99)00061-2.

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28

Comyn, J., F. Brady, R. A. Dust, M. Graham, and A. Haward. "Mechanism of moisture-cure of isocyanate reactive hot melt adhesives." International Journal of Adhesion and Adhesives 18, no. 1 (February 1998): 51–60. http://dx.doi.org/10.1016/s0143-7496(98)80004-3.

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29

Frankling, Peter G. "The increasing importance of hot melt adhesives in product assembly." Pigment & Resin Technology 25, no. 1 (January 1996): 4–11. http://dx.doi.org/10.1108/eb043164.

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30

Tse, M. F. "Semi-Structural Hot Melt Adhesives Based on Crosslinkable Functionalized Polyolefins." Journal of Adhesion 50, no. 4 (July 1995): 215–32. http://dx.doi.org/10.1080/00218469508014554.

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31

Frankling, P. G. "The role of hot‐melt adhesives in sift‐proof sealing." Pigment & Resin Technology 26, no. 5 (October 1997): 289–95. http://dx.doi.org/10.1108/03699429710177663.

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32

Fernandes, E. G., A. Lombardi, R. Solaro, and E. Chiellini. "Thermal characterization of three-component blends for hot-melt adhesives." Journal of Applied Polymer Science 80, no. 14 (2001): 2889–901. http://dx.doi.org/10.1002/app.1406.

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33

Dumas, Jean-Pierre, Philippe Tordjeman, Youssef Zeraouli, and Frédéric Di Paolo. "Heat transfer model for the cooling of hot melt adhesives." Journal of Adhesion Science and Technology 12, no. 4 (January 1998): 399–413. http://dx.doi.org/10.1163/156856198x00119.

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34

Wang, Liyu, and Fumiya Iida. "Physical Connection and Disconnection Control Based on Hot Melt Adhesives." IEEE/ASME Transactions on Mechatronics 18, no. 4 (August 2013): 1397–409. http://dx.doi.org/10.1109/tmech.2012.2202558.

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35

Park, Young-Jun, Hyo-Sook Joo, Hyun-Joong Kim, and Young-Kyu Lee. "Adhesion and rheological properties of EVA-based hot-melt adhesives." International Journal of Adhesion and Adhesives 26, no. 8 (December 2006): 571–76. http://dx.doi.org/10.1016/j.ijadhadh.2005.09.004.

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36

He, Xianru, Rui Zhang, Chengyu Yang, Yaoqiang Rong, and Guangsu Huang. "Study on orientation in EVA/Fe3O4 composite hot-melt adhesives." International Journal of Adhesion and Adhesives 44 (July 2013): 9–14. http://dx.doi.org/10.1016/j.ijadhadh.2013.02.003.

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37

Kalish, Jeffrey P., Suriyakala Ramalingam, Onyenkachi Wamuo, Omkar Vyavahare, Ying Wu, Shaw Ling Hsu, Charles W. Paul, and Andrea Eodice. "Role of n-alkane-based additives in hot melt adhesives." International Journal of Adhesion and Adhesives 55 (December 2014): 82–88. http://dx.doi.org/10.1016/j.ijadhadh.2014.07.017.

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38

Cho, Youn Bok, Han Mo Jeong, and Byung Kyu Kim. "Reactive hot melt polyurethane adhesives modified by acrylic copolymer nanocomposites." Macromolecular Research 17, no. 11 (November 2009): 879–85. http://dx.doi.org/10.1007/bf03218630.

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39

Kunkel, Dieter. "PUR hot melt adhesives for efficient bonding of sandwich elements." adhäsion KLEBEN & DICHTEN 47, no. 9 (September 2003): 28–31. http://dx.doi.org/10.1007/bf03255626.

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40

Sun, Peng, Yuquan Li, Bo Qin, Jiang-Fei Xu, and Xi Zhang. "Super Strong and Multi-Reusable Supramolecular Epoxy Hot Melt Adhesives." ACS Materials Letters 3, no. 7 (June 14, 2021): 1003–9. http://dx.doi.org/10.1021/acsmaterialslett.1c00277.

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41

Zhang, Zhanrong, Duncan J. Macquarrie, James H. Clark, and Avtar S. Matharu. "Chemical modification of starch and the application of expanded starch and its esters in hot melt adhesive." RSC Adv. 4, no. 79 (2014): 41947–55. http://dx.doi.org/10.1039/c4ra08027k.

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42

Shih, Hsi-Hsin, and Gary R. Hamed. "Poly(Ethylene-co-Vinylacetate) Based Hot Melt Adhesives: I. Relating Adhesive Rheology to Peel Adhesion." Journal of Adhesion 61, no. 1-4 (February 1997): 231–45. http://dx.doi.org/10.1080/00218469708010524.

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43

Viljanmaa, M., A. Södergård, R. Mattila, and P. Törmälä. "Hydrolytic and environmental degradation of lactic acid based hot melt adhesives." Polymer Degradation and Stability 78, no. 2 (2002): 269–78. http://dx.doi.org/10.1016/s0141-3910(02)00171-4.

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44

Viljanmaa, M., A. Södergård, and P. Törmälä. "Lactic acid based polymers as hot melt adhesives for packaging applications." International Journal of Adhesion and Adhesives 22, no. 3 (January 2002): 219–26. http://dx.doi.org/10.1016/s0143-7496(01)00057-4.

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45

Zhao, Zhong-fu, Bing Fang, Xiaohui Li, and Qing Wang. "Development of hot-melt pressure–sensitive adhesives for transdermal drug delivery." Journal of Adhesion Science and Technology 27, no. 2 (January 2013): 143–53. http://dx.doi.org/10.1080/01694243.2012.701513.

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46

Latko-Durałek, Paulina, Jan Macutkevic, Christopher Kay, Anna Boczkowska, and Tony McNally. "Hot-melt adhesives based on co-polyamide and multiwalled carbon nanotubes." Journal of Applied Polymer Science 135, no. 11 (November 15, 2017): 45999. http://dx.doi.org/10.1002/app.45999.

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47

Laine, Christiane, Pia Willberg‐Keyriläinen, Jarmo Ropponen, and Tiina Liitiä. "Lignin and lignin derivatives as components in biobased hot melt adhesives." Journal of Applied Polymer Science 136, no. 38 (May 21, 2019): 47983. http://dx.doi.org/10.1002/app.47983.

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48

Hu, Andrew Teh, Ruey-Shi Tsai, and Yu-Der Lee. "Preparation of block copolyetheramides and their properties as hot melt adhesives." Journal of Applied Polymer Science 37, no. 7 (March 1989): 1863–76. http://dx.doi.org/10.1002/app.1989.070370710.

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Kalish, Jeffrey P., Suriyakala Ramalingam, Huimin Bao, Douglas Hall, Onyenkachi Wamuo, Shaw Ling Hsu, Charles W. Paul, Andrea Eodice, and Yew-Guan Low. "An analysis of the role of wax in hot melt adhesives." International Journal of Adhesion and Adhesives 60 (July 2015): 63–68. http://dx.doi.org/10.1016/j.ijadhadh.2015.03.008.

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Schmidt, H., H. Scholze, and G. Tünker. "Hot melt adhesives for glass containers by the sol-gel process." Journal of Non-Crystalline Solids 80, no. 1-3 (March 1986): 557–63. http://dx.doi.org/10.1016/0022-3093(86)90446-1.

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