Relevant bibliographies by topics / Adhesives Reliability

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Adhesives Reliability'

Author: Grafiati
Published: 4 June 2021
Last updated: 16 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Adhesives Reliability.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Adhesives Reliability"

1

Otsuka, Yuichi, Yoshihisa Hiraki, Yuki Hakozaki, Yukio Miyashita, and Yoshiharu Mutoh. "Effects of Adhesives on Reliability in Interfacial Strength Evaluation Method for Plasma-Sprayed Hydroxyapatite Coating." International Journal of Automation Technology 11, no. 6 (October 31, 2017): 907–14. http://dx.doi.org/10.20965/ijat.2017.p0907.

Full text
Abstract:
The purpose of this study is to evaluate interfacial strength of plasma-sprayed HAp coating by using more general adhesives. Plasma-sprayed HAp coating has been applied to bond bones with the surfaces of artificial hip joints. However, HAp coating is subjected to crack or delamination by mechanical loading. Conventional standard codes for measurement of interfacial strength of calcium phosphate coating determine the use of a specific adhesive irrationally. Our group previously proposed pre-immersion treatment process in preparation of interfacial testing specimens in order to obtain valid value of interfacial strength. However, the type of the adhesive was for medical purpose and not general one. To widen applicability of the proposed method, a selection policy of adhesive is indispensable. Metal Lock Y610 (ML adhesive) was selected as one of general adhesives. Interfacial strength tests by using ML adhesive were conducted. The results of interfacial strength test were compatible with the one reported by previous study, which suggest that the selection of general type of adhesive was successful. Raman spectroscopy analyses were also conducted to confirm a suppressed infiltration of ML adhesives.
APA, Harvard, Vancouver, ISO, and other styles
2

Zhong, Z. W. "Various Adhesives for Flip Chips." Journal of Electronic Packaging 127, no. 1 (March 1, 2005): 29–32. http://dx.doi.org/10.1115/1.1846064.

Full text
Abstract:
Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cycling tests. The reliability of the packages was 100% meeting the requirements for an industrial application. A stud bump bonding process with reduced process steps was proposed. Curing of conductive adhesive and underfill epoxy was not required, resulting in reduced packaging time.
APA, Harvard, Vancouver, ISO, and other styles
3

Patelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, and Aaron J. Schmidt. "Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000051–55. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000051.

Full text
Abstract:
Abstract High power semiconductor applications require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current die attach solutions such as eutectic solders and high thermal conductive silver epoxies and sintered silver adhesives have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will focus on development of a reinforced, sintered silver die attach solution for high power semiconductor applications with focus on a pressure-less, low temperature sintering technology that offers high reliability for high temperature (250°C) applications. The electronic, optoelectronic, and semiconductor industries have the need for high performance adhesives, in particular, high power devices require low-stress, high thermal conductivity, thermally stable, and moisture resistant adhesives for the manufacture of high reliability devices. This paper introduces a new reinforced sintered silver adhesive based on the “resin-free” Conductive Fusion Technology. The high performance adhesive offers a robust solution for high temperature, high reliability applications. Conductive Fusion Technology consists of a high thermal conductivity silver component blended with a non-conductive, low-modulus powder component. The non-conductive powder component comprises an organically modified inorganic material that exhibits excellent thermal stability at temperatures exceeding 250°C. Properties of the sintered silver adhesive, such as storage modulus, can be modified by varying the content of the non-conductive component.
APA, Harvard, Vancouver, ISO, and other styles
4

Cui, Hui-wang, Dong-sheng Li, and Qiong Fan. "Reliability of flexible electrically conductive adhesives." Polymers for Advanced Technologies 24, no. 1 (July 26, 2012): 114–17. http://dx.doi.org/10.1002/pat.3059.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

NAKATA, Yoshihiro. "Adhesion Reliability of the Adhesives for Automotive." Journal of The Adhesion Society of Japan 39, no. 12 (2003): 455–60. http://dx.doi.org/10.11618/adhesion.39.455.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Titova, Ol'ga, Tatyana Melenberg, Lyudmila Linnik, Takhmina Boeva, Andrey Burov, Sergey Daironas, and Ella Daironas. "ADHESIVE SYSTEMS IN THE PRACTICE OF A DENTIST DOCTOR." Actual problems in dentistry 16, no. 1 (May 14, 2020): 178–81. http://dx.doi.org/10.18481/2077-7566-20-16-1-178-181.

