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Journal articles on the topic 'Atomic layer deposition'

Author: Grafiati

Published: 4 June 2021

Last updated: 26 July 2025

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1

Godlewski, Marek. "Atomic layer deposition." Semiconductor Science and Technology 27, no. 7 (2012): 070301. http://dx.doi.org/10.1088/0268-1242/27/7/070301.

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2

Szyszka, Bernd, and Hugo Tholense. "Atomic Layer Deposition." JOT Journal für Oberflächentechnik 51, no. 9 (2011): 48–51. http://dx.doi.org/10.1365/s35144-011-0169-4.

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3

Pimenoff, Joe. "Atomic Layer Deposition." Vakuum in Forschung und Praxis 24, no. 6 (2012): 10–13. http://dx.doi.org/10.1002/vipr.201200502.

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4

Leskela, Markku, Emma Salmi, and Mikko Ritala. "Atomic Layer Deposited Protective Layers." Materials Science Forum 879 (November 2016): 1086–92. http://dx.doi.org/10.4028/www.scientific.net/msf.879.1086.

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This paper reviews the use of Atomic Layer Deposition (ALD) in protective coatings. Because of the growth principle ALD allows the deposition of dense conformal films on substrates of different size and shape. Recently, ALD has received increasingly interest in deposition of protective coatings. In protective coatings oxides are the most common materials and especially Al, Ti, and Ta oxides have been applied. The use of nanolaminates enables improving the protection properties. Since ALD films are pinhole-free and often thin they are used to protect against moisture, radiation, out-gassing but

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5

Pécz, B., Zs Baji, Z. Lábadi, and A. Kovács. "ZnO layers deposited by Atomic Layer Deposition." Journal of Physics: Conference Series 471 (November 29, 2013): 012015. http://dx.doi.org/10.1088/1742-6596/471/1/012015.

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6

Solanki, Raj. "Atomic Layer Deposition of Copper Seed Layers." Electrochemical and Solid-State Letters 3, no. 10 (1999): 479. http://dx.doi.org/10.1149/1.1391185.

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7

Poodt, Paul, David C. Cameron, Eric Dickey, et al. "Spatial atomic layer deposition: A route towards further industrialization of atomic layer deposition." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 30, no. 1 (2012): 010802. http://dx.doi.org/10.1116/1.3670745.

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8

Leskelä, Markku, Mikko Ritala, and Ola Nilsen. "Novel materials by atomic layer deposition and molecular layer deposition." MRS Bulletin 36, no. 11 (2011): 877–84. http://dx.doi.org/10.1557/mrs.2011.240.

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9

Scarel, G., E. Bonera, C. Wiemer, et al. "Atomic-layer deposition of Lu2O3." Applied Physics Letters 85, no. 4 (2004): 630–32. http://dx.doi.org/10.1063/1.1773360.

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10

Reijnen, L., B. Meester, A. Goossens, and J. Schoonman. "Atomic layer deposition of CuxS." Le Journal de Physique IV 11, PR3 (2001): Pr3–1103—Pr3–1107. http://dx.doi.org/10.1051/jp4:20013138.

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11

George, Steven M. "Atomic Layer Deposition: An Overview." Chemical Reviews 110, no. 1 (2010): 111–31. http://dx.doi.org/10.1021/cr900056b.

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12

Hämäläinen, Jani, Timo Sajavaara, Esa Puukilainen, Mikko Ritala, and Markku Leskelä. "Atomic Layer Deposition of Osmium." Chemistry of Materials 24, no. 1 (2011): 55–60. http://dx.doi.org/10.1021/cm201795s.

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13

Bedair, S. M. "Atomic layer epitaxy deposition processes." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 12, no. 1 (1994): 179. http://dx.doi.org/10.1116/1.587179.

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14

Jaffal, Moustapha, Taguhi Yeghoyan, Gauthier Lefèvre, et al. "Topographical selective deposition: A comparison between plasma-enhanced atomic layer deposition/sputtering and plasma-enhanced atomic layer deposition/quasi-atomic layer etching approaches." Journal of Vacuum Science & Technology A 39, no. 3 (2021): 030402. http://dx.doi.org/10.1116/6.0000969.

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15

Sinha, Ashwini, Dennis W. Hess, and Clifford L. Henderson. "Transport behavior of atomic layer deposition precursors through polymer masking layers: Influence on area selective atomic layer deposition." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25, no. 5 (2007): 1721. http://dx.doi.org/10.1116/1.2782546.

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16

Pedersen, Henrik. "(Invited) Atomic Layer Deposition as the Enabler for the Meta Stable Semiconductor InN and Its Alloys." ECS Meeting Abstracts MA2023-02, no. 32 (2023): 1569. http://dx.doi.org/10.1149/ma2023-02321569mtgabs.

