Books on the topic 'Adhesives Reliability'

W, Swanson Dale, and Knovel (Firm), eds. Adhesives technology for electronic applications: Materials, processes, reliability. Norwich, NY: William Andrew Pub., 2005.

W, Swanson Dale, ed. Adhesives technology for electronic applications: Materials, processing, reliability. 2nd ed. Amsterdam: William Andrew Pub., 2011.

Rolf, Aschenbrenner, ed. Proceedings First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoporating POLY, PEP & Adhesives in Electronics : presented at Polytronic 2001 Potsdam Germany October 21-24, 2001. Piscataway, N.J: Institute of Electrical and Electronicsal Engineers, 2001.

International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (6th 2007 Tokyo, Japan). Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics: Odaiba, Tokyo, Japan, January 15-18, 2007 s. Piscataway, NJ: IEEE, 2007.

Budapesti Műszaki és Gazdaságtudományi Egyetem. Dept. of Electronics Technology., ed. POLYTRONIC 2002: 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics : conference proceedings : June 23-26, 2002, Hotel Balaton, Zalaegerszeg, Hungary. Piscataway, New Jersey: IEEE, 2002.

Swanson, Dale W., and James J. Licari. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. Elsevier Science & Technology Books, 2016.

Licari, James J., and Dale W. Swanson. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. William Andrew Publishing, 2005.

Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta. Reliability, Stress Analysis, & Failure Prevention Issues in Emerging Technologies & Materials: Presented at the 1995 Asme International Mechanical Engineering ... 1995 San Francisco, California; De-Vol 87). American Society of Mechanical Engineers, 1995.

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.), eds. Reliability, stress analysis, and failure prevention issues in emerging technologies and materials: Presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California. New York: American Society of Mechanical Engineers, 1995.

Conference On Polymers an International. Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, October 23-26, 2005 ... Institute of Electrical & Electronics Enginee, 2005.

Electronics, Institute of Electrical and. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 12-15 September, 2004, Portland, Or. Institute of Electrical & Electronics Enginee, 2004.

Swanson, Dale W., and Dale W. Swanson. Adhesive Materials for Electronic Applications: Polymers, Bonding, and Reliability. William Andrew Publishing, 2005.

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.), eds. Reliability, stress analysis, and failure prevention issues: Presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. New York, N.Y: American Society of Mechanical Engineers, 2000.

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1999 : Nashville, Tenn.), eds. Reliability, stress analysis, and failure prevention issues in adhesive and bolted connections: Presented at the 1999 ASME International Mechanical Engineering Congress and Exposition, November 14-19, 1999, Nashville, Tennessee. New York, N.Y: American Society of Mechanical Engineers, 1999.

Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta. Reliability, Stress Analysis and Failure Prevention Issues in Adhesive and Bolted Connections: Presented at the 1999 Asme International Mechanical Engineering ... Design Engineering Division), Vol. 105.). Amer Society of Mechanical, 1999.

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1998 : Anaheim, Calif.), eds. Reliability, stress analysis, and failure prevention aspects of adhesive and bolted joints, rubber components, composite springs: Presented at the 1998 ASME International Mechanical Engineering Congress and Exposition, November 15-20, 1998, Anaheim, California. New York, N.Y: American Society of Mechanical Engineers, 1998.

Atlanta, Ga ). International Mechanical Engineering Congress and Exposition (1996 :. Reliability, Stress Analysis and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs: Presented at the 1998 ... Anaheim, California (De (Series), Vol. 100.). American Society of Mechanical Engineers, 1998.

Erol, Sancaktar, American Society of Mechanical Engineers. Design Engineering Division., and International Mechanical Engineering Congress and Exposition (1997 : Dallas, Tex.), eds. Reliability, stress analysis, and failure prevention issues in adhesively bonded and bolted joints, composites design: Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas. New York, N.Y: American Society of Mechanical Engineers, 1997.

Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta. Reliability, Stress Analysis, and Failure Prevention Issues in Adhesively Bonded and Bolted Joints, Composites Design: Presented at the 1997 Asme International ... Design Engineering Division), V. 96.). American Society of Mechanical Engineers, 1997.