Journal articles: 'Adhesives Reliability'

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Otsuka, Yuichi, Yoshihisa Hiraki, Yuki Hakozaki, Yukio Miyashita, and Yoshiharu Mutoh. "Effects of Adhesives on Reliability in Interfacial Strength Evaluation Method for Plasma-Sprayed Hydroxyapatite Coating." International Journal of Automation Technology 11, no. 6 (October 31, 2017): 907–14. http://dx.doi.org/10.20965/ijat.2017.p0907.

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The purpose of this study is to evaluate interfacial strength of plasma-sprayed HAp coating by using more general adhesives. Plasma-sprayed HAp coating has been applied to bond bones with the surfaces of artificial hip joints. However, HAp coating is subjected to crack or delamination by mechanical loading. Conventional standard codes for measurement of interfacial strength of calcium phosphate coating determine the use of a specific adhesive irrationally. Our group previously proposed pre-immersion treatment process in preparation of interfacial testing specimens in order to obtain valid value of interfacial strength. However, the type of the adhesive was for medical purpose and not general one. To widen applicability of the proposed method, a selection policy of adhesive is indispensable. Metal Lock Y610 (ML adhesive) was selected as one of general adhesives. Interfacial strength tests by using ML adhesive were conducted. The results of interfacial strength test were compatible with the one reported by previous study, which suggest that the selection of general type of adhesive was successful. Raman spectroscopy analyses were also conducted to confirm a suppressed infiltration of ML adhesives.

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Zhong, Z. W. "Various Adhesives for Flip Chips." Journal of Electronic Packaging 127, no. 1 (March 1, 2005): 29–32. http://dx.doi.org/10.1115/1.1846064.

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Flip chips using various adhesives were studied. The assembly yields using nonconductive adhesive and anisotropic conductive film investigated were 97% and 100%, respectively. A packaging process using anisotropic conductive paste with a 100% packaging yield was developed. All the packages passed various reliability tests such as burn in, artificial sweat and humidity tests, and temperature cycling tests. The reliability of the packages was 100% meeting the requirements for an industrial application. A stud bump bonding process with reduced process steps was proposed. Curing of conductive adhesive and underfill epoxy was not required, resulting in reduced packaging time.

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Patelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, and Aaron J. Schmidt. "Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000051–55. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000051.

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Abstract High power semiconductor applications require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current die attach solutions such as eutectic solders and high thermal conductive silver epoxies and sintered silver adhesives have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will focus on development of a reinforced, sintered silver die attach solution for high power semiconductor applications with focus on a pressure-less, low temperature sintering technology that offers high reliability for high temperature (250°C) applications. The electronic, optoelectronic, and semiconductor industries have the need for high performance adhesives, in particular, high power devices require low-stress, high thermal conductivity, thermally stable, and moisture resistant adhesives for the manufacture of high reliability devices. This paper introduces a new reinforced sintered silver adhesive based on the “resin-free” Conductive Fusion Technology. The high performance adhesive offers a robust solution for high temperature, high reliability applications. Conductive Fusion Technology consists of a high thermal conductivity silver component blended with a non-conductive, low-modulus powder component. The non-conductive powder component comprises an organically modified inorganic material that exhibits excellent thermal stability at temperatures exceeding 250°C. Properties of the sintered silver adhesive, such as storage modulus, can be modified by varying the content of the non-conductive component.

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Cui, Hui-wang, Dong-sheng Li, and Qiong Fan. "Reliability of flexible electrically conductive adhesives." Polymers for Advanced Technologies 24, no. 1 (July 26, 2012): 114–17. http://dx.doi.org/10.1002/pat.3059.

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NAKATA, Yoshihiro. "Adhesion Reliability of the Adhesives for Automotive." Journal of The Adhesion Society of Japan 39, no. 12 (2003): 455–60. http://dx.doi.org/10.11618/adhesion.39.455.

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Titova, Ol'ga, Tatyana Melenberg, Lyudmila Linnik, Takhmina Boeva, Andrey Burov, Sergey Daironas, and Ella Daironas. "ADHESIVE SYSTEMS IN THE PRACTICE OF A DENTIST DOCTOR." Actual problems in dentistry 16, no. 1 (May 14, 2020): 178–81. http://dx.doi.org/10.18481/2077-7566-20-16-1-178-181.

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Subject. Dental restoration includes work on tissue restoration by filling, using inlays, veneers, and artificial crowns. Adhesive systems are used in therapeutic dentistry for working with composites, compomers and some glass-ionomer cements, for adhesive fixation of all types of indirect structures, repairing chips of composite and ceramic linings; in pediatric dentistry for sealing fissures, for fixing orthodontic structures. Currently, there are eight generations of adhesives on the market of dental materials. The first two generations of adhesives required only enamel etching and transformed the dentin layer, while the third already provided for conditioning of the dentin, and the fourth and fifth ― and all-out etching. The sixth, seventh and eighth generations of adhesives are self-etching analogues. This article presents the results of a survey of practical health care dentists in choosing an adhesive system. The goal is to evaluate the preferences of the choice of adhesive systems by dentists. Methodology. 30 dental therapists and orthopedic dentists took part in the survey. Results. The results of the questionnaire analysis showed that the majority of dentists prefer to use fifth-generation adhesives in their practice (46 %), the sixth generation of adhesive systems is in second place in popularity (31 %), followed by the "gold standard" ― the fourth generation (13 %), and the seventh (10 %) in last place. Conclusions. The fifth-generation adhesive systems surpassed the other generations in efficiency and reliability. This is why the majority of dentists surveyed chose this generation.