Full text
Abstract:
Subject. Dental restoration includes work on tissue restoration by filling, using inlays, veneers, and artificial crowns. Adhesive systems are used in therapeutic dentistry for working with composites, compomers and some glass-ionomer cements, for adhesive fixation of all types of indirect structures, repairing chips of composite and ceramic linings; in pediatric dentistry for sealing fissures, for fixing orthodontic structures. Currently, there are eight generations of adhesives on the market of dental materials. The first two generations of adhesives required only enamel etching and transformed the dentin layer, while the third already provided for conditioning of the dentin, and the fourth and fifth ― and all-out etching. The sixth, seventh and eighth generations of adhesives are self-etching analogues. This article presents the results of a survey of practical health care dentists in choosing an adhesive system. The goal is to evaluate the preferences of the choice of adhesive systems by dentists. Methodology. 30 dental therapists and orthopedic dentists took part in the survey. Results. The results of the questionnaire analysis showed that the majority of dentists prefer to use fifth-generation adhesives in their practice (46 %), the sixth generation of adhesive systems is in second place in popularity (31 %), followed by the "gold standard" ― the fourth generation (13 %), and the seventh (10 %) in last place. Conclusions. The fifth-generation adhesive systems surpassed the other generations in efficiency and reliability. This is why the majority of dentists surveyed chose this generation.
APA, Harvard, Vancouver, ISO, and other styles
7

Ruales, M., J. Merced, and R. Ramos. "Managing Voids in Adhesives for Medical Devices." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000567–71. http://dx.doi.org/10.4071/isom-poster2.

Full text
Abstract:
Void content within the adhesive layer dispensed over the connector module in neuromodulation devices is critical. Voids can affect the thermal transfer, bond strength, and stress decoupling of the adhesive, which can eventually lead to degraded device reliability. The effects of voids are investigated for a silicone based adhesive used in these medical devices. There are many challenges associated with the curing process that this adhesive undergoes which drive the need for unique and specific testing to determine optimal process settings. The parameters evaluated included curing time, temperature, thickness, and relative humidity. Reduction in void content was linked with mechanical properties including hardness and tensile strength. Achievement of void free medical adhesives will encourage today's microelectronic packaging industry to meet the challenges of smaller and denser medical devices.
APA, Harvard, Vancouver, ISO, and other styles
8

Guzii, Sergii, Ihar Bazhelka, and Vasyl Lashchivskyi. "STUDY OF THE INFLUENCE OF COMPOUNDS OF THE ANO3 and ANO3 nH2O TYPES ON RHEOKINETIC AND COLLOID-CHEMICAL PROPERTIES OF ALUMINOSILICATE ADHESIVES FOR WOOD." ScienceRise, no. 5 (November 11, 2020): 14–23. http://dx.doi.org/10.21303/2313-8416.2020.001493.