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Indium nitride (InN) is highly interesting for high-frequency and high-speed electronics given the remarkably high electron mobility in InN. The development of InN based electronics is hampered by the difficulty in depositing high quality thin films. The InN crystal breaks down to indium metal and nitrogen gas at about 500 °C which limits the deposition temperature, making conventional chemical vapor deposition (CVD) poorly suited for InN. Atomic Layer Deposition (ALD) is a low temperature, time-resolved form of CVD where the precursor gases are pulsed sequentially, separated by inert gas. Thi

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17

Tsai, Fa-Ta, Ching-Kong Chao, Kai-Jyun Jhong, and Rwei-Ching Chang. "Characterization of oxide barrier layers prepared by atomic layer deposition." Advances in Mechanical Engineering 9, no. 7 (2017): 168781401771180. http://dx.doi.org/10.1177/1687814017711809.

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Atomic layer deposition has become an important thin-film growth technique for producing gas diffusion barriers because of its low process temperature and its ability to produce uniform films. In this work, atomic layer deposition was used to deposit various Al2O3 and ZnO thin films on polyethylene terephthalate substrates; subsequently, the physical properties and water vapor transmission rates of the films were characterized. Single and hybrid films (Al2O3, ZnO, Al2O3/ZnO, and ZnO/Al2O3) with thicknesses of 25, 50, and 100 nm at a deposition temperature of 60°C were investigated. The deposit

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18

Zhao, Yang. "Atomic Layer Deposition and Molecular Layer Deposition for Next Generation Battery." ECS Meeting Abstracts MA2021-02, no. 29 (2021): 858. http://dx.doi.org/10.1149/ma2021-0229858mtgabs.

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19

Muneshwar, Triratna, and Ken Cadien. "Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 33, no. 6 (2015): 060603. http://dx.doi.org/10.1116/1.4926382.

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20

Song, Seung Keun, Holger Saare, and Gregory N. Parsons. "Integrated Isothermal Atomic Layer Deposition/Atomic Layer Etching Supercycles for Area-Selective Deposition of TiO2." Chemistry of Materials 31, no. 13 (2019): 4793–804. http://dx.doi.org/10.1021/acs.chemmater.9b01143.

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21

Hernández-Arriaga, H., E. López-Luna, E. Martínez‐Guerra, M. M. Turrubiartes, A. G. Rodríguez, and M. A. Vidal. "Growth of HfO2/TiO2nanolaminates by atomic layer deposition and HfO2-TiO2by atomic partial layer deposition." Journal of Applied Physics 121, no. 6 (2017): 064302. http://dx.doi.org/10.1063/1.4975676.

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22

Li, Yanghui, Weidong Shen, Yueguang Zhang, Xiang Hao, Huanhuan Fan, and Xu Liu. "Anti-reflection coating at 550 nm fabricated by atomic layer deposition." Chinese Optics Letters 11, S1 (2013): S10205. http://dx.doi.org/10.3788/col201311.s10205.

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23

Plakhotnyuk, Maksym, Atilla C. Varga, Karolis Parfeniukas, Ivan Kundrata та Julien Bachmann. "Inherently Selective Atomic Layer Deposition for Optical and Sensor Applications: Microreactor Direct Atomic Layer Processing (μDALP™)". ECS Meeting Abstracts MA2023-02, № 29 (2023): 1463. http://dx.doi.org/10.1149/ma2023-02291463mtgabs.

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In parallel to additive manufacturing leading the revolution in traditional manufacturing, the same principles can revolutionize traditional thin film deposition techniques. Where lithography and vapor phase deposition techniques struggle, for example, with rapid iterations for prototyping or incompatibility with the used chemistry, additive manufacturing can shine. Indeed, several approaches are in development for 3D nanopriting1,2,3. Atomic Layer Deposition, and in more general Atomic Layer Processing, offers a unique opportunity for localized 3D processing/printing due to its two-step proce

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24

Lu, Junling. "Atomic Lego Catalysts Synthesized by Atomic Layer Deposition." Accounts of Materials Research 3, no. 3 (2022): 358–68. http://dx.doi.org/10.1021/accountsmr.1c00250.

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25

Faraz, T., F. Roozeboom, H. C. M. Knoops, and W. M. M. Kessels. "Atomic Layer Etching: What Can We Learn from Atomic Layer Deposition?" ECS Journal of Solid State Science and Technology 4, no. 6 (2015): N5023—N5032. http://dx.doi.org/10.1149/2.0051506jss.

