Journal articles: 'Antenna arrays. Integrated circuits'

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Turk, Melih, and Fikret Tokan. "Broadband, Beam-Steering Asymmetric Stacked Microstrip Phased Array with Enhanced Front-to-Back Ratio." Applied Computational Electromagnetics Society 36, no. 3 (April 20, 2021): 273–81. http://dx.doi.org/10.47037/2020.aces.j.360307.

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The backward radiation is a critical problem that may cause breakdown of the front-end circuits that are integrated behind the antenna. Thus, antennas having high Front to Back Ratio (FBR) are required. For phased arrays, the back lobe suppression is required for all scanning angles at all frequencies of the band. In this work, a stacked patch linear array with asymmetric configuration is proposed. It is capable of scanning the beam in ±40° with less than 1.34 dB scanning loss. Due to the usage of probe-fed stacked patches as the antenna elements, impedance matching in 8-10 GHz is achieved. More than 30 dB FBR is obtained for broadside radiation. It is above 20 dB when the beam is steered to θ = 40°. This is valid for all frequencies of the band. A prototype is fabricated and measured. Higher than 38 dB FBR is observed. With its broadband, high FBR and low scanning loss, the proposed asymmetrical stacked patch phased array is suitable as radar and base station antenna.

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Yan, Dunbao, Chao Wang, Qiang Gao, and Naichang Yuan. "A novel compact interembedded AMC structure for integrated circuits and antenna arrays." Microwave and Optical Technology Letters 45, no. 4 (2005): 303–5. http://dx.doi.org/10.1002/mop.20803.

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Song, Hang, Afreen Azhari, Xia Xiao, Eiji Suematsu, Hiromasa Watanabe, and Takamaro Kikkawa. "Microwave Imaging Using CMOS Integrated Circuits with Rotating 4 × 4 Antenna Array on a Breast Phantom." International Journal of Antennas and Propagation 2017 (2017): 1–13. http://dx.doi.org/10.1155/2017/6757048.

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A digital breast cancer detection system using 65 nm technology complementary metal oxide semiconductor (CMOS) integrated circuits with rotating 4 × 4 antenna array is presented. Gaussian monocycle pulses are generated by CMOS logic circuits and transmitted by a 4 × 4 matrix antenna array via two CMOS single-pole-eight-throw (SP8T) switching matrices. Radar signals are received and converted to digital signals by CMOS equivalent time sampling circuits. By rotating the 4 × 4 antenna array, the reference signal is obtained by averaging the waveforms from various positions to extract the breast phantom target response. A signal alignment algorithm is proposed to compensate the phase shift of the signals caused by the system jitter. After extracting the scattered signal from the target, a bandpass filter is applied to reduce the noise caused by imperfect subtraction between original and the reference signals. The confocal imaging algorithm for rotating antennas is utilized to reconstruct the breast image. A 1 cm3 bacon block as a cancer phantom target in a rubber substrate as a breast fat phantom can be detected with reduced artifacts.

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Tung, Wei-Shin, Wei-Yuan Chiang, Chih-Kai Liu, Chiung-An Chen, Pei-Zong Rao, Patricia Angela R. Abu, Wan-Ming Chen, Faisal Asadi, and Shih-Lun Chen. "Low Cost AIP Design in 5G Flexible Antenna Phase Array System Application." Micromachines 11, no. 9 (September 13, 2020): 851. http://dx.doi.org/10.3390/mi11090851.

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In this paper, a low cost 28 GHz Antenna-in-Package (AIP) for a 5G communication system is designed and investigated. The antenna is implemented on a low-cost FR4 substrate with a phase shift control integrated circuit, AnokiWave phasor integrated circuit (IC). The unit cell where the array antenna and IC are integrated in the same plate constructs a flexible phase array system. Using the AIP unit cell, the desired antenna array can be created, such as 2 × 8, 8 × 8 or 2 × 64 arrays. The study design proposed in this study is a 2 × 2 unit cell structure with dimensions of 18 mm × 14 mm × 0.71 mm. The return loss at a 10 dB bandwidth is 26.5–29.5 GHz while the peak gain of the unit cell achieved 14.4 dBi at 28 GHz.

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Spira, Steffen, Kurt Blau, Reiner Thomä, and Matthias A. Hein. "Agile multi-beam front-end for 5G mm-wave measurements." International Journal of Microwave and Wireless Technologies 13, no. 7 (June 8, 2021): 740–50. http://dx.doi.org/10.1017/s1759078721000842.

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AbstractThe 5th generation new radio (5G NR) standards create both enormous challenges and potential to address the spatio-spectral-temporal agility of wireless transmission. In the framework of a research unit at TU Ilmenau, various concepts were studied, including both approaches toward integrated circuits and distributed receiver front-ends (FEs). We report here on the latter approach, aiming at the proof-of-principle of the constituting FEs suitable for later modular extension. A millimeter-wave agile multi-beam FE with an integrated 4 by 1 antenna array for 5G wireless communications was designed, manufactured, and verified by measurements. The polarization is continuously electronically adjustable and the directions of signal reception are steerable by setting digital phase shifters. On purpose, these functions were realized by analog circuits, and digital signal processing was not applied. The agile polarization is created inside the analog, real-time capable FE in a novel manner and any external circuitry is omitted. The microstrip patch antenna array integrated into this module necessitated elaborate measurements within the scope of FE characterization, as the analog circuit and antenna form a single entity and cannot be assessed separately. Link measurements with broadband signals were successfully performed and analyzed in detail to determine the error vector magnitude contributions of the FE.

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Tan, Guan-Nan, Xue-Xia Yang, Huan Mei, and Zhong-Liang Lu. "Study on Millimeter-Wave Vivaldi Rectenna and Arrays with High Conversion Efficiency." International Journal of Antennas and Propagation 2016 (2016): 1–8. http://dx.doi.org/10.1155/2016/1897283.

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A novel Vivaldi rectenna operated at 35 GHz with high millimeter wave to direct current (MMW-to-DC) conversion efficiency is presented and the arrays are investigated. The measured conversion efficiency is 51.6% at 35 GHz and the efficiency higher than 30% is from 33.2 GHz to 36.6 GHz when the input MMW power is 79.4 mW. The receiving Vivaldi antenna loaded with metamaterial units has a high gain of 10.4 dBi at 35 GHz. A SIW- (substrate integrated waveguide-) to-microstrip transition is designed not only to integrate the antenna with the rectifying circuit directly but also to provide the DC bypass for the rectifying circuit. When the power density is 8.7 mW/cm2, the received MMW power of the antenna is 5.6 mW, and the maximum conversion efficiency of the rectenna element is 31.5%. The output DC voltage of the element is nearly the same as that of the parallel array and is about half of the series array. The DC power obtained by the 1 × 2 rectenna arrays is about two times as much as that of the element. The conversion efficiencies of the arrays are very close to that of the element. Large scale arrays could be expended for collecting more DC power.

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Zhai, Guohua, Yong Cheng, Qiuyan Yin, Shouzheng Zhu, and Jianjun Gao. "Uniplanar Millimeter-Wave Log-Periodic Dipole Array Antenna Fed by Coplanar Waveguide." International Journal of Antennas and Propagation 2013 (2013): 1–5. http://dx.doi.org/10.1155/2013/430618.

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A uniplanar millimeter-wave broadband printed log-periodic dipole array (PLPDA) antenna fed by coplanar waveguide (CPW) is introduced. This proposed structure consists of several active dipole elements, feeding lines, parallel coupled line, and the CPW, which are etched on a single metallic layer of the substrate. The parallel coupled line can be optimized to act as a transformer between the CPW and the PLPDA antenna. Meanwhile, this transform performs the task of a balun to achieve a wideband, low cost, low loss, simple directional antenna. The uniplanar nature makes the antenna suitable to be integrated into modern printed communication circuits, especially the monolithic millimeter-wave integrated circuits (MMIC). The antenna has been carefully examined and measured to present the return loss, far-field patterns, and antenna gain.