Full text
Abstract:
In the technology of gluing solid wood, various adhesives are used, which, in addition to ensuring the strength of the gluing, must also be characterized by a number of rheological and colloidal-chemical properties, namely: have acceptable viscosity, low contact angles, have good spreading and enveloping ability, penetrate deep into the wood , providing reliable cohesive-adhesive contact and much more. Today, adhesives based on PVA dispersions and urea formaldehydes are used, the properties of which have been sufficiently studied and tested in practice. An alternative to organic-based adhesives is mineral adhesives, in particular aluminosilicate adhesives, which are non-flammable and have high mechanical strength. Object of research: rheokinetic patterns and processes of formation of colloidal-chemical structures of aluminosilicate adhesives modified with compounds of the ANO3 and ANO3×nH2O type. Investigated problem: Considering that aluminosilicate adhesives are multiphase reactive suspensions, the viscosity of which changes over time and affects their viability, the issue of viscosity stabilization due to the introduction of electrolyte salts into their composition is relevant, and will also contribute to improving the wettability and spreading of the adhesive during applying them to substrates and gluing samples from various types of wood. Main scientific results: The effect of the concentrations of compounds of the ANO3 and ANO3×nH2O type on the rheokinetic and chemical-colloidal properties of the aluminosilicate adhesive has been established, which will make it possible to use aluminosilicate adhesives in practice for gluing wood of various species, as well as to work out possible technological methods of their application, taking into account the obtained data on the viscosity, wetting and spreadability of the modified adhesive on the surface of the wood substrate. Area of practical use of the research results: woodworking enterprises for the production of glued solid wood products. Innovative technological product: aluminosilicate adhesives modified with ANO3 and ANO3×nH2O nitrate additives for gluing wood of various species. Scope of application of an innovative technological product: the application of these approaches will make it possible to obtain glued materials from wood from different species with improved technological and physical and mechanical properties of the glue seam and, accordingly, to increase the quality and reliability of products.
APA, Harvard, Vancouver, ISO, and other styles
9

Popov, Viktor, Olga Dornyak, Andrei Latinin, and Elena Lushnikova. "CREATING DURABLE WOOD GLUE STRUCTURES BASED ON PHYSICOMODIFIED ADHESIVES." Voronezh Scientific-Technical Bulletin 4, no. 4 (January 25, 2021): 70–75. http://dx.doi.org/10.34220/2311-8873-2021-4-4-70-75.

Full text
Abstract:
In the past few decades, gluing technologies have been widely used in woodworking, which significantly expand the range of new products. Bonding of products with adhesives is used in the manufacture of furniture, parquet, load-bearing and enclosing structures, door and window blocks, prefabricated houses and many other products. The main criteria for the quality of glued wood joints is the cohesive and adhesive strength of the glued joint. To date, a number of technologies have been developed to improve the strength of glued wood joints. In order to increase the strength of the adhesive bond of wood, technologists propose methods of variation by such factors as temperature, pressure during curing of the adhesive joint, the purity of the surface treatment of substrates, and the thickness of the adhesive layer. A large amount of work and substantial financial costs are spent on creating new brands of adhesives. However, the requirements for glued timber products are not solved by the proposed gluing technologies and new brands of glues. First of all, this concerns the widely used glue wood structures (CDC), as a rule, operating in difficult conditions with high mechanical loads. To solve the problem of increasing the reliability of glue wood structures, instead of domestic imported, but more expensive adhesives are often used. To a certain extent, the creation of more high-strength adhesive joints has recently also been solved by the use of methods for modifying domestic adhesives exposed to irradiation with magnetic and electric fields, as well as ultrasound.
APA, Harvard, Vancouver, ISO, and other styles
10

Lee, Jun Hyup. "Highly Adhesive and Sustainable UV/Heat Dual-Curable Adhesives Embedded with Reactive Core-Shell Polymer Nanoparticles for Super-Narrow Bezel Display." Materials 13, no. 16 (August 7, 2020): 3492. http://dx.doi.org/10.3390/ma13163492.

Full text
Abstract:
To achieve the seamless characteristics of displays, liquid crystal (LC) devices need a super-narrow bezel design. This device architecture can be constructed using functional adhesives that possess excellent physical and chemical properties. In this study, mechanically robust ultraviolet (UV)/heat dual-curable adhesives with outstanding reliability and processability have been fabricated using reactive poly(methyl methacrylate) (PMMA)/polyethyleneimine (PEI) core-shell nanoparticles. Their curing characteristics, narrow drawing processability, adhesive strength, elongation at break, and the contact contamination of LCs have been investigated. Compared to conventional adhesive material, the proposed adhesive containing multifunctional PMMA/PEI nanoparticles afforded a high adhesion strength of 40.2 kgf cm−2 and a high elongation of 64.8% due to the formation of a firm crosslinked network with matrix resins comprising bisphenol A epoxy resin and bisphenol A glycerolate dimethacrylate. Moreover, the proposed adhesive showed an excellent narrow drawing width of 1.2 mm, which is a prerequisite for super-narrow bezel display. With regard to LC contamination, it was found that the level of contamination could be remarkably reduced to 61 µm by a high-temperature curing process. This study makes a significant contribution to the development of advanced display, because it provides robust and sustainable display adhesives based on nanomaterials, thereby enhancing the life and sustained operability of displays.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Adhesives Reliability"

