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Journal articles on the topic 'Ag-Sn-Sb alloy'

Author: Grafiati

Published: 28 June 2021

Last updated: 29 July 2025

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1

Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature

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2

Wu, C. P., D. Q. Yi, S. Goto, et al. "Oxidation of Ag-Sn-Sb alloy powders." Materials and Corrosion 65, no. 5 (2012): 522–30. http://dx.doi.org/10.1002/maco.201206542.

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3

Dahshan, Alaa, Horesh Kumar, and Neeraj Mehta. "Role of some modifiers on the thermo-mechanical properties of Se90In10 chalcogenide glass (ChGs)." European Physical Journal Applied Physics 94, no. 3 (2021): 31101. http://dx.doi.org/10.1051/epjap/2021210044.

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The studies on the micro-hardness of ChGs provide useful information regarding their straightforward involvement in the fabrication of sensors, fibers, and other optical elements for direct use in infrared optics. This work deals with the mechanical response of the glassy Se90In10 alloy under the influence of additives (Sn, Ag, Sb, and Ge). For this, we have determined the micro-hardness of all glassy alloys. Using the values of Vickers hardness (Hv), glass transition temperature (Tg), and present glasses, we have calculated the other significant thermo-mechanical parameters. The effect of Sn,

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4

Park, Won-Bum, Yong-Woo Kim, Sun-Joong Kim, and Youn-Bae Kang. "Development of Wet Chemical Analysis Technique for Tramp Elements (M = As, Pb, Sb, and Sn) in Silver-M Alloys." Korean Journal of Metals and Materials 61, no. 9 (2023): 694–703. http://dx.doi.org/10.3365/kjmm.2023.61.9.694.

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Wet chemical analysis techniques for four elements (M = As, Pb, Sb, and Sn) in Ag – M binary alloys were investigated with emphasis on the choice of solvent acid and the characteristic wavelength used in the ICP-AES (Inductively-Coupled Plasma Atomic Emission Spectrometer) analysis. The elements are representative tramp elements in ferrous scrap. The activity of these elements needs to be increased to remove them efficiently during the molten scrap refining process. The activity of these elements in the molten scrap (molten iron alloy) is usually measured by a chemical equilibration technique

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5

Li, Chaojun, Yanfu Yan, Tingting Gao, and Guodong Xu. "The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder." Materials 13, no. 19 (2020): 4443. http://dx.doi.org/10.3390/ma13194443.

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To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of I

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6

Wang, Fu Li, Jing Chao Chen, and Jie Yu. "First-Principles Calculations for Electrical Proterties of the Lead Anode Plate." Advanced Materials Research 634-638 (January 2013): 1817–20. http://dx.doi.org/10.4028/www.scientific.net/amr.634-638.1817.

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Four kinds of fermi energy of lead anode plate were calculated by using first-principles. Different metals and different alloy elements of the fermi energy level were compared, the minimum electrode potential lead base alloy anode materials is known. The results calculations show that the adding alloy elements can reduce the electrode potential of the lead anode plate, four kinds of alloy systems Pb-Ag, Pb-Sb, Pb-Sr, Pb-Sn were calculated, the highest of fermi energy was Pb-Sb alloy. So the Pb-Sb alloy is expected to become the electrode potential minimum lead base alloy anode materials.

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7

Liu, G. X., Z. M. Guan, D. B. Williams, and M. R. Notis. "A Study of DIGM in Ag/Cu system by AEM." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 2 (1990): 416–17. http://dx.doi.org/10.1017/s042482010013568x.

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DIGM phenomenon is very similar to the diffusion process and the coupled migration of the reaction front occured in discontinuous precipitation. It is likely to postulate that DIGM may occur in the system where discontinuous precipitation appears. W. Kim and co-author have Investigated DIGM In six copper alloy systems (Ag/Cu, Mg/Cu, Sb/Cu, In/Cu, Cd/Cu and Sn/Cu) in which discontinuous precipitation has been found. In Kim s experiment, the diffusion treatments were conducted at 400 °C and 450 °C for 4 days, Kim found DIGM occurred in 4 systems, i. e. Sb/Cu, In/Cu, Cd/Cu and Sn/Cu, but in Ag/Cu

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8

Nur, Monika, Naoya Yamaguchi, and Fumiyuki Ishii. "Simple Model for Corrugation in Surface Alloys Based on First-Principles Calculations." Materials 13, no. 19 (2020): 4444. http://dx.doi.org/10.3390/ma13194444.