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26

Ahn, Jinseong, Changui Ahn, Seokwoo Jeon, and Junyong Park. "Atomic Layer Deposition of Inorganic Thin Films on 3D Polymer Nanonetworks." Applied Sciences 9, no. 10 (2019): 1990. http://dx.doi.org/10.3390/app9101990.

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Atomic layer deposition (ALD) is a unique tool for conformally depositing inorganic thin films with precisely controlled thickness at nanoscale. Recently, ALD has been used in the manufacture of inorganic thin films using a three-dimensional (3D) nanonetwork structure made of polymer as a template, which is pre-formed by advanced 3D nanofabrication techniques such as electrospinning, block-copolymer (BCP) lithography, direct laser writing (DLW), multibeam interference lithography (MBIL), and phase-mask interference lithography (PMIL). The key technical requirement of this polymer template-assi

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27

Vähä-Nissi, Mika, Terhi Hirvikorpi, Jenni Sievänen, Katriina Matilainen, Erkki Salo, and Ali Harlin. "Atomic Layer Deposition of Thin Inorganic Coatings onto Renewable Packaging Materials." Solid State Phenomena 185 (February 2012): 12–14. http://dx.doi.org/10.4028/www.scientific.net/ssp.185.12.

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Biopolymers play still a relatively minor role in the packaging material markets. For this to grow further there are problems to be solved, such as inadequate barrier properties and moisture sensitivity. Atomic layer deposition (ALD) is one potential solution. Atomic layer deposition is a layer-by-layer thin film deposition process based on self-limiting gas-solid reactions. It is well suited for producing pinhole free barrier coatings uniform in thickness at relatively mild process conditions. The purpose of this presentation is to summarize our recent work done concerning atomic layer deposi

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28

Illiberi, Andrea, Michael Givens, Alessandra Leonhardt, Matthew Surman, Ranjith Ramachandran, and Mihaela Popovici. "Atomic Layer Deposition for Memory Applications." ECS Meeting Abstracts MA2022-02, no. 31 (2022): 1120. http://dx.doi.org/10.1149/ma2022-02311120mtgabs.

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The semiconductor industry has continuously adopted more complex architectures and 3D geometries, while simultaneously down scaling the critical dimensions of the devices. This presentation will briefly review the evolution of the memory device architectures, their impact on material/processing requirements, and outline how atomic scale processing has helped to overcome integration challenges. We will first present some key atomic scale processes which have enabled the fabrication of 3D memory devices, with particular focus on V-NAND and DRAM. Next, we will introduce new atomic scale processes

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29

Shin, Seokyoon, Giyul Ham, Heeyoung Jeon, Jingyu Park, Woochool Jang, and Hyeongtag Jeon. "Atomic Layer Deposition: Overview and Applications." Korean Journal of Materials Research 23, no. 8 (2013): 405–22. http://dx.doi.org/10.3740/mrsk.2013.23.8.405.

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30

Min, Byung-Don, Jong-Soo Lee, and Sang-Sig Kim. "Al2O3Nano-Coating by Atomic Layer Deposition." Transactions on Electrical and Electronic Materials 4, no. 3 (2003): 15–18. http://dx.doi.org/10.4313/teem.2003.4.3.015.

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31

Charvot, Jaroslav, Raul Zazpe, Jan M. Macak, and Filip Bureš. "Organoselenium Precursors for Atomic Layer Deposition." ACS Omega 6, no. 10 (2021): 6554–58. http://dx.doi.org/10.1021/acsomega.1c00223.

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32

Henderick, Lowie, Arpan Dhara, Andreas Werbrouck, Jolien Dendooven, and Christophe Detavernier. "Atomic layer deposition of metal phosphates." Applied Physics Reviews 9, no. 1 (2022): 011310. http://dx.doi.org/10.1063/5.0069647.

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33

Willis, Brian, Rahul Gupta, and Chao-Ying Ni. "Atomic Layer Deposition for Nanoelectrode Devices." ECS Transactions 33, no. 2 (2019): 25–35. http://dx.doi.org/10.1149/1.3485238.

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34

Niinisto, J., T. Blanquart, S. Seppala, M. Ritala, and M. Leskela. "Heteroleptic Precursors for Atomic Layer Deposition." ECS Transactions 64, no. 9 (2014): 221–32. http://dx.doi.org/10.1149/06409.0221ecst.

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35

Farhangfar, Sh, R. B. Yang, M. Pelletier, and K. Nielsch. "Atomic layer deposition of ZnS nanotubes." Nanotechnology 20, no. 32 (2009): 325602. http://dx.doi.org/10.1088/0957-4484/20/32/325602.

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36

Getz, Michael, Per-Anders Hansen, Mohammed A. K. Ahmed, Helmer Fjellvåg, and Ola Nilsen. "Luminescent YbVO4 by atomic layer deposition." Dalton Transactions 46, no. 9 (2017): 3008–13. http://dx.doi.org/10.1039/c7dt00253j.

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37

Tan, Lee Kheng, Bo Liu, Jing Hua Teng, Shifeng Guo, Hong Yee Low, and Kian Ping Loh. "Atomic layer deposition of a MoS2film." Nanoscale 6, no. 18 (2014): 10584–88. http://dx.doi.org/10.1039/c4nr02451f.

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38

Ritala, Mikko, and Jaakko Niinistö. "Industrial Applications of Atomic Layer Deposition." ECS Transactions 25, no. 8 (2019): 641–52. http://dx.doi.org/10.1149/1.3207651.

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39

Proslier, Thomas, J. Klug, Nicholas C. Becker, Jeffrey W. Elam, and Michael Pellin. "(Invited) Atomic Layer Deposition of Superconductors." ECS Transactions 41, no. 2 (2019): 237–45. http://dx.doi.org/10.1149/1.3633673.

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40

Hu, Liang, Weihong Qi, and Yejun Li. "Coating strategies for atomic layer deposition." Nanotechnology Reviews 6, no. 6 (2017): 527–47. http://dx.doi.org/10.1515/ntrev-2017-0149.

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AbstractAtomic layer deposition (ALD) is a vapor phase technique capable of producing a variety of materials. It consists of the alternation of separate self-limiting surface reactions, which enables accurate control of film thickness at the Angstrom level. ALD becomes a powerful tool for a lot of industrial and research applications. Coating strategies are the key for ALD; however, there are few systematic reviews concerning coating strategies for ALD. This review provides a detailed summary of state-of-the-art coating strategies in ALD, emphasizing the recent progress in the fabrication of n

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41

Sundaram, Ganesh, Douwe Monsma, and Jill Becker. "Leading Edge Atomic Layer Deposition Applications." ECS Transactions 16, no. 4 (2019): 19–27. http://dx.doi.org/10.1149/1.2979977.

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42

Østreng, Erik, Henrik H. Sønsteby, Timo Sajavaara, Ola Nilsen, and Helmer Fjellvåg. "Atomic layer deposition of ferroelectric LiNbO3." J. Mater. Chem. C 1, no. 27 (2013): 4283–90. http://dx.doi.org/10.1039/c3tc30271g.

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43

Natarajan, G., P. S. Maydannik, D. C. Cameron, I. Akopyan, and B. V. Novikov. "Atomic layer deposition of CuCl nanoparticles." Applied Physics Letters 97, no. 24 (2010): 241905. http://dx.doi.org/10.1063/1.3525929.

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44

van Ommen, J. R., and A. Goulas. "Atomic layer deposition on particulate materials." Materials Today Chemistry 14 (December 2019): 100183. http://dx.doi.org/10.1016/j.mtchem.2019.08.002.

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45

Narayan, Roger J., Shashishekar P. Adiga, Michael J. Pellin, et al. "Atomic layer deposition of nanoporous biomaterials." Materials Today 13, no. 3 (2010): 60–64. http://dx.doi.org/10.1016/s1369-7021(10)70035-3.

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46

Wilson, C. A., J. A. McCormick, A. S. Cavanagh, D. N. Goldstein, A. W. Weimer, and S. M. George. "Tungsten atomic layer deposition on polymers." Thin Solid Films 516, no. 18 (2008): 6175–85. http://dx.doi.org/10.1016/j.tsf.2007.11.086.

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47

Wu, Yanlin, Dirk Döhler, Maïssa Barr, et al. "Atomic Layer Deposition from Dissolved Precursors." Nano Letters 15, no. 10 (2015): 6379–85. http://dx.doi.org/10.1021/acs.nanolett.5b01424.

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48

Chalker, P. R. "Photochemical atomic layer deposition and etching." Surface and Coatings Technology 291 (April 2016): 258–63. http://dx.doi.org/10.1016/j.surfcoat.2016.02.046.

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49

Griffiths, Matthew B. E., Peter J. Pallister, David J. Mandia, and Seán T. Barry. "Atomic Layer Deposition of Gold Metal." Chemistry of Materials 28, no. 1 (2015): 44–46. http://dx.doi.org/10.1021/acs.chemmater.5b04562.

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50

Purvis, Gail. "Atomic layer deposition high fashion, 2004." III-Vs Review 17, no. 6 (2004): 2. http://dx.doi.org/10.1016/s0961-1290(04)00574-5.

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