1

Su, Bin. "Electrical, thermomechanical and reliability modeling of electrically conductive adhesives." Diss., Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/10425.

Full text
Abstract:
The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of filler particles, such as size, shape and distribution, on electrical conductivity are studied by the method of factorial design. The second part of the dissertation evaluates the reliability and investigates the failure mechanism of conductive adhesives subjected to fatigue loading, moisture conditioning and drop impacts. In fatigue tests it is found that electrical conduction failure occurs prior to mechanical failure. The experimental data show that electrical fatigue life can be described well by the power law equation. The electrical failure of conductive adhesives in fatigue is due to the impaired epoxy-silver interfacial adhesion. Moisture uptake in conductive adhesives is measured after moisture conditioning and moisture recovery. The fatigue life of conductive adhesives is significantly shortened after moisture conditioning and moisture recovery. The moisture accelerates the debonding of silver flakes from epoxy resin, which results in a reduced fatigue life. Drop tests are performed on test vehicles with conductive adhesive joints. The electrical conduction failure happens at the same time as joint breakage. The drop failure life is found to be correlated with the strain energy caused by the drop impact, and a power law life model is proposed for drop tests. The fracture is found to be interfacial between the conductive adhesive joints and components/substrates. This research provides a comprehensive understanding of the conduction mechanism of conductive adhesives. The computer-simulated modeling approach presents a useful design tool for the conductive adhesive industry. The reliability tests and proposed failure mechanisms are helpful to prevent failure of conductive adhesives in electronic packages. Moreover, the fatigue and impact life models provide tools in product design and failure prediction of conductive adhesives.
APA, Harvard, Vancouver, ISO, and other styles
2

Su, Bin. "Electrical, thermomechanical and reliability modeling of electrically conductive adhesives." Available online, Georgia Institute of Technology, 2006, 2006. http://etd.gatech.edu/theses/available/etd-12192005-124641/.

Full text
Abstract:
Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2006.
Qu, Jianmin, Committee Chair ; Baldwin, Daniel, Committee Member ; Wong, C. P., Committee Member ; Sitaraman, Suresh, Committee Member ; Jacob, Karl, Committee Member.
APA, Harvard, Vancouver, ISO, and other styles
3

Puthenparambil, Abhilash. "Effect of bonding pressure on reliability of anisotropic conductive adhesives [sic] joints in a silicon-to-flex-substrate interconnction." Diss., Online access via UMI:, 2006.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Zhang, Rongwei. "Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/39548.

Full text
Abstract:
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; However, ICAs have a higher resistivity compared to tin/lead solder. The higher resistivity of ICAs results from the large contact resistance between conductive fillers. Several novel approaches to engineer the interface between electrically conductive fillers were studied to develop highly conductive ICAs. Shown in this dissertation are three methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The findings and insights in this dissertation significantly contribute to (1) understanding of filler-filler, filler-polymer and structure-property relationships of ICAs; (2) the structural design and formulation of high performance ICAs; and (3) the wider use of ICAs in emerging applications such as printed electronics and solar cells.
APA, Harvard, Vancouver, ISO, and other styles
5

Löw, Richard Constantin. "Stress evaluation and reliability of electrically conductive adhesive interconnections." Templin Detert, 2009. http://d-nb.info/997085126/04.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Huppe, Barbara A. (Barbara Alaine) 1977. "High reliability adhesive joining of metal and composite components." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/81570.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Chiang, Weng-Keong. "Reliability study of non-conductive adhesive joints for fine-pitch microelectronics." Thesis, Brunel University, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.443292.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Choudhury, Abhishek. "Chip-last embedded low temperature interconnections with chip-first dimensions." Thesis, Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/37104.