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The structural stability of M/Ag(111)–3×3R30° surface alloys is systematically investigated by using first-principles calculations, where M is a member of group III (B, Al, Ga, In, Tl), IV (C, Si, Ge, Sn, Pb), and V (N, P, As, Sb, Bi) elements. We focus on the corrugation parameter d which is determined by the height of the M atom from the Ag atom in the plane of the top-most atom, and the relation between atomic radii and corrugations in M/Ag(111) is obtained. The tendencies of the corrugation parameter d can be understood by using a simple hard spherical atomic model. We introduce a new type

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9

Musa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh, and Saud Norainiza. "Zn-Sn Based High Temperature Solder - A Short Review." Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.

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The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead-free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperatur

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10

Chen, Zhiwen, Kun Ma, Li Liu, et al. "Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated Temperatures." IEEE Transactions on Components, Packaging and Manufacturing Technology 11, no. 7 (2021): 1081–87. http://dx.doi.org/10.1109/tcpmt.2021.3093562.

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11

Wang, Yufei, Min Li, Haiyan Gao, Jun Wang, and Baode Sun. "First-Principles Study on the Cu/Fe Interface Properties of Ternary Cu-Fe-X Alloys." Materials 13, no. 14 (2020): 3112. http://dx.doi.org/10.3390/ma13143112.

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The supersaturated Fe in Cu is known to reduce the electrical conductivity of Cu severely. However, the precipitation kinetics of Fe from Cu are sluggish. Alloying is one of the effective ways to accelerate the aging precipitation of Cu-Fe alloys. Nucleation plays an important role in the early stage of aging. The interface property of Cu/γ–Fe is a key parameter in understanding the nucleation mechanism of γ-Fe, which can be obviously affected with the addition of alloying elements. In this paper, first principles calculations were carried out to investigate the influence of alloying elements

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12

CRISTEA-STAN, DANIELA, BOGDAN CONSTANINESCU, DANIELE CECCATO, CLAIRE PACHECO, LAURENT PICHON, and CATALIN LUCULESCU. "MICRO-PIXE STUDIES ON NATIVE TRANSYLVANIAN GOLD FOR ARCHAEOLOGICAL ARTIFACTS AUTHENTICATION." International Journal of Modern Physics: Conference Series 27 (January 2014): 1460133. http://dx.doi.org/10.1142/s2010194514601331.

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Determination of the geological provenance of gold is a powerful argument in the authentication of ancient gold artifacts. Small samples (hundreds of microns) of native gold from Transylvanian deposits were scanned by micro-PIXE to obtain information on the natural Au – Ag alloy composition and on the presence of trace elements such as Sn , Sb , and Cu . The experiments were performed at the AGLAE Louvre and LNL AN2000 accelerators. Mineral identification was confirmed by a micro-mineralogical study using the INFLPR-Magurele Scanning Electron Microscope associated with an Energy-dispersive X-r

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13

Hong, Sung-joon, Ashutosh Sharma, and Jae Pil Jung. "Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb." Materials 17, no. 11 (2024): 2661. http://dx.doi.org/10.3390/ma17112661.

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This study was conducted on SAC105 (Sn-1wt.%Ag-0.5wt.%Cu) lead-free solder modified with Bi and Sb. The wetting, melting point, and mechanical properties were analysed with the addition of 1~5 wt.%Bi and 1~5 wt.%Sb for SAC105 base alloy. The wetting characteristics were assessed by wetting time (zero cross time, ZCT) obtained from wetting balance tests. The mechanical properties were analysed by tensile tests. Considering two factors (Bi, Sb), a three-level (0, 1, 2 wt.%) design of experiment (DOE) method array was applied for Taguchi optimization. The results indicated that the solder wetting

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14

Mladenovic, Srba, Desimir Markovic, Ljubica Ivanic, Svetlana Ivanov, and Zagorka Acimovic-Pavlovic. "The microstructure and properties of as-cast Sn-Zn-Bi solder alloys." Chemical Industry 66, no. 4 (2012): 595–600. http://dx.doi.org/10.2298/hemind111219015m.

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Research on the lead-free solders has attracted wide attention, mostly as the result of the implementation of the Directive on the Restriction of the Use of Hazardous Substances in Electrical and Electronic Equipment. The Sn-Zn solder alloys have been considered to be one of the most attractive lead-free solders due to its ability to easily replace Sn-Pb eutectic alloy without increasing the soldering temperature. Furthermore, the mechanical properties are comparable or even superior to those of Sn-Pb solder. However, other problems still persist. The solution to overcoming these drawbacks is

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15

Mitsui, Kohei, Hirohiko Watanabe, Jantanee Tungbanjerdwanid, and Ikuo Shohji. "Sn-Sb-Ag Solder Alloy which Achieves High-Temperature Operation and High Reliability of Power Semiconductors." Journal of The Japan Institute of Electronics Packaging 28, no. 3 (2025): 214–17. https://doi.org/10.5104/jiep.28.214.

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16

Dolníček, Zdeněk, Dalibor Velebil, and Radek Vodrážka. "Charakteristika měděného slitku ze zlatého dolu na Zlatém vrchu v Mníšku pod Brdy (střední Čechy, Česká republika)." Bulletin Mineralogie Petrologie 32, no. 1 (2024): 23–30. http://dx.doi.org/10.46861/bmp.32.023.

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A copper pig with dimensions 3.3 × 2.3 × 1.7 cm and weighing 25 g was found together with few iron artefacts (several mining chisels, several fragments of mining hoes, a hook) in dump material of ancient gold mine at the Zlatý vrch Hill near Mníšek pod Brdy town, central Bohemia, Czech Republic. The gold mines were in operation in the surrounding area in the 15-16th centuries with some later attempts in 18th century. A material characterization of the copper artefact, based on reflected light microscopy and electron microprobe study, is presented in this paper. The composition can be roughly a

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17

Ueda, Shigeru, Ryo Katsube, and Katsunori Yamaguchi. "Distributions of Sn, Sb, and Bi between Ag-Pb Alloy and PbO Based Melt at 1273 K." MATERIALS TRANSACTIONS 50, no. 7 (2009): 1820–23. http://dx.doi.org/10.2320/matertrans.m2009117.

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18

Keheyan, Yeghis, and Giancarlo Lanterna. "Micro-Stratigraphical Investigation on Corrosion Layers in Ancient Bronze Artefacts of Urartian Period by Scanning Electron Microscopy, Energy-Dispersive Spectrometry, and Optical Microscopy." Heritage 4, no. 3 (2021): 2526–43. http://dx.doi.org/10.3390/heritage4030143.

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The results of the analysis on some fragments of bronze belts and a bowl discovered from southwestern Armenia at the Yegheghnadzor archaeological site are discussed. The samples are dated to the 7–6th millennium BCE from the Urartian period. The artefacts were corroded, and a multilayer structure was formed. To study the stratigraphy of layers and their composition, the samples have been analyzed using SEM-EDS (Scanning Electron Microscopy, Energy-Dispersive Spectrometry) and OM (Optical Microscopy) techniques. The bronze finds appear with the typical incrustations rich in alloy alteration com

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19

Franczak, Krystian, Michał Sadzikowski, Paweł Kwaśniewski, Grzegorz Kiesiewicz, Wojciech Ściężor, and Szymon Kordaszewski. "Research on Alloying Elements’ Influence on CuETP-Grade Copper’s Mechanical and Electrical Properties." Materials 17, no. 12 (2024): 3020. http://dx.doi.org/10.3390/ma17123020.

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The continuous industrial development that occurs worldwide generates the need to develop new materials with increasingly higher functional properties. This need also applies to the basic material for electricity purposes, which is copper. In this article, we carry out studies on the influence of various alloying elements such as Mg, In, Si, Nb, Hf, Sb, Ni, Al, Fe, Zr, Cr, Zn, P, Ag, Sc, Pb, Sn, Co, Ti, Mn, Te and Bi on the electrical and mechanical properties of ETP-grade copper. The research involves producing copper alloys using the gravity die casting method with alloy additions of 0.1 wt.

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20

Mitovski, Aleksandra, Dragana Zivkovic, Ljubisa Balanovic, Nada Strbac, and Zivan Zivkovic. "Life cycle assessment (LCA) of lead-free solders from the environmental protection aspect." Chemical Industry 63, no. 3 (2009): 163–69. http://dx.doi.org/10.2298/hemind0903163m.

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Life-cycle assessment (LCA) presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equival

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21

Li, Yue Hong, and Huai Bao Yuan. "Development and Application of Series Re-Calibration Samples of Copper and Copper Alloy." Advanced Materials Research 503-504 (April 2012): 511–15. http://dx.doi.org/10.4028/www.scientific.net/amr.503-504.511.

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In accordance with the requirements of the reference materials technical specifications, refer to some countries’ existing standards of chemical composition of copper and copper products, design the chemical composition of each re-calibration samples. Using proper methods of batching, smelting technique and extrusion processes etc., developed a set of re-calibration samples of copper and copper alloy. These samples are mainly used for standardization of photoelectric direct reading spectrometer instrument, to meet the re-calibration of various elements of Cu, Pb, Fe, Ni, Bi, Sb, P, As, Al, Zn,

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22

Silva Campos, Maria del Rosario, Carsten Blawert, Nico Scharnagl, Michael Störmer, and Mikhail L. Zheludkevich. "Cathodic Protection of Mild Steel Using Aluminium-Based Alloys." Materials 15, no. 4 (2022): 1301. http://dx.doi.org/10.3390/ma15041301.

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Typically, steel is protected from corrosion by employing sacrificial anodes or coatings based on Zn, Mg, Al or Cd. However, stricter environmental regulations require new environmentally friendly alternatives to replace Cd. Traditionally, Al-based anodes have been employed to cathodically protect steel in marine applications or as ion vapour deposition (IVD)-Al sacrificial coatings for aerospace applications. However, Al tends to passivate, thus losing its protective effect. Therefore, it is important to identify possible alloys that can provide a constantly sufficient current. In this study,

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23

Tarbay, János Gábor, and Boglárka Maróti. "Preliminary handheld XRF analysis of Late Bronze Age metal finds from the Budakeszi-Őzvölgy-tető site (Pest county, Hungary)." Archeometriai Műhely 20, no. 1 (2023): 23–36. http://dx.doi.org/10.55023/issn.1786-271x.2023-002.

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This study discusses the chemical analysis results of Middle and Late Bronze Age stray finds and the Late Bronze Age hoards excavated at the recently discovered Budakeszi-Őzvölgy-tető site (Pest County, Hungary). This measurement series is the second stage in the scientific evaluation of the finds, which helps to characterize the elemental composition and raw material characteristics of the A and B hoards and the stray finds. Our aim is to obtain elemental composition information on the 103 objects, which can be used to identify the main alloy types within the hoards, as well as to establish a

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24

Xu, Canhui, Danqing Yi, Chunping Wu, Huiqun Liu, and Weizhou Li. "Microstructures and properties of silver-based contact material fabricated by hot extrusion of internal oxidized Ag–Sn–Sb alloy powders." Materials Science and Engineering: A 538 (March 2012): 202–9. http://dx.doi.org/10.1016/j.msea.2012.01.031.

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25

Kasem, Md Riad, Kazuhisa Hoshi, Rajveer Jha, et al. "Superconducting properties of high-entropy-alloy tellurides M-Te (M: Ag, In, Cd, Sn, Sb, Pb, Bi) with a NaCl-type structure." Applied Physics Express 13, no. 3 (2020): 033001. http://dx.doi.org/10.35848/1882-0786/ab7482.

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26

MITSUI, Kohei, Ikuo SHOHJI, Tatsuya KOBAYASHI, and Hirohiko WATANABE. "Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties." Journal of Smart Processing 9, no. 3 (2019): 133–39. http://dx.doi.org/10.7791/jspmee.9.133.

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27

Sobhy, M., A. M. El-Refai, and A. Fawzy. "Effect of Graphene Oxide Nano-Sheets (GONSs) on thermal, microstructure and stress–strain characteristics of Sn-5 wt% Sb-1 wt% Ag solder alloy." Journal of Materials Science: Materials in Electronics 27, no. 3 (2015): 2349–59. http://dx.doi.org/10.1007/s10854-015-4032-x.

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28

El-Taher, A. M., S. E. Abd El Azeem, and A. A. Ibrahiem. "Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method." Journal of Materials Science: Materials in Electronics 31, no. 12 (2020): 9630–40. http://dx.doi.org/10.1007/s10854-020-03506-4.

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29

Yao, Yu, Jiajun Wen, Qi He, et al. "Optimizing Vertical Zone Refining for Ultra-High-Purity Tin: Numerical Simulations and Experimental Analyses." Separations 11, no. 9 (2024): 273. http://dx.doi.org/10.3390/separations11090273.

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This study investigates the application of the vertical zone refining process to produce ultra-high-purity tin. Computational fluid dynamics (CFD) simulations were conducted using an Sn-1 wt.%Bi binary alloy to assess the effects of two key parameters—heater temperature and pulling rate—on Bi impurity segregation. The simulations revealed a dynamic evolution in molten zone height, characterized by an initial rapid rise, followed by a gradual increase and ending with a sharp decline. Despite these fluctuations, the lower solid–liquid interface consistently remained slightly convex. After nine z

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30

Korolev, Alexey A. "Electrolytic Processing of Pb-Bi Alloy." Journal of Siberian Federal University. Engineering & Technologies 14, no. 8 (2021): 930–41. http://dx.doi.org/10.17516/1999-494x-0362.

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Metal bismuth is mainly produced as a by-product in the production of lead, tungsten, copper, silver, gold, tin and zinc. Approximately 90 % of all extracted bismuth is obtained from lead, copper and other concentrates. The main source of bismuth is lead concentrates obtained during the processing of lead, as well as lead-zinc and other polymetallic ores. During the processing of these concentrates, bismuth almost completely enters the rough lead, from which it is removed during its refining. The most common technologies for the recovery of bismuth from lead ingots are the Kroll-Betterton proc

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31

Griesche, Axel, Bo Zhang, Jürgen Horbach, and Andreas Meyer. "Interdiffusion and Thermodynamic Forces in Binary Liquid Alloys." Materials Science Forum 649 (May 2010): 481–86. http://dx.doi.org/10.4028/www.scientific.net/msf.649.481.

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A novel X-ray radiography method is used to measure chemical diffusion in a long-capillary in liquid Al95Ni5 at.-%. Molecular dynamics simulations provide interdiffusion coefficients and thermodynamic factors for the whole composition range in Al-Ni. The data are compared to literature data in Sb-Sn and Ag-Sn. The relation between interdiffusion coefficient and thermodynamic forces is discussed in the context of the Darken equation. In systems with common ordering tendency (Al-Ni, Sb-Sn) the thermodynamic factor is larger than one and enhances interdiffusion. In systems with common demixing te

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32

Moser, Z., W. Gąsior, J. Pstruś, I. Ohnuma, and K. Ishida. "Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb and Sn–Ag–Cu–Sb alloys: Experiment vs. modeling." International Journal of Materials Research 97, no. 4 (2006): 365–70. http://dx.doi.org/10.1515/ijmr-2006-0061.

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Abstract Surface tension and density measurements by maximum bubble pressure and dilatometric techniques were carried out in an extensive range of temperature on liquid alloys close to the ternary eutectic Sn3.3Ag0.76Cu with different Sb content. It has been found that the addition of Sb to Sn, Sn–Sb, to binary eutectic Sn–Ag and to Sn3.3Ag0.76Cu decreases the surface tension and density. The values of the surface tension calculated by the Butler model and by the method based on the binary alloys surface tension data with the ternary and quaternary correction factors were compared with the exp

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33

Gather, Bernd, Peter Schröter, and Roger Blachnik. "Mischungsenthalpien der ternären Systeme Ag-In-Sn, Ag-Sn-Sb, Ag-In-Sb und In-Pb-Sb." International Journal of Materials Research 78, no. 4 (1987): 280–85. http://dx.doi.org/10.1515/ijmr-1987-780407.

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34

Yang, Tixin, Youyang Chen, Kangdong You, et al. "Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys." Materials 15, no. 14 (2022): 4727. http://dx.doi.org/10.3390/ma15144727.

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The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag content. Adding alloying elements is an effective approach for improving the mechanical properties of the SAC alloys. In this study, the effect of Bi, Sb, and Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) solder alloys was investigated. The SAC solders with four compositions: SAC105-1 wt.%Bi, SAC105-1 wt.%S

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35

Moser, Z., W. Gąsior, J. Pstruś, I. Ohnuma, and K. Ishida. "Influence of Sb additions on surface tension and density of Sn–Sb, Sn–Ag–Sb andSn–Ag–Cu–Sb alloys: Experiment vs. modeling." Zeitschrift für Metallkunde 97, no. 4 (2006): 365–70. http://dx.doi.org/10.3139/146.101225.

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36

Shohji, Ikuo, and Yuichiro Toyama. "Effect of Strain Rate on Tensile Properties of Miniature Size Specimens of Several Lead-Free Alloys." Materials Science Forum 783-786 (May 2014): 2810–15. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.2810.

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The effect of strain rate on tensile properties of several lead-free solder was investigated using miniature size specimens. High-temperature lead-free solder which are Sn-Cu and Sn-Sb alloys were prepared. Moreover, low-Ag lead-free solder which are Sn-1Ag-0.7Cu (SAC107, mass%) based alloys were prepared. Sn-3Ag-0.5Cu (SAC305) was also prepared for comparison. Tensile strength is proportion to the logarithm of strain rate in all solder investigated. Although 0.1% proof stress decreases at high strain rate in high-temperature solder, it scarcely changes in low-Ag solder. Elongation somewhat in

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37

Shalaby, Rizk Mostafa. "Effect of rapid solidification on microstructure, creep resistance and thermal properties of Sn-10 wt.% Sb- 3 wt.% X ( X= In, Ag, Bi and Zn) lead-free solder alloys." JOURNAL OF ADVANCES IN PHYSICS 9, no. 1 (2015): 2287–98. http://dx.doi.org/10.24297/jap.v9i1.1469.

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AbstractThe harmful effects of lead on the environment and human health, coupled with the threat of legislation, have prompted a serious search for lead-free solders for electronic packaging applications. The melt-spinning processes of ternary Sn-10 wt.%Sb-3 wt.%X (X=In, Ag, Bi and Zn) were analyzed using x-ray diffractometer (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and Vickers hardness tester (HV). The investigation showed that, the addition of a small amount of the third element enhances the ductility of the Snâ€“10 wt.% Sb lead-free solder due to th

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38

Koncz-Horváth, Dániel, and Zoltán Gácsi. "Analysis of Lead in SnAg Based Solders Using X-Ray Fluorescence." Materials Science Forum 752 (March 2013): 37–41. http://dx.doi.org/10.4028/www.scientific.net/msf.752.37.

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This paper reports the results of ED-XRF method for the determination of low-level contaminated solders. The method was calibrated for the analysis of part-per-million (ppm) levels of Pb and major levels of other elements. In this work, two types of Sn-Ag based solder alloys are used; the ternary Sn-3.0wt%Ag-0.5wt%Cu (SAC305) and the 6-part Sn-3.5wt%Ag-3.2wt%Bi-1.6wt%Sb-0.5wt%Cu-0.15wt%Ni were examined. Empirical calibration and fundamental parameter calibration were used to analyze samples. The results of this study demonstrate the differences between the applied calibration methods for detec

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Weltsch, Zoltán, and Antal Lovas. "The Relation between the Surface Tension and the Bulk Properties of Diluted Silver Based Melts." Materials Science Forum 729 (November 2012): 19–24. http://dx.doi.org/10.4028/www.scientific.net/msf.729.19.

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The wettability of graphite by the Ag-M based (M: Cd, In Sn, Sb) liquid alloys was measured using the sessile drop method at a temperature interval of 1273 1473 K. Except the Ag-Cd alloys, the investigated systems exhibit worse wettability than that of Ag (host metal) melt, within the investigated temperature range. The compositional and concentration dependence of contact angle (Θ) exhibits similar trends, than the residual resistivity change measured in the same alloys in solid state. Nevertheless, the measured segregation effects during the solidification are not significant.

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Moser, Zbigniew, Wladyslaw Gasior, Janusz Pstrus, et al. "Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system." MATERIALS TRANSACTIONS 45, no. 3 (2004): 652–60. http://dx.doi.org/10.2320/matertrans.45.652.

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Sklyarchuk, V., Yu Plevachuka, I. Kaban, and R. Novakovic. "Surface properties and wetting behavior of liquid Ag-Sb-Sn alloys." Journal of Mining and Metallurgy, Section B: Metallurgy 48, no. 3 (2012): 443–48. http://dx.doi.org/10.2298/jmmb120719055s.

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Surface tension and density measurements of liquid Ag-Sb-Sn alloys were carried out over a wide temperature range by using the sessile drop method. The surface tension experimental data were analyzed by the Butler thermodynamic model in the regular solution approximation. The wetting characteristics of these alloys on Cu and Ni substrates have been also determined. The new experimental results were compared with the calculated values as well as with data available in the literature.

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42

Masson, D. Bruce, and Brian K. Kirkpatrick. "Equilibrium solidification of Sn-Ag-Sb thermal fatigue-resistant solder alloys." Journal of Electronic Materials 15, no. 6 (1986): 349–53. http://dx.doi.org/10.1007/bf02661884.

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Lee, Chiapyng, Chung-Yung Lin, and Yee-Wen Yen. "The 260°C phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints." Journal of Alloys and Compounds 458, no. 1-2 (2008): 436–45. http://dx.doi.org/10.1016/j.jallcom.2007.04.002.

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Yang, Fan, Liang Zhang, Zhi-quan Liu, Su-juan Zhong, Jia Ma, and Li Bao. "Properties and Microstructures of Sn-Bi-X Lead-Free Solders." Advances in Materials Science and Engineering 2016 (2016): 1–15. http://dx.doi.org/10.1155/2016/9265195.

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The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variati

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Kepezhinskas, P. K., N. V. Berdnikov, V. O. Krutikova, N. P. Kepezhinskas, I. A. Astapov, and E. A. Kirichenko. "SILVER MINERALIZATION IN DEEP MAGMATOGENIC SYSTEMS OF ANCIENT ISLAND ARCS: ILDEUS ULTRABASIC MASSIF, STANOVOY MOBILE BELT (RUSSIAN FAR EAST)." Tikhookeanskaya Geologiya 42, no. 4 (2023): 30–60. http://dx.doi.org/10.30911/0207-4028-2023-42-4-30-60.

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The Triassic (232–233 Ma) Ildeus mafic-ultrabasic massif is a fragment of a large mineralized magmatogenic system formed within the Stanovoy mobile belt at the Mesozoic stage of its evolution. Ultrabasic rocks are represented by cumulative plagioclase- and amphibole-bearing dunites, peridotites, websterites, and pyroxenites; basic rocks are gabbro-anorthosites, norites, and two-pyroxene gabbro. Most intrusive rocks of the Ildeus magmatogenic system experienced ultramafic (serpentine, chlorite, talc, carbonates) and acidic (quartz, biotite, potassium feldspar, secondary micas) metasomatism. Geo

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Gierlotka, Wojcieh, Yu-Chih Huang, and Sinn-Wen Chen. "Phase Equilibria of Sn-Sb-Ag Ternary System (II): Calculation." Metallurgical and Materials Transactions A 39, no. 13 (2008): 3199–209. http://dx.doi.org/10.1007/s11661-008-9671-6.

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de Freitas, Pâmella Raffaela Dantas, Bruno Silva Sobral, Raí Batista de Sousa, et al. "Assessment of the solidification behavior and microhardness of Sb-modified Sn-Ag alloys." Microelectronics Reliability 167 (April 2025): 115624. https://doi.org/10.1016/j.microrel.2025.115624.

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Lin, Chung-Yung, Chiapyng Lee, Xingjun Liu, and Yee-Wen Yen. "Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C." Intermetallics 16, no. 2 (2008): 230–38. http://dx.doi.org/10.1016/j.intermet.2007.10.002.

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Yao, Shinya, Yoichi Kaku, and Zensaku Kozuka. "The Activity Coefficients of Oxygen in Liquid Ag–In, Ag–Sn, Ag–Sb and Ag–Ge Alloys." Transactions of the Japan Institute of Metals 27, no. 8 (1986): 616–22. http://dx.doi.org/10.2320/matertrans1960.27.616.

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Chen, Sinn-Wen, Po-Yin Chen, Chen-Nan Chiu, Yu-Chih Huang, and Chao-Hong Wang. "Phase Equilibria of the Sn-Sb-Ag Ternary System (I): Experimental." Metallurgical and Materials Transactions A 39, no. 13 (2008): 3191–98. http://dx.doi.org/10.1007/s11661-008-9673-4.

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