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Curran, Brian, Jacob Reyes, Christian Tschoban, Ivan Ndip, Klaus-Dieter Lang, Jens Leiß, Marta Martinez-Vazquez, and Rens Baggen. "Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000384–88. http://dx.doi.org/10.4071/2380-4505-2018.1.000384.

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Abstract Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a K-Band receiver front-end, composed of four GaAs ICs, with linear IF output power for input powers above −40dBm and a temperature of 42°C during operation.

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Serafino, Giovanni, Antonio Malacarne, Claudio Porzi, Paolo Ghelfi, Marco Presi, Antonio D'Errico, Marzio Puleri, and Antonella Bogoni. "Simultaneous beam steering of multiple signals based on optical wavelength-selective switch." International Journal of Microwave and Wireless Technologies 7, no. 3-4 (April 28, 2015): 391–98. http://dx.doi.org/10.1017/s1759078715000707.

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A novel, photonics-based scheme for the independent and simultaneous beam steering of multiple radio frequency signals at a wideband phased-array antenna is presented. As a proof of concept, a wavelength-selective switch (WSS) is employed both as a wavelength router to feed multiple antenna elements and as a tunable phase shifter to independently control the phase of each signal at any antenna element. In the experiment, two signals at 12.5 and 37.5 GHz are simultaneously fed to the four output ports of the WSS with independent and tunable phase shifts, emulating the independent steering of two signals in a four-element phased-array antenna. The results confirm the precision and flexibility of the proposed scheme, which can be realized both with bulk components or resorting to photonic integrated circuits, especially for wide-band applications. The architecture for a possible integrated implementation of the proposed solution is presented, employing a structure based on micro-ring resonator. Starting from these results, the feasibility of an integrated version of the presented architecture is also considered. The proposed photonic integrated circuit realizing the beam-forming network might be based on tunable true-time delay, as well as on phase shift through micro-ring resonators, and could be conveniently implemented with CMOS-compatible silicon technology.

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Klatser, Paul, Marc Van Der Vossen, Gerard Voshaar, Rinus Boot, Adriaan Hulzinga, Maikel Iven, and Chris Roeloffzen. "An ultra flat phased array Ku-band antenna with integrated receivers in SiGe BiCMOS." International Journal of Microwave and Wireless Technologies 7, no. 3-4 (June 2015): 379–89. http://dx.doi.org/10.1017/s1759078715000999.

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A highly integrated Ku-band (10.7–12.75 GHz) planar phased array receiver of 64 antenna elements is presented. It features instantaneous reception of the full Ku-band (2.05 GHz wide) in two orthogonal polarizations with wide scan angles by using time delay instead of phase shift. The receiver is part of a system for satellite broadcast TV reception on board of moving vehicles. Two SiGe radio frequency integrated circuits (RFICs) were developed, packaged in ceramic BGAs and assembled onto a 15-layer printed circuit board (PCB) which integrates the antenna elements. An outline of the system is given along with a detailed description. It sets a new standard in integration density. The receiver has extensive analog signal processing at intermediate frequency (IF)-level. A novel bipolar implementation for true time delay is proposed, with a continuous programmable delay range of 0…80 ps with less than 2.5 ps group-delay variation in 2 GHz bandwidth (BW). The wide BW calls for a constant group-delay implementation in the IF chain. The receiver (RFIC) consumes only 132 mW per channel. Each channel has 40 dB gain.

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D’Addario, Larry R., and Douglas Wang. "An Integrated Circuit for Radio Astronomy Correlators Supporting Large Arrays of Antennas." Journal of Astronomical Instrumentation 05, no. 02 (May 31, 2016): 1650002. http://dx.doi.org/10.1142/s2251171716500021.

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Radio telescopes that employ arrays of many antennas are in operation, and ever larger ones are being designed and proposed. Signals from the antennas are combined by cross-correlation. While the cost of most components of the telescope is proportional to the number of antennas N, the cost and power consumption of cross-correlation are proportional to [Formula: see text] and dominate at sufficiently large N. Here, we report the design of an integrated circuit (IC) that performs digital cross-correlations for arbitrarily many antennas in a power-efficient way. It uses an intrinsically low-power architecture in which the movement of data between devices is minimized. In a large system, each IC performs correlations for all pairs of antennas but for a portion of the telescope’s bandwidth (the so-called “FX” structure). In our design, the correlations are performed in an array of 4096 complex multiply-accumulate (CMAC) units. This is sufficient to perform all correlations in parallel for 64 signals (N[Formula: see text]=[Formula: see text]32 antennas with two opposite-polarization signals per antenna). When N is larger, the input data are buffered in an on-chip memory and the CMACs are reused as many times as needed to compute all correlations. The design has been synthesized and simulated so as to obtain accurate estimates of the ICs size and power consumption. It is intended for fabrication in a 32[Formula: see text]nm silicon-on-insulator process, where it will require less than 12[Formula: see text]mm2 of silicon area and achieve an energy efficiency of 1.76–3.3[Formula: see text]pJ per CMAC operation, depending on the number of antennas. Operation has been analyzed in detail up to [Formula: see text]. The system-level energy efficiency, including board-level I/O, power supplies, and controls, is expected to be 5–7[Formula: see text]pJ per CMAC operation. Existing correlators for the JVLA ([Formula: see text]) and ALMA ([Formula: see text]) telescopes achieve about 5000[Formula: see text]pJ and 1000[Formula: see text]pJ, respectively using application-specific ICs (ASICs) in older technologies. To our knowledge, the largest-N existing correlator is LEDA at [Formula: see text]; it uses GPUs built in 28[Formula: see text]nm technology and achieves about 1000[Formula: see text]pJ. Correlators being designed for the SKA telescopes ([Formula: see text] and [Formula: see text]) using FPGAs in 16[Formula: see text]nm technology are predicted to achieve about 100[Formula: see text]pJ.

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Rahman, Muhammad Asad, Eisuke Nishiyama, Md Azad Hossain, Quazi Delware Hossain, and Ichihiko Toyoda. "A multi-layer approach of orthogonally fed circularly polarized microstrip array antenna for enhanced gain." International Journal of Microwave and Wireless Technologies 11, no. 5-6 (March 8, 2019): 532–42. http://dx.doi.org/10.1017/s1759078719000151.

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AbstractA new circularly polarized microstrip array antenna using the orthogonal feed technique is proposed in this paper. The antenna has a multi-layer structure and a new 3-way power divider employing the both-sided microwave integrated circuit technology is designed to configure the feed network of the array. Circular polarization (CP) is realized by creating a quadrature phase difference between orthogonal feed circuits of the patches. The multi-layer structure gives flexibility to adjust the patch spacing that helps to reduce the sidelobe level of the antenna. It is found that the multi-layer structure exhibits a gain of about 2 dB higher than that of a single layer structure by means of sidelobe reduction. The proposed structure also exhibits good CP performances that are verified by a good agreement of measured and simulated results. Simple and compact structure makes the antenna suitable for various wireless applications.

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Zhang, Xiao Hong, Guo Qing Luo, and Lin Xi Dong. "Substrate Integrated Waveguide Fed Cavity Backed Slot Antenna for Circularly Polarized Application." International Journal of Antennas and Propagation 2013 (2013): 1–6. http://dx.doi.org/10.1155/2013/316208.