Full text
Abstract:
Small form-factor packages with high integration density are driving the innovations in chip-to-package interconnections. Metallurgical interconnections have evolved from the conventional eutectic and lead-free solders to fine pitch copper pillars with lead-free solder cap. However, scaling down the bump pitch below 50-80µm and increasing the interconnect density with this approach creates a challenge in terms of accurate solder mask lithography and joint reliability with low stand-off heights. Going beyond the state of the art flip-chip interconnection technology to achieve ultra-fine bump pitch and high reliability requires a fundamentally- different approach towards highly functional and integrated systems. This research demonstrates a low-profile copper-to-copper interconnect material and process approach with less than 20µm total height using adhesive bonding at lower temperature than other state-of-the-art methods. The research focuses on: (1) exploring a novel solution for ultra-fine pitch (< 30µm) interconnections, (2) advanced materials and assembly process for copper-to-copper interconnections, and (3) design, fabrication and characterization of test vehicles for reliability and failure analysis of the interconnection. This research represents the first demonstration of ultra-fine pitch Cu-to-Cu interconnection below 200°C using non-conductive film (NCF) as an adhesive to achieve bonding between silicon die and organic substrate. The fabrication process optimization and characterization of copper bumps, NCF and build-up substrate was performed as a part of the study. The test vehicles were studied for mechanical reliability performance under unbiased highly accelerated stress test (U-HAST), high temperature storage (HTS) and thermal shock test (TST). This robust interconnect scheme was also shown to perform well with different die sizes, die thicknesses and with embedded dies. A simple and reliable, low-cost and low-temperature direct Cu-Cu bonding was demonstrated offering a potential solution for future flip chip packages as well as with chip-last embedded active devices in organic substrates.
APA, Harvard, Vancouver, ISO, and other styles
9

Mehrotra, Gaurav. "Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22594.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Jullien, Jean-Baptiste. "Etude de fiabilité et définition de modèles théoriques de vieillissement en très haute température pour des systèmes électronique et microélectronique." Thesis, Bordeaux 1, 2012. http://www.theses.fr/2012BOR14604/document.

Full text
Abstract:
Ce travail s'intègre dans les domaines de l'analyse et de la prédiction de la fiabilité des assemblages Multi-Chip Module. Il présente l'étude de fiabilité de microcâblages filaires (wire bonding) en très haute température à partir d'essais de vieillissement et d'analyses expérimentales. Les résultats permettent d'identifier les mécanismes de dégradation et d'évaluer les températures limites d'utilisation de ces interconnexions. Il développe une étude du comportement thermomécanique des joints collés à partir d'essais de caractérisation mécanique, d'essais de vieillissement accéléré et de simulations numériques par éléments finis. Ces méthodes permettent d'évaluer la criticité des assemblages dès la phase de conception
This work is performed in analysis and prediction areas of Multi-Chip Module package reliability. It presents a reliability study on wire bonding in high temperature environment from aging tests and experimental analyzes. Results permit to identify degradation mechanisms and evaluate temperature limits of these interconnections. It develops a study of the thermomechanical behavior of adhesive joints from mechanical characterization tests, accelerated aging tests and finite element simulations. These methods are used to assess the criticality of packages from the design phase
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Adhesives Reliability"

1

W, Swanson Dale, and Knovel (Firm), eds. Adhesives technology for electronic applications: Materials, processes, reliability. Norwich, NY: William Andrew Pub., 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