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Ruales, M., J. Merced, and R. Ramos. "Managing Voids in Adhesives for Medical Devices." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000567–71. http://dx.doi.org/10.4071/isom-poster2.

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Void content within the adhesive layer dispensed over the connector module in neuromodulation devices is critical. Voids can affect the thermal transfer, bond strength, and stress decoupling of the adhesive, which can eventually lead to degraded device reliability. The effects of voids are investigated for a silicone based adhesive used in these medical devices. There are many challenges associated with the curing process that this adhesive undergoes which drive the need for unique and specific testing to determine optimal process settings. The parameters evaluated included curing time, temperature, thickness, and relative humidity. Reduction in void content was linked with mechanical properties including hardness and tensile strength. Achievement of void free medical adhesives will encourage today's microelectronic packaging industry to meet the challenges of smaller and denser medical devices.

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Guzii, Sergii, Ihar Bazhelka, and Vasyl Lashchivskyi. "STUDY OF THE INFLUENCE OF COMPOUNDS OF THE ANO3 and ANO3 nH2O TYPES ON RHEOKINETIC AND COLLOID-CHEMICAL PROPERTIES OF ALUMINOSILICATE ADHESIVES FOR WOOD." ScienceRise, no. 5 (November 11, 2020): 14–23. http://dx.doi.org/10.21303/2313-8416.2020.001493.

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In the technology of gluing solid wood, various adhesives are used, which, in addition to ensuring the strength of the gluing, must also be characterized by a number of rheological and colloidal-chemical properties, namely: have acceptable viscosity, low contact angles, have good spreading and enveloping ability, penetrate deep into the wood , providing reliable cohesive-adhesive contact and much more. Today, adhesives based on PVA dispersions and urea formaldehydes are used, the properties of which have been sufficiently studied and tested in practice. An alternative to organic-based adhesives is mineral adhesives, in particular aluminosilicate adhesives, which are non-flammable and have high mechanical strength. Object of research: rheokinetic patterns and processes of formation of colloidal-chemical structures of aluminosilicate adhesives modified with compounds of the ANO3 and ANO3×nH2O type. Investigated problem: Considering that aluminosilicate adhesives are multiphase reactive suspensions, the viscosity of which changes over time and affects their viability, the issue of viscosity stabilization due to the introduction of electrolyte salts into their composition is relevant, and will also contribute to improving the wettability and spreading of the adhesive during applying them to substrates and gluing samples from various types of wood. Main scientific results: The effect of the concentrations of compounds of the ANO3 and ANO3×nH2O type on the rheokinetic and chemical-colloidal properties of the aluminosilicate adhesive has been established, which will make it possible to use aluminosilicate adhesives in practice for gluing wood of various species, as well as to work out possible technological methods of their application, taking into account the obtained data on the viscosity, wetting and spreadability of the modified adhesive on the surface of the wood substrate. Area of practical use of the research results: woodworking enterprises for the production of glued solid wood products. Innovative technological product: aluminosilicate adhesives modified with ANO3 and ANO3×nH2O nitrate additives for gluing wood of various species. Scope of application of an innovative technological product: the application of these approaches will make it possible to obtain glued materials from wood from different species with improved technological and physical and mechanical properties of the glue seam and, accordingly, to increase the quality and reliability of products.

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Popov, Viktor, Olga Dornyak, Andrei Latinin, and Elena Lushnikova. "CREATING DURABLE WOOD GLUE STRUCTURES BASED ON PHYSICOMODIFIED ADHESIVES." Voronezh Scientific-Technical Bulletin 4, no. 4 (January 25, 2021): 70–75. http://dx.doi.org/10.34220/2311-8873-2021-4-4-70-75.

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In the past few decades, gluing technologies have been widely used in woodworking, which significantly expand the range of new products. Bonding of products with adhesives is used in the manufacture of furniture, parquet, load-bearing and enclosing structures, door and window blocks, prefabricated houses and many other products. The main criteria for the quality of glued wood joints is the cohesive and adhesive strength of the glued joint. To date, a number of technologies have been developed to improve the strength of glued wood joints. In order to increase the strength of the adhesive bond of wood, technologists propose methods of variation by such factors as temperature, pressure during curing of the adhesive joint, the purity of the surface treatment of substrates, and the thickness of the adhesive layer. A large amount of work and substantial financial costs are spent on creating new brands of adhesives. However, the requirements for glued timber products are not solved by the proposed gluing technologies and new brands of glues. First of all, this concerns the widely used glue wood structures (CDC), as a rule, operating in difficult conditions with high mechanical loads. To solve the problem of increasing the reliability of glue wood structures, instead of domestic imported, but more expensive adhesives are often used. To a certain extent, the creation of more high-strength adhesive joints has recently also been solved by the use of methods for modifying domestic adhesives exposed to irradiation with magnetic and electric fields, as well as ultrasound.