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A novel planar low-profile cavity-backed slot antenna for circularly polarized applications is presented in this paper. The low-profile substrate integrated waveguide (SIW) cavity is constructed on a single PCB substrate with two metal layers on the top and the bottom surfaces and metallized via array through the substrate. The SIW cavity is fed by a SIW transmission line. The two orthogonal degenerate cavities resonanceTM110mode are successfully stimulated and separated. The circularly polarized radiation has been generated from the crossed-slot structure whose two arms’ lengths have slight difference Its gain is higher than 5.4 dBi, the peak cross-polarization level is lower than −22 dB, and the maximum axial ratio (AR) is about −1.5 dB. Compared with the previous presented low-profile cavity-backed slot antenna work, the spurious radiation from the proposed antenna’s feeding element is very low and it has less interference on the following circuits.

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Busuioc, Dan, Safieddin Safavi-Naeini, and Mahmoud Shahabadi. "High frequency integrated feed for front end circuitry and antenna arrays." International Journal of RF and Microwave Computer-Aided Engineering 19, no. 3 (December 23, 2008): 380–88. http://dx.doi.org/10.1002/mmce.20359.

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Yang, Zhou, Huang Jingjian, Wu Weiwei, and Yuan Naichang. "A Printed LPDA Antenna Fed by a Microstrip Line to Double Sided Parallel Strip Line from Backside." International Journal of Antennas and Propagation 2017 (2017): 1–7. http://dx.doi.org/10.1155/2017/6259682.

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A novel planar printed log-periodic dipole array (LPDA) antenna fed by tapered microstrip line (MSL) to double sided parallel strip line (DSPSL) is proposed in this paper. The proposed antenna adopts MSL feeding approach from backside. Using this feeding technique makes the printed LPDA antenna easier to be integrated into radio frequency (RF) circuits. In this paper, four layers are used to construct the antenna. The four layers of the printed LPDA antenna are printed on three thin dielectric substrates which are integrated together. To validate this approach, a printed LPDA antenna is simulated and fabricated for operating in the S and C bands (2.5–6 GHz). The antenna showed a good result over the whole frequency range with 2 : 1 VSWR, an average gain of 6.5 dB, and stable radiation patterns. The measured results are in very good agreement with simulations.

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Soref, Richard. "Reconfigurable Integrated Optoelectronics." Advances in OptoElectronics 2011 (May 4, 2011): 1–15. http://dx.doi.org/10.1155/2011/627802.

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Integrated optics today is based upon chips of Si and InP. The future of this chip industry is probably contained in the thrust towards optoelectronic integrated circuits (OEICs) and photonic integrated circuits (PICs) manufactured in a high-volume foundry. We believe that reconfigurable OEICs and PICs, known as ROEICs and RPICs, constitute the ultimate embodiment of integrated photonics. This paper shows that any ROEIC-on-a-chip can be decomposed into photonic modules, some of them fixed and some of them changeable in function. Reconfiguration is provided by electrical control signals to the electro-optical building blocks. We illustrate these modules in detail and discuss 3D ROEIC chips for the highest-performance signal processing. We present examples of our module theory for RPIC optical lattice filters already constructed, and we propose new ROEICs for directed optical logic, large-scale matrix switching, and 2D beamsteering of a phased-array microwave antenna. In general, large-scale-integrated ROEICs will enable significant applications in computing, quantum computing, communications, learning, imaging, telepresence, sensing, RF/microwave photonics, information storage, cryptography, and data mining.

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Griffin, D. W., and A. J. Parfitt. "Electromagnetic design aspects of packages for monolithic microwave integrated circuit-based arrays with integrated antenna elements." IEEE Transactions on Antennas and Propagation 43, no. 9 (1995): 927–31. http://dx.doi.org/10.1109/8.410202.

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Khalil, Hisham, M. Mansoor Ahmed, and Umair Rafique. "Nose-Cone Conformal Substrate-Integrated Waveguide Slot Array Antenna for X-Band Radar Applications." International Journal of Antennas and Propagation 2019 (December 23, 2019): 1–11. http://dx.doi.org/10.1155/2019/6262574.

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This paper presents the design of nose-cone conformal substrate-integrated waveguide (SIW) slot array antenna for modern radar applications. Firstly, the wave propagation characteristics have been investigated in doubly curved SIW, and it has been observed that they are non-uniform along the longitudinal direction of nose-cone conformal SIW. To ensure the constant wave propagation along the length of conformal SIW, the conventional design of SIW is reformulated for nose-cone conformal SIW and circuit model modification has been demonstrated. Secondly, the procedure for designing a SIW-based array on curved surfaces has been developed. In the proposed design, rectangular waveguide (RWG) to SIW feeding structure has been used to avoid spurious radiations. Finally, 1 × 6 element-based nose-cone conformal slotted array has been designed and compared with planar and cylindrical conformal arrays. It has been observed from the results that the nose-cone conformal slot array offers low sidelobe levels (SLLs) and high gain. For the validation of the proposed design, the conformal slotted array has been fabricated and measured, which exhibited a reasonable agreement between the measured and the simulated data.

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Weikle, Robert M., C. Zhang, S. Hawasli, S. Nadri, L. Xie, N. Scott Barker, and A. W. Lichtenberger. "Terahertz Diode Arrays and Differential Probes based on Heterogeneous Integration and Silicon Micromachining." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 000924–62. http://dx.doi.org/10.4071/2016dpc-tp36.

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Due to the technological needs of the radio astronomy and remote sensing scientific communities, as well as emerging applications in the areas of imaging, security, and broadband communications, terahertz and submillimeter-wave electronics continues to be an area of growth and increasing interest for academic researchers, government laboratories, and industry. The recent establishment of a commercial infrastructure for test and measurement instrumentation in this spectral region has fueled this growth and the emergence of CMOS as a submillimeter-wave technology has greatly expanded access to this spectral region by providing circuit designers with a platform for realizing terahertz circuits without need for specialized fabrication facilities or processes. The continued emergence of new terahertz devices has created a need for improved approaches to packaging, integration, and measurement tools for diagnostics and characterization in this portion of the spectrum. This paper focuses on progress in two parallel efforts aimed at addressing these needs: (1) the development of a direct-contact probe technology for on-wafer measurement of differential scattering-parameters in the WR-5.1 (140—220 GHz) and WR-3.4 (220—330 GHz) frequency bands, and (2) the development of processing technologies for realizing highly-integrated submillimeter-wave diode-based quasi-optical arrays, including phase modulators and sideband generators, that are based on heterogeneous integration of III-V semiconductors onto thin silicon membranes as a support substrate. The foundation for these efforts is micromachining and processing of silicon, allowing the fabrication of mechanically-robust and low-loss membrane carriers that can support and interconnect terahertz devices as well as directly interface them to surrounding circuitry. Examples of heterogeneous integration onto silicon as an approach to packaging and interfacing terahertz components that are detailed in this paper include development of differential micromachined wafer probes for in situ measurements of devices and circuits in the 140—330 GHz region. The probe design concept includes an integrated on-chip balun and matching network for terminating common-mode signals that may be generated by the DUT. The design methodology and initial measurement results for this probe will be presented. In addition, an example of heterogeneous integration/packaging of a submillimeter-wave frequency sideband generator array for phase modulation at 1.6 THz will be discussed. The sideband generator design incorporates 100 planar varactor diodes integrated into an array of bowtie antennas on a common substrate. Performance of the array as a phase shifter is described and the application of a new quasi-vertical diode fabrication process that consists of transfer of GaAs epitaxy to thin silicon support substrates will be discussed as an approach for implementing optimized arrays in the terahertz frequency range.

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Mohan, Anand. "DIELECTRIC OPTICAL ANTENNA: A NEW CONCEPT FOR MICROWAVE FREQUENCIES." Information Management and Computer Science 3, no. 2 (December 7, 2020): 27–29. http://dx.doi.org/10.26480/imcs.02.2020.27.29.

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The dielectric optical antenna operating band is used to enhance bandwidth of operation band. The dielectric resonator antenna has high permittivity. The capabilities of antenna depend on made-up materials. Antenna range plays very important role for transmission of radio-signals. The properties of antenna play very important role in any technical or communicational devices. Current communication system requires high level portable communicational devices. Nanoantenna has high level configurable conductor power to help to change specific feature. Optical antenna has great capability to connect one network another network . The specific feature of optical antenna moving around development of our life to give convenient life. Only advanced generation technology has power to change our simple life to advanced technological life. In this research paper we have introduced new technical idea to develop our brain to gain high level efficiency to controlled our system with helps of antenna full usability for human being .The antenna characteristics depends on permittivity , dimension, properties limiting factors, geometrical properties, shape, model, wavelength scale and intensity of antenna aperture wavelength, which incident radiation relates to its design . In this paper we apply maxwell equations for free space propagation, as well as solve its amplitude of phase future plasmonic integrated circuits will be capable to extremely high range data processing at optical domain, the optical frequencies will be controlled by efficient optical emission of plasmonic antenna. In this project the new concept of microwave range arrays is applied to convert plasmonic optical antenna array, with nano-coupled plasmonic wave guide, as a spatial filter to absorb a specific wave length at particular specified incident angle. Nanoantenna transmits optical signals on nanometre scale. Optical nanoantenna are expected to radiate in THZ or GHZ frequency range. Optical DRA antenna has very unique and key application for such types of device based configuration .The optical DRA –antenna has unique spectral ability to optimize as well as design in nanometre scale.

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Sieganschin, Anton, Thomas Jaschke, and Arne F. Jacob. "A compact low-noise frontend for interleaved Rx/Tx arrays at K-/Ka-Band." International Journal of Microwave and Wireless Technologies 13, no. 6 (March 29, 2021): 595–601. http://dx.doi.org/10.1017/s1759078721000404.

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AbstractThis contribution deals with a frontend for interleaved receive (Rx)-/transmit (Tx)-integrated phased arrays at K-/Ka-band. The circuit is realized in printed circuit board technology and feeds dual-band Rx/Tx- and single-band Tx-antenna elements. The dual-band element feed is composed of a substrate-integrated waveguide (SIW) diplexer with low insertion loss, a low-noise amplifier (LNA), a bandpass filter, and several passive transitions. The compression properties of the LNA are identified through two-tone measurements. The results dictate the maximum allowable output power of the power amplifier. The single band feed consists of a SIW with several transitions. Simulation and measurement results of the individual components are presented. The frontend is assembled and measured. It exhibits an Rx noise figure of 2 dB, a Tx insertion loss of ~ 2.9 dB, and an Rx/Tx-isolation of 70 dB. The setup represents the unit cell of a full array and thus complies with the required half-wave spacing at both Rx and Tx.

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Ali, Hafiz T., Saifullah Amin, Muhammad Amin, Moazam Maqsood, Abdur Rahman Maud, and Mohammad Yusuf. "Design and Development of a Near Isotropic Printed Arc Antenna for Direction of Arrival (DoA) Applications." Electronics 10, no. 7 (March 27, 2021): 797. http://dx.doi.org/10.3390/electronics10070797.

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This research presents an easy to fabricate isotropic printed arc antenna element to be used for direction of arrival (DoA) arrays. The proposed antenna exhibits a total gain variation of 0.5 dB over the entire sphere for 40 MHz impedance bandwidth at 1 GHz, which is the best design isotropy reported in literature so far. In addition, the isotropic bandwidth of the antenna for total gain variation of ≤3 dB is 225 MHz with 86% efficiency. The isotropic wire antenna is first designed and simulated in Numerical Electromagnetic code (NEC). An equivalent printed antenna is then simulated in CST, where single (short circuited) stub is integrated with the antenna for input matching and the results of NEC simulations are verified. The planar antenna is then manufactured using FR4 substrate for measurements. Good agreement between the measured and simulated results is observed, however the total gain variation is increased to 2 dB for the fabricated antenna. This is because of the unavoidable field scattering from the antenna substrate, the feed cables, and the antenna testing platform.

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Khalid, Fatima, Warda Saeed, Nosherwan Shoaib, Muhammad U. Khan, and Hammad M. Cheema. "Quad-Band 3D Rectenna Array for Ambient RF Energy Harvesting." International Journal of Antennas and Propagation 2020 (May 15, 2020): 1–23. http://dx.doi.org/10.1155/2020/7169846.

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This paper presents a quad-band, 3D mountable rectenna module for ambient energy harvesting. With the aim of powering up Internet of Things (IoT) nodes in practical ambient environments, a hybrid approach of combining power, both at RF and DC, is adopted using 98 MHz FM band, GSM900 (Global System for Mobile Communications), GSM1800, and Wi-Fi 2.4 GHz band. A dual polarized cross-dipole antenna featuring asymmetric slots as well as central ring structure enables multiband response and improved matching at the higher three frequency bands, whereas a loaded monopole wire antenna is used at the lower FM band. Four identical multiband antennas are placed in a 3D cubic arrangement that houses a 4-to-1 power combiner and matching circuits on the inside and the FM antenna on the top. In order to maintain stable rectenna output at varying input power levels and load resistances, a novel transmission line based matching network using closed form equations is proposed. Integrated in form of a 10 × 10 × 10 cm3 cube using standard FR4 substrate, the rectenna generates a peak output voltage of 2.38 V at −10 dBm input power. The RF to DC conversion efficiency is 70.28%, 41.7%, 33.37%, and 27.69% at 98 MHz, 0.9 GHz, 1.8 GHz, and 2.4 GHz, respectively, at −6 dBm. The rectenna also exhibits a measured conversion efficiency of 31.3% at −15 dBm for multitone inputs in ambient environment. The promising results in both indoor and outdoor settings are suitable to power low power IoT devices.

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Berg, Håkan, Heiko Thiesies, and Niklas Billström. "Low-cost TRM technologies for phased array radars." International Journal of Microwave and Wireless Technologies 1, no. 4 (June 19, 2009): 369–75. http://dx.doi.org/10.1017/s1759078709990304.

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Low-cost enabling technologies for T/R modules (TRMs) in phased array radars are proposed and analyzed in terms of technology, performance, and cost aspects. Phase and amplitude controlling integrated circuits (ICs) realized in a low-cost standard silicon process are demonstrated. The design of several ICs at the S-, C-, on X-band has shown that silicon germanium is a strong contender for gallium arsenide. This also applies to TRMs suited for military active phased array antenna (AESA) radars. The circuits presented in this paper are manufactured by austriamicrosystems in their 0.35 µm SiGe-BiCMOS process with an fT of around 70 GHz. A TRM packaging concept based on soldered surface-mount technology and organic substrates is also demonstrated. A cost analysis concludes that by using the proposed packaging concept and the SiGe core-chip technology, the TRM production cost can be potentially reduced by 70% compared to traditional ceramic hermetic packaging with core chip in GaAs technology.

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Portosi, Vincenza, Antonella Maria Loconsole, and Francesco Prudenzano. "A Split Ring Resonator-Based Metamaterial for Microwave Impedance Matching with Biological Tissue." Applied Sciences 10, no. 19 (September 26, 2020): 6740. http://dx.doi.org/10.3390/app10196740.

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A metamaterial lens based on a split ring resonator (SRR) array has been designed and optimized to improve the focusing and the penetration depth in human biological tissue of a microwave beam irradiated by a substrate integrated waveguide (SIW) cavity backed patch antenna. The impedance matching of the antenna loaded with human tissue is strongly improved. The simulations have been performed by using CST Microwave Studio®. A prototype of the device has been fabricated with the printed board circuits (PCB) process and has been characterized using a Network Analyzer and an antenna measurement system in anechoic chamber. A novel microwave applicator for hyperthermia therapy of skin cancer could be developed. The performances of the proposed applicator have been evaluated in terms of measured S11 scattering parameter modulus and simulated power loss density. The obtained results indicate that an SRR-based metamaterial is a promising solution for external microwave applicators to employ in dermatology.

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Tatu, Serioja Ovidiu, and Emilia Moldovan. "Millimeter Wave Multi-Port Interferometric Radar Sensors: Evolution of Fabrication and Characterization Technologies." Sensors 20, no. 19 (September 24, 2020): 5477. http://dx.doi.org/10.3390/s20195477.

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Recent advances in millimeter wave technologies, both in component and system design, in line with important size and cost reductions, have opened up new applications in ultra-high-speed wireless communications, radar and imaging sensors. The paper presents the evolution of millimeter wave circuit and modules fabrication and characterization technologies in the past decades. Novel planar low-cost fabrication technologies have been successfully developed in this period. In combination with the standard rectangular wave-guide technology, these offer great opportunities for prototyping and testing of future millimeter wave transceivers or front-ends, which integrate antenna arrays, down-converters, modulators, amplifiers, etc., in a compact fixture. The paper uses, as a suggestive example, the evolution of the multi-port interferometric front-ends implementation from millimeter wave bulky components and systems to miniaturized and high-efficient ones. Circuit and system designs are carefully done to avoid (as much as possible) complicated calibration methods or difficult post-processing of baseband data. This requires an increased effort in design and fabrication, but it allows miniaturization, low-power consumption, while keeping very good overall performances. Useful and straightforward laboratory characterization techniques of circuits and systems are described in detail.

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He, Han, Xiaochen Chen, Adnan Mehmood, Leevi Raivio, Heikki Huttunen, Pasi Raumonen, and Johanna Virkki. "ClothFace: A Batteryless RFID-Based Textile Platform for Handwriting Recognition." Sensors 20, no. 17 (August 28, 2020): 4878. http://dx.doi.org/10.3390/s20174878.

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This paper introduces a prototype of ClothFace technology, a battery-free textile-based handwriting recognition platform that includes an e-textile antenna and a 10 × 10 array of radio frequency identification (RFID) integrated circuits (ICs), each with a unique ID. Touching the textile platform surface creates an electrical connection from specific ICs to the antenna, which enables the connected ICs to be read with an external UHF (ultra-haigh frequency) RFID reader. In this paper, the platform is demonstrated to recognize handwritten numbers 0–9. The raw data collected by the platform are a sequence of IDs from the touched ICs. The system converts the data into bitmaps and their details are increased by interpolating between neighboring samples using the sequential information of IDs. These images of digits written on the platform can be classified, with enough accuracy for practical use, by deep learning. The recognition system was trained and tested with samples from six volunteers using the platform. The real-time number recognition ability of the ClothFace technology is demonstrated to work successfully with a very low error rate. The overall recognition accuracy of the platform is 94.6% and the accuracy for each digit is between 91.1% and 98.3%. As the solution is fully passive and gets all the needed energy from the external RFID reader, it enables a maintenance-free and cost-effective user interface that can be integrated into clothing and into textiles around us.

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Sun, Guang, Yi Liu, Taolin Liu, and Hu Yang. "Wideband and High-Efficiency SIW Cavity-Backed Magneto-Electric Dipole Antenna Array." International Journal of Antennas and Propagation 2019 (November 16, 2019): 1–16. http://dx.doi.org/10.1155/2019/9019034.

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In this paper, a compact, wideband, and high-efficiency substrate integrated waveguide (SIW) feeding cavity-backed aperture-coupled magneto-electric (ME) dipole antenna element and its array are proposed. Firstly, an SIW cavity-backed and a modified bowtie dipole are designed for the antenna element which makes it possess a high gain and wide impedance bandwidth. The antenna element covers an impedance bandwidth of 66.3% from 10.7 to 21.3 GHz with a peak gain of 10.3 dBi. Secondly, a 4 × 4 array is designed using the proposed antenna element. And a full-corporate substrate integrated waveguide feeding network is introduced to excite the array elements for the antenna application with wide bandwidth and high efficiency. For validation, a prototype of 4 × 4 array is fabricated by standard printed circuit board (PCB) facilities and further measured. The measured −10 dB impedance bandwidth of the proposed 4 × 4 antenna array is 30% (12.75–17.25 GHz) with its gain being 18.2–20.9 dBi within the entire band. The measured maximum aperture efficiency of the antenna array is 94% at 14.92 GHz. Notably, the measured results agree well with simulations, and it shows great advantages over other similar antennas on efficiency and bandwidth.

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Venu Madhav, P., and Dr M SivaGanga Prasad. "Topology Optimization of Dual Octagonal Array antenna for low frequency applications." International Journal of Engineering & Technology 7, no. 2.17 (April 15, 2018): 13. http://dx.doi.org/10.14419/ijet.v7i2.17.11552.

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Objectives: Efficient antenna design for use in communication systems is altering the face of the antenna modeling. The ever-increasing demand for portable and efficient antennas is making researchers to develop innovative models [1] using advanced antenna modeling tools that comply with industrial needs and standards. Methods/Statistical Analysis: Antennas with lower operating frequencies have the major constraints on its size, efficiency and gain. Study on matching techniques, feeding techniques was also to be considered.Findings: Micro strip patch antennas offers considerable amount of radiation, low cost when fabricated on FR4, light weight and are conformable to suite any application. This paper projects the design, simulation and testing of a dual octagonal patch, the topology algorithm [3] is used to optimize the size and shape of the patch where octagons are spaced in the form of an array to address optimization on size and fits into wireless applications. Application/Improvements: The proposed model is tested in the standard antenna test bench comprising of microwave integrated circuit analyzer receiver MIC10kit and found to operate at a resonant frequency of 1.8 GHz with good radiation characteristics.

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Zongxin, Wang, Xiang Bo, and Yang Fei. "A Multibeam Antenna Array Based on Printed Rotman Lens." International Journal of Antennas and Propagation 2013 (2013): 1–6. http://dx.doi.org/10.1155/2013/179327.

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A compact printable multibeam antenna array is studied in this paper. The antenna system is composed of a printed Rotman lens and an antipodal dual elliptically tapered slot antenna array; both of the two components are studied, respectively, at first, and then integrated on a single printed circuit board to make up the integrated unit of the multibeam antenna array. Measured results of all components are presented.

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Bonnet, B., R. Chiniard, H. Legay, D. Nevo, P. Monfraix, O. Vendier, P. Couderc, and J. L. Cazaux. "Use of 3D Packaging Technology for Satellite Active Antennas Front-ends." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000554–60. http://dx.doi.org/10.4071/isom-2012-wa14.

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Multi-Chip Module Vertical (MCM-V) technology, also called 3D packaging technology, enables the realization of a compact and low loss integrated feed for active antennas in Ka band. The active devices can be located in the vicinity of the radiating element, which reduces dramatically the volume and complexity of the antenna front-end for future architectures with more than a hundred beams in Ka band. This paper deals with the optimization of 3D packaging technology to reach the requirements of 30GHz microwave modules for space applications. The technological developments that have been led on the design and the assembly processes are detailed. The measurement results of an integrated feed module in radiation are given and the circuit designed to optimize the signal-to-noise ratio of the front-end for receiving antennas is characterized. The performance is as good as for an optimized planar front-end with a waveguide access for a much more compact module, especially in terms of footprint in an antenna array. These results successfully position 3D packaging as a disruptive technology for future space and telecom subsystems.

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Meng, Zhaozong, Zhipeng Wu, and John Gray. "Microwave sensor technologies for food evaluation and analysis: Methods, challenges and solutions." Transactions of the Institute of Measurement and Control 40, no. 12 (September 20, 2017): 3433–48. http://dx.doi.org/10.1177/0142331217721968.

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Microwave sensor technology is widely accepted as a non-destructive and hygienic means for food evaluation and analysis. However, its applications concentrate on in-lab investigations, which are not widely applied for on-line measurement in food industry. Motivated by the rapid progress of microwave technologies and the lack of on-line measurement systems in industry, this paper aims to provide a comprehensive overview of microwave sensors for food measurement, define the technological gap, and suggest the potential solutions. With a brief introduction to the fundamentals, classification and analysis of the traditional methods and technologies are presented, followed by a discussion of calibration and decision-making methods. Based on the analysis of the cutting-edge microwave sensing technologies, the limitations and challenges facing the present studies are identified. Then, focusing on some new emerging technologies including Monolithic Microwave Integrated Circuits, antenna array and System on Chip Ultra-Wide Band pulse-based time domain systems, the feasibility and prospective of potential solutions in this particular area are suggested. In addition, integration of emerging Information and Communication Technologies (ICT) and new design concepts of the sensor system concerning the practical use for smart manufacturing are also illustrated. The potentiality of the suggested new emerging technologies and integration of ICT to satisfy future digitised industry will be inspirational and of interest to researchers of both microwave engineering and food sectors.

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Kim, Young-Jun, Gunhark Noh, Han Lim Lee, and Sungwook Yu. "Dual-Polarized Multi-Channel 24 GHz Radar Sensor Antenna for High Channel-to-Channel Isolation." Sensors 20, no. 18 (September 14, 2020): 5233. http://dx.doi.org/10.3390/s20185233.

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This article presents a dual-polarized, high gain multi-beam and high T/Rx channel-to-channel isolation antenna module for 24 GHz sensor applications. The proposed antenna is configured to support 2-Tx and 2-Rx channels with a pair of vertically polarized (VP) radiation pattern and a pair of horizontally polarized (HP) radiation pattern. Further, each linearly polarized T/Rx antenna is configured by 2 × 4 array with a multi-layer integrated feed network, resulting in four sets of 2 × 4 array antennas fabricated within a single printed circuit board (PCB). Since multiple RF channels must be ensured with minimal interference, high antenna-to-antenna, including Tx-to-Tx, Rx-to-Rx, and Tx-to-Rx port isolations in the proposed antenna are achieved by multi-layered feed network and four sets of T-shaped magnetic walls. To verify the performance of the proposed structure, a 2-Tx and 2-Rx antenna module was fabricated at 24 GHz. The fabricated antenna showed a measured maximum 10-dB impedance bandwidth of 3.9% with a maximum measured gain of 11.7 dBi, considering both Tx and Rx. Further, the measured channel-to-channel isolations were always better than 35.6 dB at 24 GHz.

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34

Kim, Young-Jun, Ye-Bon Kim, Hyun-Jun Dong, Yong Soo Cho, and Han Lim Lee. "Compact Switched-Beam Array Antenna with a Butler Matrix and a Folded Ground Structure." Electronics 9, no. 1 (December 18, 2019): 2. http://dx.doi.org/10.3390/electronics9010002.

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A compact switched-beam array antenna, based on a switched Butler matrix with four folded ground antennas, is presented for unmanned aerial vehicle (UAV) applications. The folded ground structure, including a slotted patch radiator surrounded by multiple air-gapped ground layers, is adopted to maximize compactness. The extra ground layers provide extra capacitive coupling around the patch antenna, resulting in a down-shift of resonant frequency and a reduction in the antenna size. Also, to optimize aerial operation with a wider beam coverage, the 1 × 4 array is integrated with a switched Butler matrix controlled by a microcontroller unit (MCU). The choice of the Butler matrix reduces the complexity of beamforming circuitry and avoids the use of high-cost phase shifters requiring extra control-bit signals. Further, the array antenna is optimized for high isolation among the antenna ports and a minimal UAV body effect. Then, the proposed structure was verified at 1.96 GHz for test purposes only, and the array size, excluding the antenna case, was 2.16λo × 0.54λo × 0.07λo. The measured 10 dB impedance bandwidth for all antenna elements in the array was always better than 3.4%, and the isolation among the antenna ports was also better than 19 dB. The measured peak gain, excluding the loss of the switched Butler module, was about 9.98 dBi, on average. Lastly, the measured peak scan angles were observed at −39°, −17°, 9° and 31° according to switching modes.

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Zhang, Y. P. "Integrated Circuit Ceramic Ball Grid Array Package Antenna." IEEE Transactions on Antennas and Propagation 52, no. 10 (October 2004): 2538–44. http://dx.doi.org/10.1109/tap.2004.834427.

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36

Carrez, F., and J. Vindevoghel. "Integrated circuit array antenna for short-range communication systems." Electronics Letters 34, no. 14 (1998): 1370. http://dx.doi.org/10.1049/el:19981008.

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Shekhar, Chandra, and Shirshu Varma. "An Optimized 2.4GHz RF Energy Harvester for Energizing Low-Power Wireless Sensor Platforms." Journal of Circuits, Systems and Computers 28, no. 06 (June 12, 2019): 1950104. http://dx.doi.org/10.1142/s0218126619501044.

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The lifetime of battery-operated sensor platforms (i.e., sensor nodes) is a critical issue. The replacement of their batteries is quite a challenging task if these platforms are deployed for detecting events in inaccessible geographical areas (e.g., forest). This paper describes an optimized RF energy harvester/scavenger (consisting of an antenna, impedance matching circuit and rectifier) for energizing low-power sensor platforms (electronic systems). Few nonmatched rectifiers (using HSMS-285X Schottky diodes) are fabricated to characterize the input impedance for different sets of parameters. After characterization a proper impedance matching circuit is integrated for the maximum power transfer from antenna to rectifier. It is shown that a single stage of RF rectifier is enough to produce output voltage of 1.8[Formula: see text]V. Very few realizations of RF energy harvester are reported in the literature under 2.4[Formula: see text]GHz ISM band category. Furthermore, high-gain microstrip patch array antennas are fabricated to capture the maximum power from the surroundings. The maximum harvesting range of 0.92[Formula: see text]m is obtained at 27[Formula: see text]dBm transmitting power level.

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38

Yaxin, Zhang, Zeng Hongxin, Kou Wei, Wang Lan, Daniel M. Mittleman, and Yang Ziqiang. "Terahertz smart dynamic and active functional electromagnetic metasurfaces and their applications." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 378, no. 2182 (September 14, 2020): 20190609. http://dx.doi.org/10.1098/rsta.2019.0609.

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The demand for smart and multi-functional applications in the terahertz (THz) frequency band, such as for communication, imaging, spectroscopy, sensing and THz integrated circuits, motivates the development of novel active, controllable and informational devices for manipulating and controlling THz waves. Metasurfaces are planar artificial structures composed of thousands of unit cells or metallic structures, whose size is either comparable to or smaller than the wavelength of the illuminated wave, which can efficiently interact with the THz wave and exhibit additional degrees of freedom to modulate the THz wave. In the past decades, active metasurfaces have been developed by combining diode arrays, two-dimensional active materials, two-dimensional electron gases, phase transition material films and other such elements, which can overcome the limitations of conventional bulk materials and structures for applications in compact THz multi-functional antennas, diffractive devices, high-speed data transmission and high-resolution imaging. In this paper, we provide a brief overview of the development of dynamic and active functional electromagnetic metasurfaces and their applications in the THz band in recent years. Different kinds of active metasurfaces are cited and introduced. We believe that, in the future, active metasurfaces will be combined with digitalization and coding to yield more intelligent metasurfaces, which can be used to realize smart THz wave beam scanning, automatic target recognition imaging, self-adaptive directional high-speed data transmission network, biological intelligent detection and other such applications. This article is part of the theme issue ‘Advanced electromagnetic non-destructive evaluation and smart monitoring’.

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Ogura, Nobuo, Siddharth Ravichandran, Tailong Shi, Atom Watanabe, Shuhei Yamada, Mohanalingam Kathaperumal, and Rao Tummala. "First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000202–7. http://dx.doi.org/10.4071/2380-4505-2019.1.000202.

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Abstract With the number of connected-devices increasing tremendously, communication data rates are projected to be at least 10–100X in the 5G/mm-wave (MMW) technology - much higher than the existing 4G LTE connections.[1], [2] To catch up with the trend, novel packaging technology in the MMW frequency range is required, which will address fundamental MMW technical challenges such as high dielectric loss, degradation of quality factors in passives, increased parasitic, dramatically-enhanced electromagnetic interference, and the reduced radiation efficiency of antenna arrays. State-of-the-art approaches being pursued include organic-core substrates that have a low dielectric constant (Dk) and low dissipation factor (Df) such as fluorine based or liquid-crystal polymer (LCP) substrates in order to achieve enhanced antenna performance and low signal dissipations. These organic-based substrate technologies, however, can neither miniaturize packages nor handle precision signal routings that enable high density packages. To address these challenges, attention is focused on Fan-Out Wafer Level Package (FOWLP) technologies, like eWLB, InFO, and SWIFT, where integrated circuits (ICs) are embedded in epoxy molding compound. [3]–[6] Recently, glass-panel embedding (GPE) technology is emerging as an ideal packaging methodology that enables superior performance along with small form factor, ultra-low-loss, high density, ultra-short interconnects, and low cost. [7] These benefits stem from the advantages of using glass which has excellent properties such as ultra-smooth surface for precision redistribution layer (RDL), exceptional dimensional stability for panel-scalability and tailorability of CTE that allow direct board-attach for improved system performance. In addition, utilizing the epoxy molding compounds as encapsulation material allows the GPE package to be thinner and more robust package with small farm factor. Molding of glass cavity panels also helps with the handling of ultra-thin glass which is seen as a bottleneck towards glass based packaging solutions in production. These facilitates enhanced throughput by allowing more cavity cut outs (more coupons) per panel. This paper presents the first demonstration of ultra-thin GPE with sheet type epoxy molding compound (SMC) for 5G/mm-wave applications. First part of this paper discusses the process-flow used in glass-panel embedding with laminated SMC, including chip placement in glass cavities, lamination of SMC, and the reliability of the package architecture. This paper reports on such a demonstration in 60 μm glass substrates with 40 μm thickness SMC. The second part of this paper focuses on low-loss interconnects for 5G/mm-wave applications and presents the process development of signal routings such as transmission lines and microvias in RDLs as well as through-package vias (TPVs) with via-in-via process. The results suggest that the ultra-thin GPE architecture is a promising packaging technology solution for a variety of applications including high-frequency communications and high-performance computing.

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Wang, Zhenye, Xiwang Dai, and Wen Sun. "Tri-beam slot antenna array based on substrate integrated waveguide (SIW) technology." International Journal of Microwave and Wireless Technologies 12, no. 3 (September 20, 2019): 246–51. http://dx.doi.org/10.1017/s1759078719001260.

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AbstractA novel tri-beam slot antenna array based on substrate integrated waveguide (SIW) technology is proposed in this paper. The beam forming network is a 3 × 3 Butler matrix consisted of three couplers and four phase shifters. A 1.76 dB coupler is located between two 3 dB couplers, with this arrangement; the input signal can be divided into three parts with the same amplitude and certain phase differences. Two parallel slots are cut off broadside of SIW transmission line, which constitutes the basic unit of the antenna array. A 3 × 2 slot antenna array is connected with this circuit. Three beams with the directions of −30, 0 and 30° are produced when different ports are excited, respectively. The S parameters, radiation patterns, and gains are simulated and measured, which show that it can be a candidate for multi-beam wireless communication systems.

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Ojaroudi Parchin, Naser, Haleh Jahanbakhsh Basherlou, and Raed A. Abd-Alhameed. "Design of Multi-Mode Antenna Array for Use in Next-Generation Mobile Handsets." Sensors 20, no. 9 (April 25, 2020): 2447. http://dx.doi.org/10.3390/s20092447.

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In this study, a new design of a tri-band multiple-input–multiple-output (MIMO) antenna array is proposed for fifth-generation (5G) cellular systems. Its structure is composed of eight identical planar-inverted F antenna (PIFA) elements placed at different edge corners of the handset mainboard with overall dimensions of 150 × 75 mm2. The PIFA elements and ground plane of the MIMO antenna system are arranged on the back layer of the platform, which makes the design easy to integrate with the handset circuit. For S11 ≤ −10 dB, the radiation elements of the MIMO design operate at the frequency ranges of 2.5–2.7 GHz, 3.4–3.75 GHz, and 5.6–6 GHz covering the long-term evolution (LTE) 41, 42/43, and 47 operation bands, respectively. The array achieves better than 15 dB return loss results across the three operating bands. The presented antenna array not only exhibits multi-band operation but also generates the polarization diversity characteristic, which makes it suitable for multi-mode operation. The proposed antenna array was simulated and experimentally tested. Fundamental characteristics of the proposed design are investigated. It offers three band S-parameters with acceptable isolation and dual-polarized radiation with quite good efficiency and gain results. Besides this, the total active reflection coefficient (TARC) and envelope correlation coefficient (ECC) results of the PIFAs are very low over the bands. In addition, the radiation characteristics of the MIMO antenna in the presence of the user and handset components are studied. Moreover, a new and compact phased array millimeter-wave (MM-Wave) antenna with broad bandwidth and end-fire radiation is introduced which can be easily integrated into the smartphone antenna system. Due to its good performance and simple structures, the proposed smartphone antenna array design is a good candidate for future multi-mode 5G cellular applications.

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El Halaoui, Mustapha, Laurent Canale, Adel Asselman, and Georges Zissis. "Dual-Band 28/38 GHz Inverted-F Array Antenna for Fifth Generation Mobile Applications." Proceedings 63, no. 1 (December 28, 2020): 53. http://dx.doi.org/10.3390/proceedings2020063053.

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The development of 5G (fifth generation) mobile communication systems was initiated to meet the expected need for higher data rates. In this article, a new 28/38 GHz dual-band “inverted-F” array antenna for 5G applications is proposed. This antenna can be integrated in OLEDs (Organic Light Emitting Diodes) panels which can be used both for lighting or display. This 5G antenna, composed of 32 elements, has the advantage of a dual-band and compact structure. Each element of the array antenna has the shape of an “inverted-F” antenna. This array antenna can cover the 28 GHz band (27.94–28.83 GHz) and the 38 GHz band (37.97–38.96 GHz) with mutual coupling between the elements less than −35 dB. The characteristics of the end fire radiation beams were obtained by employing an array of 32 “inverted-F” antenna elements on the upper and lower portions of the PCB (Printed Circuit Board). The suggested design has a gain of approximately 16.52 dB at 28.38 GHz and 15.35 dB at 38.49 GHz, which is suitable for 5G mobile communications.

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Fischer, A., A. Stelzer, and L. Maurer. "A 77-GHz antenna and fully integrated radar transceiver in package." International Journal of Microwave and Wireless Technologies 4, no. 4 (February 16, 2012): 447–53. http://dx.doi.org/10.1017/s1759078712000049.

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A 77-GHz–directional folded dipole antenna integrated in an embedded wafer level ball grid array package is presented. For the characterization of the antenna, a frequency multiplier is embedded, which scales the 4.25-GHz input signal up to 76.5 GHz and allows the use of a commercial signal source. The antenna structure is manufactured at the metallic layer, in the fan-out area of the package, and is directly connected to the monolithically integrated transceiver. The gain of the antenna is about 7 dBi, measured over a large bandwidth of about 8 GHz. The combination of the frequency multiplier with a 77-GHz transceiver and the on-package antenna is a promising approach for a system-in-package to future radar modules for automotive radar applications. Such a module avoids 77-GHz transitions to the printed circuit board and hence simplifies the design and manufacturing of the radar sensor significantly.

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Gong, Ke, Xue Hui Hu, Peng Hu, Bing Jie Deng, and You Chao Tu. "A Series-Fed Linear Substrate-Integrated Dielectric Resonator Antenna Array for Millimeter-Wave Applications." International Journal of Antennas and Propagation 2018 (2018): 1–6. http://dx.doi.org/10.1155/2018/9672790.

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A series-fed linear substrate-integrated dielectric resonator antenna array (SIDRAA) is presented for millimeter-wave applications, in which the substrate-integrated dielectric resonator antenna (SIDRA) elements and the feeding structure can be codesigned and fabricated using the same planar process. A prototype 4 × 1 SIDRAA is designed at Ka-band and fabricated with a two-layer printed circuit board (PCB) technology. Four SIDRAs are implemented in the Rogers RT6010 substrate using the perforation technique and fed by a compact substrate-integrated waveguide (SIW) through four longitudinal coupling slots within the Rogers RT5880 substrate. The return loss, radiation patterns, and antenna gain were experimentally studied, and good agreement between the measured and simulated results is observed. The SIDRAA example provides a bandwidth of about 10% around 34.5 GHz for 10 dB return loss and stable broadside radiation patterns with the peak gain of 10.5–11.5 dBi across the band.

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Li, Jianxiong, Yunxiang Li, Weiguang Shi, Haolin Jiang, and Luhong Mao. "Two-Element Tapered Slot Antenna Array for Terahertz Resonant Tunneling Diode Oscillators." International Journal of Antennas and Propagation 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/847475.

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Two-element tapered slot antenna (TSA) array for terahertz (THz) resonant tunneling diode (RTD) oscillators is proposed in this paper. The proposed TSA array has the advantages of both the high directivity and high gain at the horizontal direction and hence can facilitate the horizontal communication between the RTD oscillators and other integrated circuit chips. A MIM (metal-insulator-metal) stub with a T-shaped slot is used to reduce the mutual coupling between the TSA elements. The validity and feasibility of the proposed TSA array have been simulated and analyzed by the ANSYS/ANSOFT’s High Frequency Structure Simulator (HFSS). Detailed modeling approaches and theoretical analysis of the proposed TSA array have been fully addressed. The simulation results show that the mutual coupling between the TSA elements is reduced below −40 dB. Furthermore, at 500 GHz, the directivity, the gain, and the half power beam width (HPBW) at theE-plane of the proposed TSA array are 12.18 dB, 13.09 dB, and 61°, respectively. The proposed analytical method and achieved performance are very promising for the antenna array integrated with the RTD oscillators at the THz frequency and could pave the way to the design of the THz antenna array for the RTD oscillators.

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Thevenot, M., C. Menudier, A. El Sayed Ahmad, G. Zakka El Nashef, F. Fezai, Y. Abdallah, E. Arnaud, F. Torres, and T. Monediere. "Synthesis of Antenna Arrays and Parasitic Antenna Arrays with Mutual Couplings." International Journal of Antennas and Propagation 2012 (2012): 1–22. http://dx.doi.org/10.1155/2012/309728.

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A synthesis method to design multielement antennas with couplings is presented. The main objective is to perform a rigorous determination of the electromagnetic characteristics involved in the design, especially with arrays of moderate sizes. The aim is to conceive jointly and efficiently the antenna and the circuits to connect (feed distribution network, power amplifiers, reactive loads, etc.). The subsequent objective is to improve the understanding and capabilities of strongly coupled antennas. As a whole, the synthesis procedure is then applied to different antenna architectures in order to show its efficiency and versatility. A focus on some antenna concepts where the management of couplings is a key factor to improve the performances is presented. After describing the synthesis procedure, the first category of coupled multielement antenna studied concerns radiating arrays in linear or circular polarization. A design including couplings effects on an active array is also presented. Then, the method is applied to parasitic antenna arrays and a specific investigation on reflectarray antenna is performed as they can be considered as a particular case of parasitic arrays.

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Nguyen, Truong Khang, and Ikmo Park. "Design of a Substrate-Integrated Fabry-Pérot Cavity Antenna forK-Band Applications." International Journal of Antennas and Propagation 2015 (2015): 1–12. http://dx.doi.org/10.1155/2015/373801.

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This paper presents the design of a planar, low-profile, high-gain, substrate-integrated Fabry-Pérot cavity antenna forK-band applications. The antenna consists of a frequency selective surface (FSS) and a planar feeding structure, which are both lithographically patterned on a high-permittivity substrate. The FSS is made of a circular hole array that acts as a partially reflecting mirror. The planar feeding structure is a wideband leaky-wave slit dipole fed by a coplanar waveguide whose ground plane acts as a perfect reflective mirror. The measured results show that the proposed antenna has an impedance bandwidth of more than 8% (VSWR ≤ 2), a maximum gain of 13.1 dBi, and a 3 dB gain bandwidth of approximately 1.3% at a resonance frequency of around 21.6 GHz. The proposed antenna features low-profile, easy integration into circuit boards, mechanical robustness, and excellent cost-effective mass production suitability.

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Gao, Jing, Takashi Iida, Hiroyuki Mizutani, Sadanori Sakaguchi, Shuji Murakami, Atsushi Shimizu, and Tomohisa Wada. "The Implementation of a 2/4/8 Antennas Configurable Diversity OFDM Receiver for Mobile HDTV Application." International Journal of Digital Multimedia Broadcasting 2009 (2009): 1–9. http://dx.doi.org/10.1155/2009/303627.

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Two pre-FFT adaptive array (AA) antenna combiners and a post-FFT carrier diversity (CD) combiner are integrated with a Japan Terrestrial digital TV (ISDB-T) OFDM receiver using 90 nm 7M1P CMOS process. A 2/4/8-antenna diversity receiver can be configured and a low-cost 4 antenna diversity reception system can be realized in one LSI by making use of the AA-CD two-stage diversity combining method. Mobile reception performance is increased by 1.63 times using a denoise filter circuit and SPLINE interpolator under urban 6-path Rayleigh fading (TU6) model with 2-antenna post-FFT carrier diversity (2CD) combing mode. The die area is 49 and the power consumption is 310 mW.

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Banerjee, Soumen, Biswarup Rana, and Susanta Kumar Parui. "Substrate integrated waveguide based triangular antenna arrays." Microwave and Optical Technology Letters 58, no. 3 (January 27, 2016): 675–79. http://dx.doi.org/10.1002/mop.29645.

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Wincza, K., S. Gruszczynski, and K. Sachse. "Aperture coupled to stripline antenna element for integrated antenna arrays." Electronics Letters 42, no. 3 (2006): 130. http://dx.doi.org/10.1049/el:20063951.

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Journal articles on the topic 'Antenna arrays. Integrated circuits'

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