W, Swanson Dale, ed. Adhesives technology for electronic applications: Materials, processing, reliability. 2nd ed. Amsterdam: William Andrew Pub., 2011.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Rolf, Aschenbrenner, ed. Proceedings First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoporating POLY, PEP & Adhesives in Electronics : presented at Polytronic 2001 Potsdam Germany October 21-24, 2001. Piscataway, N.J: Institute of Electrical and Electronicsal Engineers, 2001.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (6th 2007 Tokyo, Japan). Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics: Odaiba, Tokyo, Japan, January 15-18, 2007 s. Piscataway, NJ: IEEE, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Budapesti Műszaki és Gazdaságtudományi Egyetem. Dept. of Electronics Technology., ed. POLYTRONIC 2002: 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics : conference proceedings : June 23-26, 2002, Hotel Balaton, Zalaegerszeg, Hungary. Piscataway, New Jersey: IEEE, 2002.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Swanson, Dale W., and James J. Licari. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. Elsevier Science & Technology Books, 2016.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Licari, James J., and Dale W. Swanson. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. William Andrew Publishing, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta. Reliability, Stress Analysis, & Failure Prevention Issues in Emerging Technologies & Materials: Presented at the 1995 Asme International Mechanical Engineering ... 1995 San Francisco, California; De-Vol 87). American Society of Mechanical Engineers, 1995.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.), eds. Reliability, stress analysis, and failure prevention issues in emerging technologies and materials: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. New York: American Society of Mechanical Engineers, 1995.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Conference On Polymers an International. Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, October 23-26, 2005 ... Institute of Electrical & Electronics Enginee, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Adhesives Reliability"

1

Lee, Sang Kook, Miyauchi Hirouki, and Jin Young Jeong. "Reliability Assessment of Structural Sealant Durability." In Durability of Building and Construction Sealants and Adhesives: 5th Volume, 65–84. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2015. http://dx.doi.org/10.1520/stp158320140084.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Li, Qing Hua, and Jian Hua Zhang. "Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)." In Key Engineering Materials, 2879–82. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-456-1.2879.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Liu, Johan, Olli Salmela, Jussi Särkkä, James E. Morris, Per-Erik Tegehall, and Cristina Andersson. "Conductive Adhesive Joint Reliability." In Reliability of Microtechnology, 71–98. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-5760-3_5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Licari, James J., and Dale W. Swanson. "Reliability." In Adhesives Technology for Electronic Applications, 347–91. Elsevier, 2005. http://dx.doi.org/10.1016/b978-081551513-5.50008-5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Licari, James J., and Dale W. Swanson. "Reliability." In Adhesives Technology for Electronic Applications, 289–344. Elsevier, 2011. http://dx.doi.org/10.1016/b978-1-4377-7889-2.10006-3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

"Polymeric Impregnate, Embedment, and Adhesives." In High Reliability Magnetic Devices. CRC Press, 2002. http://dx.doi.org/10.1201/9780203910689.ch8.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

"Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications." In Electrically Conductive Adhesives, 165–92. CRC Press, 2008. http://dx.doi.org/10.1201/b12245-12.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Whitfield, Kent. "Degradation Processes and Mechanisms of PV System Adhesives/Sealants and Junction Boxes." In Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules, 235–54. Elsevier, 2019. http://dx.doi.org/10.1016/b978-0-12-811545-9.00010-0.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

"85 Adhesive Samples." In Reliability Assessments, 629–33. Boca Raton : Taylor & Francis, 2016. | “A CRC title.”: CRC Press, 2017. http://dx.doi.org/10.1201/9781315371009-63.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

"85 Adhesive Samples." In Reliability Assessments, 629–34. CRC Press, 2016. http://dx.doi.org/10.1201/b21800-66.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Adhesives Reliability"

1

Saiki, Naoya, Kazuaki Inaba, Kikuo Kishimoto, and Hideo Senoo. "Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52096.