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Lee, Jun Hyup. "Highly Adhesive and Sustainable UV/Heat Dual-Curable Adhesives Embedded with Reactive Core-Shell Polymer Nanoparticles for Super-Narrow Bezel Display." Materials 13, no. 16 (August 7, 2020): 3492. http://dx.doi.org/10.3390/ma13163492.

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To achieve the seamless characteristics of displays, liquid crystal (LC) devices need a super-narrow bezel design. This device architecture can be constructed using functional adhesives that possess excellent physical and chemical properties. In this study, mechanically robust ultraviolet (UV)/heat dual-curable adhesives with outstanding reliability and processability have been fabricated using reactive poly(methyl methacrylate) (PMMA)/polyethyleneimine (PEI) core-shell nanoparticles. Their curing characteristics, narrow drawing processability, adhesive strength, elongation at break, and the contact contamination of LCs have been investigated. Compared to conventional adhesive material, the proposed adhesive containing multifunctional PMMA/PEI nanoparticles afforded a high adhesion strength of 40.2 kgf cm−2 and a high elongation of 64.8% due to the formation of a firm crosslinked network with matrix resins comprising bisphenol A epoxy resin and bisphenol A glycerolate dimethacrylate. Moreover, the proposed adhesive showed an excellent narrow drawing width of 1.2 mm, which is a prerequisite for super-narrow bezel display. With regard to LC contamination, it was found that the level of contamination could be remarkably reduced to 61 µm by a high-temperature curing process. This study makes a significant contribution to the development of advanced display, because it provides robust and sustainable display adhesives based on nanomaterials, thereby enhancing the life and sustained operability of displays.

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Königer, Tobias. "Highly Flexible Die Attach Adhesives for MEMS packages." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 001169–77. http://dx.doi.org/10.4071/isom-2012-thp51.

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Die attach materials for most MEMS packages must be highly flexible as temperature changes during the assembly process and application may lead to thermo-mechanical stress as a consequence of dissimilar coefficients of thermal expansion of substrate, chip and adhesive. Thermo-mechanical stress results in a distortion of the signal characteristics of the extremely stress-sensitive MEMS device. Within the scope of this paper, highly flexible heat-curing adhesives with a Young's modulus down to 5 MPa (0.725 ksi) at room temperature were developed. DMTA measurements show that temperature storage at +120 °C (+248 °F) does not cause the adhesive to embrittle, which would have a negative effect on the MEMS package's reliability. After storage at +120 °C (+248 °F) for up to 1000 h, no increase in Young's modulus can be observed. The adhesives cure at extremely low temperatures down to +100 °C (+212 °F), which reduces stress development during the assembly process. In addition, the adhesives have very process-friendly properties. Processing times of more than one week can be achieved. The option of dual curing enables preliminary light fixation of the chip within just seconds.

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Alizadehyazdi, Vahid, Mehdi Modabberifar, S. M. Javid Mahmoudzadeh Akherat, and Matthew Spenko. "Electrostatic self-cleaning gecko-like adhesives." Journal of The Royal Society Interface 15, no. 141 (April 2018): 20170714. http://dx.doi.org/10.1098/rsif.2017.0714.

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This paper describes the use of the electrostatic element of an electrostatic/gecko-like adhesive to repel dust particles, which have been shown to significantly affect adhesion and reliability. The result is a non-destructive, non-contact cleaning method that can be used in conjunction with other cleaning techniques, many of which rely on physical contact between the fibrillar adhesive and substrate. The paper focuses on experimental evaluation of the repulsion of 100 μm glass beads as a function of wave shape, frequency, phase number and electrode direction in relation to the gecko-like features. Results show that a two-phase square wave with the lowest practically feasible frequency can remove 100 μm glass beads from a directional gecko-like adhesive with up to 70% efficiency. Finally, using the optimized electrostatic cleaning properties, results show an approximately 25% recovery in shear stress on a rough glass for three contaminated directional gecko-like adhesives after contact with a dusty table.

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Cruzetta, Laisa, Isadora M. Garcia, Gabriela de Souza Balbinot, Amanda S. Motta, Fabrício M. Collares, Salvatore Sauro, and Vicente C. B. Leitune. "Evaluation of the Physicochemical and Antibacterial Properties of Experimental Adhesives Doped with Lithium Niobate." Polymers 12, no. 6 (June 11, 2020): 1330. http://dx.doi.org/10.3390/polym12061330.

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The aim of the present study was to formulate dental adhesives with different concentrations of LiNbO3 and to evaluate their physicochemical and antibacterial properties. A dental adhesive was formulated using methacrylate monomers and photoinitiators and used as a control filler-free group. Subsequently, three experimental adhesives doped with LiNbO3 at different concentrations (1 wt.%, 2 wt.%, and 5 wt.%) were also formulated. All the experimental adhesives were assessed to evaluate the degree of conversion (DC), softening in solvent, immediate and long-term microtensile bond-strength (μ-TBS), radiopacity, ultimate tensile strength, and antibacterial activity. The incorporation of 1 wt.% of LiNbO3 had no negative effect on the DC of the adhesive resin compared to the control group (p > 0.05). We observed a decrease in the percentage of softening in solvent in the group LiNbO3 at 1 wt.% (p < 0.05). The addition of LiNbO3 increased the radiopacity at a concentration above 2 wt.%, and there was also an increase in cohesive strength (p < 0.05). The immediate μ-TBS increased for LiNbO3 at 5 wt.% (p < 0.05), and there was no statistical difference for the other groups compared to the control (p > 0.05). After six months, the group with 5 wt.% still presented the highest μ-TBS (p < 0.05). The adhesives showed no antimicrobial activity (p > 0.05). LiNbO3 was successfully incorporated in dental adhesives, increasing the radiopacity and their resistance to degradation. Although LiNbO3 offered no antibacterial properties, the reliability of LiNbO3 incorporation in the adhesive encourages new tests to better investigate the antimicrobial action of LiNbO3 through temperature variation.

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Bhattacharya, Swapan, Fei Xie, Daniel F. Baldwin, Han Wu, Kelley Hodge, and Qing Ji. "Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 002018–53. http://dx.doi.org/10.4071/2016dpc-tha24.

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Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

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Li, Yi, Kyoung-Sik Moon, and C. P. Wong. "Reliability improvement of conductive adhesives on tin (Sn) surfaces." Journal of Adhesion Science and Technology 19, no. 16 (January 2005): 1427–44. http://dx.doi.org/10.1163/156856105774805822.

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Bao, Nuo, Chun Jie Wang, Lin Zhu, and Shun Guang Song. "Effect of Filling with Adhesive on Solder Alloys Subjected to Random Vibration." Applied Mechanics and Materials 163 (April 2012): 34–38. http://dx.doi.org/10.4028/www.scientific.net/amm.163.34.

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In order to obtain a better filling way with suitable adhesive to enhance the reliability of 3D PLUS solder joints. Finite element analysis of random vibration method was carried out. By means of the method, the effect of filling way on the stress distribution in solder joints was investigated under the condition of two types adhesives 55/9 and GD414. Stress distribution and its maximum value of 3D PLUS solder joint at peak time were acquired. Comparative analysis of the maximum stress between under filled adhesive and side filled adhesive with 55/9 or GD414 respectively. The results showed that under filled adhesive 55/9 can effectively improve the solder joint stress.

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Liu, Mary, and Wusheng Yin. "SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000165–69. http://dx.doi.org/10.4071/isom-ta63.

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3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20–40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won't help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.

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Cao, Liqiang, Zonghe Lai, and Johan Liu. "Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate." Journal of Electronic Packaging 127, no. 1 (March 1, 2005): 43–46. http://dx.doi.org/10.1115/1.1846066.

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There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and fine pitch capability are the major advantages of conducting adhesive technology. A new and innovative connection technology geared towards achieving increased functionality at a lower total system cost is anisotropic conductive adhesive (ACA) interconnection. ACAs, when used for flip chip assembly, provide electrical as well as mechanical interconnections for fine pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure environments. The effects of high temperature and high humidity on the bond strength of ACA joints were measured using 90 deg peel test as well as by microstructural examination. It was found that aging generally caused a decrease in peel strength, especially the results of scanning electronic microscopy showed that the pressure cooker test could most effectively reveal the adhesion behavior.

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Papadogiannis, Dimitris, Maria Dimitriadi, Maria Zafiropoulou, Maria-Dimitra Gaintantzopoulou, and George Eliades. "Universal Adhesives: Setting Characteristics and Reactivity with Dentin." Materials 12, no. 10 (May 27, 2019): 1720. http://dx.doi.org/10.3390/ma12101720.

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The aim of the study was to evaluate the performance of six commercially available universal dental adhesives: Adhese Universal (ADU), All-Bond Universal (ABU), Clearfil Universal Bond Quick (CBQ), G-Premio Bond (GPB), Prelude One (PRO) and Scotchbond Universal (SBU). The properties tested were: (a) degree of C=C conversion (DC%); (b) Vickers micro-hardness (VHN); (c) extent of oxygen inhibition (OI/μm), all related with the adhesive film properties; (d) extent of dentin demineralisation (DM%), insoluble salt formation (AS%); and (e) shear bond strength (SBS, self-etch mode) related to the adhesive-dentin interactions. Statistical analysis (α = 0.05) was performed by one-way ANOVA and Tukey’s test (DC%, VHN, OI, DM% AS%) and Weibull analysis (SBS, σ0-β). The DC ranged from 67.2–82.5% (all >GPB), OI from 5.6–18.6 μm (SBU > ADU, GPB, ABU > CBQ > PRO), microhardness from 1.1–6.6 VHN (SBU > ADU > ABU > CBQ > PRO > GPB: not measurable), DM from 69.3% (GPB) to 16–12.5% (CBQ, SBU, ADU) and 13.2–10.6% (ABU, ADU, PRO), in homogeneous groups and AS from 26–15.9% (ABU, CBQ > GPB, PRO, ADU, SBU). For SBS the σ0 (characteristic life) ranged from 29.3–16.6 MPa (CBQ, ADU, ABU, SBU > PRO > GPB), the β (reliability) from 5.1–9.7 (p > 0.05). All failure modes were of mixed type (adhesive and composite cohesive). Although all these adhesives were based on the 10-methacryloyloxydecyl dihydrogen phosphate (10-MDP) adhesive monomer, the different co-monomers, solvents and catalysts led to variations in their film properties, reactivity and bonding capacity with dentin.

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Zhang, Yan, Janusz Sitek, Jing-yu Fan, Shiwei Ma, Marek Koscielski, Lilei Ye, and Johan Liu. "Characterization of nano-enhanced interconnect materials for fine pitch assembly." Soldering & Surface Mount Technology 26, no. 1 (January 28, 2014): 12–17. http://dx.doi.org/10.1108/ssmt-10-2013-0033.

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Purpose – Multiple fillers are adopted to study the filler influences on electrical and mechanical properties of the conductive adhesives. The performances of the developed nano-enhanced interconnect materials in printing process are also evaluated. The paper aims to discuss these issues. Design/methodology/approach – Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives with multiple fillers. Differential scanning calorimetry measurement is carried out to characterize the curing behavior of the samples with different fillers, four-probe method is used to obtain the bulk resistivity, shear test is conducted for adhesive strength, and environmental loading test is also involved. Furthermore, printing trials with different patterns have been carried out. Findings – The electrical resistivity of the adhesives with submicro-sized silver spheres does not monotonically change with the increasing sphere proportion, and there exists an optimized value for the ratio of silver flakes to spheres. Samples with relatively small amount of CNT additives show improved electrical properties, while their mechanical strengths tend to decrease. For the printing application, the adhesives with 18.3 volume% filler content behave much better than those with lower filler content of 6 percent. The presence of the nano-particles makes a slight improvement in the printing results. Research limitations/implications – More detailed printing performance and reliability test of the samples need to be carried out in the future. Originality/value – The conductive adhesives as interconnect materials exhibit some improved properties with optimized bimodal or trimodal fillers. The additive of the nano-fillers affects slightly on the printing quality of the bimodal conductive adhesives.

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Chen, Liu Caroline, Zonghe Lai, Zhaonian Cheng, and Johan Liu. "Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection." Journal of Electronic Packaging 128, no. 3 (August 7, 2005): 177–83. http://dx.doi.org/10.1115/1.2227057.

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Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses Seqv and shear stress σxy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed.

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Yim, Byung-Seung, Jeong Il Lee, and Jong-Min Kim. "Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives." Journal of Welding and Joining 35, no. 3 (June 30, 2017): 15–20. http://dx.doi.org/10.5781/jwj.2017.35.3.3.

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PENNANEN, VIRPI, and OUTI RUSANEN. "RELIABILITY TESTING ON FLIP CHIP JOINING WITH ISOTROPICALLY-CONDUCTIVE ADHESIVES." Journal of Electronics Manufacturing 07, no. 04 (December 1997): 287–92. http://dx.doi.org/10.1142/s0960313197000300.

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Liu, Johan, Xiu-zhen Lu, and Li-qiang Cao. "Reliability aspects of electronics packaging technology using anisotropic conductive adhesives." Journal of Shanghai University (English Edition) 11, no. 1 (February 2007): 1–16. http://dx.doi.org/10.1007/s11741-007-0101-6.

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Liu, Johan, and Zonghe Lai. "Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate." Journal of Electronic Packaging 124, no. 3 (July 26, 2002): 240–45. http://dx.doi.org/10.1115/1.1478059.

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A reliability study on anisotropically conductive adhesive joints on a Flip-Chip/FR-4 assembly has been carried out. In the study, nine types of anisotropic conductive adhesive (ACA) and one nonconductive film (NCF) were used. In total, nearly one-thousand single joints were subjected to reliability tests in terms of temperature cycling between −40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The test chip used for this extensive reliability test had a pitch of 100 μm. Therefore, this work was particularly focused on evaluation on the reliability of ultra fine pitch flip-chip interconnections using anisotropically conductive adhesives on a low-cost substrate. The reliability was characterized by single contact resistance measurement using the four-probe method during temperature cycling testing up to 3000 cycles. The Mean Time To Failure (MTTF) (defined as 50% failure of all tested joints) are 650, 2500, and 3500 cycles when the failure definition is defined as 20% increase, larger than 50 mΩ and larger than 100 mΩ, respectively, using the in-situ electrical resistance measurement technique. Using the discontinuous (manual) measurement at room temperature by taking out the sample from the cycling chamber, the MTTF for the same joint system is around 2500 cycles in the case that the failure criteria is defined as 20% of the resistance increase, far better than the results from the in-situ measurement. The results show clearly that in optimized conditions, high reliability flip-chip anisotropically conductive adhesive joints on low-cost substrate can be achieved.

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Kintz, K. Andrew, Sara N. Paisner, and M. Shane Thompson. "THERMAL MANAGEMENT SOLUTIONS FOR THE LED MARKET." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000151–55. http://dx.doi.org/10.4071/isom-2010-ta5-paper3.

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High-brightness light emitting diodes (LEDs) are challenged with thermal management issues due to increased power and reduced surface area. This has led to the need for new materials with higher thermal conductivity that can quickly remove the heat from the active layer. LORD Corporation has developed two new thermal management materials, a “no pump-out” thermal grease and a low modulus die attach adhesive, as solutions to the heat dissipation problems facing LED manufacturers. These innovative technologies will help engineers solve complex fundamental thermal management problems. A new 4 W/mK silicone thermal grease has been developed with significant resistance to in-package bleed-out or pump-out eliminating the reliability problem most commonly encountered with traditional thermal greases. A new 10–20 W/mK thermal epoxy adhesive has also been developed creating a new class of flexible adhesives with high adhesion. This combination allows the new LORD die attach adhesive to not only effectively transfer heat out of the package, but also to dissipate the stress caused by thermal expansion and contraction during thermal cycling thereby affording improved package reliability.

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Silva, S. M. A., J. Malcarne-Zanon, R. M. Carvalho, M. C. Alves, M. F. De Goes, A. Anido-Anido, and M. R. Carrilho. "Effect of Oxalate Desensitizer on the Durability of Resin-Bonded Interfaces." Operative Dentistry 35, no. 6 (November 1, 2010): 610–17. http://dx.doi.org/10.2341/09-202-l.

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Clinical Relevance Despite oxalate desensitizer showing a decrease in the rate of resin-dentin bond degradation over time, it compromised the baseline bond strength of etch-and-rinse adhesives to dentin. Further investigation regarding reliability of the combination of oxalate desensitizers and etch-and-rinse adhesives is required prior to implementation of this approach in the clinical routine.

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Liu, Mary, and Wusheng Yin. "An Innovative High Thermal Conductive Solderable Adhesive." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000852–56. http://dx.doi.org/10.4071/isom-2011-wp6-posterpapers-paper2.

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With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320 °C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230 °C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.

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Rusanen, O., and J. Lenkkeri. "Reliability issues of replacing solder with conductive adhesives in power modules." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 18, no. 2 (May 1995): 320–25. http://dx.doi.org/10.1109/96.386268.

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Machalická, Klára, and Martina Eliášová. "Behavior of Glued Connections under Shear Loading." Key Engineering Materials 662 (September 2015): 241–44. http://dx.doi.org/10.4028/www.scientific.net/kem.662.241.

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An intensive research in load-bearing glass structures leads to the requirement for performing glass-to-glass or glass-to-different material connections. Glued shear connection is suitable for these applications mainly due to its uniform stress distribution in larger area in comparison with bolted connections. The reliability of adhesive in the connection during the life time of a structure is affected by many factors, [1], [2], [3], [4]. The article deals with the experimental analysis focused on the determination of material characteristics of adhesives in planar connections, it describes the effect of various factors on the behavior of an adhesive joint under increasing shear loads, its ultimate load-bearing capacity and its failure modes. The main investigated factors are the type of adhesive, the type of connected materials (material of substrate), surface treatment and the thickness of the adhesive layer. Due to importance of adhesive layer thickness especially in rigid and semi-rigid glues, numerical models responding to the effect of thickness was carried out.

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Yim, Byung-Seung, Jeong Il Lee, Yuseon Heo, Jooheon Kim, Seong Hyuk Lee, Young-Eui Shin, and Jong-Min Kim. "Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers." MATERIALS TRANSACTIONS 53, no. 12 (2012): 2104–10. http://dx.doi.org/10.2320/matertrans.mb201207.

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Liu, J., and L. Ljungkrona. "Reliability of thermo-setting anisotropically conductive adhesives in Chip on Glass application." Microsystem Technologies 2, no. 1 (March 1995): 32–37. http://dx.doi.org/10.1007/bf02739526.

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Mitachi, Seiko, Akihito Ito, and Kazushi Kimura. "Highly Moisture-Resistant, Silane-Modified, Cyanogen-Free Optical Adhesives, and Their Reliability." Journal of Materials Engineering and Performance 23, no. 5 (March 12, 2014): 1544–50. http://dx.doi.org/10.1007/s11665-014-0931-x.

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Chiang, K. N., C. W. Chang, and C. T. Lin. "Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages." Journal of Electronic Packaging 123, no. 4 (May 10, 2001): 331–37. http://dx.doi.org/10.1115/1.1389847.

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Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. In contrast to a solder type flip chip interconnection, the electric current passing through conductive particles becomes the dominant conduction paths. The interconnection between the particles and the conductive surfaces is constructed by the elastic/plastic deformation of conductive particles with contact pressure, which is maintained by tensile stress in the adhesive. Although loss of electric contact can occur when the adhesive expands or swells in the Z- axis direction, delamination and cracking can occur in the adhesive layer while the tensile stress is excessive. In addition to performing processing simulations as well as reliability modeling, this research investigates the contact force that is developed and relaxed within the interconnection during the process sequence by using nonlinear finite element simulations. Environmental effects, such as high temperature and thermal loading, are also discussed. Moreover, a parametric study is performed for process design. To improve performance and reliability, variables such as ACF materials, proper processing conditions are discussed as well. Furthermore, this study presents a novel method called equivalent spring method, capable of significantly reducing the analysis CPU time and make process modeling and contact analysis of the 3D ACA/ACF process possible.

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Kayaba, Yasuhisa, Yuzo Nakamura, Jun Kamada, and Kazuo Kohmura. "New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid Bonding." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000280–83. http://dx.doi.org/10.4071/2380-4505-2019.1.000280.

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Abstract Heterogeneous integration of logic, memory, and sensor chips on interposers (2.5D) has attracted a lot of attention as a candidate for More-than-Moore technology. For the high performance 2.5D devices, high density integration of chips with narrow spacing and high density interconnections with small pitch bonding electrodes are a key technology. In the current bonding technology, solder micro-bumps (>20 μm in diameter) and non-conductive adhesives have been adopted. There may be some limitations for high density device integration with these technologies because of the protrusion of adhesives around the chips, the thermal sliding at the bonding, and the limit of solder micro-bump minimization. Hybrid bonding with a small Cu electrode (<10 μm in diameter) is a strong candidate for improving advanced device integration technology. Our goal is to develop a new adhesive which gives no protrusion, no thermal sliding, no voids, and high electrical reliability. A spin coating thin adhesive was therefore developed. The new adhesive can be cured at 200 °C. The cured adhesive film has no tackiness and has an optically flat surface. The adhesive film can be temporarily bondable to SiO2 at room temperature. After 200 °C baking, a permanent bonding can be achieved, and there is no degradation of bonding strength and no voids even after 400 °C of baking. For the applicability to the chip-on-wafer process, the adhesive film/Si wafer can be cut into chips by blade dicing without any delamination and without any apparent particles. After bonding the adhesive/Si chip to a bare Si wafer at room temperature, the thermal sliding amount after the thermal compression process (250 °C, 10 min, 1 MPa) was less than 1 μm (under the detection limit) according to optical microscopic measurements. In addition, there was no protrusion of adhesive around the chip corner from SEM. A first trial result for hybrid bonding is also reported.

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Chanchani, Rajen. "An Overview - Temporary Wafer Bonding / Debonding for 2.5D and 3D Technologies." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 1–9. http://dx.doi.org/10.4071/isom-2012-ta16.

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In recent years, material suppliers in collaboration with equipment suppliers have developed many new materials/process options for temporary bonding and debonding to be used in 2.5D and 3D technologies. . These options are still being evaluated and at best they are in prototype stage. As a result, the cost is still perceived to be high, there are no reliability data available and many new users in the market are confused about which option and corresponding equipment set should they invest in. I will present the requirements for ideal temporary bonding debonding solution, describe the available technology options for temporary bonding and debonding and their status. The primary technologies for temporary bonding are adhesive-based. These adhesives are tailored so the adhesive bonds can be broken either by laser ablation, thermal-slide, ZoneBond process, solvent release or mechanical peel-off. It appears that a single solution will not be applicable to all different 2.5D/3D technologies that are being developed and thus, multiple options will be the forerunners.

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Nguyen, Hoang-Vu, Knut E. Aasmundtveit, Helge Kristiansen, and Tore Helland. "An Overview of Isotropic Conductive Adhesives Filled with Metal-coated Polymer Spheres." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000200–000207. http://dx.doi.org/10.4071/isom-2013-ta66.

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Novel isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) have been introduced in order to improve the mechanical performance, and hence the reliability, compared to conventional ICAs filled with solid silver (Ag) particles. This paper summarizes a number of characterization studies on the electrical, the mechanical and the rheological properties, as well as a study on the reliability, of MPS-based ICAs. The feasibility of the ICAs filled with MPS has been demonstrated in terms of potential processing capabilities, improved mechanical performance and competitive electrical properties (compared to conventional ICAs with Ag flakes). Therefore, the MPS-based ICAs have a good potential for demanding environment applications, in which electronic products (e.g., hand held devices) are subjected to thermal shock and thermal cycling, mechanical vibration and mechanical shock.

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Liu, Mary, and Wusheng Yin. "High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000001–7. http://dx.doi.org/10.4071/isom-2017-tp11_031.

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Abstract The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.

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Kim, Hyun-Sik, Hyeon-Deuk Hwang, and Kwan-Young Han. "Ink-Step Adaptability and Reliability of Maleimide-Functionalized UV-Curable Optically Clear Adhesives." Nanoscience and Nanotechnology Letters 9, no. 8 (August 1, 2017): 1146–52. http://dx.doi.org/10.1166/nnl.2017.2461.

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STAM, F., P. O'GRADY, and J. BARRETT. "CHARACTERISATION AND RELIABILITY STUDY OF ANISOTROPIC CONDUCTIVE ADHESIVES FOR FINE PITCH PACKAGE ASSEMBLY." Journal of Electronics Manufacturing 05, no. 01 (March 1995): 1–8. http://dx.doi.org/10.1142/s0960313195000025.

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41

Klosterman, D., Li Li, and J. E. Morris. "Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 21, no. 1 (March 1998): 23–31. http://dx.doi.org/10.1109/95.679028.

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Saarinen-Pulli, Kirsi, Sanna Lahokallio, and Laura Frisk. "Effects of different anisotropically conductive adhesives on the reliability of UHF RFID tags." International Journal of Adhesion and Adhesives 64 (January 2016): 52–59. http://dx.doi.org/10.1016/j.ijadhadh.2015.10.012.

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Kim, Jong-Woong, Young-Chul Lee, and Seung-Boo Jung. "Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications." Journal of Electronic Materials 37, no. 1 (September 11, 2007): 9–16. http://dx.doi.org/10.1007/s11664-007-0252-z.

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Ma, De Long, and Yi Wang Bao. "An Improved Cross-Bonded Method for Measuring Interfacial Bond Strength of Adhesives." Key Engineering Materials 726 (January 2017): 8–12. http://dx.doi.org/10.4028/www.scientific.net/kem.726.8.

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Interfacial bond strength is one of the vital mechanical properties of adhesives. The cross-bonded method, which is widely used to measure the interfacial tensile and shear bond strength simultaneously, has attracted extensive attention. An improved cross-bonded method is presented in this study in order to promote the accuracy and reliability of the testing results. The ergo 9900 glue, E-7 glue, AB glue and 502 glue were measured in this study. Compared with the original method, the results of the improved cross-bonded method show that: (i) the coefficient of variation of the interfacial bond strength decreased significantly; (ii) the interfacial shear bond strength of the adhesives is closer to its true value.

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Ho, Li-Ngee, Teng Fei Wu, Hiroshi Nishikawa, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita, and Koyu Ota. "Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives." Journal of Materials Science: Materials in Electronics 22, no. 7 (September 2, 2010): 735–40. http://dx.doi.org/10.1007/s10854-010-0202-z.

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Lee, J., C. S. Cho, and J. E. Morris. "Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards." Microsystem Technologies 15, no. 1 (July 23, 2008): 145–49. http://dx.doi.org/10.1007/s00542-008-0678-0.

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Chiang, W. K., Y. C. Chan, Brian Ralph, and Andrew Holland. "Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications." Journal of Electronic Materials 35, no. 3 (March 2006): 443–52. http://dx.doi.org/10.1007/bf02690531.

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Park, Young-Jun, Hyun-Joong Kim, Dae-Soon Park, and Ick-Kyung Sung. "Reliability of liquid crystal cell and immiscibility between dual-curable adhesives and liquid crystal." European Polymer Journal 46, no. 7 (July 2010): 1642–48. http://dx.doi.org/10.1016/j.eurpolymj.2009.05.034.

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Li, Qing Hua, and Jian Hua Zhang. "Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)." Key Engineering Materials 353-358 (September 2007): 2879–82. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.2879.

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Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as the conducting filler. The effects of nano-fillers (SiO2 nano-particles and carbon nanotubes) on the conductivity, adhension strength and reliability of ICAs were investigated experimentally in this paper. The results showed that these two nano fillers can improve both the conductivity and adhesion strength of ICAs, which maybe attributed to the nano-particles forming physico-chemical bonds with epoxy resin. These physico-chemical bonds increase the contact area and then minish the interspace of Ag particles, so it reduces electrical resistance and enables a high current flow. And the increasing contact area will improve the contact strength between Ag particles and epoxy resin. Under the reliability testing with the high temperature and high humidity (85°C/85RH), the SiO2 nano-particles can improve the reliability of ICAs apparently, while carbon nanotubes can not. This is because insulating material can prevent silver migration.

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Zhao, Yuan, Doug Katze, John Wood, Bruno Tolla, and Howard Yun. "High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000360–63. http://dx.doi.org/10.4071/2380-4505-2019.1.000360.

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Abstract Over the past decade, electronic parts have become smaller, more complex and higher functioning. This is well-understood for many products within the consumer and handheld markets. Miniaturization, however, is also impacting sectors such as aerospace and automotive, pushing the limits of already harsh environments. As more power is driven through active devices, the integrity of materials used to provide the electrically conductive interfaces is becoming increasingly critical. For many applications, adhesive films have been the preferred material because they offer a variety of performance and operational advantages such high electrical and thermal conductivity, uniform bondlines, superior adhesion and low processing temperatures. Today, though, as miniaturization pushes power-density limits and devices are also being exposed to high operating temperatures, even traditionally robust adhesive films are challenged to cope with these conditions. In sectors such as aerospace where high reliability is essential, material capability must evolve to deliver on fail-safe performance expectations. This paper will compare the performance of an established and widely used electrically conductive film adhesive with that of a newly developed film designed to provide improved mechanical performance over a higher elevated temperature range.

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Journal articles on the topic 'Adhesives Reliability'

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