Full text
Abstract:
Mechanical evaluation method of adhesive strength for bonding IC chips in chip-stacked packages is investigated. These film adhesives are required to bond IC chips securely under JEDEC moisture/reflow test. The stress condition of film adhesives under the moisture/reflow test is analyzed by FEM to clarify proper stress condition for the adhesive test. Thermal strain, moisture expansion and strain induced by vapor pressure is considered. It is found that the shear stress is the main loading factor on reflow process in the analysis. A shear test using chevron-shaped chip is proposed as the adhesive test, which apply shear load to the film adhesive at the corner of a chip. The specimen is fabricated by the same process of actual semiconductor manufacturing. The evaluation method is conducted without any problem. The proposed method is thought to be suitable for film adhesives of chip bonding.
APA, Harvard, Vancouver, ISO, and other styles
2

Yong, Ding, Lai Chunchao, Zhang Peiqiang, Zhen Bingjie, Liu zilian, and Zheng zhanping. "Reliability evaluation and selection of underfill adhesives." In 2019 20th International Conference on Electronic Packaging Technology(ICEPT). IEEE, 2019. http://dx.doi.org/10.1109/icept47577.2019.245256.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Tuhus, T., and A. Bjorneklett. "Thermal cycling reliability of die bonding adhesives." In Proceedings of IEEE International Reliability Physics Symposium. IEEE, 1993. http://dx.doi.org/10.1109/relphy.1993.283323.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Nan Wang, Murali Murugesan, Lilei Ye, Bjorn Carlberg, Si Chen, and Johan Liu. "Reliability investigation of nano-enhanced thermal conductive adhesives." In 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO). IEEE, 2012. http://dx.doi.org/10.1109/nano.2012.6322137.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Wenkai Tao, Si Chen, Par Berggren, and Johan Liu. "Reliability study for high temperature stable conductive adhesives." In 2010 International Symposium on Advanced Packaging Materials: Microtech (APM). IEEE, 2010. http://dx.doi.org/10.1109/isapm.2010.5441378.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Plitz, Irene M., Osman S. Gebizlioglu, and Michael P. Dugan. "Reliability characterization of adhesives used in passive optical components." In Optical Tools for Manufacturing and Advanced Automation, edited by Dilip K. Paul and Hakan H. Yuce. SPIE, 1994. http://dx.doi.org/10.1117/12.168638.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Dasgupta, Abhijit, J. Caers, Preethi Iyer, Pascal Baumgaertner, and Daniel Farley. "Characterization of Anisotropic Conductive Adhesives." In ASME 2003 International Mechanical Engineering Congress and Exposition. ASMEDC, 2003. http://dx.doi.org/10.1115/imece2003-42022.

Full text
Abstract:
Thermomechanical stress analysis of Flip-chip-on-flex (FCOF) has been investigated. The effect of bonding pressure on the reliability is analyzed. Key findings are: shear forces are the dominant forces acting across the interconnect and govern the reliability of the package, FCOFs bonded at higher pressures develop lower shear stress and packages with higher bump heights exhibit better performance. This study encompasses testing of packages under thermal shock treatment and results being verified by a 2D linear elastic model. Parametric studies that might provide useful design guidelines are also included.
APA, Harvard, Vancouver, ISO, and other styles
8

Nagarkar, Kaustubh. "Reliability of compliant electrically conductive adhesives for flexible PV modules." In 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2016. http://dx.doi.org/10.1109/itherm.2016.7517641.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Frisk, L., S. Lahokallio, M. Mostofizadeh, J. Kiilunen, and K. Saarinen. "Reliability of isotropic electrically conductive adhesives under condensing humidity testing." In 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012). IEEE, 2012. http://dx.doi.org/10.1109/eptc.2012.6507073.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Plitz, Irene M., Osman S. Gebizlioglu, and Michael P. Dugan. "Reliability characterization of UV-curable adhesives used in optical devices." In SPIE's 1994 International Symposium on Optics, Imaging, and Instrumentation, edited by Hakan H. Yuce, Dilip K. Paul, and Roger A. Greenwell. SPIE, 1994. http://dx.doi.org/10.1117/12.187412.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Adhesives Reliability"

1

Spearing, S. M., B. L. Wardle, and Qingda Yang. The Reliability of Adhesive Joints Under Piezomechanical Loading. Fort Belvoir, VA: Defense Technical Information Center, October 2006. http://dx.doi.org/10.21236/ada456787.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Adhesives Reliability' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography